EP1641572B1 - Enlevement d'une couche ou d'un revetement d'un substrat par laser - Google Patents

Enlevement d'une couche ou d'un revetement d'un substrat par laser Download PDF

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Publication number
EP1641572B1
EP1641572B1 EP04743293A EP04743293A EP1641572B1 EP 1641572 B1 EP1641572 B1 EP 1641572B1 EP 04743293 A EP04743293 A EP 04743293A EP 04743293 A EP04743293 A EP 04743293A EP 1641572 B1 EP1641572 B1 EP 1641572B1
Authority
EP
European Patent Office
Prior art keywords
coating
layer
substrate
laser
laser radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04743293A
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German (de)
English (en)
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EP1641572A1 (fr
Inventor
Adrian Thomas
Jonathan Davies
Peter Hugh Dickinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Spectrum Technologies PLC
Original Assignee
Spectrum Technologies PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0315947A external-priority patent/GB0315947D0/en
Priority claimed from GB0316347A external-priority patent/GB0316347D0/en
Application filed by Spectrum Technologies PLC filed Critical Spectrum Technologies PLC
Priority to PL04743293T priority Critical patent/PL1641572T3/pl
Publication of EP1641572A1 publication Critical patent/EP1641572A1/fr
Application granted granted Critical
Publication of EP1641572B1 publication Critical patent/EP1641572B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Definitions

  • This invention relates to a method for removing a layer or coating from a substrate in accordance with claim 1 and in particular, but not exclusively, to laser removal of the insulating coating or "enamel" from a conductor as a preliminary step in making an electrical connection by e.g. spot welding, soldering, crimping etc.
  • US-A-6348241 discloses a treatment for the internal surfaces of metal gas bottles to remove (metal) oxide layers from the internal surface.
  • Metal oxides are absorbent at the laser process wavelength stipulated and therefore it is clear that a laser radiation is absorbed at the surface of the coating to be removed.
  • US-A-5151134 discloses a method for cleaning of pollutants from a surface using a laser.
  • the laser is coupled to the pollutant to be removed with its frequency lying within the absorption spectrum of the polluting material, the laser radiation is therefore absorbed by the pollutant.
  • FR-A-2692822 discloses a method of laser surface treatment for removing an outer surface in which the laser energy is coupled into the surface layer rather than passing transparently through to the interface.
  • US-A-6468356 discloses a method in accordance with the preamble of claim 1, for removing moulding material residues by applying a first pulsed laser beam at a wavelength that is absorbed by the moulding material residues to directly attack residues greater than a predetermined thickness, and applying a second pulsed laser beam at a different wavelength to which moulding material residues of thickness less than the preferred thickness are at least partially transparent, to generate a plasma, which vaporises the moulding material residue.
  • this invention provides a method of at least partially removing a layer or coating of material from a substrate, said method comprising the step of:-
  • the coating or layer is substantially transparent to said laser radiation at its operating wavelength.
  • the laser radiation may typically be of wavelength between, say, 200 nm to 12 ⁇ m and may be conveniently generated by an NdYag laser.
  • the laser is preferably a Q-switched laser generating short pulses of typical pulse length between 1 nanosecond and 300 nanoseconds or higher.
  • the pulse repetition rate of the laser is typically between 1 kHz and 30 kHz or higher.
  • said pulsed radiation beam is effective also to etch or clean the surface of the substrate adjacent the interface. This is particularly useful to remove e.g. metal oxides to leave a bare surface particularly suitable for further processing.
  • the pulsed beam of laser radiation is moved relative to the substrate in a scan direction (or vice versa ) and at least one of the following parameters is controlled to cause removal of a moving swath of said layer or coating:-
  • said pulsed beam of radiation is scanned over a selected region of said substrate in a first scanning stage to effect initial removal of said layer or coating, and is then scanned over said region in a second scanning stage to effect cleaning of residual debris.
  • An apparatus for at least partially removing a layer or coating of material from a substrate, suitable for carrying out the method of claim 1 comprises:
  • Figure 1 is a schematic view of a laser wire stripper suitable for carrying out the method of this invention.
  • An NdYag laser of wavelength 1064 nm is used having a constant average power rating of 60 W, and 85 kW peak and a spot size of about 20 ⁇ m. The spot size generates about 200 ⁇ m diameter ablated area.
  • the laser is Q-switched to provide a pulsed beam of pulses of between about 100 nanoseconds and 200 nanoseconds, which is scanned across the area to be stripped.
  • the lower limit for the pulse repetition rate is in the range of 1 to 2 kHz at 1500 mm/sec scan rate which tends to give only just sufficient pulse overlap.
  • the upper limit to be about 5 kHz at constant power because at higher frequencies the peak power tends to drop.
  • the pulse repetition rate can be further increased and in another example the laser was operated at 1 MW peak power, at a pulse repetition rate of 10 kHz, and a scan rate of 2500 mm/sec.
  • the peak power may be reduced to as low as 1 to 25 kW with a pulse repetition rate in the 10 to 30 kHz range, but then the laser must scan slower, at about 100 mm/sec and the scan should be repeated.
  • a laser was set up to operate with the following parameters:- Repetition rate: 3.5 kHz Scan speed: 400 mm/sec Spot size: ⁇ 50 ⁇ m Wavelength: 1064 nm Energy per pulse: 15 mJ Pulse width: ⁇ 250 ns max Peak power: ⁇ 200 KW
  • the spot size although nominally 50 ⁇ m, also affected the surrounding area so the effective spot size in terms of the effect at the interface was about 100 ⁇ m to 200 ⁇ m.
  • the beam was scanned horizontally across the wire to be stripped and prepared, that is perpendicular to the longitudinal axis of the wire.
  • the wire is scanned by the beam in a first pass in accordance with the above parameters, at a pitch or spacing of about 100 ⁇ m between adjacent scan lines.
  • the first pass removes most if not all of the coating off the wire, but may leave some debris.
  • the wire is scanned with the pulsed laser beam at a higher pulse rate (- 8kHz) and at a higher scan speed ( ⁇ 1000 mm/sec) but otherwise with the same parameters as above.
  • the second pass may not be required, because the nature of the coating and the interface effect may mean that the coating detaches in larger flakes, leaving little or no debris.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Cleaning In General (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)

