EP1880032A2 - Compositions de brasure a base d'alliage d'etain - Google Patents

Compositions de brasure a base d'alliage d'etain

Info

Publication number
EP1880032A2
EP1880032A2 EP06759560A EP06759560A EP1880032A2 EP 1880032 A2 EP1880032 A2 EP 1880032A2 EP 06759560 A EP06759560 A EP 06759560A EP 06759560 A EP06759560 A EP 06759560A EP 1880032 A2 EP1880032 A2 EP 1880032A2
Authority
EP
European Patent Office
Prior art keywords
solder
alloy composition
tin
alloy
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06759560A
Other languages
German (de)
English (en)
Other versions
EP1880032A4 (fr
Inventor
Karl F. Seelig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Iron&Metal Co Inc
Original Assignee
American Iron&Metal Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Iron&Metal Co Inc filed Critical American Iron&Metal Co Inc
Publication of EP1880032A2 publication Critical patent/EP1880032A2/fr
Publication of EP1880032A4 publication Critical patent/EP1880032A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • the invention relates to a lead-free and bismuth-free tin alloy that contains antimony and nickel or cobalt.
  • the present invention relates generally to an improved solder composition. More specifically, the present invention relates to an improved solder composition that contains no lead or bismuth yet still achieves superior soldering characteristics.
  • solders employed In the electronic manufacturing of printed circuit boards and the assembly of components thereon, the solders employed generally contain tin and lead to provide mechanical and electrical connections. Solders that contain tin and lead typically yield highly reliable connections in both automated and manual soldering and provide a surface on printed circuit boards extremely conducive to soldering.
  • Tin-lead alloys of, for example, sixty (60%) percent tin, forty (40%) percent lead; and sixty-three (63%) percent tin, thirty-seven (37%) percent lead have historically been used for most electronic soldering operations. These alloys have been selected and are preferred because of their low melting temperatures, mechanical strength, low relative cost, as well as superior wetting characteristics and electrical conductivity. '
  • U.S. Patent No. 3,503,721 issued to Lupfer, discloses a tin-silver alloy of 96.5% tin and 3.5 ⁇ 0.5% silver with wetting and electrical conductivity characteristics marginally acceptable to suit the needs of the electronics industry.
  • this alloy has mechanical strength weaknesses that would prohibit its use on a wide range of electronic printed circuit board assemblies. For example, creep strength, a measure of flow under pressure, and percent elongation, metal stretching before fracture, are considerably lower than that of the tin-lead alloys now used. Even with the common tin-lead alloys, solder joints stress fractures are the cause of many field failures in printed circuit boards where vibration or temperature variations occur.
  • liquidus temperature of 221° C requires that automated soldering be accomplished at a temperature that in many situations would damage the printed circuit board and/or the components. Due to the high content of silver, the cost of this alloy is considerably higher than tin-lead alloys. For each percentage point of silver added to the alloy, the price increases by approximately $0.75/lbs. (based on a silver market of $5.00/troy ounce).
  • U.S. Patent No. 4,778,733, issued to Lubrano et al. discloses an alloy containing, by weight, 0.7% to 6% copper; 0.05% to 3% silver; with the remainder being tin with a temperature range of 440°-630° F.
  • This alloy has a melting temperature that is too high to be used in a wide range of electronic soldering applications without damaging printed circuit boards or components.
  • the alloy disclosed by Lubrano et al. exhibits inferior soldering performance, slow wetting times and mechanical strengths ill-suited to electronic assembly applications.
  • U.S. Patent No. 4,695,428, issued to Ballentine et al. discloses an alloy containing 0.5-4% antimony; 0.5-4% zinc; 0.1-3% silver; 0.1-2% copper; 88-98.8% tin.
  • the zinc content in this alloy causes the alloy to oxidize quickly. This inhibits wetting and flow, producing high dross formation which results in extremely high defect levels.
  • the productivity lost in using such a composition for mass electronic soldering makes it an unacceptable alternative to tin-lead solders.
  • U.S. Patent No. 4,758,407 issued to Ballentine et al. discloses an alloy containing tin, copper, nickel, silver and antimony. All of the alloy combinations disclosed by Ballentine et al. have liquidus temperatures in excess of those required for electronic assembly. The lowest disclosed liquidus temperature is 238° C, which is unacceptable for use in the electronics industry.
  • the most commonly used lead-free alloy is comprised of tin-silver-copper. Industry testing has proven that tin-silver-copper, lead-free solder alloys do not offer sufficient drop testing characteristics as compared to tin-lead solder alloys, especially on 0.3 mm BGA devices.
  • Common tin-silver-copper alloys known as SAC alloys, contain 3-4% silver and 0.5-1% copper.
  • SAC alloys contain 3-4% silver and 0.5-1% copper.
  • the main problem with these alloys in a BGA type application is the AgSn intermetallic plate formation as well as Kirkendal voiding that occurs. To make SAC alloys more stable, several elements have been added to reduce copper erosion as well as limit large intermetallic plates from forming.
  • solder alloys composed of tin-silver-copper- antimony described in US Patent Nos. 5,352,407 and 5,405,577, issued to Seelig et al. show improvement versus tin-silver-copper alloys.
  • this alloy shows some improvements of tin, silver, copper alloys; however there is still a need for enhanced performance.
  • the present invention provides solder alloys with new advantages not found in currently available solder compositions, and overcomes many of the disadvantages of currently available compositions.
