EP1706269A2 - Drop ejection assembly - Google Patents

Drop ejection assembly

Info

Publication number
EP1706269A2
EP1706269A2 EP04815609A EP04815609A EP1706269A2 EP 1706269 A2 EP1706269 A2 EP 1706269A2 EP 04815609 A EP04815609 A EP 04815609A EP 04815609 A EP04815609 A EP 04815609A EP 1706269 A2 EP1706269 A2 EP 1706269A2
Authority
EP
European Patent Office
Prior art keywords
channel
nozzle
nozzle opening
fluid
drop ejector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04815609A
Other languages
German (de)
French (fr)
Other versions
EP1706269B1 (en
EP1706269A4 (en
Inventor
John C. Batterton
Andreas Bibl
Paul A. Hoisington
Steven H. Barss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Dimatix Inc
Original Assignee
Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/749,833 external-priority patent/US7303259B2/en
Priority claimed from US10/749,829 external-priority patent/US7237875B2/en
Priority claimed from US10/749,816 external-priority patent/US7121646B2/en
Priority claimed from US10/749,622 external-priority patent/US7168788B2/en
Application filed by Dimatix Inc filed Critical Dimatix Inc
Publication of EP1706269A2 publication Critical patent/EP1706269A2/en
Publication of EP1706269A4 publication Critical patent/EP1706269A4/en
Application granted granted Critical
Publication of EP1706269B1 publication Critical patent/EP1706269B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber

Abstract

A fluid drop delivery device is disclosed. The device includes a plurality of nozzle openings from which fluid is ejected and a waste control aperture.

