EP1706266B1 - Drop ejection assembly - Google Patents
Drop ejection assembly Download PDFInfo
- Publication number
- EP1706266B1 EP1706266B1 EP04815778A EP04815778A EP1706266B1 EP 1706266 B1 EP1706266 B1 EP 1706266B1 EP 04815778 A EP04815778 A EP 04815778A EP 04815778 A EP04815778 A EP 04815778A EP 1706266 B1 EP1706266 B1 EP 1706266B1
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- EP
- European Patent Office
- Prior art keywords
- projections
- nozzle opening
- drop ejector
- ink
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007599 discharging Methods 0.000 description 15
- 238000007639 printing Methods 0.000 description 8
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14475—Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber
Definitions
- This invention relates to depositing drops on a substrate.
- Ink jet printers are one type of apparatus for depositing drops on a substrate.
- Ink jet printers typically include an ink path from an ink supply to a nozzle path. The nozzle path terminates in a nozzle opening from which ink drops are ejected.
- Ink drop ejection is typically controlled by pressurizing ink in the ink path with an actuator, which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element.
- An actuator which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element.
- a typical print assembly has an array of ink paths with corresponding nozzle openings and associated actuators. Drop ejection from each nozzle opening can be independently controlled.
- each actuator is fired to selectively eject a drop at a specific pixel location of an image as the print assembly and a printing substrate are moved relative to one another.
- the nozzle openings typically have a diameter of 50 microns or less, e.g. around 25 microns, are separated at a pitch of 100-300 nozzles/inch, have a resolution of 100 to 3000 dpi or more, and provide drops with a volume of about 1 to 120 picoliters (pl) or less.
- Drop ejection frequency is typically 10 kHz or more.
- Hoisington et al. U.S. Patent No. 5,265,315 describes a print assembly that has a semiconductor body and a piezoelectric actuator.
- the body is made of silicon, which is etched to define ink chambers. Nozzle openings are defined by a separate nozzle plate, which is attached to the silicon body.
- the piezoelectric actuator has a layer of piezoelectric material, which changes geometry, or bends, in response to an applied voltage. The bending of the piezoelectric layer pressurizes ink in a pumping chamber located along the ink path.
- Piezoelectric ink jet print assemblies are also described in Fishbeck et al. U.S. Patent No. 4,825,227 , Hine U.S. Patent No. 4,937,598 , Moynihan et al. U.S. Patent No. 5,659,346 and Hoisington U.S. Patent No. 5,757,391 .
- EP 1 293 343 discloses a liquid discharge recording head comprising a substrate on which an energy generating element for generating liquid discharging energy is provided, and an orifice plate which is laminated with the substrate and in which a discharge port corresponding to the energy generating element is provided, and wherein a liquid droplet is discharged in a direction substantially perpendicular to surfaces of the substrate and the orifice plate, and further wherein a flow path is formed between the substrate and the orifice plate, a groove encircling the flow path is formed in the orifice plate, and edge portions of the orifice plate contacted with the groove are formed as saw-shaped portions having a number of minute indentations.
- EP 0 943 441 discloses an ink jet recording head, wherein an open exhaust port is secured on the side of the end in a direction in which a cleaning blade and a recording head are relatively moved in the vicinity of a nozzle aperture in a nozzle plate and a protective layer for regulating so that the cleaning blade comes in contact with the vicinity of a nozzle aperture when the cleaning blade is pressed is formed.
- EP 0 960 733 discloses an ink jet head, including a plurality of discharging outlets disposed in an arrangement direction; a plurality of ink pathways communicating with an associated one of said discharging outlets, each ink pathway having an energy generating element for generating energy for discharging an ink from said discharging outlet; and a discharging outlet face having a discharging outlet surface, said discharging outlets being arranged in said discharging outlet surface and a water-repellent discharging outlet peripheral region circumscribing said discharging outlets, and having a first side and a second side, herewith a recessed hydrophilic region circumscribing said water-repellent discharging outlet peripheral region, said recessed hydrophilic region being positioned along the arrangement direction of the discharging outlets on at least one said side of said water-repellent discharging outlet peripheral region, said recessed hydrophilic region being separated by a predetermined distance from said water-repellent discharging outlet peripheral region.
- the invention features a drop ejector according to claim 1.
- the invention features a drop ejector according to claim.
- Embodiments may include one or more of the following advantages.
- Printhead operation is robust and reliable since waste ink about the face of the nozzle plate is controlled to reduce interference with drop formation and ejection.
- Drop velocity and trajectory straightness is maintained in high performance printheads in which large arrays of small nozzles must accurately eject ink to precise locations on a substrate.
- the projections control waste ink and permit desirable jetting characteristics with a variety of jetting fluids, such as inks with varying viscosity or surface tension characteristics, and heads with varying pressure characteristics at the nozzle openings.
- the projections are robust, do not require moving components, and can be economically implemented by etching, e.g., in a semiconductor material such as a silicon material.
- an inkjet apparatus 10 includes a reservoir 11 containing a supply of ink 12 and a passage 13 leading from the reservoir 11 to a pressure chamber 14.
- the actuator is operable to force ink from the pressure chamber 14 through a passage 16 leading to a nozzle opening 17 in an nozzle plate 18, causing a drop of ink 19 to be ejected from the nozzle 17 toward a substrate 20.
- the ink j et apparatus 10 and the substrate 20 can be moved relative to one another.
- the substrate can be a continuous web that is moved between rolls 22 and 23.
- the inkjet apparatus also controls the operating pressure at the ink meniscus proximate the nozzle openings when the system is not ejecting drops. Variations in meniscus pressure can cause variation in drop volume or velocity which can lead to printing errors and weeping.
