EP1586099B1 - Method for producing an electronic component - Google Patents
Method for producing an electronic component Download PDFInfo
- Publication number
- EP1586099B1 EP1586099B1 EP03815532.1A EP03815532A EP1586099B1 EP 1586099 B1 EP1586099 B1 EP 1586099B1 EP 03815532 A EP03815532 A EP 03815532A EP 1586099 B1 EP1586099 B1 EP 1586099B1
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- European Patent Office
- Prior art keywords
- main body
- resistance
- etching
- outer electrodes
- measured
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 239000001117 sulphuric acid Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910003289 NiMn Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching
Definitions
- the invention relates to a method for producing an electrical component, which has a main body and two opposing outer electrodes.
- Electroceramic devices such as NTC thermistors are needed in large quantities with a very tight tolerance of the ohmic resistance.
- Methods are known for producing such components, in which a large number of such components having different resistance values are produced. The lying within a given resistance tolerance components are determined by electrical measurement and then separated from the integrity of the components.
- This method has the disadvantage that a relatively large scrap of components must be accepted.
- NTC thermistors In order to reduce this committee, it is also known to produce NTC thermistors by the components are adjusted to a desired resistance by mechanical removal of parts of the ceramic body and possibly also the outer electrodes.
- this method has the disadvantage that it is not possible or only with great effort in very small designs, for example in the design 0402 with dimensions of 1 mm x 0.5 mm x 0.5 mm.
- the method described has the advantage that, dispensing with mechanical processing methods, for example, waiving loops, rasps or planing a simple and easy to implement equipment with little effort to produce the device is provided with a predetermined target value for the electrical resistance.
- the said method also has the advantage that it is particularly suitable for the production of components with a very small volume, where a mechanical processing of the body would require a very high time and equipment expense.
- the main body produced in process step a) have an actual resistance which is below the nominal resistance. Only in this case it is possible to achieve an adaptation of the actual resistance to the nominal resistance by etching away parts of the basic body.
- a base body containing a ceramic material is used. This has the advantage that the required in a variety of applications electroceramic devices, surface mount NTC thermistors or similar devices can be easily and inexpensively manufactured.
- nickel-manganese spinels of the formula Ni III 1-z [Mn III 2 Mn II z ] O 4 may be used as material for NTC thermistors, where 0 ⁇ z ⁇ 0.4.
- This embodiment of the method has the advantage that it allows the processing or adjustment of the resistance value for very small components, where mechanical processing would be possible only with great effort.
- the method can be carried out particularly advantageously by immersing the base body in a liquid which corroses the material of the base body.
- This approach has the advantage that the removal of the material of the body is substantially uniform, so that massive damage to one or a few specific locations can be avoided.
- the procedure described has the further advantage that several bodies can be treated simultaneously in a single process step.
- sulfuric acid can be used as corrosive liquid.
- the etching can also be carried out by dry etching.
- the actual value of the resistance can be measured before step b).
- This approach has the advantage that a control mechanism for the Weglegien can be provided. It is possible to draw conclusions about the etching process from the deviation between the desired value and the actual value of the resistance.
- a duration for the etching process for example in a corrosive liquid, by determining the difference between the desired value of the resistor and the actual value of the resistor.
- relationships between the etching time and the resistance increase thereby achieved for a type of component are measured by experiments.
- a predetermined etching time can be determined on the basis of the measurement of the actual resistance and the resulting difference from the nominal resistance.
- the resistance of the component will then be with sufficient accuracy in the vicinity of the desired value.
- Measuring the resistance before initiating step b) of the method may be advantageous for determining whether an approximation of the resistance can occur at all with the aid of the etching. This would not be the case, for example, if such large tolerances occur in the manufacture of the base body that the resistance of the component is greater than the desired value already during production. By etching the body could be done in this case, no further adjustment to the target value, since by etching the body of the resistance can only be increased, but not lowered.
