EP1880032A4 - Compositions de brasure a base d'alliage d'etain - Google Patents

Compositions de brasure a base d'alliage d'etain

Info

Publication number
EP1880032A4
EP1880032A4 EP06759560A EP06759560A EP1880032A4 EP 1880032 A4 EP1880032 A4 EP 1880032A4 EP 06759560 A EP06759560 A EP 06759560A EP 06759560 A EP06759560 A EP 06759560A EP 1880032 A4 EP1880032 A4 EP 1880032A4
Authority
EP
European Patent Office
Prior art keywords
alloy composition
lead
tin alloy
tin
alloy solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06759560A
Other languages
German (de)
English (en)
Other versions
EP1880032A2 (fr
Inventor
Karl F Seelig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMERICAN IRON&METAL Co Inc
American Iron & Metal Co
Original Assignee
AMERICAN IRON&METAL Co Inc
American Iron & Metal Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMERICAN IRON&METAL Co Inc, American Iron & Metal Co filed Critical AMERICAN IRON&METAL Co Inc
Publication of EP1880032A2 publication Critical patent/EP1880032A2/fr
Publication of EP1880032A4 publication Critical patent/EP1880032A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une composition d'alliage pour brasure, exempte de plomb et de bismuth, pour des applications, à toxicité réduite, à des ensembles électroniques. La composition d'alliage comprend environ 0,01 % à environ 4,5 % d'argent ; environ 0,01 % à environ 3 % de cuivre ; environ 0,002 % à environ 5,0 % d'antimoine ; environ 85 % à environ 99 % d'étain, et environ 0,002 % à environ 1 % soit de nickel, soit de cobalt. La composition d'alliage présente une température de fusion d'environ 217 °C, avec un mouillage et une résistance mécanique supérieure, ce qui rend la composition d'alliage tout à fait appropriée pour la fabrication de cartes de circuits imprimés et, du fait des séries de bossages et de colonnes du composant exempt de plomb, ladite composition convient pour remplacer les brasures étain-plomb conventionnelles.
EP06759560A 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain Withdrawn EP1880032A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67986905P 2005-05-11 2005-05-11
PCT/US2006/018235 WO2006122240A2 (fr) 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain

Publications (2)

Publication Number Publication Date
EP1880032A2 EP1880032A2 (fr) 2008-01-23
EP1880032A4 true EP1880032A4 (fr) 2009-03-04

Family

ID=37397305

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06759560A Withdrawn EP1880032A4 (fr) 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain

Country Status (5)

Country Link
US (1) US20060263234A1 (fr)
EP (1) EP1880032A4 (fr)
CA (1) CA2607286A1 (fr)
MX (1) MX2007013971A (fr)
WO (1) WO2006122240A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051181A1 (fr) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. Alliage de soudure tendre sans plomb
US7829791B2 (en) * 2008-01-03 2010-11-09 Interplex Nas, Inc. Solder wire construction
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
US9770786B2 (en) * 2010-06-01 2017-09-26 Senju Metal Industry Co., Ltd. Lead-free solder paste
JP5878290B2 (ja) * 2010-12-14 2016-03-08 株式会社日本スペリア社 鉛フリーはんだ合金
EP3838473A1 (fr) * 2015-05-05 2021-06-23 Indium Corporation Alliages de soudure sans plomb de haute fiabilité pour applications électroniques en environnements difficiles
MY186064A (en) * 2015-05-05 2021-06-18 Indium Corp High reliability lead-free solder alloys for harsh environment electronics applications
JP6292342B1 (ja) * 2017-09-20 2018-03-14 千住金属工業株式会社 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
CN109014652A (zh) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 一种环保型焊锡材料及其制备工艺
FR3101561B1 (fr) * 2019-10-06 2023-09-22 Pruvost Jean Claude Lucien Alliage de soudure sans plomb appelé SIA à base de Sn et Bi et d’additifs de Cu et d’Ag limités à 1 %.
CN114227057B (zh) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 无铅焊料合金及其制备方法、用途
WO2024101041A1 (fr) * 2022-11-07 2024-05-16 富士電機株式会社 Matériau de soudure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (fr) * 1993-04-29 1994-11-10 Seelig Karl F Composition d'alliage a l'etain pour braser exempte de bismuth et de plomb
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
WO2001034860A1 (fr) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Alliage a souder
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US5762716A (en) * 1997-01-09 1998-06-09 American Iron & Metal Company, Inc. Methods for wiping a metal contaminated surface with a water soluble fabric
CA2340393A1 (fr) * 1999-06-11 2000-12-21 Katsuaki Suganuma Soudure sans plomb

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (fr) * 1993-04-29 1994-11-10 Seelig Karl F Composition d'alliage a l'etain pour braser exempte de bismuth et de plomb
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
WO2001034860A1 (fr) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Alliage a souder
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KARIM Z S ET AL: "LEAD-FREE SOLDER BUMP TECHNOLOGIES FOR FLIP-CHIP PACKAGING APPLICATIONS", PROCEEDINGS OF THE SPIE, SPIE, vol. 4587, 9 November 2001 (2001-11-09), pages 581 - 587, XP008029398 *

Also Published As

Publication number Publication date
WO2006122240A3 (fr) 2007-02-01
US20060263234A1 (en) 2006-11-23
MX2007013971A (es) 2008-02-22
CA2607286A1 (fr) 2006-11-16
EP1880032A2 (fr) 2008-01-23
WO2006122240A2 (fr) 2006-11-16

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