- pressure control is provided by a vacuum source 30 such as a mechanical pump that applies a vacuum to the headspace 9 over the ink 12 in the reservoir 11. The vacuum is communicated through the ink to the nozzle opening 17 to prevent ink from weeping through the nozzle opening by force of gravity.
- a controller 32 e.g. a computer controller, monitors the vacuum over the ink in the reservoir 11 and adjusts the source 30 to maintain a desired vacuum in the reservoir.
- a vacuum source is provided by arranging the ink reservoir below the nozzle openings to create a vacuum proximate the nozzle openings.
- An ink level monitor (not shown) detects the level of ink, which falls as ink is consumed during a printing operation and thus increases the vacuum at the nozzles.
- a controller monitors the ink level and refills the reservoir from a bulk container when ink falls below a desired level to maintain vacuum within a desired operation range.
- the ink in which the reservoir is located far enough below the nozzles that the vacuum of the meniscus overcomes the capillary force in the nozzle, the ink can be pressurized to maintain a meniscus proximate the nozzle openings.
- the operating vacuum is maintained at about 0.5 to about 10 inches of water.
- nozzle plate portion 90 includes elevated platform 92 and nozzle opening 94 that is centered on platform 92.
- Proximate the platform 92 and nozzle opening 94 is a field of ink control projections 96 in the form of cylindrical posts that extend from the floor of the nozzle plate transversely to the plane of nozzle opening 94.
- ink may collect on the nozzle plate 18. If ink collection is uncontrolled, over time, the ink can form puddles which cause printing errors. For example, puddles near the edge of a nozzle opening can affect the trajectory, velocity or volume of the ejected drops. Also, a puddle could become large enough so that it drips onto printing substrate causing an extraneous mark.
- the puddle could also protrude far enough off the nozzle plate surfaces that the printing substrate comes into contact with it, causing a smear on the printing substrate.
- the projections 96 spread waste fluid about the nozzle plate and, thus, discourage the growth of deep puddles that can, e.g., drip off the nozzle plate onto printing substrate. Initially, puddles form on platform 92 and then move from platform 92 to the field of projections 96 that are proximate platform 92.
- the projections 96 define spaces 98 so that waste fluid is wicked away from nozzle opening 94 by capillary forces.
- two portions 90, 90' of a nozzle plate include two adjacent nozzle openings 94, 94' as illustrated.
- Each of the portions 90, 90' includes a field of projections surrounding the nozzle opening. The fields are bordered by void regions 114, 115 and 117 and waste channels 119, 122. Channels 119, 122 include drain apertures 121.
- the pattern of the projections diverts ink away from the nozzles and toward the channels.
- waste ink puddles initially move in all possible directions from projection-to-projection under the influence of capillary action, including the four general directions 112, 116, 118 and 120.
- apertures 121 are maintained under reduced pressure, e.g., by communication with a mechanical vacuum apparatus (not shown) to draw the waste ink from each channel.
- the apertures can be filled with a wicking material, e.g., a foamed polyurethane or other absorbent material, to remove waste ink from each channel 119.
- the ratio of the projection height to projection width is from about 0.2 to about 1 or greater, e.g. about 5 or greater.
- waste ink moves from projection-to-projection under the influence of gravity and capillary action, macroscopically in a single direction 112, 116, 118 or 120, depending upon the orientation of nozzle plate 110.
- Suitable channels are described in U.S. Serial Number 10/749,833, filed December 30, 2003
- suitable apertures are described in U.S. Serial Number 10/749,829, filed December 30, 2003 .
- the spacing, size, location, shape, number and pattern of the projections are selected to prevent excessive pooling of ink on the nozzle surface by increasing the surface area of the nozzle plate in the area about the nozzle opening.
- the size of the spaces G between the projections is such that the fluid will be drawn into the openings and retained by capillary forces.
- the spacing G is between about 20 % of the nozzle opening width W N or more and about twice the nozzle opening width W N or less.
- the pattern of projections define a series of rows and columns. In embodiments, the pattern defines an arc.
- the pattern of projections can be arranged to direct waste ink in a desired direction on the nozzle plate.
- the width of the projections W P is small enough to provide substantial increase in surface area, but large enough to be sufficiently robust. In addition, the width of the projections is not so large that excessive waste ink builds up on outer surfaces. In embodiments, the width of the projections is about twice the nozzle opening width or less.
- the height of the projections H P can be greater than, equal to, or less than the plane of the nozzle opening. Longer projections can retain a greater amount of waste ink because they present greater surface area. Projections that are recessed below the nozzle opening plane are less susceptible to damage. Projections that are in the plane of the nozzle opening can, in some cases, be easier to manufacture, e.g., by etching.
- the projections are disposed in locations on the nozzle plate in which waste ink may collect.
- the projections substantially surround the nozzle opening.
- the projections are spaced from the nozzle opening to discourage the collection of waste ink too close to the nozzle opening, where it could affect drop ejection.
- the projections are no closer to the periphery of the nozzle opening than about 20% or 200 % of the nozzle opening width W N .
- the shape of the projections can be elongated posts.
- the posts can be, e.g., circular in cross-section or irregular in cross-section.
- the posts can be substantially perpendicular to the plane of the nozzle opening or at other transverse angles with respect to the plane of the nozzle opening.
- the projections are wall structures. The wall structures can be attached to the nozzle plate over a substantial area and, thus, resist dislodgement should the nozzle plate come into contact with a foreign body, e.g., a substrate.
- the number of posts is selected to control a desired jetting fluid volume or to create a desired pattern, as discussed above.