Claims (14)

  1. - Procédé pour enlever au moins partiellement une couche ou un revêtement (16) de matériau à partir d'un substrat (14), ledit procédé comprenant l'étape consistant à :
    - diriger sur ledit substrat (14) un faisceau pulsé (12) de rayonnement laser d'une longueur d'onde choisie de telle sorte que la couche ou le revêtement (16) est sensiblement transparent audit rayonnement laser, caractérisé par le fait que ledit faisceau pulsé de rayonnement laser est commandé de façon à provoquer un effet d'onde de choc à l'interface entre ladite couche ou ledit revêtement (16) et ledit substrat (14) pour provoquer une séparation locale de ladite couche ou dudit revêtement vis-à-vis dudit substrat.
  2. - Procédé selon la revendication 1, dans lequel le rayonnement laser est d'une longueur d'onde comprise entre 200 nm et 12 µm.
  3. - Procédé selon la revendication 2, dans lequel ledit rayonnement laser est généré par un laser NdYag (10).
  4. - Procédé selon l'une quelconque des revendications précédentes, dans lequel ledit rayonnement laser est généré par un laser à CO2 (10).
  5. - Procédé selon l'une quelconque des revendications précédentes, dans lequel ledit rayonnement laser est généré par un laser déclenché (10).
  6. - Procédé selon l'une quelconque des revendications précédentes, dans lequel le faisceau pulsé (12) a des impulsions de longueur d'impulsion comprises entre 1 nanoseconde et 300 nanosecondes.
  7. - Procédé selon l'une quelconque des revendications précédentes, dans lequel la fréquence de répétition des impulsions du faisceau pulsé (12) est comprise entre 1 KHz et 30 KHz.
  8. - Procédé selon l'une quelconque des revendications précédentes, dans lequel la couche ou le revêtement (16) comprend un matériau diélectrique.
  9. - Procédé selon l'une quelconque des revendications précédentes, dans lequel le substrat (14) est un conducteur en cuivre ou en un matériau à base de cuivre.
  10. - Procédé selon l'une quelconque des revendications précédentes, dans lequel la couche ou le revêtement (16) comprend au moins un oxyde métallique.
  11. - Procédé selon l'une quelconque des revendications précédentes, dans lequel ledit faisceau pulsé (12) de rayonnement laser est efficace également pour graver ou nettoyer la surface du substrat (14) adjacente à l'interface.
  12. - Procédé selon l'une quelconque des revendications précédentes, dans lequel le faisceau pulsé (12) de rayonnement laser est balayé par rapport au substrat (14) dans une direction de balayage et au moins l'un des paramètres suivants est commandé pour provoquer l'enlèvement d'une bande mobile de ladite couche ou dudit revêtement (16) :
    - la vitesse de balayage ;
    - la puissance de crête du laser ;
    - la fréquence de répétition des impulsions du laser ; et
    - la taille de spot.
  13. - Procédé selon l'une quelconque des revendications précédentes, dans lequel ledit faisceau pulsé (12) de rayonnement laser est balayé sur ledit substrat (14) le long de lignes de balayage espacées successives.
  14. - Procédé selon la revendication 12, dans lequel ledit faisceau pulsé (14) de rayonnement est balayé sur une région choisie dans un premier stade de balayage pour provoquer l'enlèvement initial de ladite couche ou dudit revêtement (16), puis est balayé sur ladite région dans un second stade de balayage pour provoquer le nettoyage de débris résiduels.
EP04743293A 2003-07-08 2004-07-08 Enlevement d'une couche ou d'un revetement d'un substrat par laser Expired - Lifetime EP1641572B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL04743293T PL1641572T3 (pl) 2003-07-08 2004-07-08 Laserowe usuwanie warstwy lub powłoki z podłoża

