EP1586099A1 - Method for producing an electronic component - Google Patents
Method for producing an electronic componentInfo
- Publication number
- EP1586099A1 EP1586099A1 EP03815532A EP03815532A EP1586099A1 EP 1586099 A1 EP1586099 A1 EP 1586099A1 EP 03815532 A EP03815532 A EP 03815532A EP 03815532 A EP03815532 A EP 03815532A EP 1586099 A1 EP1586099 A1 EP 1586099A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- base body
- resistance
- etching
- component
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000003486 chemical etching Methods 0.000 claims abstract description 3
- 238000005530 etching Methods 0.000 claims description 33
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000003518 caustics Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910003289 NiMn Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching
Definitions
- the invention relates to a method for producing an electrical component which has a base body and two opposite outer electrodes.
- Electro-ceramic components for example NTC thermistors, are required in large quantities with a very narrow tolerance of the ohmic resistance. Methods for producing such components are known in which a large number of such components are produced with a wide variety of resistance values. The components lying within a predetermined resistance tolerance are determined by electrical measurement and then separated from the entirety of the components.
- This method has the disadvantage that a relatively large reject of the components has to be accepted.
- NTC thermistors In order to reduce this scrap, it is also known to manufacture NTC thermistors by mechanically removing parts of the ceramic base body and possibly also the outer electrodes to match the components to a desired resistance.
- this method has the disadvantage that it is not possible or only possible with very great effort in the case of very small designs, for example in the 0402 design with the dimensions 1 mm 0.5 mm ⁇ 0.5 mm.
- a method for producing a component which comprises the following steps:
- the method described has the advantage that without mechanical processing methods, for example without grinding, rasping or planing, a simple method which can be carried out with little effort in terms of apparatus for producing the component with a predetermined desired value for the electrical resistance is provided.
- the method mentioned also has the advantage that it is particularly suitable for the production of components with a very small volume, where mechanical processing of the base body would require a very high outlay in terms of time and equipment.
- the current path available for the current flow between the opposite outer electrodes is narrowed, as a result of which the electrical resistance of the base body increases.
- the base bodies produced in method step a) have an actual resistance which is below the target resistance. Only in this case can the actual resistance be matched to the target resistance by etching away parts of the base body.
- a base body is used that contains a ceramic material. This has the advantage that the electro-ceramic components, surface-mountable NTC thermistors or similar components required in a large number of applications can be produced simply and cheaply.
- a ceramic material can also be used, the resistance of which has a negative temperature coefficient. This enables NTC thermistors to be manufactured.
- NTC thermistors for example, nickel-manganese spinels of the formula Ni 1 - 1 -] __ z [Mn 11 ⁇ M 11 ⁇ O4, where: O ⁇ z ⁇ 0.4.
- the method can be carried out particularly advantageously by immersing the base body in a liquid that etches the material of the base body.
- This procedure has the advantage that the material of the base body is removed substantially uniformly, so that massive damage at one or a few special points can be avoided.
- the procedure described has the further advantage that several base bodies can be treated simultaneously in a single process step.
- the etching can also be carried out by dry etching.
- the actual value of the resistance can be measured before step b).
- This procedure has the advantage that a control mechanism for etching away can be provided. Conclusions about the etching process can be drawn from the deviation between the target value and the actual value of the resistor.
- a duration for the etching process for example in an etching liquid, by determining the difference between the target value of the resistor and the actual value of the resistor.
- experiments are used to measure relationships between the etching time and the resulting increase in resistance for a component type.
- a previously determined etching duration can be determined on the basis of the measurement of the actual resistance and the resulting difference to the target resistance.
- the resistance of the component After etching the base body for the previously determined etching time, the resistance of the component will be close to the target value with sufficient accuracy. Measuring the resistance before initiating step b) of the method can be advantageous in order to determine whether the resistance can be matched at all with the aid of the etching. This would not be the case, for example, if tolerances so great occur during the manufacture of the base body that the resistance of the component is greater than the desired value even during manufacture. In this case, by etching the base body, no further adjustment to the target value could take place, since by etching the base body the resistance can only be increased, but not reduced.