- there are four or more posts e.g., six or more.
- the height H P of the projections is, e.g., from about 5 microns to about 100 microns or more, for example, 200 microns.
- the spacing S from the closest post to the edge of platform is, e.g., from about 10 microns to about 20 microns, while the gap, G, between the projections is, e.g., about 5 microns to about 25 microns.
- the width of the projections Wp is, e.g., from about 5 microns to about 20 microns.
- the nozzle width is about 200 microns or less, e.g., 10 to 50 microns
- the nozzle pitch is about 25 nozzles/inch or more, e.g., about 100-300 nozzles/inch
- the ink drop volume is about 1 to 70 pL and the fluid is pressurized by a piezoelectric actuator.
- the jetting fluid has a viscosity of about 1 to 40 centipoise.
- the the fluid has a surface tension of about 20-50 dynes/cm.
- the jetting fluid is ink.
- the jetting fluid is a biological fluid.
- nozzle plate portion 120 includes a nozzle opening 126 disposed in a well 124 and is surrounded by projections 125 in the form of cylindrical posts proximate nozzle opening 126. Projections 125 to symmetrically spread waste ink within the well. Over time, well 124 partially fills with jetting fluid to form a meniscus over the nozzle opening.
- DROP EJECTION ASSEMBLY The use of a well to facilitate the jetting of fluids is described in an application entitled "DROP EJECTION ASSEMBLY" filed concurrently herewith and assigned U.S. Serial Number 10/749,622 filed December 30, 2003 .
- nozzle plate portion 200 includes a plurality of arcuate projections 202 in the form of walls that form broken, concentric surfaces about elevated platform 204 and nozzle opening 206 that is centered on platform 204.
- the projections 202 about the elevated platform 204 extend transversely to the plane of the nozzle opening 206.
- a first space 207 is formed between the edge of the elevated platform 203 and the first series of arcuate projections 202 that form the first broken concentric surface about the elevated platform.
- a second space 210 is formed between projections 202 that are radially equidistant from the center of the nozzle opening 206 and a third space 212 is formed between projections 202 on adjacent, broken concentric surfaces.
- Ink puddles that form on platform 204 move to the field of projections 202.
- the ink wicks into the first space 207 and then moves under capillary action until it finds a second space 210, and then begins to move radially away from the platform 204.
- a third space 212 the waste ink moves into that space or continues to move radially away from nozzle opening 206.
- the path followed by the waste ink depends upon the relative sizes of the first 207, second 210 and third 212 spaces.
- the number of broken, concentric surfaces about platform 204 is, e.g., 2, 4, 6, 10 or more.
- the spacing between projections is such that fluid will be drawn into the openings and retained by capillary forces as described above.
- the arcuate projections are above the plane of nozzle opening 206.
- the projections and/or the nozzle opening in any of the above described embodiments can be formed by machining, electroforming, laser ablation, and chemical or plasma etching.
- the projections can also be formed by molding, e.g., injection molded plastic projections.
- the projections and nozzle opening can be formed in a common body or in separate bodies that are assembled.
- the nozzle opening can be formed in a body that defines other components of an ink flow path and the well can be formed in a separate body which is assembled to the body defining the nozzle opening.
- the projections, nozzle opening, and pressure chamber are formed in a common body.
- the body can be a metal, carbon or an etchable material such as silicon material, e.g., silicon or silicon dioxide. Forming printhead components using etching techniques is further described in U.S. Serial Number 10/189,947, filed July 3, 2002 , and U.S. Serial Number 60/510,459, filed October 10, 2003 .
- the drop ejection system can be utilized to eject fluids other than ink.
- the deposited droplets can be ink or other materials.
- the deposited droplets may be a UV or other radiation curable material or other material, for example, biological fluids, capable of being delivered as droplets.
- the apparatus described could be part of a precision dispensing system.
- the projections can be formed of a porous material, e.g., porous silicon or porous metal, to increase the surface area and, thus, the waste ink handling capacity of the projections.
- the projections can be formed of an absorbent material that can help to wick away the waste ink from the nozzle plate.
- the projections can be used in combination with other waste fluid control features such as apertures described in U.S. Serial Number 10/749,829 filed December 30, 2003 , wells as described in U.S. Serial Number 10/749,622 filed December 30, 2003 and/or channels as described in U.S. Serial Number 10/749,833 filed December 30,2003 .
- a series of channels can be included on the nozzle face proximate the projections.
- the cleaning structures can be combined with a manual or automatic washing and wiping system in which a cleaning fluid is applied to the nozzle plate and wiped clean.
- the cleaning structures can collect cleaning fluid and debris rather than jetted waste ink.
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
- Jet Pumps And Other Pumps (AREA)
Abstract
Description
- This invention relates to depositing drops on a substrate.
- Ink jet printers are one type of apparatus for depositing drops on a substrate. Ink jet printers typically include an ink path from an ink supply to a nozzle path. The nozzle path terminates in a nozzle opening from which ink drops are ejected. Ink drop ejection is typically controlled by pressurizing ink in the ink path with an actuator, which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element. A typical print assembly has an array of ink paths with corresponding nozzle openings and associated actuators. Drop ejection from each nozzle opening can be independently controlled. In a drop-on-demand print assembly, each actuator is fired to selectively eject a drop at a specific pixel location of an image as the print assembly and a printing substrate are moved relative to one another. In high performance print assemblies, the nozzle openings typically have a diameter of 50 microns or less, e.g. around 25 microns, are separated at a pitch of 100-300 nozzles/inch, have a resolution of 100 to 3000 dpi or more, and provide drops with a volume of about 1 to 120 picoliters (pl) or less. Drop ejection frequency is typically 10 kHz or more.