  • the invention is generally directed to novel and unique solder compositions with particular application in the electronic manufacturing of printed circuit boards and the assembly of components therein, as well as lead less component bumping arrays and column arrays.
  • the solder compositions of the present invention achieve desired physical characteristics, such as wetting, peel strength, low melting point, physical strength, fatigue resistance, electrical conductivity, matrix stability, and uniform joint strength, but without the toxic elements found in known tin-lead solder alloys.
  • the alloy compositions of the present invention include a combination of tin, silver, copper, antimony, and either nickel or copper, to offer a unique set of physical characteristics that allow it to be used as a viable alternative to tin-lead alloys in electronic soldering and printed circuit board coating, as well as lead less component bumping arrays and column arrays.
  • the alloy of the present invention possesses physical characteristics that result in a stronger mechanical joint with superior fatigue resistance to tin-lead alloys, tin- silver alloys, or alloys containing bismuth.
  • the melting point temperature is lower than any other lead-free or bismuth free alternative solder alloy.
  • the preferred embodiment of the present invention has a reduced toxicity and a melting point of about 217° C and consisting of, in weight percent, 85-99% tin; 0.01-4.5% silver; 0.01-3.0% copper; and 0.002-5.0% antimony and either 0.0001-1.0% nickel or 0.0001- 1.0% cobalt.
  • solder compositions that are a viable substitute for tin-lead solder alloys.
  • Another object of the present invention is to provide solder alloy compositions that are well suited for the electronic manufacturing of printed circuit boards and the assembly of components thereon.
  • solder alloy compositions acceptable for the electronics industry that contain no lead or bismuth.
  • solder alloy compositions that are free of toxic elements and safe for the environment.
  • the preferred embodiments of the present invention are lead-free and bismuth- free solder compositions that contain tin, silver, copper, antimony, and nickel or contain tin, silver, copper, antimony, and cobalt.
  • the solder alloy compositions of the present invention have the physical characteristics and the application performance to economically meet the needs of the electronic industry and the assembly and coating of printed circuit boards. In particular, the alloy exhibits ideal physical characteristics yet does not contain toxic elements as alloys found in the prior art which could harm workers and the environment.
  • the alloys of the present invention have advantages over the tin, silver, copper, antimony alloy described in the prior art. Below is an independent comparison test between a tin, silver, copper, antimony alloy, as described in US Patent No. 5,405,577 and a prior art tin-lead solder alloy containing 63% tin and 37% lead. As seen below, the mechanical strength of this alloy is superior to known tin-lead alloys.
  • alloy compositions of the present invention that exhibit the desired physical characteristics is comprised by weight as follows:
  • the solder composition comprises about 1.75% to about 2.0% silver; about 0.8% copper; about 0.5% antimony; about 0.08% nickel; and about 96.6% to about 96.9% tin.
  • the melting point temperature of the composition is in the range of about 217° C.
  • the liquidus temperature of about 217° C coupled with superior wetting allows the alloy of the present invention to be used with existing mass and hand soldering equipment without damaging most printed circuit boards or electronic components.
  • this alloy when tested in JEDEC drop tests of 1500g X 0.5 meters demonstrated twice the fatigue life of the known SAC alloys.
  • an SAC alloy containing antimony but lacking nickel e.g., having the composition about 1.75% to about 2.0% silver; about 0.8% copper; about 0.5% antimony; and about 96.6% to about 96.9% tin
  • the solder composition comprises about 0.5% to about 1.75% silver; about 0% to about 0.5% copper; about 0.002% to about 0.2% antimony; about 0.08% to about 0.04% nickel; and about 97.5% to about 99.4% tin.
  • the solder composition comprises about 1.0% to about 1.75% silver; about 0.8% copper; about 1.0% antimony; about 0.008% cobalt; and about 96.44% to about 97.2% tin.
  • This alloy also showed an improved fatigue life over SAC alloys in JEDEC drop tests of 150Og X 0.5 meters.
  • the solder composition comprises about 0.02% to about 1.0% silver; about 0.2% to about 0.8% copper; about 0.2% to about 0.8% antimony, about 0.008% to about 0.4% cobalt, and about 97% to about 99.6% tin.
  • the present solder compositions may comprise about 85% to about 87% tin; about 87% to about 89% tin; about 89% to about 91% tin; about 91% to about 93% tin; about 93% to about 95% tin; about 95% to about 97% tin; or about 97% to about 99% tin, or a combination of two or more of the above ranges (e.g., from about 95% to about 99% tin).
  • the present solder compositions may comprise about 0.01% to about 0.05% silver; about 0.05% to about 0.1% silver; about 0.1% to about 0.5% silver; about 0.5% to about 1.0% silver; about 1.0% to about 2.0% silver; about 2.0% to about 3.0% silver; about 3.0% to about 4.0% silver; or about 4.0% to about 4.5% silver, or a combination of two or more of the above ranges (e.g., from about 1.0% to about 3% silver).
  • the present solder compositions may comprise about 0.01% to about 0.05% copper; about 0.05% to about 0.1% copper; about 0.1% to about 0.5% copper; about 0.5% to about 1.0% copper; about 1.0% to about 2.0% copper; or about 2.0% to about 3.0% copper, or a combination of two or more of the above ranges (e.g., from about 0.1% to about 1% copper).
  • the present solder compositions may comprise about 0.002% to about 0.005% antimony; about 0.005% to about 0.01% antimony; about 0.01% to about 0.05% antimony; about 0.05% to about 0.1% antimony; about 0.1% to about 0.5% antimony; or about 0.5% to about 1.0% antimony; about 1.0% to about 2.0% antimony; about 2.0% to about 5.0% antimony; or a combination of two or more of the above ranges (e.g., from about 0.1% to about 1% antimony).