- FIG. 1 shows an NTC thermistor with a base body 1, which consists of the ceramic material NiMn spinel or other similarly suitable material. On opposite side surfaces of the main body 1 external contacts 21, 22 are mounted. By etching away parts of the main body 1, the current path between the external contacts 21, 22 can be narrowed, as shown by the dashed lines. As a result, the resistance of the component increases. It is thus possible to increase the resistance of the device by etching of the base body 1 so that a desired resistance is achieved with sufficient accuracy.
- the device off FIG. 1 corresponds to the design 0603, which means that the component has the following dimensions: 1.6 mm x 0.8 mm x 0.8 mm.
- the height of the main body 1 is 0.8 mm.
- the length, the depth, the width or the diameter of a component come into consideration. It's special advantageous for the method described here to use components whose smallest dimension is smaller than 3 mm.
- the external contacts (21, 22) consist of a material which is not attacked by the etching solution or significantly less than the ceramic material is attacked, so that the solderability remains.
- a 3-layer metallization with an Ag / Ni / Sn layer sequence or with a silver / palladium metallization.
- FIG. 2 shows such a calibration curve for a device of the type 0603 with a resistance R25, measured at 25 ° C, of 6000 ⁇ . It is in FIG. 2 the resistance R25, measured in ⁇ , plotted over the etching time t, measured in minutes. As the etching solution, a 10% sulfuric acid was used. FIG. 2 shows measuring points at the measuring times 0, 1, 5 and 10 minutes. It can be clearly seen that the resistance R25 increases with increasing etching time.
- the present invention is not limited to NTC thermistors, but can be applied to any electrical device whose resistance depends on the geometric dimensions of its body.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermistors And Varistors (AREA)
Description
Die Erfindung betrifft ein Verfahren zur Herstellung eines elektrischen Bauelements, das einen Grundkörper sowie zwei gegenüberliegende Außenelektroden aufweist.The invention relates to a method for producing an electrical component, which has a main body and two opposing outer electrodes.
Elektrokeramische Bauelemente, beispielsweise NTC-Thermistoren werden in großen Stückzahlen mit einer sehr engen Toleranz des ohmschen Widerstandes benötigt. Es sind Verfahren zur Herstellung solcher Bauelemente bekannt, bei denen eine Vielzahl solcher Bauelemente mit unterschiedlichsten Widerstandswerten hergestellt werden. Die innerhalb einer vorgegebenen Widerstandstoleranz liegenden Bauelemente werden durch elektrische Messung ermittelt und anschließend aus der Ganzheit der Bauelemente abgesondert.Electroceramic devices, such as NTC thermistors are needed in large quantities with a very tight tolerance of the ohmic resistance. Methods are known for producing such components, in which a large number of such components having different resistance values are produced. The lying within a given resistance tolerance components are determined by electrical measurement and then separated from the integrity of the components.
Dieses Verfahren hat den Nachteil, daß ein relativ großer Ausschuß der Bauelemente in Kauf genommen werden muß.This method has the disadvantage that a relatively large scrap of components must be accepted.
Um diesen Ausschuß zu vermindern, ist es desweiteren bekannt, NTC-Thermistoren herzustellen, indem durch mechanisches Abtragen von Teilen des keramischen Grundkörpers sowie ggf. noch der Außenelektroden die Bauelemente auf einen Sollwiderstand hin abgeglichen werden. Dieses Verfahren hat jedoch den Nachteil, daß es bei sehr kleinen Bauformen, beispielsweise bei der Bauform 0402 mit den Abmessungen 1 mm x 0,5 mm x 0,5 mm nicht oder nur mit sehr großem Aufwand möglich ist.In order to reduce this committee, it is also known to produce NTC thermistors by the components are adjusted to a desired resistance by mechanical removal of parts of the ceramic body and possibly also the outer electrodes. However, this method has the disadvantage that it is not possible or only with great effort in very small designs, for example in the design 0402 with dimensions of 1 mm x 0.5 mm x 0.5 mm.
Aus
Es ist Aufgabe der vorliegenden Erfindung, ein Verfahren zur Herstellung von Bauelementen anzugeben, bei dem das Einhalten einer vorgegebenen Toleranz für den elektrischen Widerstand auch für kleinvolumige Bauelemente möglich ist.It is an object of the present invention to provide a method for the production of components, in which the compliance a predetermined tolerance for the electrical resistance is also possible for small-volume components.