-
Hoisington et al. U.S. Patent No. 5,265,315 , describes a print assembly that has a semiconductor body and a piezoelectric actuator. The body is made of silicon, which is etched to define ink chambers. Nozzle openings are defined by a separate nozzle plate, which is attached to the silicon body. The piezoelectric actuator has a layer of piezoelectric material, which changes geometry, or bends, in response to an applied voltage. The bending of the piezoelectric layer pressurizes ink in a pumping chamber located along the ink path. Piezoelectric ink jet print assemblies are also described inFishbeck et al. U.S. Patent No. 4,825,227 ,Hine U.S. Patent No. 4,937,598 ,Moynihan et al. U.S. Patent No. 5,659,346 andHoisington U.S. Patent No. 5,757,391 . -
EP 1 293 343 discloses a liquid discharge recording head comprising a substrate on which an energy generating element for generating liquid discharging energy is provided, and an orifice plate which is laminated with the substrate and in which a discharge port corresponding to the energy generating element is provided, and wherein a liquid droplet is discharged in a direction substantially perpendicular to surfaces of the substrate and the orifice plate, and further wherein a flow path is formed between the substrate and the orifice plate, a groove encircling the flow path is formed in the orifice plate, and edge portions of the orifice plate contacted with the groove are formed as saw-shaped portions having a number of minute indentations. -
EP 0 943 441 discloses an ink jet recording head, wherein an open exhaust port is secured on the side of the end in a direction in which a cleaning blade and a recording head are relatively moved in the vicinity of a nozzle aperture in a nozzle plate and a protective layer for regulating so that the cleaning blade comes in contact with the vicinity of a nozzle aperture when the cleaning blade is pressed is formed. -
EP 0 960 733 discloses an ink jet head, including a plurality of discharging outlets disposed in an arrangement direction; a plurality of ink pathways communicating with an associated one of said discharging outlets, each ink pathway having an energy generating element for generating energy for discharging an ink from said discharging outlet; and a discharging outlet face having a discharging outlet surface, said discharging outlets being arranged in said discharging outlet surface and a water-repellent discharging outlet peripheral region circumscribing said discharging outlets, and having a first side and a second side, herewith a recessed hydrophilic region circumscribing said water-repellent discharging outlet peripheral region, said recessed hydrophilic region being positioned along the arrangement direction of the discharging outlets on at least one said side of said water-repellent discharging outlet peripheral region, said recessed hydrophilic region being separated by a predetermined distance from said water-repellent discharging outlet peripheral region. - In an aspect, the invention features a drop ejector according to claim 1.
- In another aspect, the invention features a drop ejector according to claim.
- Other aspects or embodiments are defined in claims 2-12 and 14-25.
- Embodiments may include one or more of the following advantages. Printhead operation is robust and reliable since waste ink about the face of the nozzle plate is controlled to reduce interference with drop formation and ejection. Drop velocity and trajectory straightness is maintained in high performance printheads in which large arrays of small nozzles must accurately eject ink to precise locations on a substrate. The projections control waste ink and permit desirable jetting characteristics with a variety of jetting fluids, such as inks with varying viscosity or surface tension characteristics, and heads with varying pressure characteristics at the nozzle openings. The projections are robust, do not require moving components, and can be economically implemented by etching, e.g., in a semiconductor material such as a silicon material.
- Still further aspects, features, and advantages follow. For example, particular aspects include projection dimensions, characteristics, and operating conditions described below.
-
-
Fig. 1 is a schematic of a drop ejection assembly. -
Fig. 2 is a perspective view of a portion of a nozzle plate with projections. -
Fig. 3 is a top view of a portion of a nozzle plate with projections. -
Fig. 4 is a perspective view of a portion of a nozzle plate with a nozzle opening and projections disposed in a well. -
Fig. 5 is a perspective view of a portion of a nozzle plate with arcuate projections. -
Fig. 5A is a top view of a portion of the nozzle plate shown inFig. 5 . -
Fig. 5B is a cross-sectional view of the nozzle plate portion shown inFig. 5A , taken alongline 5B-5B. - Referring to
Fig. 1 , aninkjet apparatus 10 includes areservoir 11 containing a supply ofink 12 and apassage 13 leading from thereservoir 11 to apressure chamber 14. Anactuator 15, e.g., a piezoelectric transducer, forms one wall of thepressure chamber 14. The actuator is operable to force ink from thepressure chamber 14 through apassage 16 leading to a nozzle opening 17 in annozzle plate 18, causing a drop ofink 19 to be ejected from thenozzle 17 toward asubstrate 20. During operation, the inkj et apparatus 10 and thesubstrate 20 can be moved relative to one another. For example, the substrate can be a continuous web that is moved betweenrolls nozzles 17 innozzle plate 18, a desired image is produced onsubstrate 20. - The inkjet apparatus also controls the operating pressure at the ink meniscus proximate the nozzle openings when the system is not ejecting drops. Variations in meniscus pressure can cause variation in drop volume or velocity which can lead to printing errors and weeping. In the embodiment illustrated, pressure control is provided by a
