EP1584104A4 - RECRYSTALLIZATION OF SEMICONDUCTOR SUPERFICIAL FILMS BY AMAS ENERGETIC IRRADIATION - Google Patents
RECRYSTALLIZATION OF SEMICONDUCTOR SUPERFICIAL FILMS BY AMAS ENERGETIC IRRADIATIONInfo
- Publication number
- EP1584104A4 EP1584104A4 EP03799903A EP03799903A EP1584104A4 EP 1584104 A4 EP1584104 A4 EP 1584104A4 EP 03799903 A EP03799903 A EP 03799903A EP 03799903 A EP03799903 A EP 03799903A EP 1584104 A4 EP1584104 A4 EP 1584104A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- amas
- recrystallization
- energetic irradiation
- semiconductor
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0812—Ionized cluster beam [ICB] sources
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43386602P | 2002-12-12 | 2002-12-12 | |
| US433866P | 2002-12-12 | ||
| PCT/US2003/039754 WO2004053945A2 (en) | 2002-12-12 | 2003-12-12 | Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1584104A2 EP1584104A2 (en) | 2005-10-12 |
| EP1584104A4 true EP1584104A4 (en) | 2010-05-26 |
Family
ID=32508036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03799903A Withdrawn EP1584104A4 (en) | 2002-12-12 | 2003-12-12 | RECRYSTALLIZATION OF SEMICONDUCTOR SUPERFICIAL FILMS BY AMAS ENERGETIC IRRADIATION |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1584104A4 (en) |
| JP (1) | JP2006510196A (en) |
| AU (1) | AU2003299614A1 (en) |
| WO (1) | WO2004053945A2 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7410890B2 (en) | 2002-12-12 | 2008-08-12 | Tel Epion Inc. | Formation of doped regions and/or ultra-shallow junctions in semiconductor materials by gas-cluster ion irradiation |
| WO2005079318A2 (en) | 2004-02-14 | 2005-09-01 | Epion Corporation | Methods of forming doped and un-doped strained semiconductor and semiconductor films by gas-cluster ion irradiation |
| JP2008502150A (en) | 2004-06-03 | 2008-01-24 | エピオン コーポレーション | Improved dual damascene integrated structure and method of manufacturing the same |
| US7514725B2 (en) | 2004-11-30 | 2009-04-07 | Spire Corporation | Nanophotovoltaic devices |
| EP1787321A4 (en) * | 2004-12-03 | 2008-12-03 | Tel Epion Inc | FORMATION OF ULTRA-THIN JUNCTIONS BY IRRADIATION WITH IONS OF GASEOUS AGGREGATES |
| TWI476292B (en) | 2005-08-30 | 2015-03-11 | 尖端科技材料股份有限公司 | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
| US20070178678A1 (en) * | 2006-01-28 | 2007-08-02 | Varian Semiconductor Equipment Associates, Inc. | Methods of implanting ions and ion sources used for same |
| US7566888B2 (en) | 2007-05-23 | 2009-07-28 | Tel Epion Inc. | Method and system for treating an interior surface of a workpiece using a charged particle beam |
| US20110021011A1 (en) | 2009-07-23 | 2011-01-27 | Advanced Technology Materials, Inc. | Carbon materials for carbon implantation |
| US8062965B2 (en) | 2009-10-27 | 2011-11-22 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8138071B2 (en) | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| TWI386983B (en) | 2010-02-26 | 2013-02-21 | 尖端科技材料股份有限公司 | Method and apparatus for enhancing the lifetime and performance of an ion source in an ion implantation system |
| US8779383B2 (en) | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
| CN103201824B (en) | 2010-08-30 | 2016-09-07 | 恩特格里斯公司 | Preparation of compounds or intermediates thereof from solid materials and devices and methods for using the compounds and intermediates |
| JP5318137B2 (en) * | 2011-03-22 | 2013-10-16 | 株式会社東芝 | Method for producing multilayer film |
| TWI583442B (en) | 2011-10-10 | 2017-05-21 | 恩特葛瑞斯股份有限公司 | B2f4 manufacturing process |
| KR20200098716A (en) | 2012-02-14 | 2020-08-20 | 엔테그리스, 아이엔씨. | Carbon dopant gas and co-flow for implant beam and source life performance improvement |
| SG11201601015RA (en) | 2013-08-16 | 2016-03-30 | Entegris Inc | Silicon implantation in substrates and provision of silicon precursor compositions therefor |
| US9123879B2 (en) | 2013-09-09 | 2015-09-01 | Masahiko Nakayama | Magnetoresistive element and method of manufacturing the same |
| US9368717B2 (en) | 2013-09-10 | 2016-06-14 | Kabushiki Kaisha Toshiba | Magnetoresistive element and method for manufacturing the same |
| US9231196B2 (en) | 2013-09-10 | 2016-01-05 | Kuniaki SUGIURA | Magnetoresistive element and method of manufacturing the same |
