EP1754936B1 - Kühlvorrichtung für lichtemittierende Elemente - Google Patents

Kühlvorrichtung für lichtemittierende Elemente Download PDF

Info

Publication number
EP1754936B1
EP1754936B1 EP05017833A EP05017833A EP1754936B1 EP 1754936 B1 EP1754936 B1 EP 1754936B1 EP 05017833 A EP05017833 A EP 05017833A EP 05017833 A EP05017833 A EP 05017833A EP 1754936 B1 EP1754936 B1 EP 1754936B1
Authority
EP
European Patent Office
Prior art keywords
light emitting
seat body
seat
diode
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP05017833A
Other languages
English (en)
French (fr)
Other versions
EP1754936A1 (de
Inventor
An-Si Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Excel Cell Electronic Co Ltd
Original Assignee
Excel Cell Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Excel Cell Electronic Co Ltd filed Critical Excel Cell Electronic Co Ltd
Priority to DE602005011277T priority Critical patent/DE602005011277D1/de
Priority to AT05017833T priority patent/ATE415596T1/de
Priority to EP05017833A priority patent/EP1754936B1/de
Publication of EP1754936A1 publication Critical patent/EP1754936A1/de
Priority to HK07105033.1A priority patent/HK1100298A1/xx
Application granted granted Critical
Publication of EP1754936B1 publication Critical patent/EP1754936B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This invention relates to a light emitting assembly, more particularly to a light emitting assembly including a thermally conductive heat-dissipating device provided with a plurality of fins, and at least one light emitting device mounted on the thermally conductive heat-dissipating device.
  • this invention relates to a light emitting assembly including at least one light emitting device including a thermally conductive diode seat and a light emitting diode mounted on said diode seat; and a thermally conductive heat-dissipating device including a seat body that has an upper surface; wherein said diode seat is mounted on said upper surface of said seat body; and wherein said seat body is provided with a plurality of fins that project therefrom and that are spaced apart from each other; and wherein said seat body has a peripheral edge, said fins being distributed along and extending downwardly from said peripheral edge of said seat body.
  • a light emitting assembly of this type is known from the European Patent Application EP 0 559 124 A1 .
  • the European Patent Application EP 1 467 414 A1 discloses a light emitting diode (LED) and a LED lamp consisted of LEDs.
  • the LED comprises at least one LED chip.
  • the LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board.
  • the LED chip also has a transparent medium layer on it.
  • the base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically.
  • the LED is electrically connected to a driving circuit through its outgoing wires.
  • the driving circuit is in turn electrically connected to an electrical connector through its housing.
  • a LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing.
  • Lighting devices that include a light emitting diode, such as automotive lighting devices and indoor lighting devices, are known in the art.
  • heat will be simultaneously generated by the light emitting diode, and the generated heat will increase with an increase in the intensity of the emitted light.
  • the heat generated has to be sufficiently dissipated. Otherwise, it will accumulate in the light emitting diode and result in an increase in the temperature of the light emitting diode and those of components in the vicinity of the light emitting diode. The light emitting diode and the nearby components are easily damaged due to the elevated temperature.
  • the object of the present invention is to provide a light emitting assembly that can overcome the aforesaid drawback of the prior art.
  • a light emitting assembly of the aforementioned kind is characterized in that two adjacent ones of said fins extend downwardly from said seat body in a first direction (X) and a second direction (Y), respectively, the first direction (X) and the second direction (Y) forming an acute angle ( ⁇ ) therebetween.
  • a light emitting assembly according to prior art is shown to include a light emitting device 20 and a thermally conductive heat-dissipating device 10.
  • the light emitting device 20 includes a thermally conductive diode seat 22 and a light emitting diode 21 mounted on the diode seat 22.
  • the thermally conductive heat-dissipating device 10 includes a seat body 100 that has an upper surface 101 on which the diode seat 22 is mounted, and that is provided with a plurality of fins 103 projecting therefrom and spaced apart from each other.
