EP1743050A2 - Procede et dispositif pour le revetement thermique sous vide - Google Patents

Procede et dispositif pour le revetement thermique sous vide

Info

Publication number
EP1743050A2
EP1743050A2 EP05736229A EP05736229A EP1743050A2 EP 1743050 A2 EP1743050 A2 EP 1743050A2 EP 05736229 A EP05736229 A EP 05736229A EP 05736229 A EP05736229 A EP 05736229A EP 1743050 A2 EP1743050 A2 EP 1743050A2
Authority
EP
European Patent Office
Prior art keywords
substrate
hollow body
channel
coating
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05736229A
Other languages
German (de)
English (en)
Inventor
Lutz Gottsmann
Ulf Seyfert
Bernd-Dieter Wenzel
Reinhard JÄGER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Ardenne Anlagentechnik GmbH
Original Assignee
Von Ardenne Anlagentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne Anlagentechnik GmbH filed Critical Von Ardenne Anlagentechnik GmbH
Publication of EP1743050A2 publication Critical patent/EP1743050A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Definitions

  • the invention relates to a method and a device for the thermal vacuum coating of a continuously transported substrate by evaporating solid and / or liquid coating materials and vapor deposition of the vaporous coating material on the substrate, the substrate moving in a heated evaporation channel of an evaporation device, the evaporation channel is arranged in a vacuum chamber and is connected to an evaporation device, and the evaporation device and the evaporation device are the essential parts of a coating device.
  • PVD physical vapor deposition
  • Such systems are used in particular for the coating of band-shaped steel substrates with a bandwidth on the centimeter scale up to the meter scale.
  • the coating device For the economical use of a system according to the continuous coating process, there is a need for the coating device to be continuously stocked with coating material without interrupting the continuous substrate transport.
  • temperatures are used in the vapor deposition channel which are suitable for influencing the mechanical properties of the substrate. For this reason, a precise coordination between the temperature in the vapor deposition channel and the transport speed of the substrate is necessary and must be observed.
  • the substrate can heat up to the point where it is damaged, and its physical properties can increase up to Change useless.
  • the tearing of the substrate tape is associated with a considerable amount of time and cost for the repair due to the usual system size and the special process conditions.
  • the object is achieved in a method according to the invention in that the vapor deposition channel is separated into an outer space and an inner space when the substrate is below a minimum transport speed or when the substrate is at a standstill by inserting at least one position-changing hollow body such that the substrate is located in the inner space ,
  • the substrate located in the evaporation channel is thermally protected by the hollow body arranged between the substrate and the hot evaporation channel surface, and the substrate is in such a malfunction no thermal see exposure to stress.
  • Another particular advantage of inserting a hollow body according to the invention into the space between the vaporization channel surface and the substrate is that the vapor-like coating material flowing in, for example, through nozzles in the channel surface essentially flows on the hollow body and not on the substrate separates. In this way, an uncontrolled coating of the substrate in the event of a malfunction can also be prevented. Furthermore, because of the good closure of the substrate with the hollow body inserted, it is possible to close the substrate protection device according to the invention for conditioning the evaporator system, since this can prevent contamination of the layer on the substrate section located within the vapor deposition channel.
  • two hollow bodies are inserted in a movement directed towards one another and the two end faces of the two hollow bodies directed towards one another lie against one another in the inserted state.
  • the hollow body or bodies moves in the vacuum chamber surrounding the vaporization duct.
  • the vaporization channel has an opening on the inlet side for introducing the hollow body.
  • the hollow body is in the ready position as well as in the use position and in every intermediate position in the vacuum chamber, so that influencing of the process parameters, such as pressure within the vacuum chamber, is avoided.
  • this embodiment of the invention is suitable for ensuring that the substrate can be protected particularly quickly.
  • the hollow body is inserted parallel to the transport direction of the band-shaped substrate.
  • the hollow body thus rests in the ready position in the immediate vicinity of the vapor deposition channel and is already positioned so precisely in this position relative to the moving substrate that only a parallel displacement of the hollow body is required.
  • the protection of the substrate is thus produced after a simple linear movement of the protective body has been carried out.
  • the hollow body is cooled using a suitable method, since the heat energy absorbed by the hollow body is thus dissipated.
  • the cooling is therefore particularly preferably carried out actively by means of a cooling liquid. This cooling can be done independently be guaranteed by the duration of the stay of the hollow body in the hot evaporation channel.
  • the loading of the coating chamber with coating material is expediently prevented by closing a valve in the event of a fault.
  • the vaporous coating material which is already in the vaporization channel and the feed line separates essentially completely on the cold surface of the hollow body pushed into the vaporization channel. Since the remaining surfaces of the vapor deposition channel continue to be heated until the remaining vaporous coating material is essentially completely deposited, the coating material will essentially only deposit on the hollow body.