vacuum source 30 such as a mechanical pump that applies a vacuum to theheadspace 9 over theink 12 in thereservoir 11. The vacuum is communicated through the ink to the nozzle opening 17 to prevent ink from weeping through the nozzle opening by force of gravity. Acontroller 32, e.g. a computer controller, monitors the vacuum over the ink in thereservoir 11 and adjusts thesource 30 to maintain a desired vacuum in the reservoir. In other embodiments, a vacuum source is provided by arranging the ink reservoir below the nozzle openings to create a vacuum proximate the nozzle openings. An ink level monitor (not shown) detects the level of ink, which falls as ink is consumed during a printing operation and thus increases the vacuum at the nozzles. A controller monitors the ink level and refills the reservoir from a bulk container when ink falls below a desired level to maintain vacuum within a desired operation range. In other embodiments, in which the reservoir is located far enough below the nozzles that the vacuum of the meniscus overcomes the capillary force in the nozzle, the ink can be pressurized to maintain a meniscus proximate the nozzle openings. In embodiments, the operating vacuum is maintained at about 0.5 to about 10 inches of water. - Referring to
Fig. 2 ,nozzle plate portion 90 includes elevatedplatform 92 andnozzle opening 94 that is centered onplatform 92. Proximate theplatform 92 andnozzle opening 94 is a field ofink control projections 96 in the form of cylindrical posts that extend from the floor of the nozzle plate transversely to the plane ofnozzle opening 94. During ink jetting, ink may collect on thenozzle plate 18. If ink collection is uncontrolled, over time, the ink can form puddles which cause printing errors. For example, puddles near the edge of a nozzle opening can affect the trajectory, velocity or volume of the ejected drops. Also, a puddle could become large enough so that it drips onto printing substrate causing an extraneous mark. The puddle could also protrude far enough off the nozzle plate surfaces that the printing substrate comes into contact with it, causing a smear on the printing substrate. Theprojections 96 spread waste fluid about the nozzle plate and, thus, discourage the growth of deep puddles that can, e.g., drip off the nozzle plate onto printing substrate. Initially, puddles form onplatform 92 and then move fromplatform 92 to the field ofprojections 96 that areproximate platform 92. Theprojections 96 definespaces 98 so that waste fluid is wicked away from nozzle opening 94 by capillary forces. - Referring to
Fig. 3 , twoportions 90, 90' of a nozzle plate include twoadjacent nozzle openings 94, 94' as illustrated. Each of theportions 90, 90' includes a field of projections surrounding the nozzle opening. The fields are bordered byvoid regions waste channels Channels drain apertures 121. The pattern of the projections diverts ink away from the nozzles and toward the channels. When the nozzle plate is oriented horizontally (nozzle opening upward or downward), waste ink puddles initially move in all possible directions from projection-to-projection under the influence of capillary action, including the fourgeneral directions void region projections 96 is too great for capillary forces to continue to move waste ink in that direction. The movement of waste ink continues until encountering channels 119,122, which catch waste ink. In embodiments,apertures 121 are maintained under reduced pressure, e.g., by communication with a mechanical vacuum apparatus (not shown) to draw the waste ink from each channel. Alternatively, the apertures can be filled with a wicking material, e.g., a foamed polyurethane or other absorbent material, to remove waste ink from eachchannel 119. In embodiments, the ratio of the projection height to projection width is from about 0.2 to about 1 or greater, e.g. about 5 or greater. When the nozzle plate is oriented vertically, waste ink moves from projection-to-projection under the influence of gravity and capillary action, macroscopically in asingle direction nozzle plate 110. Suitable channels are described inU.S. Serial Number 10/749,833, filed December 30, 2003U.S. Serial Number 10/749,829, filed December 30, 2003 - The spacing, size, location, shape, number and pattern of the projections are selected to prevent excessive pooling of ink on the nozzle surface by increasing the surface area of the nozzle plate in the area about the nozzle opening. The size of the spaces G between the projections is such that the fluid will be drawn into the openings and retained by capillary forces. In embodiments, the spacing G is between about 20 % of the nozzle opening width WN or more and about twice the nozzle opening width WN or less. In embodiments, the pattern of projections define a series of rows and columns. In embodiments, the pattern defines an arc. The pattern of projections can be arranged to direct waste ink in a desired direction on the nozzle plate.
- The width of the projections WP is small enough to provide substantial increase in surface area, but large enough to be sufficiently robust. In addition, the width of the projections is not so large that excessive waste ink builds up on outer surfaces. In embodiments, the width of the projections is about twice the nozzle opening width or less. The height of the projections HP can be greater than, equal to, or less than the plane of the nozzle opening. Longer projections can retain a greater amount of waste ink because they present greater surface area. Projections that are recessed below the nozzle opening plane are less susceptible to damage. Projections that are in the plane of the nozzle opening can, in some cases, be easier to manufacture, e.g., by etching.
- The projections are disposed in locations on the nozzle plate in which waste ink may collect. In embodiments, the projections substantially surround the nozzle opening. In embodiments, the projections are spaced from the nozzle opening to discourage the collection of waste ink too close to the nozzle opening, where it could affect drop ejection. In embodiments, the projections are no closer to the periphery of the nozzle opening than about 20% or 200 % of the nozzle opening width WN.
- In embodiments, the shape of the projections can be elongated posts. The posts can be, e.g., circular in cross-section or irregular in cross-section. The posts can be substantially perpendicular to the plane of the nozzle opening or at other transverse angles with respect to the plane of the nozzle opening. In other embodiments, the projections are wall structures. The wall structures can be attached to the nozzle plate over a substantial area and, thus, resist dislodgement should the nozzle plate come into contact with a foreign body, e.g., a substrate.
- The number of posts is selected to control a desired jetting fluid volume or to create a desired pattern, as discussed above. In embodiments in which the projections surround the nozzle opening, there are four or more posts, e.g., six or more.
