EP1610933B1 - Procede pour produire une plaque de serrage - Google Patents

Procede pour produire une plaque de serrage Download PDF

Info

Publication number
EP1610933B1
EP1610933B1 EP04739079A EP04739079A EP1610933B1 EP 1610933 B1 EP1610933 B1 EP 1610933B1 EP 04739079 A EP04739079 A EP 04739079A EP 04739079 A EP04739079 A EP 04739079A EP 1610933 B1 EP1610933 B1 EP 1610933B1
Authority
EP
European Patent Office
Prior art keywords
chips
micro
chipboard
board
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04739079A
Other languages
German (de)
English (en)
Other versions
EP1610933A2 (fr
Inventor
Martin Berger
Manfred Riepertinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Egger GmbH and Co OG
Original Assignee
Fritz Egger GmbH and Co OG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz Egger GmbH and Co OG filed Critical Fritz Egger GmbH and Co OG
Priority to PL09158439T priority Critical patent/PL2078599T3/pl
Priority to PL04739079T priority patent/PL1610933T3/pl
Priority to EP09158439A priority patent/EP2078599B1/fr
Publication of EP1610933A2 publication Critical patent/EP1610933A2/fr
Application granted granted Critical
Publication of EP1610933B1 publication Critical patent/EP1610933B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles

Definitions

  • the present invention relates to a method for producing a plate at least partially from microspan material.
  • Table 1 shows the diameters of the chips, the values of the table being understood to mean that, for example, for covering layer material, 95.8 mass% of the material to be screened passes through a sieve with a mesh size of 2.0 mm or 8.4 mass% through the screen mesh area from 1.4 to 2.0 mm.
  • diameter is to be understood in the indication of a sieve fraction that the diameter in each case indicates the smallest diameter in a cross section in any direction of the particle or chip. Because in a screening, the particles to be sieved are moved so that elongated particles are also erected and come along the longitudinal extent through the sieve.
  • the shavings are mixed separately into cover layers and middle layer in mixers with binder, hardener, wax emulsion and optionally additives and fed to the spreading machine, which forms a multi-layered chip cake mirroring the center of the board.
  • the chip cake consisting of lower cover layer, a middle layer and an upper cover layer (three-layer or multilayer boards). But a multi-layered structure can also be completely missing, then one speaks of single-layer plates.
  • a stable chipboard is pressed under the action of pressure and temperature, by curing the binder, which can meet the requirements of the European standard EN 312-3, shown in Table 2.
  • the production of fiberboards by the dry process is known.
  • the wood particles so-called wood chips, are softened by the action of pressure and temperature in a saturated steam atmosphere and then separated in a refiner into fine particles, the fibers. This process is also called defibration.
  • MDF fibers are prone to clumping or felting, screening with screening machines such as chips is not possible to determine the size of the fibers. Therefore, the diameters of MDF fibers were determined by means of a laser particle counter.
  • the sample material was homogeneously mixed with water to form an approximately 2% dispersion and fed to the PQM 1000 measuring device.
  • the measured quantities were the number of fibers, with a certain length and a certain diameter, from which the mass fractions could then be calculated as a function of the fiber diameter. The results are shown in Table 3.
  • the fibers leave the refiner together with water and steam via a pressure pipeline, the so-called blowpipe - also called blow-line.
  • blowpipe - also called blow-line.
  • this tube there are several leads for supplying binder, hardener, emulsion and other additives.
  • the fiber-binder mixture thus obtained is transferred to the dryer - usually a tubular electric dryer in which the fibers are dried by the action of convective heat to a final moisture content of 8 to 15%.
  • the result is binder-provided wood fibers from which a fiber cake is subsequently formed.
  • a stable plate medium-density fiberboard MDF or high-density fiberboard HDF
  • the panels comply with the requirements of European standard EN 622, Part 5, which defines the properties of MDF and whose values are shown in Table 4.
  • a fiberboard in contrast to a chipboard, is distinguished by a very homogeneous density distribution over the plate thickness and over a very homogeneous surface. If the direct coating of chipboard makes high demands on the preparation of particle board surface quality, such as. can be achieved by trowelling, so an MDF board can be painted with conventional painting techniques without pretreatment as a chipboard. The reason for this is on the one hand the high isotropy of the MDF surface, which is ensured by the fineness and / or fiberiness of the wood, and on the other hand by the homogeneous suction behavior of the surface.
  • fiberboard Another disadvantage in the production of fiberboard is that the fibers are not pourable Good and thus are expensive to handle.
  • the conventional mixers used for particle board production can not be used for gluing the fibers.
  • the fibers are very flexible due to their elongated rod-like shape with small thickness and have the so-called Curl bin. As a result, juxtaposed fibers entangle and matt easily, which makes pouring or sieving impossible for fractionation.
  • a disadvantage of the fiberboard is that due to the high process temperatures, the color of the fibers and thus of the finished fiberboard is dark is.
  • the dark color makes a color coating difficult, for example by painting, when a light color, for example white, is to be achieved as the surface color.
  • cover plates for example, for doors or furniture, from a mixture of wood or wood-based particles and a powdered phenolic resin as a binder, wherein the diameter of the wood particles between 0.1 mm and 0.6 mm.
  • the manufacturing process involves mechanical comminution or dissolution in fluid systems of, for example, chipboards in chips, which are then dried and further comminuted in a hammer mill. By means of a sieving process, the desired particles of diameter larger than 0.1 mm and smaller than 0.6 mm are then separated out. The resulting wood particle mixture is then pressed with the phenol resin-containing binder at high temperature in the desired, optionally profiled form.
  • the present invention is therefore based on the technical problem of specifying a method for producing a chipboard and a chipboard itself, wherein the chipboard has properties of an MDF board without the use of expensive MDF manufacturing process.
  • the method is characterized in that the chips are dried before micro-machining to a residual moisture of less than 10%, preferably between 2 and 5%.
  • the wood is not shredded as it is for MDF in the moist state after thermal digestion, but micro-machining in the dried state at a residual moisture content of less than 10%.
  • a plate produced by the method according to the invention consists of a cellulose-containing material with a content of cellulose-containing chips and with a proportion of binders.
  • Microplated material is provided within at least one plate layer, the chips having a proportion of micro-chips with a diameter of less than 1.0 mm, which is at least 75%, in particular at least 80% and preferably at least 90% of the chips.
  • the produced plate even contains a proportion of greater than 95% chips with a diameter of less than 1.0 mm. It is also possible to produce a plate containing over 98% of micro-chips smaller than 1 mm in diameter.
  • Such a plate is thus characterized in that in the at least one layer, the proportion of micro-chips is greater than in conventional chipboard. It generally applies that the properties of the chipboard are better, the greater the proportion of chips under a diameter of less than 1 mm.
  • the chips have a proportion of micro-chips with a diameter of less than 0.6 mm, which is at least 50%, in particular at least 65% and preferably at least 80% or even at least 85% of the chips.
  • the plate produced by the method according to the invention in such a way that in the micro-chip material the chips have a proportion of micro-chips a diameter of less than 0.4 mm, which is at least 35%, in particular at least 50% and preferably at least 60% of the chips.
  • the proportion of small chips, so the micro-chips is so high that the properties of such micro-chipboard are similar to the properties of MDF boards.
  • the properties of the micro-chipboard are the better, the greater the proportion of smaller micro-chips.
  • the plate can be made entirely from the micro-chipboard material in a preferred manner, so that a homogeneous distribution of the micro-chips within the plate results.
