EP1608789B1 - Legierung auf kupferbasis - Google Patents

Legierung auf kupferbasis Download PDF

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Publication number
EP1608789B1
EP1608789B1 EP04706595A EP04706595A EP1608789B1 EP 1608789 B1 EP1608789 B1 EP 1608789B1 EP 04706595 A EP04706595 A EP 04706595A EP 04706595 A EP04706595 A EP 04706595A EP 1608789 B1 EP1608789 B1 EP 1608789B1
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EP
European Patent Office
Prior art keywords
weight
parts
alloy
phased
alpha
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04706595A
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English (en)
French (fr)
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EP1608789A2 (de
Inventor
Hung-Quoc Tran
Stéphane GILLIERON
Emmanuel Vincent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swissmetal - UMS Usines Metallurgiques Suisses SA
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Swissmetal - UMS Usines Metallurgiques Suisses SA
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Publication date
Application filed by Swissmetal - UMS Usines Metallurgiques Suisses SA filed Critical Swissmetal - UMS Usines Metallurgiques Suisses SA
Publication of EP1608789A2 publication Critical patent/EP1608789A2/de
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Publication of EP1608789B1 publication Critical patent/EP1608789B1/de
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper-based alloy and its applications and more specifically to a nickel silver for use in the manufacture of ballpoint pen components.
  • the incompatibility between the alloy and the ink can then reduce the functional efficiency and the writing comfort of the instrument.
  • the resistance to gel inks can be improved by increasing the copper content of the alloy, as for example in the breasts ⁇ and in nickel silver ⁇ .
  • This solution has the disadvantage of reducing the susceptibility to hot deformation of the alloy.
  • the poor hot deformability of the alloys of the prior art involves higher production costs.
  • An object of the present invention is to provide an alloy and ball pen components free from the limitations of the prior art.
  • FIG. 1 represents a metallographic section of an alloy according to the invention in a single phase ⁇ structure.
  • Figure 1a shows a micrograph corresponding to Figure 1.
  • FIG. 2 represents a metallographic section of a nickel silver of the prior art in a two-phase ⁇ / ⁇ structure.
  • Figure 2a shows a micrograph corresponding to Figure 2.
  • Figure 3 shows a metallographic section of a two-phase nickel silver of the prior art corroded following exposure to an ink.
  • Figure 3a shows a micrograph corresponding to Figure 3.
  • FIG. 4 represents a diagram of the phase ⁇ phase of an alloy according to the invention according to the temperature of the heat treatment.
  • the alloy according to the invention is a white, gray or silver nickel silver, the composition of which is: Table 1 % weight min max Cu 43.00 48.00 Zn 33.00 38.00 Or 10.00 15.00 mn 3.50 6.50 Pb 0.00 4.00
  • This alloy has the characteristic of having two types of microstructures controllable by heat treatment.
  • the first, the single-phase structure ⁇ consists essentially of a single crystalline phase of uniform structure.
  • FIG. 1 represents a photomicrograph of a metallographic section of the alloy according to the invention having the ⁇ structure. It can be noted that the alloy consists essentially of a uniform solid solution of its components 10, apart from the black lead particles 82.
  • the alloy according to the invention may also have the two-phase ⁇ / ⁇ structure.
  • This structure represented in FIG. 2, comprises grains of a second phase 20, the ⁇ phase, whose copper content is lower than that of the ⁇ phase and which are distinguishable in FIG. 2 by their darker color.
  • the various structures of the alloy according to the invention are suitable for specific forming and machining processes.
  • the two-phase ⁇ / ⁇ structure is favorable for hot deformation, whereas the ⁇ -phase structure is favorable for cold deformation.
  • lead in the alloy facilitates machining operations, for example bar turning.
  • the alloy according to the invention can therefore be present in the two single-phase ⁇ and two-phase ⁇ / ⁇ structures. It is however possible to control the structure by heat treatment between 570 ° C and 780 ° C for 1-3 hours, followed by rapid cooling to room temperature. As a result of this treatment, the structure of the alloy is essentially ⁇ .
  • the invention also includes alloys to which, to the elements of nature and in the proportions defined by Table 1 above, are added small amounts of other elements, metallic or not, such as Magnesium, Aluminum, Iron, Phosphorus, or any other element or chemical species.
  • the composition of the alloy is determined, except unavoidable impurities, by Table 2 above.
  • FIG. 4 represents the phase ⁇ level as a function of the heat treatment temperature.
  • the choice of the temperature of the heat treatment makes it possible to modify the proportion of the ⁇ phase, and consequently to obtain materials of different characteristics.
  • the heat treatment in the TT temperature page at temperatures between 630 ° C. and 720 ° C. gives rise to a single phase ⁇ structure.
  • the temperature range E is favorable for extrusion.
  • the diagram of FIG. 4 is specific to the alloy composition specified in Table 2. According to another aspect of the invention it would also be possible to adopt different proportions of Cu, Zn, Ni, Mn and Pb and of to obtain an alloy whose proportion of the ⁇ and ⁇ phases is modifiable by heat treatment. In particular, it will be possible to vary independently the proportion of each of the components of the alloy in the range of values indicated in Table 1, or beyond. The temperatures required to modify the structure of the alloy thus obtained will then be different.
  • the alloy according to the invention has an increased resistance to corrosion due to gel inks when it is in the single-phase structure ⁇ .
  • the ⁇ phase is indeed the only one that is dissolved by gel inks.
  • FIG. 3 represents a metallographic section of an ⁇ / ⁇ nickel silver corroded by chemical reaction with the ink. It can be observed that only the ⁇ phase is attacked and that its dissolution leaves cavities 25.
  • the present invention is not limited to this specific use, but also includes any other use of the alloy according to the invention.
  • the alloy having the above composition is first cast in billets or ingots or in another form adapted to heat distortion.
  • the alloy according to the invention offers excellent deformability at high temperature. All the usual methods of hot deformation are possible. Typically, the billets are hot-extruded at a temperature of between 720 ° C. and 870 ° C., at which temperature its structure is biphasic ⁇ / ⁇ . The son thus obtained are then heat-treated between 630 ° C and 720 ° C, as explained above, to obtain the single-phase structure ⁇ .
  • the extruded material is then drawn to obtain bars or wires of suitable diameter to form ink guide tubes, ink reservoirs, or tips for instruments. writing.
  • the material thus obtained can be easily cold-worked by striking, machining, crimping, turning or by any other method.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Pens And Brushes (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)