  • the seat body 100 of the heat-dissipating device 10 is formed with a recess 104 indented inwardly from the upper surface 101 of the seat body 100.
  • the diode seat 22 has a cylindrical body 222 that is fitted into the recess 104, and an annular flange 221 that is enlarged in cross-section from the cylindrical body 222 and that contacts the upper surface 101 of the seat body 100 at a periphery of the recess 104.
  • the diode seat 22 further has an annular wall 224 that extends upwardly, and that is reduced in cross-section from the annular flange 221.
  • the light emitting diode 21 is received in the annular wall 224, and has a pair of conductive terminals 223 extending downwardly through the annular flange 221 and the cylindrical body 222.
  • the light emitting assembly may further include a circuit board 40, and a plurality of fasteners 30.
  • the circuit board 40 is disposed below and is spaced apart from the seat body 100, and the fins 103 extend between the seat body 100 and the circuit board 40.
  • the circuit board 40 has a plurality of first through-holes 401 and a plurality of second through-holes 402.
  • Each of the fasteners 30 extends through a respective fastening hole 105 in the seat body 100 and a respective first through hole 401 in the circuit board 40, so as to secure the circuit board 40 to the seat body 100.
  • each of the conductive terminals 223, which extend downwardly from the light emitting diode 21, extends through a respective one of the second through-holes 402 so as to couple electrically the light emitting diode 21 to the circuit board 40.
  • Each of the fasteners 30 may include a screw rod 301 extending through the respective fastening hole 105 and the respective first through-hole 401, and a pair of screw nuts 302 that engage threadedly and respectively two opposite ends of the screw rod 301.
  • Fig. 3 illustrates an embodiment of the light emitting assembly according to prior art.
  • the seat body 100 has a peripheral edge.
  • the fins 103 are distributed along and extend downwardly from the peripheral edge of the seat body 100.
  • Fig. 4 illustrates an embodiment of the light emitting assembly according to this invention.
  • two adjacent ones of the fins 103 extend downwardly from the seat body 100 in a first direction (X) and a second direction (Y), respectively.
  • the first direction (X) and the second direction (Y) form an acute angle ⁇ therebetween.
  • the seat body 100 of the heat-dissipating device 10 is formed with a recess 104 indented inwardly from the upper surface 101 of the seat body 100.
  • the diode seat 22 has a cylindrical body 222 that is fitted into the recess 104, and an annular flange 221 that is enlarged in cross-section from the cylindrical body 222 and that contacts the upper surface 101 of the seat body 100 at a periphery of the recess 104.
  • the diode seat 22 further has an annular wall 224 that extends upwardly, and that is reduced in cross-section from the annular flange 221.
  • the light emitting diode 21 is received in the annular wall 224, and has a pair of conductive terminals 223 extending downwardly through the annular flange 221 and the cylindrical body 222.
  • the light emitting assembly may further include a circuit board 40, and a plurality of fasteners 30.
  • the circuit board 40 is disposed below and is spaced apart from the seat body 100, and the fins 103 extend between the seat body 100 and the circuit board 40.
  • the circuit board 40 has a plurality of first through-holes 401 and a plurality of second through-holes 402.
  • Each of the fasteners 30 extends through a respective fastening hole 105 in the seat body 100 and a respective first through hole 401 in the circuit board 40, so as to secure the circuit board 40 to the seat body 100.
  • each of the conductive terminals 223, which extend downwardly from the light emitting diode 21, extends through a respective one of the second through-holes 402 so as to couple electrically the light emitting diode 21 to the circuit board 40.
  • each of the fasteners 30 includes a screw rod 301 extending through the respective fastening hole 105 and the respective first through-hole 401, and a pair of screw nuts 302 that engage threadedly and respectively two opposite ends of the screw rod 301.
  • the heat generated by the light emitting diode 21 can be efficiently dissipated by the thermally conductive heat-dissipating device 10 by virtue of the fins 103 of a specific design. Therefore, heat damage to the light emitting diode 20 and the nearby components can be avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (4)

