EP1758214B1 - Assemblage avec un module semiconducteur de puissance et un connecteur - Google Patents

Assemblage avec un module semiconducteur de puissance et un connecteur Download PDF

Info

Publication number
EP1758214B1
EP1758214B1 EP06017500A EP06017500A EP1758214B1 EP 1758214 B1 EP1758214 B1 EP 1758214B1 EP 06017500 A EP06017500 A EP 06017500A EP 06017500 A EP06017500 A EP 06017500A EP 1758214 B1 EP1758214 B1 EP 1758214B1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
semiconductor module
housing
connector
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06017500A
Other languages
German (de)
English (en)
Other versions
EP1758214A1 (fr
Inventor
Frank Ebersberger
Jürgen Steger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP1758214A1 publication Critical patent/EP1758214A1/fr
Application granted granted Critical
Publication of EP1758214B1 publication Critical patent/EP1758214B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Definitions

  • the invention describes an arrangement having a power semiconductor module with spring elements designed as contact elements and at least one connection connector for these contact elements.
  • the DE 10 2004 025 609 A1 discloses a power semiconductor module for mounting on a cooling device, with a housing and connection elements for load and auxiliary connections.
  • the load connection elements are in this case formed as metal moldings with a recess for a screw connection.
  • the auxiliary terminals are designed as spring contact elements for pressure contact with a printed circuit board arranged above the power semiconductor module. This printed circuit board preferably forms the entire external supply line, both the load and the auxiliary terminals.
  • Such a configuration is particularly suitable for a large number of auxiliary contacts, for example for the control terminals of the power semiconductor modules arranged in the power semiconductor components, their auxiliary emitter terminals and additional sensor connections.
  • auxiliary contacts for example for the control terminals of the power semiconductor modules arranged in the power semiconductor components, their auxiliary emitter terminals and additional sensor connections.
  • the connection proves to be too expensive by means of circuit board, especially if the external load leads are not formed by the same circuit board.
  • the FR-A-2763182 discloses a plug-in power supply with flexible terminal assignment formed as an arrangement with a power electronic circuit and with an interchangeable connector connector, wherein the power electronic circuit is arranged in a housing with connection elements for load connections.
  • the load terminals are designed as spring contact elements, which are arranged in the interior of the housing.
  • the terminal connector forms a further integral housing part and has connection means for connection to the load terminals. The connection connector thus connects the load connections with different external connection contacts.
  • the present invention is based on the object to present an arrangement with a power semiconductor module, wherein external leads can be connected in a simple manner with trained as a spring contact elements connecting elements, preferably auxiliary connection elements.
  • the basic idea of the invention is based on a power semiconductor module having an insulating housing and a cover advantageously integrally connected thereto.
  • the power semiconductor module has power terminals and auxiliary terminals to its external terminal. According to the invention, these are at least partially designed as spring contact elements leading out of the housing.
  • the arrangement further has a connection connector which is connected to the housing of the power semiconductor module is connected.
  • the housing has first connection devices and the connection connector has second connection devices.
  • the connection connector is preferably formed as an insulating molded body with at least one at least partially embedded therein metal moldings. This metal molding has at least one contact surface for contacting with the spring contact element of the power semiconductor module and at least one contact element for external connection contacting.
  • connection connector 1 shows a connection connector for the arrangement with a power semiconductor module.
  • FIG. 2 shows an embodiment of a power semiconductor module.
  • FIG 3 shows the arrangement according to the invention with a power semiconductor module and a connection connector.