- In particular embodiments, the height HP of the projections is, e.g., from about 5 microns to about 100 microns or more, for example, 200 microns. The spacing S from the closest post to the edge of platform is, e.g., from about 10 microns to about 20 microns, while the gap, G, between the projections is, e.g., about 5 microns to about 25 microns. The width of the projections Wp is, e.g., from about 5 microns to about 20 microns. In embodiments, the nozzle width is about 200 microns or less, e.g., 10 to 50 microns, the nozzle pitch is about 25 nozzles/inch or more, e.g., about 100-300 nozzles/inch, the ink drop volume is about 1 to 70 pL and the fluid is pressurized by a piezoelectric actuator. In embodiments, the jetting fluid has a viscosity of about 1 to 40 centipoise. In embodiments, the the fluid has a surface tension of about 20-50 dynes/cm. In embodiments, the jetting fluid is ink. In embodiments, the jetting fluid is a biological fluid.
- Referring now to
Fig. 4 ,nozzle plate portion 120 includes anozzle opening 126 disposed in a well 124 and is surrounded byprojections 125 in the form of cylindrical postsproximate nozzle opening 126.Projections 125 to symmetrically spread waste ink within the well. Over time, well 124 partially fills with jetting fluid to form a meniscus over the nozzle opening. The use of a well to facilitate the jetting of fluids is described in an application entitled "DROP EJECTION ASSEMBLY" filed concurrently herewith and assignedU.S. Serial Number 10/749,622 filed December 30, 2003 - Referring to
Figs. 5-5B ,nozzle plate portion 200 includes a plurality ofarcuate projections 202 in the form of walls that form broken, concentric surfaces aboutelevated platform 204 andnozzle opening 206 that is centered onplatform 204. Theprojections 202 about theelevated platform 204 extend transversely to the plane of thenozzle opening 206. Afirst space 207 is formed between the edge of theelevated platform 203 and the first series ofarcuate projections 202 that form the first broken concentric surface about the elevated platform. Asecond space 210 is formed betweenprojections 202 that are radially equidistant from the center of thenozzle opening 206 and athird space 212 is formed betweenprojections 202 on adjacent, broken concentric surfaces. Ink puddles that form onplatform 204 move to the field ofprojections 202. The ink wicks into thefirst space 207 and then moves under capillary action until it finds asecond space 210, and then begins to move radially away from theplatform 204. Upon encountering athird space 212, the waste ink moves into that space or continues to move radially away fromnozzle opening 206. The path followed by the waste ink depends upon the relative sizes of the first 207, second 210 and third 212 spaces. In embodiments, the number of broken, concentric surfaces aboutplatform 204 is, e.g., 2, 4, 6, 10 or more. The spacing between projections is such that fluid will be drawn into the openings and retained by capillary forces as described above. In implementations, the arcuate projections are above the plane ofnozzle opening 206. - The projections and/or the nozzle opening in any of the above described embodiments can be formed by machining, electroforming, laser ablation, and chemical or plasma etching. The projections can also be formed by molding, e.g., injection molded plastic projections. The projections and nozzle opening can be formed in a common body or in separate bodies that are assembled. For example, the nozzle opening can be formed in a body that defines other components of an ink flow path and the well can be formed in a separate body which is assembled to the body defining the nozzle opening. In other embodiments, the projections, nozzle opening, and pressure chamber are formed in a common body. The body can be a metal, carbon or an etchable material such as silicon material, e.g., silicon or silicon dioxide. Forming printhead components using etching techniques is further described in
U.S. Serial Number 10/189,947, filed July 3, 2002U.S. Serial Number 60/510,459, filed October 10, 2003 - In embodiments, the drop ejection system can be utilized to eject fluids other than ink. The deposited droplets can be ink or other materials. For example, the deposited droplets may be a UV or other radiation curable material or other material, for example, biological fluids, capable of being delivered as droplets. For example, the apparatus described could be part of a precision dispensing system. The projections can be formed of a porous material, e.g., porous silicon or porous metal, to increase the surface area and, thus, the waste ink handling capacity of the projections. The projections can be formed of an absorbent material that can help to wick away the waste ink from the nozzle plate.
- The projections can be used in combination with other waste fluid control features such as apertures described in
U.S. Serial Number 10/749,829 filed December 30, 2003U.S. Serial Number 10/749,622 filed December 30, 2003U.S. Serial Number 10/749,833 filed December 30,2003 - Still other embodiments are within the scope of the following claims.
Claims (25)
- A drop ejector, comprising:a flow path in which fluid is pressurized to eject drops from a nozzle opening (17; 94; 126; 206) in a plane, andproximate the nozzle opening (17; 94; 126; 206), a plurality of projections (96; 125; 202) extending transversely to a plane of the nozzle opening (17; 94; 126; 206), wherein the height of the projections (96; 125; 202) is substantially equal to the plane of the nozzle opening (17; 94; 126; 206), and characterized in thatthe projections (96; 125; 202) are spaced from each other by spaces (98; 124; 207, 210, 212), and each space (98; 124; 207, 210, 212) is in communication with apertures (121) maintained under reduced pressure.
- The drop ejector of claim 1 wherein the nozzle opening (17; 94; 126; 206) is surrounded by the projections (96; 125; 202).
- The drop ejector of claim 1 wherein the projections (96; 125; 202) comprise posts.
- The drop ejector of claim 1 wherein the projections (96; 125; 202) are wall-shaped.
- The drop ejector of claim 1 wherein the projections (96; 125; 202) are arranged in a pattern.
- The drop ejector of claim 5 wherein the pattern defines an array of rows and columns.
- The drop ejector of claim 5 wherein the pattern defines an arc.
- The drop ejector of claim 5, wherein the pattern defines concentric ink-collection spaces.
- The drop ejector of claim 1 wherein the projections (96; 125; 202) have a width that is about twice the nozzle opening width or less.
