WO2007045191A3 - Alliage de brasage sans plomb - Google Patents

Alliage de brasage sans plomb Download PDF

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Publication number
WO2007045191A3
WO2007045191A3 PCT/CZ2006/000067 CZ2006000067W WO2007045191A3 WO 2007045191 A3 WO2007045191 A3 WO 2007045191A3 CZ 2006000067 W CZ2006000067 W CZ 2006000067W WO 2007045191 A3 WO2007045191 A3 WO 2007045191A3
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
lead
free solder
solder alloy
tin
Prior art date
Application number
PCT/CZ2006/000067
Other languages
English (en)
Other versions
WO2007045191A2 (fr
Inventor
Jan Jenik
Original Assignee
Jan Jenik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jan Jenik filed Critical Jan Jenik
Publication of WO2007045191A2 publication Critical patent/WO2007045191A2/fr
Publication of WO2007045191A3 publication Critical patent/WO2007045191A3/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un alliage de brasage sans plomb disposé sur une base d'alliages provenant d'un groupe d'alliages constitué d'un alliage de bismuth et d'étain, d'un alliage de cuivre, de nickel et d'étain, et d'un alliage de cuivre, d'argent et d'étain, contenant 0,005 à 1 % en poids de phosphore.
PCT/CZ2006/000067 2005-10-19 2006-10-16 Alliage de brasage sans plomb WO2007045191A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CZ20050659A CZ297596B6 (cs) 2005-10-19 2005-10-19 Bezolovnatá pájka
CZPV2005-659 2005-10-19

Publications (2)

Publication Number Publication Date
WO2007045191A2 WO2007045191A2 (fr) 2007-04-26
WO2007045191A3 true WO2007045191A3 (fr) 2007-11-29

Family

ID=37671988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CZ2006/000067 WO2007045191A2 (fr) 2005-10-19 2006-10-16 Alliage de brasage sans plomb

Country Status (2)

Country Link
CZ (1) CZ297596B6 (fr)
WO (1) WO2007045191A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
DK3052931T3 (da) 2013-09-30 2023-10-30 Cytiva Sweden Ab Fremgangsmåde til overførsel af opslæmning
EP3107683B1 (fr) 2014-02-20 2021-12-08 Honeywell International Inc. Procédé de formation d'un fil de soudure

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0336575A1 (fr) * 1988-03-31 1989-10-11 COOKSON GROUP plc Compositions d'alliages à basse toxicité pour joindre et rendre étanche
JPH1034376A (ja) * 1996-07-26 1998-02-10 Nippon Genma:Kk 無鉛はんだ
US5980822A (en) * 1997-02-15 1999-11-09 Samsung Electronics Co., Ltd. Leadless alloy for soldering
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ
WO2001003878A1 (fr) * 1999-07-07 2001-01-18 Multicore Solders Limited Alliage pour soudures
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1273384A1 (fr) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
US20030024733A1 (en) * 2001-03-06 2003-02-06 Hitachi Cable Ltd. Lead-free solder, and connection lead and electrical component using said lead-free solder
WO2005048303A2 (fr) * 2003-11-06 2005-05-26 Indium Corporation Of America Alliages exempts de plomb anti-delaminage pour soudage par refusion d'un montage en surface

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (fr) * 1995-09-01 1997-03-13 Sarnoff Corporation Composition de brasage
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0336575A1 (fr) * 1988-03-31 1989-10-11 COOKSON GROUP plc Compositions d'alliages à basse toxicité pour joindre et rendre étanche
JPH1034376A (ja) * 1996-07-26 1998-02-10 Nippon Genma:Kk 無鉛はんだ
US5980822A (en) * 1997-02-15 1999-11-09 Samsung Electronics Co., Ltd. Leadless alloy for soldering
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ
WO2001003878A1 (fr) * 1999-07-07 2001-01-18 Multicore Solders Limited Alliage pour soudures
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
US20030024733A1 (en) * 2001-03-06 2003-02-06 Hitachi Cable Ltd. Lead-free solder, and connection lead and electrical component using said lead-free solder
EP1273384A1 (fr) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
WO2005048303A2 (fr) * 2003-11-06 2005-05-26 Indium Corporation Of America Alliages exempts de plomb anti-delaminage pour soudage par refusion d'un montage en surface

Also Published As

Publication number Publication date
CZ2005659A3 (cs) 2007-01-10
WO2007045191A2 (fr) 2007-04-26
CZ297596B6 (cs) 2007-01-10

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