Claims (10)

  1. Verfahren, welches eine Legierung verwendet, die aus Folgendem besteht:
    zwischen 43 und 48 Massenanteile Cu;
    zwischen 33 und 38 Massenanteile Zn;
    zwischen 10 und 15 Massenanteile Ni;
    zwischen 3.5 und 6.5 Massenanteile Mn;
    zwischen 0 und 4 Massenanteile Pb;
    wobei die Legierung eine ein-phasige Alpha-Struktur α und eine zwei-phasige Alpha-Beta-Struktur α/β aufweisen kann,
    worin das Verfahren umfasst:
    einen oder mehrere Schritte der Hitzeverformung der Legierung in der zwei-phasigen Alpha-Beta-Struktur α/β,
    einen oder mehrere Schritte der thermischen Behandlung, um eine besagte ein-phasige Alpha-Struktur α zu erhalten.
  2. Verfahren gemäss Anspruch 1, mit:
    einem Schritt des Giessens der geschmolzenen Legierung;
    einem oder mehreren Schritten der Hitzeverformung der Legierung in der zwei-phasigen Alpha-Beta-Struktur α/β;
    einem oder mehreren Schritten der thermischen Behandlung, um besagte ein-phasige Alpha-Struktur α zu erhalten,
    einem oder mehreren Schritten der Kälteverformung der Legierung in der ein-phasigen Alpha-Struktur α.
  3. Verfahren gemäss Anspruch 1, worin die Temperatur der besagten thermischen Behandlung zwischen 570°C und 780°C liegt.
  4. Verfahren gemäss Anspruch 1, worin die Temperatur der besagten thermischen Behandlung zwischen 630°C und 720°C liegt.
  5. Verfahren gemäss Anspruch 4, worin die Temperatur der besagten Hitzeverformung zwischen 720°C und 870°C liegt.
  6. Verwendung, in der Herstellung von Schreibspitzen oder Tintenbehältern von Schreibwerkzeugen oder Kugelschreibern, einer Legierung mit:
    zwischen 43 und 48 Massenanteile Cu;
    zwischen 33 und 38 Massenanteile Zn;
    zwischen 10 und 15 Massenanteile Ni;
    zwischen 3.5 und 6.5 Massenanteile Mn;
    zwischen 0 und 4 Massenanteile Pb;
    dadurch gekennzeichnet, dass die Legierung eine ein-phasige Alpha-Struktur α aufweist, die durch eine thermische Behandlung erreicht werden kann.
  7. Verwendung gemäss Anspruch 6, wobei die Legierung aus Folgendem besteht:
    zwischen 44.1 und 45.6 Massenanteile Cu;
    zwischen 35.6 und 37.1 Massenanteile Zn;
    zwischen 11.8 und 12.7 Massenanteile Ni;
    zwischen 4.6 und 5.4 Massenanteile Mn;
    zwischen 1.35 und 1.85 Massenanteile Pb.
  8. Verwendung gemäss Anspruch 6, worin die Temperatur der besagten thermische Behandlung zwischen 570°C und 780°C liegt.
  9. Schreibwerkzeug, mit einer Legierung aus:
    zwischen 43 und 48 Massenanteile Cu;
    zwischen 33 und 38 Massenanteile Zn;
    zwischen 10 und 15 Massenanteile Ni;
    zwischen 3.5 und 6.5 Massenanteile Mn;
    zwischen 0 und 4 Massenanteile Pb;
    dadurch gekennzeichnet, dass die Legierung eine ein-phasige Alpha-Struktur α aufweist, die durch eine thermische Behandlung erreicht werden kann.
  10. Schreibwerkzeug gemäss dem vorhergehenden Anspruch, worin die Legierung in einem Tintenbehälter und/oder einer Schreibspitze enthalten ist.
EP04706595A 2003-03-21 2004-01-30 Legierung auf kupferbasis Expired - Lifetime EP1608789B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH496032003 2003-03-21
CH00496/03A CH693948A5 (fr) 2003-03-21 2003-03-21 Alliage à base de cuivre.
PCT/CH2004/000051 WO2004083471A2 (fr) 2003-03-21 2004-01-30 Alliage a base de cuivre