| US9385304B2 (en) | 2013-09-10 | 2016-07-05 | Kabushiki Kaisha Toshiba | Magnetic memory and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56115527A (en) * | 1980-02-15 | 1981-09-10 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
| US4370176A (en) * | 1980-02-01 | 1983-01-25 | Commissariat A L'energie Atomique | Process for fast droping of semiconductors |
| WO2002052608A2 (en) * | 2000-12-26 | 2002-07-04 | Epion Corporation | Charging control and dosimetry system for gas cluster ion beam |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53109475A (en) * | 1977-03-07 | 1978-09-25 | Hitachi Ltd | Manufacture for semiconductor device |
| JPS58111324A (en) * | 1981-12-25 | 1983-07-02 | Hitachi Ltd | Preparation of semiconductor device |
| JP2662321B2 (en) * | 1991-05-31 | 1997-10-08 | 科学技術振興事業団 | Surface treatment method using ultra-slow cluster ion beam |
| JPH0941138A (en) * | 1995-07-31 | 1997-02-10 | Res Dev Corp Of Japan | Ion implantation method using gas cluster ion beam |
| US6251835B1 (en) * | 1997-05-08 | 2001-06-26 | Epion Corporation | Surface planarization of high temperature superconductors |
| JP2003520393A (en) * | 1999-12-10 | 2003-07-02 | エピオン コーポレイション | Ionizer for gas cluster ion beam formation |
| WO2002006557A1 (en) * | 2000-07-14 | 2002-01-24 | Epion Corporation | Gcib size diagnostics and workpiece processing |
| US6831272B2 (en) * | 2000-07-14 | 2004-12-14 | Epion Corporation | Gas cluster ion beam size diagnostics and workpiece processing |
| KR100445105B1 (en) * | 2001-10-25 | 2004-08-21 | 주식회사 다산 씨.앤드.아이 | Ultra surface smoothing device of ito thin film and method thereof using gas cluster ion beam |
| US20040002202A1 (en) * | 2002-06-26 | 2004-01-01 | Horsky Thomas Neil | Method of manufacturing CMOS devices by the implantation of N- and P-type cluster ions |
-
2003
- 2003-12-12 WO PCT/US2003/039754 patent/WO2004053945A2/en not_active Ceased
- 2003-12-12 AU AU2003299614A patent/AU2003299614A1/en not_active Abandoned
- 2003-12-12 JP JP2004558211A patent/JP2006510196A/en active Pending
- 2003-12-12 EP EP03799903A patent/EP1584104A4/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4370176A (en) * | 1980-02-01 | 1983-01-25 | Commissariat A L'energie Atomique | Process for fast droping of semiconductors |
| JPS56115527A (en) * | 1980-02-15 | 1981-09-10 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
| WO2002052608A2 (en) * | 2000-12-26 | 2002-07-04 | Epion Corporation | Charging control and dosimetry system for gas cluster ion beam |
Non-Patent Citations (3)
| Title |
|---|
| ALLEM L P ET AL: "Gas-cluster ion-beam smoothing of chemo-mechanical-polish processed GaSb(100) substrates", THIRD INTERNATIONAL CONFERENCE ON ALTERNATIVE SUBSTRATE TECHNOLOGY, September 2002 (2002-09-01), Cancun, Mexico * |
| JOURNAL OF ELECTRONIC MATERIALS, WARRENDALE, PA, US, vol. 32, no. 8, 1 August 2003 (2003-08-01), pages 842 - 848, XP009132285, ISSN: 0361-5235 * |
| YAMADA I ET AL: "Materials processing by gas cluster ion beams", MATERIALS SCIENCE AND ENGINEERING R: REPORTS, ELSEVIER SEQUOIA S.A., LAUSANNE, CH LNKD- DOI:10.1016/S0927-796X(01)00034-1, vol. 34, no. 6, 30 October 2001 (2001-10-30), pages 231 - 295, XP004308527, ISSN: 0927-796X * |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003299614A1 (en) | 2004-06-30 |
| EP1584104A2 (en) | 2005-10-12 |
| JP2006510196A (en) | 2006-03-23 |
| WO2004053945A3 (en) | 2005-03-03 |
| WO2004053945A2 (en) | 2004-06-24 |
| AU2003299614A8 (en) | 2004-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
| AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
| 17P | Request for examination filed |
Effective date: 20050905 |
|
| RBV | Designated contracting states (corrected) |
Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
| DAX | Request for extension of the european patent (deleted) | ||
| RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: TEL EPION INC. |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20100427 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/265 20060101ALI20100421BHEP Ipc: H01L 21/324 20060101ALI20100421BHEP Ipc: H01L 21/302 20060101ALI20100421BHEP Ipc: H01L 21/44 20060101ALI20100421BHEP Ipc: H01L 21/26 20060101ALI20100421BHEP Ipc: H01L 21/425 20060101AFI20050804BHEP |
|
| 17Q | First examination report despatched |
Effective date: 20100823 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20110104 |