Description

DROP EJECTION ASSEMBLY TECHNICAL FIELD This invention relates to ejecting drops.
BACKGROUND Inkjet printers are one type of apparatus for depositing drops on a substrate. Inkjet printers typically include an ink path from an ink supply to a nozzle path. The nozzle path terminates in a nozzle opening from which ink drops are ejected. Ink drop ejection is typically controlled by pressurizing ink in the ink path with an actuator, which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element. A typical print assembly has an array of ink paths with corresponding nozzle openings and associated actuators. Drop ejection from each nozzle opening can be independently controlled. In a drop-on-demand print assembly, each actuator is fired to selectively eject a drop at a specific pixel location of an image as the print assembly and a printing substrate are moved relative to one another. In high performance print assemblies, the nozzle openings typically have a diameter of 50 microns or less, e.g. around 25 microns, are separated at a pitch of 100-300 nozzles/inch, have a resolution of 100 to 3000 dpi or more, and provide drops with a volume of about 1 to 120 picoliters (pL) or less. Drop ejection frequency is typically 10 kHz or more. Hoisington et al. U.S. Patent No. 5,265,315, describes a print assembly that has a semiconductor body and a piezoelectric actuator. The body is made of silicon, which is etched to define ink chambers. Nozzle openings are defined by a separate nozzle plate, which is attached to the silicon body. The piezoelectric actuator has a layer of piezoelectric material, which changes geometry, or bends, in response to an applied voltage. The bending of the piezoelectric layer pressurizes ink in a pumping chamber located along the ink path. Piezoelectric ink jet print assemblies are also described in Fishbeck et al. U.S. Patent No. 4,825,227, Hine U.S. Patent No. 4,937,598, Moynihan et al. U.S. Patent No. 5,659,346 and Hoisington U.S. Patent No. 5,757,391, the entire contents of which are hereby incorporated by reference.
SUMMARY In an aspect, the invention features a drop ejector that includes a flow path in which fluid is pressurized to eject drops from a nozzle opening formed in a substantially planar substrate. Also formed in the substrate proximate the nozzle opening is a channel. The channel is spaced from the nozzle opening by a distance of about 20 % of a nozzle width or more. In another aspect, the invention features a method of fluid ejection that includes providing a drop ejector that includes a flow path in which fluid is pressurized for ejection through a nozzle opening formed in a substrate. Also formed in the substrate proximate the nozzle opening is a channel. The channel is spaced from the nozzle opening by a distance of about 20 % of a nozzle width or more. The method also includes providing a fluid that is wicked by capillary forces into the space defined by the channel and ejecting the fluid through the nozzle opening by pressurizing the fluid in the flow path. Other aspects or embodiments may include combinations of the features in the aspects above and/or one or more of the following. The nozzle opening is surrounded by the channel. The channel is in the shape of a circle. The channel extends radially from the nozzle opening. The channel has a width that is about twice the nozzle opening width or less. The channel has a width of about 100 microns or less. The channel is from about 2 micron to about 50 micron. The substrate is a silicon material. The planar substrate includes a plurality of nozzle openings and channels proximate the nozzle openings. The nozzle opening width is about 200 micron or less. The drop ejector includes a piezoelectric actuator. The fluid has a surface tension of about 20-50 dynes/cm. The fluid has a viscosity of about 1 to 40 centipoise. Embodiments may include one or more of the following advantages. Printhead operation is robust and reliable since waste ink about the face of the nozzle plate is controlled to reduce interference with drop formation and ejection. Drop velocity and trajectory straightness is maintained in high performance printheads in which large arrays of small nozzles must accurately eject ink to precise locations on a substrate. The channels control waste ink and permit desirable jetting characteristics with a variety of jetting fluids, such as inks with varying viscosity or surface tension characteristics, and heads with varying pressure characteristics at the nozzle openings. The channels are robust, do not require moving components, and can be economically implemented by machining, e.g. laser machining, or etching, e.g., in a semiconductor material such as a silicon material. Still further aspects, features, and advantages follow. For example, particular aspects include channel dimensions, characteristics and operating conditions described below. DESCRIPTION OF DRAWINGS Fig. 1 is a schematic of a drop ejection assembly. Fig. 2 is a perspective view of a nozzle plate, while Fig. 2A is an expanded view of region A in Fig. 2. Figs. 3-3C are cross-sectional views of a nozzle, taken along 3-3 of Fig.2A, illustrating drop ejection.
DETAILED DESCRIPTION Referring to Fig. 1, an inkjet apparatus 10 includes a reservoir 11 containing a supply of ink 12 and a passage 13 leading from the reservoir 11 to a pressure chamber 14. An actuator 15, e.g., a piezoelectric transducer, covers the pressure chamber 14. The actuator is operable to force ink from the pressure chamber 14 through a passage 16 leading to a nozzle opening 17 in an nozzle plate 18, causing a drop of ink 19 to be ejected from the nozzle 17 toward a substrate 20. During operation, the inkjet apparatus 10 and the substrate 20 can be moved relative to one another. For example, the substrate can be a continuous web that is moved between rolls 22 and 23. By selective ejection of drops from an array of nozzles 17 in nozzle plate 18, a desired image is produced on substrate 20. The inkjet apparatus also controls the operating pressure at the ink meniscus proximate the nozzle openings when the system is not ejecting drops. Variations in meniscus pressure can cause variation in drop volume or velocity which can lead to printing errors and weeping. In the embodiment illustrated, pressure control is provided by a vacuum source 30 such as a mechanical pump that applies a vacuum to the headspace 9 over the ink 12 in the reservoir 11. The vacuum is communicated through the ink to the nozzle opening 17 to prevent ink from weeping through the nozzle opening by force of gravity. A controller 32, e.g. a computer controller, monitors the vacuum over the ink in the reservoir 11 and adjusts the source 30 to maintain a desired vacuum in the reservoir. In other embodiments, a