Publications (2)

Publication Number Publication Date
EP1608789A2 EP1608789A2 (de) 2005-12-28
EP1608789B1 true EP1608789B1 (de) 2007-10-03

Family

ID=32111450

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04706595A Expired - Lifetime EP1608789B1 (de) 2003-03-21 2004-01-30 Legierung auf kupferbasis

Country Status (16)

Country Link
US (1) US9080226B2 (de)
EP (1) EP1608789B1 (de)
JP (1) JP2006520850A (de)
KR (1) KR20050108405A (de)
CN (1) CN100439537C (de)
AT (1) ATE374843T1 (de)
BR (1) BRPI0408610A (de)
CH (1) CH693948A5 (de)
DE (1) DE602004009297T2 (de)
DK (1) DK1608789T3 (de)
ES (1) ES2293213T3 (de)
HK (1) HK1088932A1 (de)
MX (1) MXPA05009635A (de)
MY (1) MY149452A (de)
TW (1) TWI314164B (de)
WO (1) WO2004083471A2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009021336A1 (de) 2009-05-14 2010-11-25 Wieland-Werke Ag Kupfer-Nickel-Zink-Legierung und deren Verwendung
WO2012104426A2 (en) 2011-02-04 2012-08-09 Swissmetal Industries Ltd Cu-ni-zn-mn alloy
WO2013131604A2 (de) 2012-03-07 2013-09-12 Wieland-Werke Ag Siliziumhaltige kupfer-nickel-zink-legierung
DE102013008822A1 (de) 2013-05-24 2014-11-27 Wieland-Werke Ag Mine für Kugelschreiber und Verwendung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7441973B2 (en) * 2006-10-20 2008-10-28 Ethicon Endo-Surgery, Inc. Adhesive applicator
KR101146356B1 (ko) * 2008-03-09 2012-05-17 미쓰비시 신도 가부시키가이샤 은백색 구리합금 및 그 제조 방법
CN102959108B (zh) * 2010-07-05 2015-04-29 Ykk株式会社 铜锌合金产品及铜锌合金产品的制造方法
US9181606B2 (en) 2010-10-29 2015-11-10 Sloan Valve Company Low lead alloy
AU2012276705B2 (en) * 2011-06-29 2015-06-11 Mitsubishi Materials Corporation Silver-white copper alloy and method of producing silver-white copper alloy
CN103045927B (zh) * 2013-01-29 2014-11-12 云南科力新材料有限公司 一种易切削含铅锌白铜及其加工方法
DE102014014239B4 (de) * 2014-09-25 2024-04-11 Wieland-Werke Ag Elektrisches Verbindungselement
EP3971312A1 (de) * 2020-09-17 2022-03-23 Société BIC Messinglegierung für schreibinstrumentenspitzen