Diese Aufgabe wird gelöst durch ein Verfahren nach Patentanspruch 1. Vorteilhafte Ausgestaltungen des Verfahrens sind den weiteren Patentansprüchen zu entnehmen.This object is achieved by a method according to
Es wird ein Verfahren zur Herstellung eines Bauelements angegeben, das die folgenden Schritte umfaßt:
- a) Bilden eines Grundkörpers mit zwei gegenüberliegenden Außenelektroden
- b) Angleichen des zwischen den Außenelektroden zu messenden Widerstandes des Grundkörpers an einen vorgegebenen Sollwert durch chemisches Wegätzen von Teilen des Grundkörpers.
- a) forming a base body with two opposite outer electrodes
- b) matching the between the outer electrodes to be measured resistance of the body to a predetermined target value by chemically etching away parts of the body.
Das beschriebene Verfahren hat den Vorteil, daß unter Verzicht auf mechanische Bearbeitungsverfahren, beispielsweise unter Verzicht auf Schleifen, Raspeln oder Hobeln eine einfache und apparativ mit geringem Aufwand durchzuführende Methode zur Herstellung des Bauelements mit einem vorgegebenen Sollwert für den elektrischen Widerstand bereitgestellt wird. Das genannte Verfahren hat zudem den Vorteil, daß es insbesondere geeignet ist zur Herstellung von Bauelementen mit sehr kleinem Volumen, wo eine mechanische Bearbeitung des Grundkörpers einen sehr hohen zeitlichen und apparativen Aufwand erfordern würde.The method described has the advantage that, dispensing with mechanical processing methods, for example, waiving loops, rasps or planing a simple and easy to implement equipment with little effort to produce the device is provided with a predetermined target value for the electrical resistance. The said method also has the advantage that it is particularly suitable for the production of components with a very small volume, where a mechanical processing of the body would require a very high time and equipment expense.
Durch das chemische Wegätzen von Teilen des Grundkörpers wird der für den Stromfluß zwischen den gegenüberliegenden Außenelektroden zur Verfügung stehende Strompfad eingeengt, wodurch der elektrische Widerstand des Grundkörpers ansteigt.As a result of the chemical etching away of parts of the main body, the current path available for the current flow between the opposing external electrodes is narrowed, as a result of which the electrical resistance of the main body increases.
Entsprechend diesem Verfahren ist es vorteilhaft, wenn die im Verfahrensschritt a) hergestellten Grundkörper einen Ist-Widerstand aufweisen, der unterhalb des Sollwiderstandes liegt. Nur in diesem Fall gelingt es, durch Wegätzen von Teilen des Grundkörpers eine Anpassung des Ist-Widerstandes an den Soll-Widerstand zu erreichen.According to this method, it is advantageous if the main body produced in process step a) have an actual resistance which is below the nominal resistance. Only in this case it is possible to achieve an adaptation of the actual resistance to the nominal resistance by etching away parts of the basic body.
In einer Ausführungsform des Verfahrens wird ein Grundkörper verwendet, der ein Keramikmaterial enthält. Dies hat den Vorteil, daß die in einer Vielzahl von Applikationen benötigten elektrokeramischen Bauelemente, oberflächenmontierbare NTC-Thermistoren oder ähnliche Bauelemente, einfach und billig hergestellt werden können.In one embodiment of the method, a base body containing a ceramic material is used. This has the advantage that the required in a variety of applications electroceramic devices, surface mount NTC thermistors or similar devices can be easily and inexpensively manufactured.
In einer anderen Ausführungsform des Verfahrens kann auch ein Keramikmaterial verwendet werden, dessen Widerstand einen negativen Temperaturkoeffizienten aufweist. Dadurch gelingt die Herstellung von NTC-Thermistoren.In another embodiment of the method, it is also possible to use a ceramic material whose resistance has a negative temperature coefficient. This allows the production of NTC thermistors.