  • the plate has a middle layer, which consists of a conventional chip material, while the two outer layers consist of the micro-chip material. This ensures that the cheaper material of the chipboard is used in the middle, while the more expensive material of the micro-chips is used on the Ünterseite and the top, in particular to be able to exploit the improved surface properties can.
  • the inventive method is then designed accordingly, wherein only a part of the plate is made from the micro-chip cake.
  • micro-chip material wood parts are machined in analogy to the chipboard production and on a residual moisture of 2 - 5%, in particular 4 - dried 4.5%. Subsequently, the dry fiber is carried out in a fiber mill, which is for example by means of special V-groove strips and baskets in a position to produce fibers from the chips.
  • the particles produced in the dry fiber are called micro-chips, which can also be derived from the properties of the micro-chips described below.
  • a first distinguishing feature compared to fibers is that the micro-chips represent a pourable and pourable good. In contrast to the fibers for a production of a fiberboard so the micro-chips can be fractionated by a sieving.
  • microspheric mixture obtained in this way has the following exemplary microspan size distribution which has been obtained by sieve analysis with sieves of corresponding mesh size.
  • Table 5 shows the measurement results for the diameter of the micro-chips over several samples. The result is a diameter distribution which is close to the diameter distribution for fibers shown in Table 3. Further measurement results are explained in more detail in the examples discussed below.
  • micro-chips are subsequently glued, and due to the nature of the micro-chips, conventional mixers used in the chipboard industry can be used. This occurs in contrast to the fiber plate technology (blow-line gluing) by the low processing temperature no damage to the binder, which is reflected in a lower binder requirement.
  • a proportion of binder based on the dry weight of the microprecipitants, of at least 12%, preferably 15-25%, is emphasized.
  • the value of the binder content varies depending on the dust content of the chips, which occurs increasingly in the production of micro chips.
  • micro chip cake is done in analogy to chipboard production. Again, no special devices are needed and it can be used on spreaders of the prior art.
  • one-floor presses, multi-daylight presses, continuous presses such as conti-roll systems or calendering machines can be used.
  • Another advantage of the method according to the invention compared to the MDF technology is that a grinding of the micro-chipboard is possible immediately after pressing. After hot pressing, MDF boards are stored for 2 to 5 days in the maturing warehouse before they can be sanded and subsequently processed. This circumstance is detrimental to the production logistics as well as to the manufacturing costs due to the need for corresponding storage capacities and the longer capital tie-up in the maturing warehouse.
  • the mechanical technological properties of the micro-chipboard according to the invention correspond to the requirements for MDF boards by the dry process, as shown in Table 4 of EN 622, Part 5 above.
  • sheets from 1.0 mm (eg calender press) to more than 40 mm (platen press or Conti-Roll press) thickness can be produced.
  • the homogenous density distribution over the slab thickness comparable with an MDF slab, offers advantages in edge processing.
  • Particle boards with a marked density minimum in the center of the board and the coarse chip structure of the middle layer chips on the other hand do not provide adequate conditions, for example, for direct paintability of the board edges.
  • Chips from the production of thin chipboard by the calender process are mikrozerspant after drying the same by means of a fiber mill.
  • the mill is characterized by special V-slot bar fittings that leave a narrow gap between stator and rotor of the mill. This can affect the Mikrospangeometrie.
  • the microsphering mixture thus obtained shows the sieve fractionation shown in Table 6.
  • the microsphering mix is mixed with 12% (solids to dry weight micro-chips) of a conventional urea-formaldehyde binder. Furthermore, 0.8 percent by weight of hardener based on solid binder based on ammonium sulfate and about 1.2% paraffin emulsion (solid wax based on dry weight micro-chips) are added in the form of a 60% emulsion.
  • the mixture of the individual components with the micro-chips is carried out in a conventional continuous mixer, as it is used for the production of chipboard.
  • micro-chip mat is formed using a spreader with wind and throw separation.
  • the microspheric cake thus obtained is then pressed in a calender press under the action of pressure and temperature to form a stable plate having the mechanical technological properties shown in Table 7.
  • the diameters are shown in cumulative distributions.
  • the curves for the micro-chips and the MDF fibers are very close to each other.
  • a micro-chipboard produced by the method of the present invention can be easily distinguished from a conventional chipboard by analyzing the size distribution of the chips.
  • the micro-chips and the fiber can nevertheless be very well distinguished from each other. Because the fibers have, in contrast to the micro-chips on a much longer form, while the micro-chips have a more cubic or almost cubic shape. Cubic shape means that the dimensions of the micro-chips in length, width and thickness are substantially similar. Incidentally, in contrast to the fiber, the cubic shape makes it possible for the micro-chips to be a free-flowing and pourable material.
  • the following test can be performed.
  • Material of the plate to be examined is treated in an acid bath in order to dissolve the aminoplast resin acting as a binder. Thereafter, the detached material is dried and mechanically sieved. If the material can be sieved, ie if it is sieve-capable, it results from the fact that the plate consists at least partially of micro-chips. On the other hand forms a coherent, possibly entangling Mass, it can be assumed that it was a fiberboard.
  • An essential criterion for the good paintability of the micro-chipboard produced by the method according to the invention is the limited absorbency of the surface. This is essentially determined by the small size of the chips, by the binder content and the calendar process additionally by the location of the heating drum. The lower the absorbency, the better the paintability.
  • the absorbency can be quantified by means of the toluene test specified in EN 382-1: 1990 10 01 (Fibreboard, Determination of surface absorption, toluene test). It is applied a defined amount of toluene on the arranged at a certain angle to the horizontal specimens and the distance which the resulting droplets travels until it is completely absorbed by the substrate, then determined as a measure of the absorbency.
  • micro-chipboard produced by the method according to the invention therefore has a significantly lower absorbency than a conventional chipboard.
  • the chipboard according to the invention can therefore be painted better than a conventional chipboard.
  • Table 1 Diameter distribution of the chips for a conventional chipboard, D - mesh width % Figures in weight percent: topcoat middle class D in mm % total % total 10.0 0.0 0.6 100.0 8.0 1.0 100.0 17.0 99.4 4.0 3.2 99.0 40.5 82.4 2.0 8.4 95.8 7.7 41.9 1.4 22.7 87.4 14.1 34.2 1.0 47.9 64.7 16.1 20.1 0.4 9.6 16.8 2.7 4.0 0.2 7.2 7.2 1.3 1.3 0.0 0.0 0.0 0.0 0.0 Table 2: Mechanical material properties of a conventional chipboard Requirement Thickness range (mm, nominal size) properties test methods unit 3 to 4 > 4 to 6 > 6 to 13 > 13 to 20 > 20 to 25 > 25 to 32 > 32 to 40 > 45 flexural strength EN 310 N / mm 2 13 15 14 13 11.5 10 8.5 7 Flexural modulus EN 310 N / mm 2 1800 1950 1800 1600 1500 1350 1200 1050 transverse tensile strength EN 319 N /