  1. Lichtemittierende Anordnung, die einschließt:
    zumindest eine lichtemittierende Einrichtung (20), die einen thermisch leitfähigen Diodensitz (22) und eine an dem Diodensitz (22) befestigte lichtemittierende Diode (21) einschließt; und eine thermisch leitfähige wärmeableitende Einrichtung (10), die einen Sitzkörper (100) mit einer oberen Oberfläche (101) einschließt; wobei der Diodensitz (22) an der oberen Oberfläche (101) des Sitzkörpers (100) befestigt ist; und wobei der Sitzkörper (100) mit einer Vielzahl von Lamellen (103) versehen ist, die von diesem wegragen und voneinander beabstandet angeordnet sind; und wobei der Sitzkörper (100) einen umlaufenden Rand aufweist, wobei die Lamellen (103) entlang dieses umlaufenden Randes des Sitzkörpers (100) verteilt sind und sich von diesem nach unten erstrecken;
    dadurch gekennzeichnet, dass
    zwei einander benachbarte der Lamellen (103) sich von dem Sitzkörper (100) weg jeweils in einer ersten Richtung (X) und einer zweiten Richtung (Y) nach unten erstrecken, wobei die erste Richtung (X) und die zweite Richtung (Y) dazwischen einen spitzen Winkel (θ) bilden.
  2. Lichtemittierende Anordnung nach Anspruch 1, dadurch gekennzeichnet, dass der Sitzkörper (100) der wärmeableitenden Einrichtung (10) mit einer von der oberen Oberfläche (101) des Sitzkörpers (100) nach innen gekerbten Ausnehmung (104) ausgebildet ist, wobei der Diodensitz (22) einen zylindrischen Körper (222), der in die Ausnehmung (104) eingepasst ist, sowie einen ringförmigen Flansch (221) aufweist, der ausgehend vom zylindrischen Körper (222) im Querschnitt erweitert ist und mit der oberen Oberfläche (101) des Sitzkörpers (100) an einem Randgebiet der Ausnehmung (104) in Kontakt tritt.
  3. Lichtemittierende Anordnung nach Anspruch 2, dadurch gekennzeichnet, dass der Diodensitz (22) des Weiteren eine ringförmige Wand (224) aufweist, die sich nach oben erstreckt und ausgehend vom ringförmigen Flansch (221) im Querschnitt verringert ist, wobei die lichtemittierende Diode (21) in der ringförmigen Wand (224) aufgenommen ist und ein Paar von leitfähigen Anschlüssen (223) aufweist, die sich durch den ringförmigen Flansch (221) und den zylindrischen Körper (222) nach unten erstrecken.
  4. Lichtemittierende Anordnung nach Anspruch 1, des Weiteren gekennzeichnet durch eine Schaltungsplatte (40), die unter dem Sitzkörper (100) und in einem Abstand von dem Sitzkörper (100) angeordnet ist, und eine Vielzahl von Befestigungselementen (30), die sich durch den Sitzkörper (100) und die Schaltungsplatte (40) erstrecken, um die Schaltungsplatte (40) an dem Sitzkörper (100) zu sichern, wobei sich die Lamellen (103) zwischen dem Sitzkörper (100) und der Schaltungsplatte (40) erstrecken und die lichtemittierende Diode (21) elektrisch an die Schaltungsplatte (40) gekoppelt ist.
EP05017833A 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende Elemente Not-in-force EP1754936B1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE602005011277T DE602005011277D1 (de) 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende Elemente
AT05017833T ATE415596T1 (de) 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende elemente
EP05017833A EP1754936B1 (de) 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende Elemente
HK07105033.1A HK1100298A1 (en) 2005-08-17 2007-05-11 Cooling device for light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05017833A EP1754936B1 (de) 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende Elemente

Publications (2)

Publication Number Publication Date
EP1754936A1 EP1754936A1 (de) 2007-02-21
EP1754936B1 true EP1754936B1 (de) 2008-11-26