- the method can also be provided to measure the resistance of the component or the base body during the etching, as a result of which the etching process can be checked directly. The etching process is then stopped as soon as the resistance of the base body has reached the desired value.
- FIG. 1 shows an electrical component in a schematic cross section before the etching and after the etching.
- FIG. 2 shows the relationship between the etching time and the increase in resistance that can be achieved as a result for an NTC termistor
- FIG. 1 shows an NTC thermistor with a base body 1, which consists of the ceramic material NiMn spinel or another similarly suitable material. External contacts 21, 22 are attached to opposite side surfaces of the base body 1. By etching away parts of the base body 1, the current path between the external contacts 21, 22 can be narrowed, as is shown by the dashed lines. This increases the resistance of the component. It is thus possible to increase the resistance of the component by etching the base body 1 in such a way that a target resistance is achieved with sufficient accuracy.
- the component from FIG. 1 corresponds to design 0603, which means that the component has the following dimensions: 1.6 mm ⁇ 0.8 mm ⁇ 0.8 mm. The smallest dimension d in the example of FIG.
- the base body 1 is the height of the base body 1 and is 0.8 mm.
- the smallest dimensions of components are the length, the depth, the width or the diameter of a component. It is special ders advantageous to use components for the method described here, the smallest dimension is less than 3 mm.
- the measurement of the resistance can be dispensed with during the etching, in that the relationship between the resistance of the component and the etching duration is determined by means of a calibration measurement. Then it is sufficient to determine the actual resistance of the component and to determine the difference between the actual resistance and the target resistance. The etching time can then be calculated from this resistance difference using the calibration curve.
- the external contacts (21, 22) consist of a material that is not attacked by the etching solution or is attacked significantly less than the ceramic material, so that the solderability remains.
- the external contacts (21, 22) consist of a material that is not attacked by the etching solution or is attacked significantly less than the ceramic material, so that the solderability remains.
- FIG. 2 shows such a calibration curve for a component of type 0603 with a resistance R25, measured at 25 ° C., of 6000 ⁇ .
- R25 measured at 25 ° C.
- FIG. 2 it is the resistance R25, measured in ⁇ , plotted over the etching time t, measured in minutes.
- a 10% sulfuric acid was used as the etching solution.
- Figure 2 shows measuring points at the measuring times 0, 1, 5 and 10 minutes. It can be clearly seen that the resistance R25 increases with increasing etching time.
- the present invention is not limited to NTC thermistors, but can be used for any electrical component, the resistance of which depends on the geometric dimensions of its base body. LIST OF REFERENCE NUMBERS
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10302800 | 2003-01-24 | ||
DE10302800A DE10302800A1 (en) | 2003-01-24 | 2003-01-24 | Method of manufacturing a component |
PCT/DE2003/004289 WO2004068508A1 (en) | 2003-01-24 | 2003-12-23 | Method for producing an electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1586099A1 true EP1586099A1 (en) | 2005-10-19 |
EP1586099B1 EP1586099B1 (en) | 2016-02-24 |
Family
ID=32694955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03815532.1A Expired - Lifetime EP1586099B1 (en) | 2003-01-24 | 2003-12-23 | Method for producing an electronic component |
Country Status (5)
Country | Link |
---|---|
US (1) | US7887713B2 (en) |
EP (1) | EP1586099B1 (en) |
CN (1) | CN1742348A (en) |