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0315947A GB0315947D0 (en) 2003-07-08 2003-07-08 Laser removal of layer or coating from a substrate
GB0316347A GB0316347D0 (en) 2003-07-12 2003-07-12 Laser removal of layer or coating from a substrate
PCT/GB2004/002950 WO2005005065A1 (fr) 2003-07-08 2004-07-08 Enlevement d'une couche ou d'un revetement d'un substrat par laser

Publications (2)

Publication Number Publication Date
EP1641572A1 EP1641572A1 (fr) 2006-04-05
EP1641572B1 true EP1641572B1 (fr) 2011-12-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP04743293A Expired - Lifetime EP1641572B1 (fr) 2003-07-08 2004-07-08 Enlevement d'une couche ou d'un revetement d'un substrat par laser

Country Status (10)

Country Link
US (1) US7632420B2 (fr)
EP (1) EP1641572B1 (fr)
JP (1) JP5074026B2 (fr)
KR (1) KR20060036076A (fr)
AT (1) ATE538880T1 (fr)
DK (1) DK1641572T3 (fr)
ES (1) ES2379342T3 (fr)
PL (1) PL1641572T3 (fr)
PT (1) PT1641572E (fr)
WO (1) WO2005005065A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
EP3447865A1 (fr) 2017-08-23 2019-02-27 Komax Holding Ag Procédé d'enlèvement d'une partie d'une feuille écran d'un habillage de câble de ligne et dispositif d'enlèvement des feuilles permettant l'enlèvement d'une partie d'une feuille écran d'un habillage de câble de ligne à un point de rupture de l'habillage de câble de ligne

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DE102008006241A1 (de) * 2008-01-25 2009-07-30 Thyssenkrupp Steel Ag Verfahren und Vorrichtung zum Abtragen einer metallischen Beschichtung
US20100224602A1 (en) * 2009-03-06 2010-09-09 General Electric Company Method and system for removing thermal barrier coating
US10112257B1 (en) * 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US10100650B2 (en) 2012-06-30 2018-10-16 General Electric Company Process for selectively producing thermal barrier coatings on turbine hardware
KR101433596B1 (ko) * 2012-10-19 2014-08-27 한일튜브 주식회사 자동차용 브레이크 튜브의 코팅층 제거 장치
US10404028B2 (en) 2013-07-22 2019-09-03 Frisimos, Ltd. System for automatic robotic cable connector assembly using a cartridge
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
EP3111525B1 (fr) * 2014-02-24 2020-11-18 Frisimos Ltd. Procédé et système pour retirer un blindage métallique d'un câble électrique
JP6287929B2 (ja) * 2015-03-30 2018-03-07 ブラザー工業株式会社 レーザ加工データ作成装置
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CN106346146B (zh) * 2016-11-04 2018-01-19 中国航空工业集团公司北京航空材料研究院 一种去除金属表面陶瓷涂层的高能短脉冲激光加工方法
US11476628B2 (en) 2019-11-12 2022-10-18 Frisimos, Ltd. System for automatic robotic cable connector assembly using a cartridge
CN113927170B (zh) * 2020-07-13 2023-09-12 大族激光科技产业集团股份有限公司 去除产品表面漆层的方法
CN114318195A (zh) * 2020-09-30 2022-04-12 中信戴卡股份有限公司 一种无牺牲层的铝合金车轮的激光冲击延寿方法
CN113118631B (zh) * 2021-03-17 2023-01-17 江苏大学 一种基于激光冲击实现厚涂层去除和基体表面改形改性的方法
CN113853063A (zh) * 2021-09-09 2021-12-28 深圳市海目星激光智能装备股份有限公司 介电材料去除方法、激光去除设备与电子器件
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EP3447865A1 (fr) 2017-08-23 2019-02-27 Komax Holding Ag Procédé d'enlèvement d'une partie d'une feuille écran d'un habillage de câble de ligne et dispositif d'enlèvement des feuilles permettant l'enlèvement d'une partie d'une feuille écran d'un habillage de câble de ligne à un point de rupture de l'habillage de câble de ligne
US11450449B2 (en) 2017-08-23 2022-09-20 Komax Holding Ag Method for stripping part of a shielding foil of a sheathed cable and foil removing device for stripping part of a shielding foil of a sheathed cable from the sheathed cable at a predetermined breaking point

Also Published As

Publication number Publication date
DK1641572T3 (da) 2012-04-02
US20050006345A1 (en) 2005-01-13
PT1641572E (pt) 2012-03-22
ATE538880T1 (de) 2012-01-15
ES2379342T3 (es) 2012-04-25
WO2005005065A1 (fr) 2005-01-20
JP2007516083A (ja) 2007-06-21
KR20060036076A (ko) 2006-04-27
PL1641572T3 (pl) 2012-05-31
EP1641572A1 (fr) 2006-04-05
JP5074026B2 (ja) 2012-11-14
US7632420B2 (en) 2009-12-15

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