- The drop ejector of claim 1 further comprising the nozzle opening (17; 94; 126; 206) having a perimeter and a nozzle opening width, wherein the projections (96; 125; 202) are no closer to the perimeter of the nozzle opening (17; 94; 126; 206) than about 20% of the nozzle opening width.
- The drop ejector of claim 1 wherein the spacing between projections (96; 125; 202) is about twice the nozzle width or less.
- The drop ejector of claim 1 wherein the number of the projections (96; 125; 202) is four or greater.
- A drop ejector, comprising:a flow path in which fluid is pressurized to eject drops from a nozzle opening (17; 94; 126; 206) in a plane, andproximate the nozzle opening (17; 94; 126; 206), a plurality of projections (96; 125; 202) extending transversely to the plane of the nozzle opening (17; 94; 126; 206), wherein the height of the projections (96; 125; 202) is below the plane of nozzle opening (17; 94; 126; 206), and wherein the projections (96; 125; 202) are spaced from each other by spaces (98; 124; 207, 210, 212) and each space (98; 124; 207, 210, 212) is in communication with apertures (121) maintained under reduced pressure.
- The drop ejector of claim 12 or claim 1 wherein the nozzle opening (17; 94; 126; 206) and projections (96; 125; 202) are defined in a common body.
- The drop ejector of claim 14 wherein the body comprises a silicon material.
- The drop ejector of claim 1 or claim 12 including a channel proximate the projections (96; 125; 202), the channel including the apertures (121).
- The drop ejector of claim 1 or claim 12 including a vacuum source or wicking material proximate the projections (96; 125; 202).
- The drop ejector of claim 12 wherein the nozzle opening (17; 94; 126; 206) is disposed in a well and the well includes said projections (96; 125; 202).
- The drop ejector of claim 12 wherein the nozzle opening (17; 94; 126; 206) is disposed on a platform and the projections (96; 125; 202) are disposed proximate the platform.
- The drop ejector of claim 1 or claim 12 wherein the nozzle opening width is about 200 micron or less.
- The drop ejector of claim claim 1 or 12 including a piezoelectric actuator.
- The drop ejector of claim 12 wherein the spacing between said projections (96; 125; 202) is between about 20% of the nozzle opening width or greater and twice the nozzle opening width or less.
- The drop ejector of claim 1 wherein the projections (96; 125; 202) have a width that is about twice the nozzle opening or less.
- The drop ejector of claim 12 wherein the projections (96; 125; 202) are arranged in a pattern.
- The drop ejector of claim 8, wherein the concentric spaces are arranged such that ink can move from one space to another space.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US10/749,816 US7121646B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
US10/749,622 US7168788B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
US10/749,829 US7237875B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
US10/749,833 US7303259B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
PCT/US2004/043776 WO2005065331A2 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
Publications (3)
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EP1706266A2 EP1706266A2 (en) | 2006-10-04 |
EP1706266A4 EP1706266A4 (en) | 2009-08-12 |
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EP04815609A Active EP1706269B1 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
EP04817071A Active EP1706270B1 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
EP04815778A Active EP1706266B1 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
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EP04815609A Active EP1706269B1 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
EP04817071A Active EP1706270B1 (en) | 2003-12-30 | 2004-12-29 | Drop ejection assembly |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4665660B2 (en) * | 2005-08-19 | 2011-04-06 | セイコーエプソン株式会社 | NOZZLE PLATE, MANUFACTURING METHOD THEREOF, AND LIQUID DISCHARGE HEAD |
US8136934B2 (en) | 2009-02-18 | 2012-03-20 | Xerox Corporation | Waste phase change ink recycling |
JP5764312B2 (en) * | 2010-11-05 | 2015-08-19 | 富士フイルム株式会社 | Ink jet recording apparatus and nozzle plate cleaning method |
US8517518B2 (en) | 2010-11-09 | 2013-08-27 | Canon Kabushiki Kaisha | Recording apparatus and liquid ejection head |
JP5863337B2 (en) * | 2011-08-25 | 2016-02-16 | キヤノン株式会社 | Inkjet recording head |
FR2968597A1 (en) * | 2010-12-13 | 2012-06-15 | Centre Nat Rech Scient | INKJET DEVICE HAVING FLUID EXTRACTION MEANS AND INK JET METHOD THEREOF |
JP5934161B2 (en) * | 2013-09-09 | 2016-06-15 | 武蔵エンジニアリング株式会社 | Nozzle and liquid material discharge apparatus including the nozzle |
JP6193442B2 (en) * | 2016-05-06 | 2017-09-06 | 武蔵エンジニアリング株式会社 | Liquid material discharge device |
JP7008270B2 (en) | 2017-04-24 | 2022-01-25 | ブラザー工業株式会社 | Liquid discharger and inkjet printer |
WO2023223196A1 (en) * | 2022-05-16 | 2023-11-23 | Merxin Ltd | Nozzle arrangement |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1109303B (en) * | 1978-10-30 | 1985-12-16 | Ipm Ind Politecnica Meridional | UNI-AXIS ANISOTROP MAGNETIZATION CREDIT CARD |