  • the present solder compositions may comprise about 0.002% to about 0.005% nickel; about 0.005% to about 0.01% nickel; about 0.01% to about 0.05% nickel; about 0.05% to about 0.1% nickel; about 0.1% to about 0.5% nickel; or about 0.5% to about 1.0% nickel, or a combination of two or more of the above ranges (e.g., from about 0.01% to about 0.1% nickel).
  • the present solder compositions may comprise about 0.002% to about 0.005% cobalt; about 0.005% to about 0.01% cobalt; about 0.01% to about 0.05% cobalt; about 0.05% to about 0.1% cobalt; about 0.1% to about 0.5% cobalt; or about 0.5% to about 1.0% cobalt, or a combination of two or more of the above ranges (e.g., from about 0.01% to about 0.1% cobalt).
  • the combination of antimony with nickel or cobalt may inhibit the SAC alloy from dissolving copper and forming large intermetallic platelets, thereby yielding a more stable matrix over time, and providing better stability and more uniform joint strength.
  • the alloys of the invention exhibit excellent wetting and melting temperatures, as well as superior physical strength, electrical conductivity, and thermocycling fatigue, for example.
  • the solder alloy compositions of the present invention may be successfully substituted for the known tin-lead alloys currently used for electronics assembly and printed circuit board manufacture, as well as lead less component bumping arrays and column arrays. Most capital equipment used in electronic soldering can employ these compositions.
  • the low melting temperature is low enough not to cause heating damage to the board or components therein.
  • the alloy compositions of the present invention are well suited for many different applications. The alloys may be employed in the coating of circuit boards and printed circuit board manufacture by use of "hot-air leveling" or "roll-tinning".
  • the alloys may be used in the assembly of electronic components on printed circuit boards when using a wavesoldering machine.
  • the alloys are also well suited for formation into various shapes and sizes, such as bars, ingots, wire, chips, ribbons, powder, preform and can be used with a core of flux. Therefore, the alloys of the present invention may be used for assembly of electronic components using solder wire and a heating device to hand solder the components to the board.
  • the compositions of the present invention have superior wetting characteristics and improved productivity. Tin-lead alloys of the prior art are easily contaminated by copper from the PC boards that are dipped into a bath during processing. Since the compositions of the present invention contain copper, minor increases in the copper content do not readily affect performance of the compositions. In addition, these new compositions will not absorb copper as quickly as prior art tin-lead solders. As a result, these new alloys can remain functional much longer than prior art tin-lead alloys to reduce overall solder consumption drastically and reduce outlay by manufacturers. Moreover, the solderability of the coated board is extended because the intermetallics are distributed evenly throughout the grain boundary of the composition. The result is a higher quality printed circuit board that cannot be achieved by the use of prior art solder compositions.
  • the compositions of the present invention can employ the same hot temperatures, preheat temperatures, and process parameters as prior art tin-lead solders now currently in use.
  • the nominal composition is very close to a eutectic alloy which exhibits physical characteristics important to high speed, low defect soldering. Since the solder alloys of the invention are less easily contaminated than tin-lead alloys, an increased usable life of the solder bath results. Further, solder joints formed by wavesoldering yield higher joint strengths and excellent electrical conductivity with even distribution of intermetallics throughout the solder joint.
  • solder alloy compositions of the present invention may also be used in the assembly of electronic components using solder wire in a heating device to hand solder the components to the board. Such a method requires a composition that wets and spreads quickly at about 235° to about 260° C.
  • the composition of the present invention can be easily formed into a cored wire solder and used easily and successfully in hand soldering.
  • the alloy compositions of the present invention enjoy a combination of a sufficiently low melting temperature for electronic applications, superior wetting characteristics, and superior mechanical strength to make it an excellent alternative to tin-lead alloys for the needs of the electronic industry for manufacture of printed circuit boards and the assembly of components onto the boards.
  • the superior solderability and wetting characteristics yield even pad thicknesses and low copper solubility to provide a tremendous advantage in the solder coating of printed circuit boards, such as by hot air leveling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une composition d'alliage pour brasure, exempte de plomb et de bismuth, pour des applications, à toxicité réduite, à des ensembles électroniques. La composition d'alliage comprend environ 0,01 % à environ 4,5 % d'argent ; environ 0,01 % à environ 3 % de cuivre ; environ 0,002 % à environ 5,0 % d'antimoine ; environ 85 % à environ 99 % d'étain, et environ 0,002 % à environ 1 % soit de nickel, soit de cobalt. La composition d'alliage présente une température de fusion d'environ 217 °C, avec un mouillage et une résistance mécanique supérieure, ce qui rend la composition d'alliage tout à fait appropriée pour la fabrication de cartes de circuits imprimés et, du fait des séries de bossages et de colonnes du composant exempt de plomb, ladite composition convient pour remplacer les brasures étain-plomb conventionnelles.
EP06759560A 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain Withdrawn EP1880032A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67986905P 2005-05-11 2005-05-11
PCT/US2006/018235 WO2006122240A2 (fr) 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain

