EP1897126A4 - Mehrfach-fluid-zuführungsvorrichtung für den träger eines halbleiterwafer-poliersystems - Google Patents

Mehrfach-fluid-zuführungsvorrichtung für den träger eines halbleiterwafer-poliersystems

Info

Publication number
EP1897126A4
EP1897126A4 EP05765992A EP05765992A EP1897126A4 EP 1897126 A4 EP1897126 A4 EP 1897126A4 EP 05765992 A EP05765992 A EP 05765992A EP 05765992 A EP05765992 A EP 05765992A EP 1897126 A4 EP1897126 A4 EP 1897126A4
Authority
EP
European Patent Office
Prior art keywords
carrier
semiconductor wafer
supplying apparatus
polishing system
wafer polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05765992A
Other languages
English (en)
French (fr)
Other versions
EP1897126A1 (de
Inventor
Sung-Bum Seo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Mecatec Co Ltd
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Publication of EP1897126A1 publication Critical patent/EP1897126A1/de
Publication of EP1897126A4 publication Critical patent/EP1897126A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Joints Allowing Movement (AREA)
EP05765992A 2005-06-28 2005-06-28 Mehrfach-fluid-zuführungsvorrichtung für den träger eines halbleiterwafer-poliersystems Withdrawn EP1897126A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2005/002021 WO2007001100A1 (en) 2005-06-28 2005-06-28 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system

Publications (2)

Publication Number Publication Date
EP1897126A1 EP1897126A1 (de) 2008-03-12
EP1897126A4 true EP1897126A4 (de) 2009-07-15

Family

ID=37595324

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05765992A Withdrawn EP1897126A4 (de) 2005-06-28 2005-06-28 Mehrfach-fluid-zuführungsvorrichtung für den träger eines halbleiterwafer-poliersystems

Country Status (3)

Country Link
EP (1) EP1897126A4 (de)
CN (1) CN100524638C (de)
WO (1) WO2007001100A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101386149B (zh) * 2007-09-12 2011-01-26 K.C.科技股份有限公司 用于化学机械抛光设备的清洁装置
GB2513183B (en) * 2013-04-19 2019-11-13 Welleng Science & Tech Ltd Rotary coupling
DE102014017451A1 (de) * 2014-11-26 2016-06-02 Eisenmann Se Anlage zum Behandeln eines Guts
US10510563B2 (en) 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
CN107097120B (zh) * 2017-05-27 2018-11-13 上海理工大学 多通道磁流变液供给装置
KR102378581B1 (ko) * 2020-06-19 2022-03-24 씰링크 주식회사 회전축 밀폐장치 및 이를 이용하는 반도체 기판처리장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3192396B2 (ja) * 1997-11-07 2001-07-23 日本ピラー工業株式会社 流体用ロータリジョイント
JP3325547B2 (ja) * 1999-11-16 2002-09-17 日本ピラー工業株式会社 ロータリジョイント
JP2004505456A (ja) * 2000-07-31 2004-02-19 エイエスエムエル　ユーエス　インコーポレイテッド 基板を化学機械研磨するための装置及び方法
KR20030039627A (ko) 2001-11-14 2003-05-22 주식회사 케이티 발신번호를 이용한 사용자별 상품 제공
KR100418278B1 (ko) * 2003-04-11 2004-02-14 주식회사 신원기계부품 로터리 유니온
KR100490266B1 (ko) * 2003-06-19 2005-05-17 두산디앤디 주식회사 반도체 웨이퍼 표면연마장비의 폴리싱 캐리어 및 컨디셔너캐리어용 다중 유체공급장치
KR100530742B1 (ko) * 2003-12-31 2005-11-23 두산디앤디 주식회사 반도체 웨이퍼 표면연마장비의 캐리어용 다중 유체공급장치

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007001100A1 *

Also Published As

Publication number Publication date
WO2007001100A9 (en) 2009-04-02
WO2007001100A1 (en) 2007-01-04
CN100524638C (zh) 2009-08-05
EP1897126A1 (de) 2008-03-12
CN101208780A (zh) 2008-06-25

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Legal Events

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A4 Supplementary search report drawn up and despatched

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