Family

ID=35517333

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05017833A Not-in-force EP1754936B1 (de) 2005-08-17 2005-08-17 Kühlvorrichtung für lichtemittierende Elemente

Country Status (4)

Country Link
EP (1) EP1754936B1 (de)
AT (1) ATE415596T1 (de)
DE (1) DE602005011277D1 (de)
HK (1) HK1100298A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101363603B (zh) * 2007-08-08 2010-09-15 威菖股份有限公司 发光二极管灯组
FR2943761B1 (fr) * 2009-03-31 2013-04-19 Mafelec Source lumineuse a diodes electroluminescentes en particulier pour dispositif de signalisation lumineuse et dispositif equipe d'une telle source lumineuse

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2818984B2 (ja) * 1992-03-04 1998-10-30 株式会社 ケー・シー・シー・商会 モザイク式パネル用照光表示装置
US6254262B1 (en) * 1998-11-27 2001-07-03 Crunk Paul D Signaling lamp having led light array with removable plastic lens
US6637921B2 (en) * 2001-09-28 2003-10-28 Osram Sylvania Inc. Replaceable LED bulb with interchangeable lens optic
JP2005513815A (ja) * 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 発光ダイオード及び発光ダイオード・ランプ
DE10251955A1 (de) * 2002-11-08 2004-05-19 Hella Kg Hueck & Co. Einbaumodul mit leistungsstarker LED, insbesondere für ein Kraftfahrzeug
ITTO20030165A1 (it) * 2003-03-06 2004-09-07 Space Cannon Vh S P A Proiettore di luce a led
US7196459B2 (en) * 2003-12-05 2007-03-27 International Resistive Co. Of Texas, L.P. Light emitting assembly with heat dissipating support

Also Published As

Publication number Publication date
HK1100298A1 (en) 2007-09-14
ATE415596T1 (de) 2008-12-15
DE602005011277D1 (de) 2009-01-08
EP1754936A1 (de) 2007-02-21

Similar Documents

Publication Publication Date Title
US7771082B2 (en) Lamp with heat conducting structure and lamp cover thereof
JP5220098B2 (ja) ヒートシンク付きｌｅｄコネクタ組立体
US8760042B2 (en) Lighting device having a through-hole and a groove portion formed in the thermally conductive main body
EP2228587B1 (de) Led-glühlampe und beleuchtungsvorrichtung
US20070041195A1 (en) Light emitting assembly
JP5123862B2 (ja) 二次元照明装置
JP3116108U (ja) 発光ダイオードセット
US8534873B1 (en) Light fixture assembly
US20130088880A1 (en) Led lighting device
US20090122553A1 (en) Light fixture assembly having improved heat dissipation capabilities
US9349930B2 (en) LED module and lighting assembly
KR101310365B1 (ko) 발광모듈 및 이를 포함하는 조명장치
JP2006040727A (ja) 発光ダイオード点灯装置及び照明器具
JP2011091037A (ja) 口金付ランプおよび照明器具
CN101413649A (zh) 发光二极管灯具
WO2009064433A1 (en) Light fixture assembly having improved heat dissipation capabilities
KR20230175149A (ko) 차량용 램프의 led 광원 모듈
US20170343204A1 (en) Led device
EP1754936B1 (de) Kühlvorrichtung für lichtemittierende Elemente
US20080037256A1 (en) Heat conductor assembly of light source
US9228734B2 (en) Light-emitting device
JP5835560B2 (ja) 照明装置
EP3259526B1 (de) Led-beleuchtungseinheit
JP2013179014A (ja) 照明器具
KR20120010653A (ko) 조명 장치

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

17P Request for examination filed

Effective date: 20070427

17Q First examination report despatched

Effective date: 20070613

REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1100298

Country of ref document: HK

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 602005011277

Country of ref document: DE

Date of ref document: 20090108

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090308

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090326

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1100298

Country of ref document: HK

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090226

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090226

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090427

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20090827

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090831

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20090817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090831

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090831

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20100430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090831

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090227

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090527

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081126

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20140428

Year of fee payment: 10

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602005011277

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160301