Beispielsweise können für NTC-Thermistoren als Material Nikkel-Mangan-Spinelle der Formel NiIII 1-z[MnIII 2MnII z]O4, wobei gilt: 0 ≤ z ≤0,4.For example, nickel-manganese spinels of the formula Ni III 1-z [Mn III 2 Mn II z ] O 4 may be used as material for NTC thermistors, where 0 ≦ z ≦ 0.4.
Es ist darüber hinaus vorteilhaft, das Verfahren mit Grundkörpern durchzuführen, deren kleinste Abmessung unter 3 mm liegt. Diese Ausführungsform des Verfahrens hat den Vorteil, daß es die Bearbeitung bzw. die Anpassung des Widerstandswertes für sehr kleine Bauelemente ermöglicht, wo eine mechanische Bearbeitung nur unter einem großen Aufwand möglich wäre.It is also advantageous to carry out the process with basic bodies whose smallest dimension is less than 3 mm. This embodiment of the method has the advantage that it allows the processing or adjustment of the resistance value for very small components, where mechanical processing would be possible only with great effort.
Besonders vorteilhaft kann das Verfahren ausgeführt werden, indem der Grundkörper in eine das Material des Grundkörpers ätzende Flüssigkeit eingetaucht wird. Diese Vorgehensweise hat den Vorteil, daß der Abtrag des Materials des Grundkörpers im wesentlichen gleichmäßig erfolgt, so daß eine massive Schädigung an einer oder wenigen speziellen Stellen vermieden werden kann. Darüber hinaus hat die beschriebene Vorgehensweise den weiteren Vorteil, daß mehrere Grundkörper gleichzeitig in einem einzigen Verfahrensschritt behandelt werden können.The method can be carried out particularly advantageously by immersing the base body in a liquid which corroses the material of the base body. This approach has the advantage that the removal of the material of the body is substantially uniform, so that massive damage to one or a few specific locations can be avoided. In addition, the procedure described has the further advantage that several bodies can be treated simultaneously in a single process step.
Als ätzende Flüssigkeit kann beispielsweise Schwefelsäure verwendet werden.For example, sulfuric acid can be used as corrosive liquid.
In einer anderen Ausführungsform der Erfindung kann das Ätzen auch durch Trockenätzen erfolgen.In another embodiment of the invention, the etching can also be carried out by dry etching.
In einer weiteren Ausgestaltung des Verfahrens kann vor dem Schritt b) der Istwert des Widerstandes gemessen werden. Diese Vorgehensweise hat den Vorteil, daß ein Steuerungsmechanismus für das Wegätzen zur Verfügung gestellt werden kann. Aus der Abweichung zwischen dem Sollwert und dem Istwert des Widerstandes können nämlich Rückschlüsse auf den Ätzvorgang gezogen werden.In a further embodiment of the method, the actual value of the resistance can be measured before step b). This approach has the advantage that a control mechanism for the Wegätzen can be provided. It is possible to draw conclusions about the etching process from the deviation between the desired value and the actual value of the resistance.
Beispielsweise ist es möglich, durch Ermittlung der Differenz zwischen dem Sollwert des Widerstandes und dem Istwert des Widerstandes eine Dauer für den Ätzvorgang, beispielsweise in einer ätzenden Flüssigkeit festzulegen. Hierzu werden durch Versuche Zusammenhänge zwischen der Ätzdauer und dem dadurch erzielten Widerstandsanstieg für einen Bauelementtyp gemessen. Anhand der so erhaltenen Daten kann aufgrund der Messung des Ist-Widerstandes und der sich daraus ergebenden Differenz zum Soll-Widerstand eine vorher festgesetzte Ätzdauer festgelegt werden.For example, it is possible to determine a duration for the etching process, for example in a corrosive liquid, by determining the difference between the desired value of the resistor and the actual value of the resistor. For this purpose, relationships between the etching time and the resistance increase thereby achieved for a type of component are measured by experiments. On the basis of the data thus obtained, a predetermined etching time can be determined on the basis of the measurement of the actual resistance and the resulting difference from the nominal resistance.