Publications (2)

Publication Number Publication Date
EP1880032A2 true EP1880032A2 (fr) 2008-01-23
EP1880032A4 EP1880032A4 (fr) 2009-03-04

Family

ID=37397305

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06759560A Withdrawn EP1880032A4 (fr) 2005-05-11 2006-05-11 Compositions de brasure a base d'alliage d'etain

Country Status (5)

Country Link
US (1) US20060263234A1 (fr)
EP (1) EP1880032A4 (fr)
CA (1) CA2607286A1 (fr)
MX (1) MX2007013971A (fr)
WO (1) WO2006122240A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111230355A (zh) * 2019-10-06 2020-06-05 普鲁沃斯特.让-克劳德.卢锡安 用于取代Sn-Pb合金、SAC305、Sn-Cu和Sn100C的无铅焊料合金

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051181A1 (fr) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. Alliage de soudure tendre sans plomb
CN101918170B (zh) * 2008-01-03 2015-09-02 怡德乐纳斯公司 焊料线缆结构
US20100059576A1 (en) * 2008-09-05 2010-03-11 American Iron & Metal Company, Inc. Tin alloy solder composition
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
KR101436714B1 (ko) * 2010-06-01 2014-09-01 센주긴조쿠고교 가부시키가이샤 납프리 솔더 페이스트
JP5878290B2 (ja) * 2010-12-14 2016-03-08 株式会社日本スペリア社 鉛フリーはんだ合金
US11229979B2 (en) * 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN107635716B (zh) * 2015-05-05 2021-05-25 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金
JP6292342B1 (ja) * 2017-09-20 2018-03-14 千住金属工業株式会社 Ｃｕ管及び／又はＦｅ管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手
US11732330B2 (en) * 2017-11-09 2023-08-22 Alpha Assembly Solutions, Inc. High reliability lead-free solder alloy for electronic applications in extreme environments
CN109014652A (zh) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 一种环保型焊锡材料及其制备工艺
CN114227057B (zh) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 无铅焊料合金及其制备方法、用途
WO2024101041A1 (fr) * 2022-11-07 2024-05-16 富士電機株式会社 Matériau de soudure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (fr) * 1993-04-29 1994-11-10 Seelig Karl F Composition d'alliage a l'etain pour braser exempte de bismuth et de plomb
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
WO2001034860A1 (fr) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Alliage a souder
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US5352407A (en) * 1993-04-29 1994-10-04 Seelig Karl F Lead-free bismuth free tin alloy solder composition
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US5762716A (en) * 1997-01-09 1998-06-09 American Iron & Metal Company, Inc. Methods for wiping a metal contaminated surface with a water soluble fabric
KR20010072364A (ko) * 1999-06-11 2001-07-31 이즈하라 요조 무연 땜납