vacuum source is provided by arranging the ink reservoir below the nozzle openings to create a vacuum proximate the nozzle openings. An ink level monitor (not shown) detects the level of ink, which falls as ink is consumed during a printing operation and thus increases the vacuum at the nozzles. A controller monitors the ink level and refills the reservoir from a bulk container when ink falls below a desired level to maintain vacuum within a desired operation range. In other embodiments, in which the reservoir is located far enough below the nozzles that the vacuum of the meniscus overcomes the capillary force in the nozzle, the ink can be pressurized to maintain a meniscus proximate the nozzle openings. In embodiments, the vacuum is maintained at about 0.5 to about 10 inches of water. Referring to Figs. 2-2A, nozzle plate portion 40 includes a plurality of nozzle openings 42 formed in a substantially planar substrate 41. Also formed in substrate 41 proximate each nozzle opening 42 is a cleaning structure in the form of a channel 44. Channels 44 control stray ink on the nozzle plate that could affect nozzle performance. For example, during ink jetting, ink may end up collecting on the nozzle plate. Over time, ink can form puddles which cause printing errors. For example, puddles near the edge of a nozzle opening can effect the trajectory, velocity or volume of the ejected drops. Also, a puddle could become large enough so that it drips onto printing substrate 20 causing an extraneous mark. The puddle could also protrude far enough off the nozzle plate 40 surface that the printing substrate 20 comes into contact with it, causing a smear on the printing substrate 20. The channels 44 collect, localize and direct waste ink.
Referring particularly to Fig. 2A, channels 44 completely surround each nozzle opening 42 that is centered on platform area 43. Channels 44 are connected by radial channels 46 and 48 that emanate from channels 44, forming a network of connected channels that direct and hold stray fluid on the nozzle plate. Referring particularly to Fig. 3, a nozzle opening 42 with an adjacent channel 44 is illustrated before drop ejection. Referring to Figs. 3A and 3B, waste ink 38 deposits on platform area 43 and is drawn into channel 44 by capillary forces. Referring to Fig. 3C, waste ink 38 is contained and distributed about nozzle opening 42 by channel 44. Upon encountering radial channels 46 or 48, ink moves into the space defined by the radial channel and then moves under capillary action radially away from nozzle opening 42 and into the network of connected channels that direct and hold stray fluid (see Fig. 2). When the nozzle plate is oriented vertically, waste ink moves through the network of channels under the influence of both gravity and capillary action, macroscopically in a single direction. When the nozzle plate is oriented horizontally, a vacuum source or wicking material can be used to remove ink from the channels. The spacing, size and orientation of the channels are selected to control waste ink. In embodiments, the spacing, S, from an edge of the channel to an edge of the nozzle opening is between about 20 % of a nozzle width, WN, or more, e.g., 30 % or more, and about five times the nozzle width or less, e.g., three times the nozzle width or less. The width, Wc, and depth, D, of the channel is selected to prevent excessive pooling of ink on the nozzle surface and to allow fluid to be drawn into the space defined by the channel and retained by capillary forces. In embodiments, the channel width is between about twice the nozzle width or less and about 10 % of the nozzle width or more. In particular embodiments, the channel width, Wc, is, e.g., about 100 microns or less, e.g., 5-20 microns, and the channel depth, D, is, e.g., about 2-10 microns or more, e.g., 50 microns. In embodiments, the nozzle width WN is, e.g., about 200 microns or less, e.g., 25-100 microns and the spacing S from the nozzle opening to the edge of the channel is, e.g., 40 microns or greater, e.g., 100 microns. In embodiments, the nozzle pitch is about 25 nozzles/inch or more, e.g., about 300 nozzles/inch, the ink drop volume is about 1 to 70 pL and the fluid is pressurized by a piezoelectric actuator. In embodiments, the jetting fluid has a viscosity of about 1 to 40 centipoise and a surface tension of about 20-50 dynes/cm. In embodiments, the jetting fluid is ink. In embodiments, the channels can include a wicking material and/or a nonwetting coating (e.g., TEFLON ' fiuoropolymer) can be applied to the nozzle plate surface between the nozzle and the channel. The channel network can also be in communication with a vacuum source (not shown). Waste ink can be returned to the main ink supply or to a separate suction system. In embodiments, the orientation of the channel is circular. In other embodiments, the orientation of the channel is sinuous. The channels and/or the nozzle opening in any of the above described embodiments can be formed by machining, electroforming, laser ablation, and chemical or plasma etching. The channels can also be formed by molding, e.g., injection molded plastic channels. In embodiments, the channel, nozzle opening, and pressure chamber are formed in a common body. The body can be a metal, carbon or an etchable material such as silicon material, e.g., silicon or silicon dioxide. Forming printhead components using etching techniques is further described in
U.S.Serial No. 10/189,947, filed July 3, 2002, and U.S. Serial No. 60/510,459, filed October 10, 2003, the entire contents of each are hereby incorporated by reference. The channels can be used in combination with other waste fluid control features such as apertures described in U.S. Serial Number 10/749,829, filed December 30, 2003, wells as described in U.S. Serial Number 10/749,622, filed December 30, 2003 and/or projections as described in U.S. Serial Number 10/749,816, filed December 30, 2003. For example, a series of projections can be included on the nozzle face proximate the channels. In embodiments, the drop ejection system can be utilized to eject fluids other than ink. For example, the deposited droplets may be a UN or other radiation curable material or other material, for example, chemical or biological fluids, capable of being delivered as drops. For example, the apparatus described could be part of a precision dispensing system. The actuator can be an electromechanical or thermal actuator. The cleaning structures can be combined with a manual or automatic washing and wiping system in which a cleaning fluid is applied to the nozzle plate and wiped clean. The cleaning structures can collect cleaning fluid and debris rather than j etted waste ink. Still other embodiments are within the scope of the following claims.