GB2061831B (en) * | 1979-11-07 | 1984-02-29 | Matsushita Electric Ind Co Ltd | Ink jet writing head with spacer in capillary chamber |
JPS5763266A (en) * | 1980-10-02 | 1982-04-16 | Seiko Epson Corp | Ink jet head |
DE3048259A1 (en) * | 1980-12-20 | 1982-07-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "NOZZLE FOR INK JET PRINTER" |
US4459601A (en) * | 1981-01-30 | 1984-07-10 | Exxon Research And Engineering Co. | Ink jet method and apparatus |
JPS57188372A (en) * | 1981-01-30 | 1982-11-19 | Exxon Research Engineering Co | Ink jet device |
JPS5995157A (en) * | 1982-11-23 | 1984-06-01 | Yokogawa Hewlett Packard Ltd | Head for bubble driven ink jet printer |
US4528996A (en) * | 1983-12-22 | 1985-07-16 | The Mead Corporation | Orifice plate cleaning system |
JPS61115644U (en) * | 1984-12-28 | 1986-07-22 | ||
US4613875A (en) * | 1985-04-08 | 1986-09-23 | Tektronix, Inc. | Air assisted ink jet head with projecting internal ink drop-forming orifice outlet |
JPS6219247A (en) * | 1985-07-16 | 1987-01-28 | Toray Ind Inc | Method for eliminating colloidal substance |
JPS62150145U (en) * | 1986-03-18 | 1987-09-22 | ||
US4825227A (en) | 1988-02-29 | 1989-04-25 | Spectra, Inc. | Shear mode transducer for ink jet systems |
US4992802A (en) * | 1988-12-22 | 1991-02-12 | Hewlett-Packard Company | Method and apparatus for extending the environmental operating range of an ink jet print cartridge |
US4937598A (en) | 1989-03-06 | 1990-06-26 | Spectra, Inc. | Ink supply system for an ink jet head |
US5265315A (en) | 1990-11-20 | 1993-11-30 | Spectra, Inc. | Method of making a thin-film transducer ink jet head |
JPH05155028A (en) * | 1991-12-04 | 1993-06-22 | Ricoh Co Ltd | Ink jet head |
AU676214B2 (en) * | 1992-10-19 | 1997-03-06 | Canon Kabushiki Kaisha | Ink jet head having improved jet port surface, and ink jet apparatus equipped with the ink jet head |
US5659346A (en) | 1994-03-21 | 1997-08-19 | Spectra, Inc. | Simplified ink jet head |
US5604521A (en) * | 1994-06-30 | 1997-02-18 | Compaq Computer Corporation | Self-aligning orifice plate for ink jet printheads |
WO1996002392A1 (en) | 1994-07-20 | 1996-02-01 | Spectra, Inc. | High frequency drop-on-demand ink jet system |
JPH08230185A (en) * | 1995-03-01 | 1996-09-10 | Brother Ind Ltd | Ink jet device |
JP3315589B2 (en) * | 1995-06-21 | 2002-08-19 | キヤノン株式会社 | Ink tank and recording apparatus provided with the same |
JP3386099B2 (en) * | 1995-07-03 | 2003-03-10 | セイコーエプソン株式会社 | Nozzle plate for ink jet recording head, method of manufacturing the same, and ink jet recording head |
EP0943441B1 (en) * | 1997-06-04 | 2005-10-26 | Seiko Epson Corporation | Ink jet recording head and ink jet recorder |
US6235212B1 (en) * | 1997-07-15 | 2001-05-22 | Silverbrook Research Pty Ltd | Method of manufacture of an electrostatic ink jet printer |
US6264307B1 (en) * | 1997-07-15 | 2001-07-24 | Silverbrook Research Pty Ltd | Buckle grill oscillating pressure ink jet printing mechanism |
US5853861A (en) * | 1997-09-30 | 1998-12-29 | E. I. Du Pont De Nemours And Company | Ink jet printing of textiles |
US6132028A (en) * | 1998-05-14 | 2000-10-17 | Hewlett-Packard Company | Contoured orifice plate of thermal ink jet print head |
GB2339170A (en) * | 1998-07-25 | 2000-01-19 | Markem Tech Ltd | Printhead with integral ink gutter |
US6267464B1 (en) * | 1998-12-28 | 2001-07-31 | Eastman Kodak Company | Self cleaning ink jet printhead cartridges |
US6283575B1 (en) * | 1999-05-10 | 2001-09-04 | Eastman Kodak Company | Ink printing head with gutter cleaning structure and method of assembling the printer |
JP2001038917A (en) * | 1999-07-29 | 2001-02-13 | Casio Comput Co Ltd | Ink jet printer |
JP2001212966A (en) * | 2000-02-04 | 2001-08-07 | Seiko Epson Corp | Hydrophilic structure and ink-jet recording head |
JP3501083B2 (en) * | 2000-03-21 | 2004-02-23 | 富士ゼロックス株式会社 | Nozzle for inkjet recording head and method of manufacturing the same |
JP2002187295A (en) * | 2000-12-22 | 2002-07-02 | Hitachi Koki Co Ltd | Ink jet print head and method for sweeping waste ink |
TW541248B (en) * | 2001-03-16 | 2003-07-11 | Benq Corp | Ink cartridge |
JP4731763B2 (en) * | 2001-09-12 | 2011-07-27 | キヤノン株式会社 | Liquid jet recording head and manufacturing method thereof |
US6820963B2 (en) | 2001-12-13 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Fluid ejection head |
US6637862B2 (en) * | 2002-02-08 | 2003-10-28 | Illinois Tool Works, Inc. | Maintenance module for fluid jet device |
-
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EP1706269A2 (en) | 2006-10-04 |
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WO2005065331A3 (en) | 2006-12-28 |
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JP2007516879A (en) | 2007-06-28 |
KR20060127955A (en) | 2006-12-13 |
WO2005065378A2 (en) | 2005-07-21 |
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KR20060127954A (en) | 2006-12-13 |
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KR20060127957A (en) | 2006-12-13 |
EP1706270B1 (en) | 2011-12-28 |
EP2415606A2 (en) | 2012-02-08 |
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