Nach Ätzen des Grundkörpers für die vorher festgesetzte Ätzdauer wird dann der Widerstand des Bauelementes mit ausreichender Genauigkeit in der Nähe des Soll-Wertes liegen. Das Messen des Widerstandes vor Einleiten des Schrittes b) des Verfahrens kann vorteilhaft sein, um festzustellen, ob mit Hilfe des Ätzens überhaupt eine Angleichung des Widerstandes erfolgen kann. Dies wäre beispielsweise nicht gegeben, wenn bei der Herstellung des Grundkörpers so große Toleranzen auftreten, daß schon bei der Herstellung der Widerstand des Bauelementes größer ist als der Sollwert. Durch Ätzen des Grundkörpers könnte in diesem Fall keine weitere Anpassung an den Sollwert erfolgen, da durch Ätzen des Grundkörpers der Widerstand nur erhöht, nicht jedoch erniedrigt werden kann.After etching the base body for the previously determined etching duration, the resistance of the component will then be with sufficient accuracy in the vicinity of the desired value. Measuring the resistance before initiating step b) of the method may be advantageous for determining whether an approximation of the resistance can occur at all with the aid of the etching. This would not be the case, for example, if such large tolerances occur in the manufacture of the base body that the resistance of the component is greater than the desired value already during production. By etching the body could be done in this case, no further adjustment to the target value, since by etching the body of the resistance can only be increased, but not lowered.
In einer anderen Ausführungsform des Verfahrens kann es auch vorgesehen sein, während des Ätzens den Widerstand des Bauelementes bzw. des Grundkörpers zu messen, wodurch eine direkte Kontrolle des Ätzvorgangs erfolgen kann. Der Ätzvorgang wird dann abgebrochen, sobald der Widerstand des Grundkörpers den Soll-Wert erreicht hat.In another embodiment of the method, it may also be provided to measure the resistance of the component or the base body during the etching, whereby a direct control of the etching process can take place. The etching process is then stopped as soon as the resistance of the main body has reached the desired value.
Im folgenden wird die Erfindung anhand von Ausführungsbeispielen und den dazugehörigen Figuren näher erläutert.
Figur 1- zeigt ein elektrisches Bauelement in einem schematischen Querschnitt vor dem Ätzen und nach dem Ätzen.
Figur 2- zeigt für einen NTC-Termistor den Zusammenhang zwischen der Ätzdauer und dem dadurch erzielbaren Widerstandsanstieg
- FIG. 1
- shows an electrical component in a schematic cross-section before the etching and after the etching.
- FIG. 2
- shows for an NTC termistor the relationship between the etching time and the resistance increase that can be achieved thereby
Es kann während des Ätzens auf die Messung des Widerstandes verzichtet werden, indem durch eine Eichmessung der Zusammenhang zwischen dem Widerstand des Bauelements und der Ätzdauer festgelegt wird. Dann genügt die Feststellung des Ist-Widerstandes des Bauelementes und die Feststellung der Differenz zwischen dem Ist-Widerstand und dem Soll-Widerstand. Aus dieser Widerstandsdifferenz kann dann die Ätzdauer anhand der Eichkurve berechnet werden.It is possible to dispense with the measurement of the resistance during the etching by determining the relationship between the resistance of the component and the etching time by means of a calibration measurement. Then it is sufficient to determine the actual resistance of the device and the determination of the difference between the actual resistance and the target resistance. From this resistance difference, the etching period can then be calculated on the basis of the calibration curve.
Erfindungsgemäß bestehen die Außenkontakte (21, 22) aus einem Material, das nicht durch die Ätzlösung angegriffen bzw. deutlich weniger als das Keramikmaterial angegriffen wird, so daß die Lötbarkeit gegeben bleibt. Es kommt beispielsweise in Betracht, eine 3-Schicht-Metallisierung mit einer Ag/Ni/Sn-Schichtenfolge oder mit einer Silber/Palladium-Metallisierung zu verwenden.According to the invention, the external contacts (21, 22) consist of a material which is not attacked by the etching solution or significantly less than the ceramic material is attacked, so that the solderability remains. For example, it is contemplated to use a 3-layer metallization with an Ag / Ni / Sn layer sequence or with a silver / palladium metallization.