Claims

WHAT IS CLAIMED IS:
1. A drop ejector, comprising: a flow path in which fluid is pressurized to eject drops from a nozzle opening formed in a substantially planar substrate, and a channel formed in the substrate proximate the nozzle opening, the channel being spaced from the nozzle opening by a distance of about 20 % of a nozzle width or more.
2. The drop ejector of claim 1 wherein the nozzle opening is surrounded by the channel.
3. The drop ejector of claim 2 wherein the channel is in the shape of a circle.
4. The drop ejector of claim 1 wherein the channel extends radially from the nozzle opening.
5. The drop ejector of claim 1 wherein the channel has a width that i s about twice the nozzle opening width or less.
6. The drop ejector of claim 1 wherein the channel has a width of about 100 microns or less.
7. The drop ejector of claim 1 wherein a depth of the channel is from about 2 micron to about 50 micron.
8. The drop ejector of claim 1 wherein the substrate is a silicon material.
9. The drop ejector of claim 1 wherein the planar substrate includes a plurality of nozzle openings and channels proximate the nozzle openings.
10. The drop ejector of claim 1 wherein the nozzle opening width is about 200 micron or less.
11. The drop ejector of claim 1 including a piezoelectric actuator.
12. A method of fluid ejection, comprising: providing a drop ejector including a flow path in which fluid is pressurized for ejection through a nozzle opening formed in a substrate, and a channel formed in the substrate proximate the nozzle opening, the channel being spaced from the nozzle opening by a distance of about 20 % of the nozzle width or more; providing a fluid that is wicked by capillary forces into the space defined by said channel, and ejecting said fluid through said nozzle opening by pressurizing said fluid in said flow path.
13. The method of claim 12 wherein the fluid has a surface tension of about 20-50 dynes/cm.
14. The method of claim 12 wherein the fluid has a viscosity of about 1 to 40 centipoise.
EP04815609A 2003-12-30 2004-12-29 Drop ejection assembly Active EP1706269B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/749,833 US7303259B2 (en) 2003-12-30 2003-12-30 Drop ejection assembly
US10/749,829 US7237875B2 (en) 2003-12-30 2003-12-30 Drop ejection assembly
US10/749,816 US7121646B2 (en) 2003-12-30 2003-12-30 Drop ejection assembly
US10/749,622 US7168788B2 (en) 2003-12-30 2003-12-30 Drop ejection assembly
PCT/US2004/043577 WO2005065294A2 (en) 2003-12-30 2004-12-29 Drop ejection assembly

Publications (3)

Publication Number Publication Date
EP1706269A2 true EP1706269A2 (en) 2006-10-04
EP1706269A4 EP1706269A4 (en) 2009-08-19
EP1706269B1 EP1706269B1 (en) 2012-06-13

Family

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Application Number Title Priority Date Filing Date
EP04815609A Active EP1706269B1 (en) 2003-12-30 2004-12-29 Drop ejection assembly
EP04817071A Active EP1706270B1 (en) 2003-12-30 2004-12-29 Drop ejection assembly
EP11183973A Withdrawn EP2415606A3 (en) 2003-12-30 2004-12-29 Drop ejection assembly
EP04815778A Active EP1706266B1 (en) 2003-12-30 2004-12-29 Drop ejection assembly

Family Applications After (3)

Application Number Title Priority Date Filing Date
EP04817071A Active EP1706270B1 (en) 2003-12-30 2004-12-29 Drop ejection assembly
EP11183973A Withdrawn EP2415606A3 (en) 2003-12-30 2004-12-29 Drop ejection assembly
EP04815778A Active EP1706266B1 (en) 2003-12-30 2004-12-29 Drop ejection assembly

Country Status (5)

Country Link
EP (4) EP1706269B1 (en)
JP (4) JP2007516878A (en)
KR (3) KR101154554B1 (en)
AT (2) ATE538934T1 (en)
WO (3) WO2005065294A2 (en)

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Also Published As

Publication number Publication date
EP1706266B1 (en) 2011-12-28
KR20060127957A (en) 2006-12-13
EP1706266A4 (en) 2009-08-12
EP1706270B1 (en) 2011-12-28
EP1706269B1 (en) 2012-06-13
WO2005065331A2 (en) 2005-07-21
EP1706266A2 (en) 2006-10-04
EP2415606A3 (en) 2012-05-09
KR101220272B1 (en) 2013-01-09
WO2005065378A3 (en) 2006-02-23
KR101154554B1 (en) 2012-06-14
KR20060127955A (en) 2006-12-13
EP1706270A4 (en) 2009-08-19
WO2005065294A3 (en) 2005-11-17
KR20060127954A (en) 2006-12-13
KR101222582B1 (en) 2013-01-16
WO2005065331A3 (en) 2006-12-28
JP2007516879A (en) 2007-06-28
JP4959013B2 (en) 2012-06-20
WO2005065378A2 (en) 2005-07-21
ATE538933T1 (en) 2012-01-15
JP2007516876A (en) 2007-06-28
EP2415606A2 (en) 2012-02-08
WO2005065294A2 (en) 2005-07-21
EP1706270A2 (en) 2006-10-04
JP2007516878A (en) 2007-06-28
JP2011161926A (en) 2011-08-25
ATE538934T1 (en) 2012-01-15
EP1706269A4 (en) 2009-08-19

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