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Dry Shavers And Clippers (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Claims (6)

  1. Procédé pour la fabrication d'un panneau en particules contenant de la cellulose,
    - dans lequel, au cours d'une première étape, un matériau contenant de la cellulose est mis mécaniquement en copeaux,
    - dans lequel les copeaux sont séchés,
    - dans lequel les copeaux sont mis mécaniquement en micro-copeaux, au moins partiellement,
    - dans lequel les micro-copeaux sont encollés,
    - dans lequel un gâteau de micro-copeaux est fabriqué avec le matériau en micro-copeaux, et
    - dans lequel, sous l'effet d'une pression et d'une température, le panneau est, au moins partiellement, fabriqué avec le matériau en micro-copeaux,
    - les copeaux présentant une part de micro-copeaux d'un diamètre inférieur à 0,4 mm, qui représente au moins 35 % en poids, en particulier au moins 50 % en poids et, de préférence, au moins 60% en poids des copeaux,
    caractérisé en ce que les copeaux, avant d'être mis en micro-copeaux, sont séchés à une humidité résiduelle inférieure à 10 %, de préférence située entre 2 % et 5 %.
  2. Procédé selon la revendication 1, dans lequel le panneau est complètement fabriqué avec le matériau en micro-copeaux.
  3. Procédé selon la revendication 1, dans lequel la couche médiane est en matériau de panneau de copeaux, et dans lequel les deux couches extérieures sont fabriquées en matériau en micro-copeaux.
  4. Procédé selon l'une des revendications 1 à 3, dans lequel la mise en micro-copeaux est effectuée à l'aide d'un moulin à fibres.
  5. Procédé selon l'une des revendications 1 à 4, dans lequel les micro-copeaux sont encollés à l'aide d'un mélangeur.
  6. Procédé selon l'une des revendications 1 à 5, dans lequel la surface du panneau est directement rectifiée après la compression.
EP04739079A 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage Expired - Lifetime EP1610933B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PL09158439T PL2078599T3 (pl) 2003-04-07 2004-04-07 Płyta wiórowa
PL04739079T PL1610933T3 (pl) 2003-04-07 2004-04-07 Sposób wytwarzania płyty wiórowej
EP09158439A EP2078599B1 (fr) 2003-04-07 2004-04-07 Plaque de serrage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10315997A DE10315997A1 (de) 2003-04-07 2003-04-07 Spanplatte sowie Verfahren zur Herstellung einer Spanplatte
PCT/EP2004/003730 WO2004089585A2 (fr) 2003-04-07 2004-04-07 Plaque de serrage et procede pour produire une plaque de serrage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP09158439A Division EP2078599B1 (fr) 2003-04-07 2004-04-07 Plaque de serrage

Publications (2)

Publication Number Publication Date
EP1610933A2 EP1610933A2 (fr) 2006-01-04
EP1610933B1 true EP1610933B1 (fr) 2009-07-01

