EP1889683A4 - Lead-free solder paste - Google Patents

Lead-free solder paste

Info

Publication number
EP1889683A4
EP1889683A4 EP06756513A EP06756513A EP1889683A4 EP 1889683 A4 EP1889683 A4 EP 1889683A4 EP 06756513 A EP06756513 A EP 06756513A EP 06756513 A EP06756513 A EP 06756513A EP 1889683 A4 EP1889683 A4 EP 1889683A4
Authority
EP
European Patent Office
Prior art keywords
lead
free solder
solder paste
alloy
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06756513A
Other languages
German (de)
French (fr)
Japanese (ja)
Other versions
EP1889683B1 (en
EP1889683A1 (en
Inventor
Minoru Ueshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of EP1889683A1 publication Critical patent/EP1889683A1/en
Publication of EP1889683A4 publication Critical patent/EP1889683A4/en
Application granted granted Critical
Publication of EP1889683B1 publication Critical patent/EP1889683B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)

Abstract

[PROBLEMS] Conventional Sn-Zn, lead-free solder pastes have disadvantages in that they are liable to form coarse Zn crystals of tens of micrometers in size and the formation of such coarse crystals can hardly be inhibited and that it is difficult to enhance the joint strength without changing the soldering temperature. Although an alloy improved in the strength by the addition of a slight amount of a group 1B element was developed, the alloy is disadvantageous in that it cannot reflow according to the same temperature profile as that of Sn-Pb paste because of its enhanced melting temperature. [MEANS FOR SOLVING PROBLEMS] A solder paste prepared by incorporating a powder of an Sn-Zn, lead-free solder paste with both an ethanol solution containing nanoparticles of 5 to 300nm in diameter containing at least one member selected from among Ag, Au and Cu and a flux forms, in soldering, an alloy consisting of Ag, Au and/or Cu and Zn and thereby forms fine clusters in the liquid phase, thus giving a fine solder texture after melting.
EP06756513.5A 2005-05-25 2006-05-24 Lead-free solder paste Active EP1889683B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005151805 2005-05-25
PCT/JP2006/310307 WO2006126564A1 (en) 2005-05-25 2006-05-24 Lead-free solder paste

Publications (3)

Publication Number Publication Date
EP1889683A1 EP1889683A1 (en) 2008-02-20
EP1889683A4 true EP1889683A4 (en) 2009-08-19
EP1889683B1 EP1889683B1 (en) 2016-02-03

Family

ID=37451988

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06756513.5A Active EP1889683B1 (en) 2005-05-25 2006-05-24 Lead-free solder paste

Country Status (6)

Country Link
US (1) US9185812B2 (en)
EP (1) EP1889683B1 (en)
JP (2) JP4493658B2 (en)
KR (1) KR101026970B1 (en)
CN (1) CN101208173B (en)
WO (1) WO2006126564A1 (en)

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US8192866B2 (en) * 2008-03-04 2012-06-05 Lockheed Martin Corporation Tin nanoparticles and methodology for making same
US8900704B1 (en) 2008-08-05 2014-12-02 Lockheed Martin Corporation Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity
US8105414B2 (en) 2008-09-15 2012-01-31 Lockheed Martin Corporation Lead solder-free electronics
US9095898B2 (en) 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
US8486305B2 (en) * 2009-11-30 2013-07-16 Lockheed Martin Corporation Nanoparticle composition and methods of making the same
US8493746B2 (en) * 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
KR101623449B1 (en) * 2009-07-14 2016-05-23 도와 일렉트로닉스 가부시키가이샤 Bonding material and bonding method each using metal nanoparticles
US9072185B2 (en) 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
US9011570B2 (en) 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
CN101823187B (en) * 2010-02-04 2012-01-25 哈尔滨工业大学 Nano-Ni reinforced low-temperature lead-free composite solder paste and preparation method thereof
US8834747B2 (en) * 2010-03-04 2014-09-16 Lockheed Martin Corporation Compositions containing tin nanoparticles and methods for use thereof
US10544483B2 (en) 2010-03-04 2020-01-28 Lockheed Martin Corporation Scalable processes for forming tin nanoparticles, compositions containing tin nanoparticles, and applications utilizing same
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JP5796685B2 (en) * 2012-10-15 2015-10-21 千住金属工業株式会社 Low temperature solder paste soldering method
CN102922177B (en) * 2012-10-25 2014-08-13 哈尔滨工业大学 Nano intermetallic compound soldering paste and preparation method thereof
DE102013102278A1 (en) * 2013-03-07 2014-09-11 Epcos Ag capacitor arrangement
KR102156373B1 (en) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 Solder paste
US9521754B1 (en) 2013-08-19 2016-12-13 Multek Technologies Limited Embedded components in a substrate
US9801277B1 (en) 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
US9053405B1 (en) 2013-08-27 2015-06-09 Flextronics Ap, Llc Printed RFID circuit
US9565748B2 (en) * 2013-10-28 2017-02-07 Flextronics Ap, Llc Nano-copper solder for filling thermal vias
US9736947B1 (en) * 2013-12-16 2017-08-15 Multek Technologies, Ltd. Nano-copper via fill for enhanced thermal conductivity of plated through-hole via
JP6417692B2 (en) * 2014-03-27 2018-11-07 日本電気株式会社 Solder composition, solder paste, solder joint structure, and electronic device
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CN104259479B (en) * 2014-10-09 2016-05-04 昆山成利焊锡制造有限公司 The preparation method of nanometer tin alloy powder for soldering paste
CN104625466B (en) * 2015-01-21 2017-11-24 哈尔滨工业大学深圳研究生院 A kind of tin solder/copper Particles dispersed solder that can quickly form high temperature solder joint at low temperature
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CN108476585B (en) 2015-12-02 2021-05-18 弗莱克斯有限公司 PCB hybrid redistribution layer
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CN105921904A (en) * 2016-06-16 2016-09-07 深圳市唯特偶新材料股份有限公司 No-clean precise printing lead-free solder paste special for mobile phones
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JP6528102B2 (en) * 2017-07-03 2019-06-12 株式会社弘輝 Flux and solder material
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Also Published As

Publication number Publication date
WO2006126564A1 (en) 2006-11-30
US20090301606A1 (en) 2009-12-10
US9185812B2 (en) 2015-11-10
JP4493658B2 (en) 2010-06-30
EP1889683B1 (en) 2016-02-03
CN101208173A (en) 2008-06-25
JP5754794B2 (en) 2015-07-29
JPWO2006126564A1 (en) 2008-12-25
EP1889683A1 (en) 2008-02-20
CN101208173B (en) 2010-05-19
JP2010120089A (en) 2010-06-03
KR20080015874A (en) 2008-02-20
KR101026970B1 (en) 2011-04-11

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