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
WO1994025634A1 (fr) * 1993-04-29 1994-11-10 Seelig Karl F Composition d'alliage a l'etain pour braser exempte de bismuth et de plomb
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
WO2001034860A1 (fr) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Alliage a souder
JP2004141910A (ja) * 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd 鉛フリーはんだ合金

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KARIM Z S ET AL: "LEAD-FREE SOLDER BUMP TECHNOLOGIES FOR FLIP-CHIP PACKAGING APPLICATIONS" PROCEEDINGS OF THE SPIE, SPIE, vol. 4587, 9 November 2001 (2001-11-09), pages 581-587, XP008029398 *
See also references of WO2006122240A2 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111230355A (zh) * 2019-10-06 2020-06-05 普鲁沃斯特.让-克劳德.卢锡安 用于取代Sn-Pb合金、SAC305、Sn-Cu和Sn100C的无铅焊料合金

Also Published As

Publication number Publication date
MX2007013971A (es) 2008-02-22
WO2006122240A3 (fr) 2007-02-01
US20060263234A1 (en) 2006-11-23
CA2607286A1 (fr) 2006-11-16
WO2006122240A2 (fr) 2006-11-16
EP1880032A4 (fr) 2009-03-04

Similar Documents

Publication Publication Date Title
US5405577A (en) Lead-free and bismuth-free tin alloy solder composition
US20060263234A1 (en) Tin alloy solder compositions
EP1468777B1 (fr) Soudure tendre sans plomb
US10322471B2 (en) Low temperature high reliability alloy for solder hierarchy
CN102066042B (zh) 无铅焊料
KR101738841B1 (ko) Ｂｉ-Ｓｎ계 고온 땜납 합금으로 이루어진 고온 땜납 이음
WO2009131178A1 (fr) Alliage de brasage sans plomb ayant une apparition de cavité de retrait supprimée
JP4770733B2 (ja) はんだ及びそれを使用した実装品
US20070172381A1 (en) Lead-free solder with low copper dissolution
KR20100113626A (ko) 납프리 땜납 합금
US9175368B2 (en) MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
EP1971699A2 (fr) Brasure sans plomb avec une faible dissolution du cuivre
US11607752B2 (en) Solder alloy, solder joint material, and electronic circuit board
KR20100132470A (ko) 무연 솔더 합금
JP2001071173A (ja) 無鉛はんだ
US20100059576A1 (en) Tin alloy solder composition
CN113677477B (zh) 焊料合金、焊膏、预成型焊料、焊料球、线状焊料、带芯焊料、焊接接头、电子电路基板和多层电子电路基板
EP2747933B1 (fr) Alliage de soudure à base de sn dopé au mn et ses joints de soudure à meilleure fiabilité contre les chocs de chute
CN115397605A (zh) 无铅且无锑的软钎料合金、焊料球和钎焊接头
WO1999004048A1 (fr) Soudures sans plomb a base d'etain-bismuth
JP5051633B2 (ja) はんだ合金
CN113385853A (zh) 一种低银高可靠无铅软钎料及其制备方法、应用
KR101142814B1 (ko) 저은 땜납 합금 및 땜납 페이스트 조성물
JP7421157B1 (ja) はんだ合金、はんだペースト及びはんだ継手
WO2024034689A1 (fr) Alliage de soudage, pâte à souder et joint à brasure tendre

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070919

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20090130

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 13/02 20060101AFI20070110BHEP

Ipc: B23K 35/26 20060101ALI20090126BHEP

Ipc: C22C 13/00 20060101ALI20090126BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090428