EP1629538A2 - Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant - Google Patents

Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant

Info

Publication number
EP1629538A2
EP1629538A2 EP04738573A EP04738573A EP1629538A2 EP 1629538 A2 EP1629538 A2 EP 1629538A2 EP 04738573 A EP04738573 A EP 04738573A EP 04738573 A EP04738573 A EP 04738573A EP 1629538 A2 EP1629538 A2 EP 1629538A2
Authority
EP
European Patent Office
Prior art keywords
holding device
radiation
system carrier
housing according
reflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04738573A
Other languages
German (de)
English (en)
Inventor
Stefan GRÖTSCH
Patrick Kromotis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP1629538A2 publication Critical patent/EP1629538A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to a housing for at least two radiation-emitting components, in particular LEDs, with a system carrier and a reflector arrangement.
  • system carriers made of metals, ceramics or semiconductors are often used for the assembly and / or heat dissipation of the LEDs.
  • they need either individually or in groups, each group having a plurality of LEDs, in each case a reflector, which is often made from a plastic.
  • the radiation-emitting component shown there has, by way of example, two LED chips 9, which are arranged on a system carrier 1 at a slight distance from one another. As already mentioned in the introduction, this usually consists of a metal, a ceramic or a semiconductor.
  • a reflector arrangement 2 is provided for the direction of the radiation emitted by the LED chips 9 and is applied directly to the system carrier 1. The connection can be made, for example, by means of an adhesive.
  • the reflector arrangement 2 has two reflectors 3, one LED chip 9 in each case coming to rest in a reflector 3.
  • the reflector arrangement 2 has approximately the same extent as the system carrier 1, which means that large-scale connection between these two elements is created.
  • the reflector arrangement in contrast to the system carrier, usually consists of a plastic, which can be easily molded into the desired shape by means of a spraying process, there is a large-area connection between two materials which have very different coefficients of thermal expansion.
  • a mechanical stress in particular in the lateral direction, can occur due to the different expansions of the system carrier 1 and the reflector arrangement 2 and destroy the composite or its connection technology.
  • a housing according to the invention comprises a system carrier and a reflector arrangement which is arranged on the system carrier, the reflector arrangement having a number of reflector elements which are each assigned to at least one radiation-emitting component and which are connected to one another by means of a holding device to form a field.
  • the reflector arrangement is thus divided into individual reflector elements. However, as in the prior art, these are not applied individually to the system carrier, but are fastened to one another in a holding device and fixed in their position relative to one another. The holding device provided with the reflectors can then be arranged and fastened on the system carrier, which results in a very simple manufacturing process.
  • the separation of the reflector arrangement into individual reflector elements reduces the interface at which the reflector elements, which usually consist of a plastic, and the system carriers, which consist, for example, of a metal, a ceramic or a semiconductor, adjoin one another.
  • the temperatures occurring during operation therefore lead to lower mechanical stresses due to thermal expansion, which significantly increases the reliability of the radiation-emitting component.
  • the system carrier and the holding device undergo similar thermal expansions in the event of temperature changes, in particular are made of the same material. It is harmless if the reflector arrangement is made of a different material, in particular made of plastic with a different coefficient of thermal expansion such as the material or the materials of the holding device and the system carrier.
  • the system carrier and the holding device have thermal expansion coefficients that are matched to one another or similar. It is of course particularly advantageous if the same materials are used for these two elements. If, for example, an aluminum is used for the system carrier, it is particularly expedient if the holding device is also made of aluminum.
  • a particularly simple manufacture results when the holding device is an electrical lead frame (leadframe). This can be brought into the desired shape in a simple manner using the known manufacturing processes, in particular punching and bending processes.
  • the holding device has at least one recess, on the respective edge of which at least one reflector element is molded in order to establish a firm connection with it.
  • the holding device will have a large number of cutouts, which are arranged, for example, in a predetermined grid.
  • the cutouts can be produced in a simple manner by a stamping process.
  • the reflectors are preferably molded on by an injection molding process or an injection molding process as are known from plastics technology.
  • the reflector can serve to receive one LED or even several LEDs that are in the form of a group.
  • the provision of the holding device according to the invention also enables the same to be used as a wiring level for the radiation-emitting components.
  • the LEDs are preferably arranged on the system carrier, with which the first electrical contact can be made. The second connection of the LED can then take place via the holding device, which provides for a suitable cable routing.
  • the holding device has a mounting frame, by means of which the holding device carrying the reflector arrangement can be mounted on the system carrier.
  • the mounting frame is preferably arranged circumferentially around the reflector arrangement and positively connected to the system carrier.
  • the mounting frame thus includes all reflectors or LEDs. It allows the holding device provided with the reflectors to be easily attached to the system carrier, e.g. by means of a screw connection, and moreover enables the space formed between the mounting frame, the system carrier and the holding device to be potted with a potting compound.
  • connection strips which can be used as a contact for surface mounting.
  • the connection strips which are in the form of pins, for example, and can also be produced by a stamping process, can be guided through the surrounding mounting frame and then, plugged in or connected as surface mount technology (SMT) contact, to a printed circuit board or the system carrier.
  • SMT surface mount technology
  • FIG. 1 shows a schematic illustration of a known from the prior art and already described in the introduction written radiation-emitting component with two LEDs
  • FIG. 2 shows a schematic illustration of a first exemplary embodiment in cross section
  • FIG. 3 shows a schematic illustration of a perspective view of a holding device provided with reflectors
  • FIG. 4 shows a schematic illustration of a further perspective view of the holding device provided with the reflectors, which shows the arrangement from FIG. 3 in section, and
  • Figure 5 is a schematic representation of a further embodiment with a mounting frame in a cross-sectional view.
  • the exemplary embodiment illustrated in FIG. 2 has a system carrier 1, for example made of a metal, a ceramic or a semiconductor.
  • a reflector arrangement 2 is applied to this.
  • the reflector arrangement 2 consists, by way of example only, of two reflectors 3 which are molded onto a holding device 4.
  • the reflector assembly 2 is made of a plastic material.
  • the holding device 4 has two cutouts 5, on the edge 6 of which the reflectors 3 are each formed. The provision of the recess and thus the provision of respective reflectors takes place at the points at which LEDs 9 are to be applied to the system carrier 1.
  • the holding device 4 can also be used as additional wiring level can be used, which includes electrical connection paths for the LEDs 9.
  • the holding device 4 is preferably made of the same material as the system carrier 1. However, at least it has a material that is adapted or adjusted to the thermal expansion coefficient of the material of the system carrier 1. If the system carrier 1 is made of aluminum, for example, the holding device 4 preferably also consists of aluminum. In the case of a ceramic system carrier made of, for example, AlN / Al 2 0 3 , iron-nickel alloys can be used as the holding device.
  • the holding device 4 is preferably made as a lead frame from a metallic material.
  • the recesses 5 can be easily. , »Punch.
  • the holding device 4 provided with the recesses 5 can then be placed in an injection molding tool in which the reflectors 3 shown in cross section are injection molded onto the edges 6 of the respective recesses 5.
  • the semi-finished product produced in this way can thus be applied to the system carrier 1 and attached to it in a single operation.
  • FIGS. 3 and 4 show a further exemplary embodiment, in which the holding device 4 is provided with a mounting frame 7. As shown in the right half of FIG. 5, the mounting frame 7 can only be arranged between the holding device 4 and the system carrier 1. However, as shown in the left half, it can also be arranged on both sides of the holding device 4.
  • the mounting frame 7 preferably runs around all reflectors provided in the radiation-emitting component. This makes it possible to fill the cavities formed between the system carrier 1, the holding device 4 and the mounting frame 7 with a potting compound, the mounting frame serving as a kind of “sealing ring”.
  • the mounting frame enables the holding device 4 to be mounted particularly easily to the system carrier 1.
  • the connection can, as is often the case, be made by gluing, but also by a screw or rivet connection via the mounting frame 7.
  • the mounting frame 7 also enables connection to a further heat sink.
  • the procedure according to the invention counteracts the problem that the reflectors have different lengths in both lateral directions of a relatively large LED array.
  • Mechanical problems that can occur in the connection area between the reflectors made of plastic and the carrier made of a different material are reduced to a relatively small area, comparable to discrete designs.
  • the housing according to the invention can therefore be used particularly advantageously in radiation-emitting components with a large number of LEDs.
  • the additional holding device opens up the possibility of routing further electrical connections and wiring therein. All of the considerations known from leadframes can be used here.
  • the invention is not limited by the description based on the exemplary embodiments. Rather, the invention encompasses every new feature and every combination of features, which in particular includes every combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un boîtier destiné à au moins deux composants rayonnants, notamment à des diodes électroluminescentes, comportant un support système (1) et un dispositif réflecteur (2) monté sur le support système (1). Ledit dispositif réflecteur comporte une pluralité de réflecteurs destinés à recevoir respectivement un composant rayonnant, et fixés les uns aux autres au moyen d'un dispositif de fixation (4).
EP04738573A 2003-05-30 2004-05-28 Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant Withdrawn EP1629538A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10324909.5A DE10324909B4 (de) 2003-05-30 2003-05-30 Gehäuse für ein strahlungsemittierendes Bauelement, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement
PCT/DE2004/001104 WO2004109812A2 (fr) 2003-05-30 2004-05-28 Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant

Publications (1)

Publication Number Publication Date
EP1629538A2 true EP1629538A2 (fr) 2006-03-01

Family

ID=33494792

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04738573A Withdrawn EP1629538A2 (fr) 2003-05-30 2004-05-28 Boitier destine a un composant rayonnant, procede de fabrication et composant rayonnant

Country Status (8)

Country Link
US (1) US7414269B2 (fr)
EP (1) EP1629538A2 (fr)
JP (1) JP2006526280A (fr)
KR (1) KR101164249B1 (fr)
CN (1) CN100407455C (fr)
DE (1) DE10324909B4 (fr)
TW (1) TWI267999B (fr)
WO (1) WO2004109812A2 (fr)

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CA2948554C (fr) * 2014-05-13 2020-04-21 Coelux S.R.L. Source de lumiere et systeme d'eclairage imitant la lumiere du soleil
CN111108616B (zh) 2016-03-08 2024-03-15 科鲁斯公司 具有透镜组件的照明系统
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Also Published As

Publication number Publication date
DE10324909A1 (de) 2005-01-05
WO2004109812A2 (fr) 2004-12-16
KR101164249B1 (ko) 2012-07-09
JP2006526280A (ja) 2006-11-16
TWI267999B (en) 2006-12-01
CN1799149A (zh) 2006-07-05
WO2004109812A3 (fr) 2005-02-03
TW200427114A (en) 2004-12-01
DE10324909B4 (de) 2017-09-07
KR20060020645A (ko) 2006-03-06
US20070069227A1 (en) 2007-03-29
US7414269B2 (en) 2008-08-19
CN100407455C (zh) 2008-07-30

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