DE (1) | DE10302800A1 (en) |
WO (1) | WO2004068508A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020081630A2 (en) | 2018-10-17 | 2020-04-23 | Petoi, Llc | Robotic animal puzzle |
US12021038B2 (en) | 2021-06-11 | 2024-06-25 | Macom Technology Solutions Holdings, Inc. | Solderable and wire bondable part marking |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6337552B1 (en) | 1999-01-20 | 2002-01-08 | Sony Corporation | Robot apparatus |
SE354143B (en) | 1972-02-15 | 1973-02-26 | Ericsson Telefon Ab L M | |
US3839110A (en) * | 1973-02-20 | 1974-10-01 | Bell Telephone Labor Inc | Chemical etchant for palladium |
DE2908361C2 (en) | 1979-03-03 | 1985-05-15 | Dynamit Nobel Ag, 5210 Troisdorf | Method for increasing the resistance of electrical ignition elements |
DD241326A1 (en) | 1985-09-25 | 1986-12-03 | Hermsdorf Keramik Veb | METHOD FOR COMPENSATING THE RESISTANT RESISTANCE OF DYED FILM FUNCTIONAL LAYERS |
DD257895A1 (en) | 1987-02-27 | 1988-06-29 | Elektronische Bauelemente Veb | METHOD FOR DEFINED ELECTROLYTIC ADJUSTMENT OF RESISTANCE ELEMENTS BASED ON CUNI ALLOYS (FILMS) |
DE3708832A1 (en) * | 1987-03-18 | 1988-09-29 | Siemens Ag | Wet-chemical patterning of hafnium boride layers |
DE3813627C2 (en) * | 1988-04-22 | 1997-03-27 | Bosch Gmbh Robert | Method for comparing the functions of an electronic circuit |
JP3039224B2 (en) | 1993-09-29 | 2000-05-08 | 松下電器産業株式会社 | Varistor manufacturing method |
JP3226014B2 (en) | 1996-02-27 | 2001-11-05 | 三菱マテリアル株式会社 | Manufacturing method of chip type thermistor |
DE19640127A1 (en) | 1996-09-28 | 1998-04-02 | Dynamit Nobel Ag | Method for matching sheet resistances with excimer laser radiation |
GB9623945D0 (en) * | 1996-11-15 | 1997-01-08 | Geco Prakla Uk Ltd | Detection of ground roll cone |
JPH10199707A (en) | 1997-01-13 | 1998-07-31 | Chichibu Onoda Cement Corp | Manufacture of chip type thermistor |
CN1279552C (en) | 1997-06-16 | 2006-10-11 | 松下电器产业株式会社 | Resistance wiring board and its mfg. method |
US6172592B1 (en) * | 1997-10-24 | 2001-01-09 | Murata Manufacturing Co., Ltd. | Thermistor with comb-shaped electrodes |
DE19800196C2 (en) * | 1998-01-07 | 1999-10-28 | Guenter Nimtz | Process for the production of surface resistance layers |
JP3624395B2 (en) * | 1999-02-15 | 2005-03-02 | 株式会社村田製作所 | Manufacturing method of chip type thermistor |
TW487742B (en) * | 1999-05-10 | 2002-05-21 | Matsushita Electric Ind Co Ltd | Electrode for PTC thermistor, manufacture thereof, and PTC thermistor |
CN1093159C (en) | 1999-05-24 | 2002-10-23 | 中国科学院新疆物理研究所 | Room temperature solid-phase reaction of thermosensitive powder with negative temperature coefficient |
KR100674692B1 (en) * | 1999-06-03 | 2007-01-26 | 마쯔시다덴기산교 가부시키가이샤 | Thin film thermistor element and method for the fabrication of thin film thermistor element |
JP4557386B2 (en) * | 2000-07-10 | 2010-10-06 | キヤノン株式会社 | Manufacturing method for recording head substrate |
US6475400B2 (en) | 2001-02-26 | 2002-11-05 | Trw Inc. | Method for controlling the sheet resistance of thin film resistors |
US7218506B2 (en) * | 2004-03-31 | 2007-05-15 | Tdk Corporation | Electrolytic capacitor and method of manufacturing the same |
-
2003
- 2003-01-24 DE DE10302800A patent/DE10302800A1/en not_active Ceased
- 2003-12-23 CN CNA2003801091686A patent/CN1742348A/en active Pending
- 2003-12-23 WO PCT/DE2003/004289 patent/WO2004068508A1/en active Application Filing
- 2003-12-23 US US10/542,974 patent/US7887713B2/en not_active Expired - Fee Related
- 2003-12-23 EP EP03815532.1A patent/EP1586099B1/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO2004068508A1 * |
Also Published As
Publication number | Publication date |
---|---|
US7887713B2 (en) | 2011-02-15 |
WO2004068508A1 (en) | 2004-08-12 |
US20060131274A1 (en) | 2006-06-22 |
DE10302800A1 (en) | 2004-08-12 |
CN1742348A (en) | 2006-03-01 |
EP1586099B1 (en) | 2016-02-24 |
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