  • an inventive device for substrate coating according to the features of claim 7.
  • the substrate when the substrate falls below a minimum transport speed or when the substrate is at a standstill, at least one hollow body which can be inserted into the vapor deposition channel surrounds the substrate.
  • the substrate resting in the evaporation channel is thus thermally protected by the hollow body arranged between the substrate and a heating device.
  • the substrate is thus exposed to lower thermal loads in such a malfunction.
  • the inflowing vapor-like coating material essentially deposits on the hollow body.
  • the hollow body is a prismatic or cylindrical hollow body.
  • the substrate is for its continuous transport passed through the hollow body, is provided so that through the hollow body a vollumfängli ⁇ cher protective body.
  • the hollow body during regular, continuous substrate transport with at least the minimum speed in a standby position outside the vapor deposition channel and within the vacuum chamber and, moreover, if necessary, when the substrate is below the minimum transport speed or when it is at a standstill in an operating position is essentially arranged in the vaporization duct.
  • the hollow body can always remain completely arranged in the vacuum chamber and close in the insertion area with the wall of the vaporization duct.
  • the hollow bodies are essentially arranged in an application position in the coating chamber, the hollow bodies form an optically sealed separation into an inner and outer part of the vapor deposition channel, whereby the described advantages with regard to the separation of the vapor deposition channel reinforce the existing substrate and also have the system engineering outlay for the substrate protection device optimized.
  • the hollow body wall can expediently be made from a high-temperature steel or a high-temperature alloy. In any case, the hollow body wall has sufficient thermal and thus also mechanical stability even in the event of a fault up to a temperature range of 800 ° C., preferably up to 1000 ° C.
  • the hollow body has an inner hollow body wall and an outer hollow body wall spaced apart from it, so that an intermediate space is enclosed.
  • the space between the two walls is formed on the hollow body to the full extent.
  • cooling of the hollow body can be made possible by the space between the inner hollow body perwand and the outer wall of the hollow body is filled with a cooling liquid.
  • the coolant absorbs the heat transferred to the walls.
  • the cooling liquid is exchanged particularly advantageously and the absorbed heat is thus carried out.
  • Water or any other liquid with a high heat capacity is used as the liquid.
  • water is used as the liquid because water is cheaply available.
  • the liquid is passed through the space for effective cooling.
  • the flow direction and the flow rate can be predetermined by the installation of walls in the intermediate space and a resulting channel environment. The smaller the channel cross section, the higher the flow rate with a constant flow volume.
  • cold liquid enters the gap and warm liquid exits.
  • the cooling can also not be active during the standby position of the hollow body, i.e. the liquid rests in the space. At the time of use, the cooling is then activated by passing the liquid through it. Alternatively, the cooling can be continuously active to ensure the function and rapid use.
  • the hollow body is mounted on rollers and / or rails so that the hollow body can be moved in a defined manner and damage to the vacuum chamber or the vapor deposition is reliably prevented during the movement.
  • the guide is designed to be vacuum-compatible and thermally stable under the operating conditions.
  • the substrate protection device comprises at least one drive.
  • the drive is preferably arranged outside the vacuum chamber and in this case acts on the hollow body via one or more transmission elements.
  • Ropes, tapes, belts, chains, toothed belts or the like are provided as transmission means. Doing so the direction of action of the force changed over the pulleys.
  • the driving force is transmitted to the hollow body, for example by means of a telescopic device, by means of a device with a rack guide or the like.
  • the transmission means and possibly the deflections are designed to be vacuum-compatible and thermally stable under the operating conditions.
  • FIG. 1 is a schematic representation of a vertical cross section through a coating device according to the invention with a substrate protection device
  • Fig. 2 shows the coating device according to Fig. 1 with the substrate protection device in the operating position
  • Fig. 3 is a schematic representation of a vertical cross section through a hollow body.
  • the 1 shows a coating device 1 according to the invention with a vacuum chamber 2 and an evaporation channel 3 arranged therein.
  • the evaporation channel 3 has a height of approximately 4 meters and is arranged at the middle height of the approximately 10 meter high vacuum chamber 2.
  • the vapor deposition channel 3 has the shape of an upright, elongated, hollow cuboid and is open at the base at the upper and lower ends.
  • the outside of the vaporization duct 3 is provided in its entirety with a heating device 4, which is designed as an electrical resistance heater for radiant heating.
  • At the middle of the vacuum chamber 2 or the vaporization channel 3 is on two opposite sides, on both sides of the
  • a nozzle 5 mounted essentially horizontally in the operating position, which with the respective narrow ends open into the vaporization duct 3.
  • the other end of the nozzles 5 is connected to an evaporation device which serves to evaporate the coating material.
  • a belt-shaped substrate 6 is transported through the vacuum chamber 2 and through the vapor deposition channel 3.