  • FIG. 1 shows a connection connector (6) for the arrangement with a power semiconductor module (1), wherein FIG. 1a shows the connection connector (6) in a three-dimensional view obliquely from above and FIG. 1b shows the connection connector (6) from below.
  • Shown here is in each case an insulating molded body (60), preferably made of plastic, with a recess (62) for carrying out a fastening screw.
  • the Isolierstoffformmaschine (60) has three as locking lugs (64) formed extensions. These detents (64) are arranged on the side facing the power semiconductor module (1) side of the connection connector (6).
  • connection connector (6) In the Isolierstoffform Sciences (60) injected here are two metal moldings (7), which protrude on the top of the connection connector (6) from the Isolierstoffform Sciences (60) and each form a plug (70). Alternatively, receptacles, solder tails or solder pins are preferred embodiments of these contact elements. It is further preferred if in the arrangement of a plurality of contact elements (70) of a connection connector (6), these contact elements are formed differently. For example, this can be realized by different width plug. Thus, the contact element are designed confusion.
  • the metal moldings (7) each form a contact surface (72) for contacting with a spring contact element (50).
  • the Isolierstoffform manipulate (60) is formed on the underside of the connection connector (6) such that these contact surfaces (72) do not protrude beyond the lower boundary of the connection connector (6), but are preferably set back relative to this limit.
  • the metal moldings (7) are for insulation to each other in Isolierstoffform moments (6) and also far enough away from each other sufficiently.
  • FIG. 2 shows an embodiment of a further developed power semiconductor module (1) according to the invention with a base plate (2) and a plastic housing (3) which encloses power semiconductor components arranged therein.
  • the power semiconductor module has load (4) and auxiliary terminals (5).
  • the load connection elements (4) are designed as metal moldings with a recess for screw connections, while auxiliary connections (5) arranged on the upper side of the power semiconductor module (1) are designed as contact springs (50), in this case as barrel springs.
  • These barrel springs (50) extend through domed recesses (30) for positioning the barrel springs (50) out of the housing (3) to permit external contacting.
  • the housing has four further recesses (36) which serve to secure a printed circuit board arranged above the power semiconductor module (1).
  • the housing (3) has connecting devices for arranging at least one connection connector (6). These connecting devices are arranged adjacent to the auxiliary contact terminals (30) and formed here as further recesses (32, 34). Shown are two variants of the recesses.
  • the first embodiment has a recess (32) with an extension designed as a dome, in which a screw is arranged and fixed therein.
  • the second embodiment is a plurality of recesses (34) which serve as passages for latching lugs (64) and wherein the recesses surrounding areas of the housing (3) act on the inside as a counter to these latching lugs (64).
  • FIG. 3 shows the arrangement according to the invention with a power semiconductor module (1) according to FIG. 2 and a connection connector (6) according to FIG. 1.
  • the latching lugs (64) of the connection connector (6) are in the associated recesses (32) of the housing (3) of the power semiconductor module (1).
  • the secure electrical connection between the barrel springs (50) and the contact surfaces (72) of the connection connector (6) is produced.
  • a plug contact (70) on the power semiconductor module (1) is available through the arrangement according to the invention for the external supply line.
  • connection connector (6) can be connected to the power semiconductor module (1) by means of a screw, not shown. This presented an alternative to the snap-lock connection (34, 64), but can also be combined with this. If a screw connection is the only force-fitting line via the connection connector (6) to the spring contact element (50), the connection connector (6) preferably has at least one pin-like projection, similar to the latching lugs, for the rotationally secure arrangement of the connection connector (6) on the housing (3 ) of the power semiconductor module (1). Also suitable is a pin-like extension of the housing with an associated recess of the connection connector.