Die vorliegende Erfindung beschränkt sich nicht auf NTC-Thermistoren, sondern kann für jedes beliebige elektrische Bauelement angewendet werden, dessen Widerstand von den geometrischen Abmessungen seines Grundkörpers abhängig ist.The present invention is not limited to NTC thermistors, but can be applied to any electrical device whose resistance depends on the geometric dimensions of its body.
- 11
- Grundkörperbody
- 21, 2221, 22
- Außenkontakteexternal contacts
- R25R25
- Widerstand gemessen bei 25° CResistance measured at 25 ° C
- tt
- zeitTime
- dd
- kleinste Abmessungsmallest dimension
Claims (9)
- Method for producing an electrical component, said method comprising the following steps:a) forming a main body (1) with two opposing outer electrodes,b) adjusting the resistance of the main body (1) which is to be measured between the outer electrodes to a predefined desired value by chemically etching parts of the main body (1),characterized in that the outer electrodes consist of a material which is attacked to a considerably lesser degree by the etching solution than the ceramic material of the main body (1), and therefore the solderability is maintained.
- Method according to Claim 1,
wherein use is made of a main body (1) which contains a ceramic material. - Method according to either of Claims 1 and 2,
wherein use is made of a main body (1), the ohmic resistance of which has a negative temperature coefficient. - Method according to one of Claims 1 to 3,
wherein use is made of a main body (1), the smallest dimension (d) of which is smaller than 3 mm. - Method according to one of Claims 1 to 4,
wherein the etching is carried out by immersing the main body (1) in a liquid which etches the material of the main body (1). - Method according to Claim 5,
wherein the etching liquid used is sulphuric acid. - Method according to one of Claims 1 to 6,
wherein the actual value of the resistance of the main body (1) is measured before step b). - Method according to Claim 7,
wherein the resistance (R25) of the main body (1) is measured during the etching. - Method according to one of Claims 1 to 8,- wherein, before step b), the difference between the desired value and the actual value of the resistance (R25) is determined and a time duration (t) for the etching process is determined therefrom, and- wherein, in step b), etching is performed with the thus determined time duration (t).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10302800A DE10302800A1 (en) | 2003-01-24 | 2003-01-24 | Method of manufacturing a component |
| DE10302800 | 2003-01-24 | ||
| PCT/DE2003/004289 WO2004068508A1 (en) | 2003-01-24 | 2003-12-23 | Method for producing an electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1586099A1 EP1586099A1 (en) | 2005-10-19 |
| EP1586099B1 true EP1586099B1 (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03815532.1A Expired - Lifetime EP1586099B1 (en) | 2003-01-24 | 2003-12-23 | Method for producing an electronic component |
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| Country | Link |
|---|---|
| US (1) | US7887713B2 (en) |
| EP (1) | EP1586099B1 (en) |
| CN (1) | CN1742348A (en) |
| DE (1) | DE10302800A1 (en) |
| WO (1) | WO2004068508A1 (en) |
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| CN113727767B (en) | 2018-10-17 | 2023-05-23 | 派拓艺(深圳)科技有限责任公司 | Machine animal splicing model |
| US12021038B2 (en) | 2021-06-11 | 2024-06-25 | Macom Technology Solutions Holdings, Inc. | Solderable and wire bondable part marking |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6337552B1 (en) * | 1999-01-20 | 2002-01-08 | Sony Corporation | Robot apparatus |