  • the substrate 6 is aligned in such a way that the surfaces are oriented transversely to the nozzle, the nozzle being directed in each case to the center of the surface of the substrate.
  • the substrate can already be coated in a previous coating run.
  • the hollow body according to the invention is also located in the vacuum chamber 2 as a substrate protection device.
  • This consists of two linearly movable units.
  • Each unit comprises a hollow cuboid 7, which is open on the sides of the base areas for the passage of the substrate strip 6.
  • the dimensions of the base area of a hollow cuboid 7 are smaller than the dimensions of the base area of the vapor deposition channel 3, and the height of a hollow cuboid 7 slightly exceeds half the height of the vapor deposition channel 3.
  • the hollow cuboids 7 are directed towards one another, are mounted so as to be movable in parallel around the substrate belt 6 and in the direction of transport of the substrate belt 6.
  • a hollow cuboid 7 is held above and below the vaporization channel 3 (FIG. 1).
  • the two hollow cuboids 7 In the operational position, i.e. H. after the two hollow cuboids have been introduced into the vapor deposition channel, the two hollow cuboids 7 abut one another with their opposite end faces at the level of the nozzles 5. In the contact plane of the two hollow cuboids 7, they lie in a vapor-tight manner on one another, so that the vapor deposition channel 3 is divided into an internal vapor deposition channel 11 and an external vapor deposition channel 12 (FIG. 2).
  • the cooling water supply to the hollow cuboid 7 takes place, for example, via meandering hose connections, not shown, which adapt to the differences in distance of the hollow cuboid 7 by opening their bending radius.
  • Fig. 3 shows a hollow cuboid in cross section.
  • the hollow cuboid 7 forms an intermediate space 10 between an outer hollow body wall 8 and an inner hollow body wall 9, which serves as a channel system. Water as cooling liquid 13 is passed through the channel system at a defined flow rate.
  • Each hollow cuboid 7 is guided on guide rails, not shown.
  • the hollow cuboid 7 has a cross strut 14 on the base side opposite the other hollow cuboid. Due to the length of the hollow cuboid, which is greater than half the length of the vaporization channel by at least one cross section of the cross strut, the cross struts of the suspension project out of the vaporization channel 3.
  • a drive also not shown, is mounted with a shaft reaching into the vacuum chamber 2.
  • the drive shafts are connected to the two hollow blocks 7 by means of traction means guided over deflection rollers.
  • the coating method is a continuous thermal vacuum coating of the band-shaped substrate by evaporating solid coating material and vapor deposition of the vaporous coating material on the continuously transported substrate in the evaporation channel 3.
  • the solid coating material is heated in a vacuum and transported through the nozzle 5 on both sides of the substrate into the heated and evacuated evaporation channel 3.
  • a vapor-tight valve provided on the evaporator device, the inflow of vaporous coating material can be regulated and also interrupted.
  • the band-shaped substrate 6 made of steel is transported in the evaporation channel 3, the transport speed varying. iert and in the embodiment is between 30 meters per minute and 200 meters per minute.
  • the substrate transport is monitored with sensors via a computer-aided control unit. As soon as a disturbance occurs in the substrate transport and the substrate 6 does not emerge from the hot evaporation channel 3 or does not emerge quickly enough, a disturbance is registered.
  • the two drive outside i.e. above and below the evaporation channel 3 in the vacuum chamber 4, aged hollow cuboid 7 as a thermal protective curtain and into the evaporation channel 3.
  • the two hollow guaders 7 lie so close to one another that no vaporous coating material penetrates into the vapor deposition inner chamber.
  • the intermediate space 10 is filled with cooling water 11, which is passed through the intermediate space 10.
  • a control unit also prevents further loading of the vapor deposition channel 3 with pressing vapor coating material.
  • the vaporous coating material located in the vaporization channel 3 and in the transport lines present between evaporation and vaporization means separates on the cooled, outer hollow body wall 8 and on the cooled, inner hollow body wall 9. At least the vapor deposition inner chamber is then essentially free of condensate of the coating material.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif et un procédé pour le revêtement thermique sous vide d'un substrat en forme de bande transporté en continu dans un conduit de vaporisation alimenté en matériau de revêtement à l'état de vapeur. L'invention vise à fournir, pour les procédés et les dispositifs de revêtement connus, la possibilité d'une protection à mise en oeuvre rapide pour le substrat afin d'éviter la détérioration de ce dernier pendant l'étape de revêtement. Le procédé selon l'invention est caractérisé en ce que, lorsque la vitesse est inférieure à la vitesse de transport minimale ou que le substrat est arrêté, le conduit de vaporisation est séparé, par l'insertion d'au moins un corps creux à position variable, en un espace extérieur du conduit de vaporisation et en un espace intérieur du conduit de vaporisation, de sorte que le substrat se trouve dans l'espace intérieur.
EP05736229A 2004-04-27 2005-04-16 Procede et dispositif pour le revetement thermique sous vide Withdrawn EP1743050A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004020842 2004-04-27
DE102004041854A DE102004041854B4 (de) 2004-04-27 2004-08-27 Verfahren und Vorrichtung zur thermischen Vakuumbeschichtung
PCT/DE2005/000702 WO2005106072A2 (fr) 2004-04-27 2005-04-16 Procede et dispositif pour le revetement thermique sous vide