Family

ID=33154116

Family Applications (2)

Application Number Title Priority Date Filing Date
EP04739079A Expired - Lifetime EP1610933B1 (fr) 2003-04-07 2004-04-07 Procede pour produire une plaque de serrage
EP09158439A Expired - Lifetime EP2078599B1 (fr) 2003-04-07 2004-04-07 Plaque de serrage

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP09158439A Expired - Lifetime EP2078599B1 (fr) 2003-04-07 2004-04-07 Plaque de serrage

Country Status (6)

Country Link
EP (2) EP1610933B1 (fr)
AT (2) ATE435104T1 (fr)
DE (3) DE10315997A1 (fr)
ES (2) ES2339832T3 (fr)
PL (2) PL1610933T3 (fr)
WO (1) WO2004089585A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020006861A1 (de) 2020-11-09 2022-05-12 Siempelkamp Maschinen- Und Anlagenbau Gmbh Verfahren und Anlage zur Herstellung von Werkstoffplatten

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1017821A5 (nl) 2007-10-19 2009-08-04 Flooring Ind Ltd Sarl Plaat, werkwijzen voor het vervaardigen van platen en paneel dat dergelijk plaatmateriaal bevat.
CN113601631A (zh) * 2021-08-17 2021-11-05 山东鹤洋木业有限公司 一种可镂铣用刨花板及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1453397A1 (de) * 1961-03-30 1969-03-13 August Moralt Holzindustrie Holzwerkstofformkoerper
FR1444912A (fr) * 1965-05-28 1966-07-08 Panneau composite et procédé perfectionné pour sa fabrication
US5227024A (en) * 1987-12-14 1993-07-13 Daniel Gomez Low density material containing a vegetable filler
SE468419B (sv) * 1990-10-19 1993-01-18 Casco Nobel Ab Pulvertraekomposition foer framstaellning av pressade traeprodukter, foerfarande foer framstaellning av en saadan komposition samt anvaendning av en saadan komposition
SE9201982D0 (sv) * 1992-06-29 1992-06-29 Perstorp Flooring Ab Spaanskiva, foerfarande foer framstaellning daerav samt anvaendning daerav
DE4409512A1 (de) * 1994-03-19 1995-09-21 Basf Ag Verfahren zur Herstellung von hochreaktiven wässerigen Bindemitteln für Holzwerkstoffe aus zerteiltem gewachsenen Holz
DE19647240B4 (de) * 1996-11-15 2005-06-09 Fritz Homann Gmbh & Co. Kg Holzfaserplatte und Verfahren zu ihrer Herstellung
DE19718772B4 (de) * 1997-05-03 2015-08-20 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur Herstellung von Holzwerkstoffplatten
DE19956765A1 (de) * 1998-11-26 2000-05-31 Ernst Nickel Dünnwandiges, dreidimensional geformtes Halbzeug oder Fertigteil
EP1190825A3 (fr) * 2000-07-29 2004-01-21 Ernst Nickel Produit fini ou semi-fini moulé, tridimensionnel, à paroi mince
DE10130526A1 (de) * 2001-06-25 2003-01-09 Dieffenbacher Gmbh Maschf Verfahren zur Herstellung von Holzwerkstoffplatten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020006861A1 (de) 2020-11-09 2022-05-12 Siempelkamp Maschinen- Und Anlagenbau Gmbh Verfahren und Anlage zur Herstellung von Werkstoffplatten

Also Published As

Publication number Publication date
WO2004089585A3 (fr) 2004-11-25
ATE435104T1 (de) 2009-07-15
PL1610933T3 (pl) 2009-12-31
ES2328572T3 (es) 2009-11-16
DE10315997A1 (de) 2004-12-02
DE502004010891D1 (de) 2010-04-22
EP2078599A1 (fr) 2009-07-15
WO2004089585A2 (fr) 2004-10-21
ATE460263T1 (de) 2010-03-15
PL2078599T3 (pl) 2010-08-31
EP1610933A2 (fr) 2006-01-04
DE502004009691D1 (de) 2009-08-13
ES2339832T3 (es) 2010-05-25
EP2078599B1 (fr) 2010-03-10