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CH467174A (it) * 1968-05-08 1969-01-15 Ateko Anstalt C O Buero Alfred Punta per penne a sfera e procedimento per la sua fabbricazione
GB1188277A (en) * 1969-03-27 1970-04-15 Int Nickel Ltd Nickel-Silver Alloys
CH508049A (fr) * 1970-04-13 1971-05-31 Int Nickel Ltd Alliages de la classe des maillechorts
DE2051566A1 (en) * 1970-10-21 1972-04-27 Int Nickel Ltd Copper-nickel-zinc-manganese alloy - having fine two-phase structure, for mfr of springs
FR2394619A1 (fr) * 1977-06-16 1979-01-12 Louyot Comptoir Lyon Alemand Maillechort comportant du fer et son procede de mise en forme
US4410290A (en) * 1981-01-27 1983-10-18 Pilot Ink Co., Ltd. Composite pen tip
US4631171A (en) * 1985-05-16 1986-12-23 Handy & Harman Copper-zinc-manganese-nickel alloys
JPH01177327A (ja) * 1988-01-06 1989-07-13 Sanpo Shindo Kogyo Kk 銀白色を呈する快削性銅基合金
DD292933A5 (de) * 1990-03-19 1991-08-14 Veb Halbzeugwerk Auerhammer Im Veb Bergbau- Und Huettenkombinat "Albert Funk",De Kupfer-zink-nickel-basislegierung fuer das stranggiessen von band
JPH07166279A (ja) * 1993-12-09 1995-06-27 Kobe Steel Ltd 耐食性、打抜き加工性及び切削性が優れた銅基合金及びその製造方法
JP2828418B2 (ja) * 1995-09-21 1998-11-25 株式会社紀長伸銅所 改良快削白色合金
EP1270758A3 (de) * 1996-09-09 2003-03-05 Toto Ltd. Verfahren zur Herstellung von Messing
US6485846B1 (en) * 2000-09-29 2002-11-26 Ametek, Inc. Corrosion resistant gauge component
CN1162560C (zh) * 2001-07-31 2004-08-18 上海第一铜棒厂 耐蚀白色铜锰合金及其线材制造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009021336A1 (de) 2009-05-14 2010-11-25 Wieland-Werke Ag Kupfer-Nickel-Zink-Legierung und deren Verwendung
DE102009021336B4 (de) 2009-05-14 2024-01-11 Wieland-Werke Ag Kupfer-Nickel-Zink-Legierung und deren Verwendung
DE102009021336B9 (de) 2009-05-14 2024-04-04 Wieland-Werke Ag Kupfer-Nickel-Zink-Legierung und deren Verwendung
WO2012104426A2 (en) 2011-02-04 2012-08-09 Swissmetal Industries Ltd Cu-ni-zn-mn alloy
WO2013131604A2 (de) 2012-03-07 2013-09-12 Wieland-Werke Ag Siliziumhaltige kupfer-nickel-zink-legierung
DE102012004725A1 (de) 2012-03-07 2013-09-12 Wieland-Werke Ag Siliziumhaltige Kupfer-Nickel-Zink-Legierung
US9617629B2 (en) 2012-03-07 2017-04-11 Wieland-Werke Ag Copper-nickel-zinc alloy containing silicon
US9738961B2 (en) 2012-03-07 2017-08-22 Wieland-Werke Ag Copper-nickel-zinc alloy containing silicon
DE102012004725B4 (de) 2012-03-07 2018-07-19 Wieland-Werke Ag Siliziumhaltige Kupfer-Nickel-Zink-Legierung
DE102013008822A1 (de) 2013-05-24 2014-11-27 Wieland-Werke Ag Mine für Kugelschreiber und Verwendung
WO2014187544A1 (de) 2013-05-24 2014-11-27 Wieland-Werke Ag Mine für kugelschreiber und verwendung
US9637808B2 (en) 2013-05-24 2017-05-02 Wieland-Werke Ag Refill for a ball-point pen and use thereof

Also Published As

Publication number Publication date
MXPA05009635A (es) 2006-03-08
ES2293213T3 (es) 2008-03-16
DE602004009297D1 (de) 2007-11-15
CN1761768A (zh) 2006-04-19
CN100439537C (zh) 2008-12-03
US9080226B2 (en) 2015-07-14
ATE374843T1 (de) 2007-10-15
TW200502411A (en) 2005-01-16
WO2004083471A3 (fr) 2004-11-18
CH693948A5 (fr) 2004-05-14
WO2004083471A2 (fr) 2004-09-30
BRPI0408610A (pt) 2006-03-07
KR20050108405A (ko) 2005-11-16
EP1608789A2 (de) 2005-12-28
DK1608789T3 (da) 2008-01-07
JP2006520850A (ja) 2006-09-14
US20060065336A1 (en) 2006-03-30
DE602004009297T2 (de) 2008-07-10
TWI314164B (en) 2009-09-01
HK1088932A1 (en) 2006-11-17
MY149452A (en) 2013-08-30

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