| SE354143B (en) * | 1972-02-15 | 1973-02-26 | Ericsson Telefon Ab L M | |
| US3839110A (en) * | 1973-02-20 | 1974-10-01 | Bell Telephone Labor Inc | Chemical etchant for palladium |
| DE2908361C2 (en) * | 1979-03-03 | 1985-05-15 | Dynamit Nobel Ag, 5210 Troisdorf | Method for increasing the resistance of electrical ignition elements |
| DD241326A1 (en) | 1985-09-25 | 1986-12-03 | Hermsdorf Keramik Veb | METHOD FOR COMPENSATING THE RESISTANT RESISTANCE OF DYED FILM FUNCTIONAL LAYERS |
| DD257895A1 (en) | 1987-02-27 | 1988-06-29 | Elektronische Bauelemente Veb | METHOD FOR DEFINED ELECTROLYTIC ADJUSTMENT OF RESISTANCE ELEMENTS BASED ON CUNI ALLOYS (FILMS) |
| DE3708832A1 (en) * | 1987-03-18 | 1988-09-29 | Siemens Ag | Wet-chemical patterning of hafnium boride layers |
| DE3813627C2 (en) * | 1988-04-22 | 1997-03-27 | Bosch Gmbh Robert | Method for comparing the functions of an electronic circuit |
| JP3039224B2 (en) * | 1993-09-29 | 2000-05-08 | 松下電器産業株式会社 | Varistor manufacturing method |
| JP3226014B2 (en) | 1996-02-27 | 2001-11-05 | 三菱マテリアル株式会社 | Manufacturing method of chip type thermistor |
| DE19640127A1 (en) | 1996-09-28 | 1998-04-02 | Dynamit Nobel Ag | Method for matching sheet resistances with excimer laser radiation |
| GB9623945D0 (en) * | 1996-11-15 | 1997-01-08 | Geco Prakla Uk Ltd | Detection of ground roll cone |
| JPH10199707A (en) | 1997-01-13 | 1998-07-31 | Chichibu Onoda Cement Corp | Manufacture of chip type thermistor |
| JP3532926B2 (en) | 1997-06-16 | 2004-05-31 | 松下電器産業株式会社 | Resistance wiring board and method of manufacturing the same |
| US6172592B1 (en) * | 1997-10-24 | 2001-01-09 | Murata Manufacturing Co., Ltd. | Thermistor with comb-shaped electrodes |
| DE19800196C2 (en) * | 1998-01-07 | 1999-10-28 | Guenter Nimtz | Process for the production of surface resistance layers |
| JP3624395B2 (en) * | 1999-02-15 | 2005-03-02 | 株式会社村田製作所 | Manufacturing method of chip type thermistor |
| TW487742B (en) * | 1999-05-10 | 2002-05-21 | Matsushita Electric Ind Co Ltd | Electrode for PTC thermistor, manufacture thereof, and PTC thermistor |
| CN1093159C (en) | 1999-05-24 | 2002-10-23 | 中国科学院新疆物理研究所 | Room temperature solid-phase reaction of thermosensitive powder with negative temperature coefficient |
| KR100674692B1 (en) * | 1999-06-03 | 2007-01-26 | 마쯔시다덴기산교 가부시키가이샤 | Thin film thermistor element and method for the fabrication of thin film thermistor element |
| JP4557386B2 (en) * | 2000-07-10 | 2010-10-06 | キヤノン株式会社 | Manufacturing method for recording head substrate |
| US6475400B2 (en) | 2001-02-26 | 2002-11-05 | Trw Inc. | Method for controlling the sheet resistance of thin film resistors |
| US7218506B2 (en) * | 2004-03-31 | 2007-05-15 | Tdk Corporation | Electrolytic capacitor and method of manufacturing the same |
-
2003
- 2003-01-24 DE DE10302800A patent/DE10302800A1/en not_active Ceased
- 2003-12-23 EP EP03815532.1A patent/EP1586099B1/en not_active Expired - Lifetime
- 2003-12-23 WO PCT/DE2003/004289 patent/WO2004068508A1/en active Application Filing
- 2003-12-23 CN CNA2003801091686A patent/CN1742348A/en active Pending
- 2003-12-23 US US10/542,974 patent/US7887713B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE10302800A1 (en) | 2004-08-12 |
| US7887713B2 (en) | 2011-02-15 |
| CN1742348A (en) | 2006-03-01 |
| US20060131274A1 (en) | 2006-06-22 |
| EP1586099A1 (en) | 2005-10-19 |
| WO2004068508A1 (en) | 2004-08-12 |
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