Publications (1)

Publication Number Publication Date
EP1743050A2 true EP1743050A2 (fr) 2007-01-17

Family

ID=34965617

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05736229A Withdrawn EP1743050A2 (fr) 2004-04-27 2005-04-16 Procede et dispositif pour le revetement thermique sous vide

Country Status (8)

Country Link
US (1) US20070240636A1 (fr)
EP (1) EP1743050A2 (fr)
JP (1) JP2007534843A (fr)
KR (1) KR100835044B1 (fr)
CN (1) CN1950535B (fr)
CA (1) CA2564256A1 (fr)
DE (1) DE102004041854B4 (fr)
WO (1) WO2005106072A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465475B2 (en) * 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
DE102013112068B4 (de) 2013-11-01 2018-09-27 VON ARDENNE Asset GmbH & Co. KG Substratbehandlungsanlage
DE102014112536A1 (de) * 2014-09-01 2016-03-03 Von Ardenne Gmbh Substratbehandlungsanlage und Heizeinrichtung
WO2016187294A1 (fr) * 2015-05-18 2016-11-24 Mustang Vacuum Systems, Inc. Appareil et procédé permettant l'évaporation et le dépôt de matériaux à l'aide d'un filament de corde
US20170144181A1 (en) * 2015-11-23 2017-05-25 United Technologies Corporation Tooling for vapor deposition
WO2019116081A1 (fr) * 2017-12-14 2019-06-20 Arcelormittal Installation de dépôt sous vide et procédé pour revêtir un substrat
WO2019116082A1 (fr) * 2017-12-14 2019-06-20 Arcelormittal Équipement de dépôt sous vide et procédé de revêtement d'un substrat
KR102292575B1 (ko) * 2019-12-16 2021-08-24 주식회사 포스코 연속 코팅 장치
DE102020126101A1 (de) 2020-10-06 2022-04-07 Thyssenkrupp Steel Europe Ag Beschichtungsvorrichtung zum Ablagern eines Beschichtungsmaterials auf einem Substrat

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Publication number Priority date Publication date Assignee Title
US3598957A (en) * 1968-09-13 1971-08-10 Tokyo Shibaura Electric Co Vacuum deposition apparatus
BE792552A (fr) * 1971-12-21 1973-06-12 Cit Alcatel Enceinte pour depot de couches minces sous vide
NL7205670A (fr) * 1972-03-16 1973-09-18
DE2951802A1 (de) * 1979-12-21 1981-07-09 Agfa-Gevaert Ag, 5090 Leverkusen Vorrichtung und verfahren zum vollautomatischen lackieren von bandfoermigen materialien
JPS5927531A (ja) * 1982-08-04 1984-02-14 Nec Corp 気相成長用試料台
JPS6021378A (ja) 1983-07-15 1985-02-02 Nisshin Steel Co Ltd 真空蒸着装置
FR2611746B1 (fr) * 1987-03-06 1989-06-30 Centre Nat Etd Spatiales Dispositif d'evaporation sous vide d'un metal en continu
DE10152655B4 (de) * 2000-10-17 2013-10-02 Samsung Display Co., Ltd. Verfahren zur Herstellung einer organischen Elektrolumineszenz-Vorrichtung
KR20040026733A (ko) * 2002-09-25 2004-04-01 주식회사 피앤아이 표면개질된 모재와의 접착력이 향상된 후막 형성 방법 및그의 장치

Non-Patent Citations (1)

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See references of WO2005106072A2 *

Also Published As

Publication number Publication date
CN1950535A (zh) 2007-04-18
KR20070005004A (ko) 2007-01-09
CA2564256A1 (fr) 2005-11-10
DE102004041854B4 (de) 2008-11-13
CN1950535B (zh) 2010-05-26
KR100835044B1 (ko) 2008-06-03
DE102004041854A1 (de) 2005-11-24
US20070240636A1 (en) 2007-10-18
WO2005106072A3 (fr) 2006-06-01
WO2005106072A2 (fr) 2005-11-10
JP2007534843A (ja) 2007-11-29

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