Similar Documents

Publication Publication Date Title
EP1915253B2 (fr) Plaque légère multicouche en matériau dérivé du bois
DE60032125T2 (de) Verbundbauelemente und herstellungsverfahren
EP3066272B1 (fr) Couche centrale comportant des éléments en bois, notamment des éléments en bois à structure ondulée
EP1267010B2 (fr) Plaque avec des fibres orientées avec des propriétés améliorées notamment dans le domaine des constructions
DE202020104647U1 (de) Holzfaserplatte und entsprechende Herstellungsanlage
EP4010158A1 (fr) Panneau de matériau et procédé de production d'un panneau de matériau
EP1469140B1 (fr) procédé pour la fabrication d'un panneau avec un support en bois reconstitué
DE69730412T2 (de) Verfahren zur Herstellung von Celluloseverbundwerkstoffen
DE102006062285B4 (de) Faserplatte und Verfahren zu deren Herstellung
EP2355965B1 (fr) Composition et procédé de fabrication d'un panneau de bois ou d'un panneau de fibres de bois
EP1610933B1 (fr) Procede pour produire une plaque de serrage
DE102005033687A1 (de) Holzfaserplatte und Verfahren zur Herstellung einer Holzfaserplatte
EP2274176B1 (fr) Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau
DE10024543A1 (de) Verfahren und Anlage zur kontinuierlichen Herstellung einer Mehrschichtplatte
EP0010537B1 (fr) Procédé pour fabriquer des panneaux de particules de bois
EP3725481A1 (fr) Matériau sous forme de plaque et son procédé de fabrication
EP2819819B1 (fr) Procédé de production de matériaux ligneux et/ou de matériaux composites
EP3268190B1 (fr) Procédé de fabrication d'un matériau à base de particules de bois et durcisseur employé dans ledit matériau pour aminoplaste
DE10049050A1 (de) Verfahren zur Herstellung einer Mehrschichtplatte und eine nach diesem Verfahren hergestellte Mehrschichtplatte
DE2929243A1 (de) Holzspanplatte sowie verfahren zu ihrer herstellung
EP3470191B1 (fr) Procédé et dispositif destinés à la fabrication d'une plaque en matériau dérivé du bois
EP1448345A1 (fr) Procede d'hydrophobation de lignocelluloses lors de la fabrication de materiaux de bois et de materiaux a base de lignocelluloses
DE10130526A1 (de) Verfahren zur Herstellung von Holzwerkstoffplatten
WO2021023784A1 (fr) Procédé de production d'une plaque de matériau
EP1185587A1 (fr) Demi-produit en fibres de bois et son procede de production

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20051020

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL HR LT LV MK

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20060829

RTI1 Title (correction)

Free format text: METHOD FOR THE PRODUCTION THEREOF

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 502004009691

Country of ref document: DE

Date of ref document: 20090813

Kind code of ref document: P

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: TROESCH SCHEIDEGGER WERNER AG

REG Reference to a national code

Ref country code: RO

Ref legal event code: EPE

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2328572

Country of ref document: ES

Kind code of ref document: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

REG Reference to a national code

Ref country code: PL

Ref legal event code: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

REG Reference to a national code

Ref country code: SK

Ref legal event code: T3

Ref document number: E 6427

Country of ref document: SK

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091102

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20100406

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091002

BERE Be: lapsed

Owner name: FRITZ EGGER GMBH & CO.

Effective date: 20100430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100407

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20100102

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090701

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 13

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: RO

Payment date: 20230306

Year of fee payment: 20

Ref country code: CZ

Payment date: 20230302

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SK

Payment date: 20230302

Year of fee payment: 20

Ref country code: PL

Payment date: 20230301

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20230418

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20230421

Year of fee payment: 20

Ref country code: FR

Payment date: 20230419

Year of fee payment: 20

Ref country code: ES

Payment date: 20230525

Year of fee payment: 20

Ref country code: DE

Payment date: 20230418

Year of fee payment: 20

Ref country code: CH

Payment date: 20230502

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20230418

Year of fee payment: 20

Ref country code: AT

Payment date: 20230421

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230418

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 502004009691

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MK

Effective date: 20240406

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: SK

Ref legal event code: MK4A

Ref document number: E 6427

Country of ref document: SK

Expiry date: 20240407

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20240408

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20240426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20240408

Ref country code: CZ

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20240407

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

Expiry date: 20240406

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK07

Ref document number: 435104

Country of ref document: AT

Kind code of ref document: T

Effective date: 20240407

REG Reference to a national code

Ref country code: SE

Ref legal event code: EUG