EP1642328A1 - Pieges destines a pieger des particules dans des chambres de depot - Google Patents

Pieges destines a pieger des particules dans des chambres de depot

Info

Publication number
EP1642328A1
EP1642328A1 EP04751945A EP04751945A EP1642328A1 EP 1642328 A1 EP1642328 A1 EP 1642328A1 EP 04751945 A EP04751945 A EP 04751945A EP 04751945 A EP04751945 A EP 04751945A EP 1642328 A1 EP1642328 A1 EP 1642328A1
Authority
EP
European Patent Office
Prior art keywords
projections
component
ring
region
pvd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04751945A
Other languages
German (de)
English (en)
Inventor
Jaeyeon Kim
Terry J. Phelan
John D. Mize
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP1642328A1 publication Critical patent/EP1642328A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

Abstract

La présente invention comprend des appareils de dépôt possédant des chambres de réaction et des éléments de piégeage de particules formés le long d'une ou de plusieurs surfaces à l'intérieur de ces chambres. Dans des aspects particuliers de cette invention, les éléments de piégeage de particules peuvent comprendre une structure de projections recourbées formant des réceptacles et, peut comprendre des microstructures sur ces projections recourbées. Cette invention concerne aussi des procédés de formation d'éléments de piégeage de particules qui commencent par la formation d'une structure de projection, l'incurvation de ces projections puis, l'exposition de ces projections aux particules de façon à former des microstructures sur ces projections recourbées.
EP04751945A 2003-06-11 2004-05-11 Pieges destines a pieger des particules dans des chambres de depot Withdrawn EP1642328A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47781003P 2003-06-11 2003-06-11
US49803603P 2003-08-26 2003-08-26
PCT/US2004/014800 WO2005001918A1 (fr) 2003-06-11 2004-05-11 Pieges destines a pieger des particules dans des chambres de depot

Publications (1)

Publication Number Publication Date
EP1642328A1 true EP1642328A1 (fr) 2006-04-05

Family

ID=33555476

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04751945A Withdrawn EP1642328A1 (fr) 2003-06-11 2004-05-11 Pieges destines a pieger des particules dans des chambres de depot

Country Status (4)

Country Link
EP (1) EP1642328A1 (fr)
KR (1) KR20060023115A (fr)
TW (1) TW200508409A (fr)
WO (1) WO2005001918A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7374648B2 (en) * 2004-06-28 2008-05-20 Honeywell International Inc. Single piece coil support assemblies, coil constructions and methods of assembling coil constructions
WO2007084114A2 (fr) 2005-01-12 2007-07-26 New York University Systeme et procede de traitement de nanofils avec des pinces optiques holographiques
EP3254305B1 (fr) * 2015-02-06 2023-05-10 Applied Materials, Inc. Composants de chambre imprimés par impression 3d configurés pour une contrainte de film plus faible et une température de fonctionnement plus basse
US11569069B2 (en) 2015-02-06 2023-01-31 Applied Materials, Inc. 3D printed chamber components configured for lower film stress and lower operating temperature
JP2018523013A (ja) * 2015-07-23 2018-08-16 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 改良されたスパッタリングコイル製品及び製造方法
WO2019007488A1 (fr) * 2017-07-04 2019-01-10 Cleanpart Group Gmbh Composant de chambre de traitement et procédé de formation d'une texture de surface
US11183373B2 (en) 2017-10-11 2021-11-23 Honeywell International Inc. Multi-patterned sputter traps and methods of making
US11739411B2 (en) 2019-11-04 2023-08-29 Applied Materials, Inc. Lattice coat surface enhancement for chamber components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5474649A (en) * 1994-03-08 1995-12-12 Applied Materials, Inc. Plasma processing apparatus employing a textured focus ring
US5942041A (en) * 1996-09-16 1999-08-24 Mosel-Vitelic, Inc. Non-sticking semi-conductor wafer clamp and method of making same
US6277194B1 (en) * 1999-10-21 2001-08-21 Applied Materials, Inc. Method for in-situ cleaning of surfaces in a substrate processing chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005001918A1 *

Also Published As

Publication number Publication date
TW200508409A (en) 2005-03-01
KR20060023115A (ko) 2006-03-13
WO2005001918A1 (fr) 2005-01-06

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Legal Events

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Effective date: 20081202