EP1642328A1 - Traps for particle entrapment in deposition chambers - Google Patents
Traps for particle entrapment in deposition chambersInfo
- Publication number
- EP1642328A1 EP1642328A1 EP04751945A EP04751945A EP1642328A1 EP 1642328 A1 EP1642328 A1 EP 1642328A1 EP 04751945 A EP04751945 A EP 04751945A EP 04751945 A EP04751945 A EP 04751945A EP 1642328 A1 EP1642328 A1 EP 1642328A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- projections
- component
- ring
- region
- pvd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47781003P | 2003-06-11 | 2003-06-11 | |
US49803603P | 2003-08-26 | 2003-08-26 | |
PCT/US2004/014800 WO2005001918A1 (en) | 2003-06-11 | 2004-05-11 | Traps for particle entrapment in deposition chambers |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1642328A1 true EP1642328A1 (en) | 2006-04-05 |
Family
ID=33555476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04751945A Withdrawn EP1642328A1 (en) | 2003-06-11 | 2004-05-11 | Traps for particle entrapment in deposition chambers |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1642328A1 (ko) |
KR (1) | KR20060023115A (ko) |
TW (1) | TW200508409A (ko) |
WO (1) | WO2005001918A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7374648B2 (en) * | 2004-06-28 | 2008-05-20 | Honeywell International Inc. | Single piece coil support assemblies, coil constructions and methods of assembling coil constructions |
WO2007084114A2 (en) | 2005-01-12 | 2007-07-26 | New York University | System and method for processing nanowires with holographic optical tweezers |
EP3254305B1 (en) * | 2015-02-06 | 2023-05-10 | Applied Materials, Inc. | 3d printed chamber components configured for lower film stress and lower operating temperature |
US11569069B2 (en) | 2015-02-06 | 2023-01-31 | Applied Materials, Inc. | 3D printed chamber components configured for lower film stress and lower operating temperature |
JP2018523013A (ja) * | 2015-07-23 | 2018-08-16 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | 改良されたスパッタリングコイル製品及び製造方法 |
WO2019007488A1 (en) * | 2017-07-04 | 2019-01-10 | Cleanpart Group Gmbh | TREATMENT CHAMBER COMPONENT AND METHOD FOR FORMING SURFACE TEXTURE |
US11183373B2 (en) | 2017-10-11 | 2021-11-23 | Honeywell International Inc. | Multi-patterned sputter traps and methods of making |
US11739411B2 (en) | 2019-11-04 | 2023-08-29 | Applied Materials, Inc. | Lattice coat surface enhancement for chamber components |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5474649A (en) * | 1994-03-08 | 1995-12-12 | Applied Materials, Inc. | Plasma processing apparatus employing a textured focus ring |
US5942041A (en) * | 1996-09-16 | 1999-08-24 | Mosel-Vitelic, Inc. | Non-sticking semi-conductor wafer clamp and method of making same |
US6277194B1 (en) * | 1999-10-21 | 2001-08-21 | Applied Materials, Inc. | Method for in-situ cleaning of surfaces in a substrate processing chamber |
-
2004
- 2004-05-11 KR KR1020057019973A patent/KR20060023115A/ko not_active Application Discontinuation
- 2004-05-11 EP EP04751945A patent/EP1642328A1/en not_active Withdrawn
- 2004-05-11 WO PCT/US2004/014800 patent/WO2005001918A1/en active Search and Examination
- 2004-05-21 TW TW093114538A patent/TW200508409A/zh unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2005001918A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW200508409A (en) | 2005-03-01 |
KR20060023115A (ko) | 2006-03-13 |
WO2005001918A1 (en) | 2005-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20060105 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20081202 |