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Claims (6)

  1. Dispositif avec un module semi-conducteur de puissance (1) comportant des éléments de contact à ressort et avec un connecteur (6), dans lequel le module semi-conducteur de puissance (1) comporte un boîtier (3) ainsi que des éléments de connexion pour des connexions de charge (4) et auxiliaires (5), dans lequel les connexions auxiliaires sont conçues comme des ressorts bombés (50) traversant à chaque fois un dôme associé et en partie sortant du boîtier (3) et le boîtier (3) comporte des premiers dispositifs de liaison (32, 34) pour la liaison avec le connecteur (6), ce dernier comportant des deuxièmes dispositifs de liaison (62, 64) pour la liaison avec le boîtier (3) du module semi-conducteur de puissance (1) et au moins un corps moulé en métal (7) avec au moins une surface de contact (72) pour le contact avec un élément de contact à ressort (5) d'une connexion auxiliaire du module semi-conducteur de puissance (1) et avec au moins un élément de contact (70) pour le contact de connexion externe et dans lequel le dispositif de liaison (32, 62) entre le module semi-conducteur de puissance (1) et le connecteur (6) est au moins un assemblage à vis, le boîtier (3) du module semi-conducteur de puissance (1) comportant un évidement (32, 62) conçu comme un dôme, une vis passant à travers l'évidement (62) du connecteur (6) et cette vis se fixant dans l'évidement (32) du boîtier (3).
  2. Dispositif selon la revendication 1, dans lequel les dispositifs de liaison (34, 64) du module semi-conducteur de puissance (1) et du connecteur (6) forment conjointement au moins un assemblage à cran à enclenchement, des évidements (34) dans le boîtier (3) du module semi-conducteur de puissance (1) formant les butées des taquets d'arrêt (64) du connecteur (6).
  3. Dispositif selon la revendication 1, dans lequel le connecteur (6) est conçu comme un corps moulé en matière isolante (60) avec au moins un corps moulé en métal (7) injecté.
  4. Dispositif selon la revendication 1, dans lequel le ou les éléments de contact (70) pour le contact de connexion externe est conçu ou sont conçus comme une ou des fiches mâles ou une ou des douilles.
  5. Dispositif selon la revendication 5, dans lequel, en présence de plusieurs éléments de contact (70), ceux-ci sont conçus de manière à ne pas pouvoir être confondus.
  6. Dispositif selon la revendication 1, dans lequel le ou les éléments de contact (70) pour le contact de connexion externe est conçu ou sont conçus comme une ou des lames à braser ou un ou des plots de brasage.
EP06017500A 2005-08-24 2006-08-23 Assemblage avec un module semiconducteur de puissance et un connecteur Not-in-force EP1758214B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005039946A DE102005039946A1 (de) 2005-08-24 2005-08-24 Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder

Publications (2)

Publication Number Publication Date
EP1758214A1 EP1758214A1 (fr) 2007-02-28
EP1758214B1 true EP1758214B1 (fr) 2007-12-19

Family

ID=37517179

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06017500A Not-in-force EP1758214B1 (fr) 2005-08-24 2006-08-23 Assemblage avec un module semiconducteur de puissance et un connecteur

Country Status (7)

Country Link
EP (1) EP1758214B1 (fr)
JP (1) JP4834486B2 (fr)
CN (1) CN1921110B (fr)
AT (1) ATE381798T1 (fr)
DE (2) DE102005039946A1 (fr)
DK (1) DK1758214T3 (fr)
ES (1) ES2299127T3 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058694B4 (de) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
DE102008012570B4 (de) 2008-03-04 2014-02-13 Infineon Technologies Ag Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102008034467B4 (de) * 2008-07-24 2014-04-03 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung
DE102013113143B4 (de) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417752B2 (fr) * 1971-10-05 1979-07-02
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
JPH02150771A (ja) * 1988-12-01 1990-06-11 Nec Corp 速度計測装置
JP3201187B2 (ja) * 1994-12-08 2001-08-20 富士電機株式会社 半導体装置
JPH08255643A (ja) * 1995-01-18 1996-10-01 Furukawa Electric Co Ltd:The プリント基板用コネクタ
TW328403U (en) * 1997-05-09 1998-03-11 Formosa Electronicindustries Inc Ac/dc power supplier having a replaceable plug
CN2315700Y (zh) * 1997-06-04 1999-04-21 吴祖榆 交直流两用可抽换电源插头的电源供应器
US6669495B2 (en) * 2000-11-06 2003-12-30 Research In Motion Limited Universal adapter with interchangeable plugs
DE10100460B4 (de) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
JP3644406B2 (ja) * 2001-05-08 2005-04-27 株式会社デンソー 指針計器及びその回動内機
EP1291914A1 (fr) * 2001-09-10 2003-03-12 ABB Schweiz AG Dispositif semi-conducteur de puissance du type de contact à pression
DE102004025609B4 (de) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul

Also Published As

Publication number Publication date
CN1921110A (zh) 2007-02-28
ATE381798T1 (de) 2008-01-15
JP4834486B2 (ja) 2011-12-14
ES2299127T3 (es) 2008-05-16
DE102005039946A1 (de) 2007-03-01
DK1758214T3 (da) 2008-04-07
JP2007059393A (ja) 2007-03-08
DE502006000232D1 (de) 2008-01-31
CN1921110B (zh) 2010-12-01
EP1758214A1 (fr) 2007-02-28

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