EP1557476A1 - Niedrig schmelzende Legierung aus Zinn, Wismut und Antimon für heissschmelzbare Elemente von Niedrigspannungssicherungen - Google Patents

Niedrig schmelzende Legierung aus Zinn, Wismut und Antimon für heissschmelzbare Elemente von Niedrigspannungssicherungen Download PDF

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Publication number
EP1557476A1
EP1557476A1 EP04468014A EP04468014A EP1557476A1 EP 1557476 A1 EP1557476 A1 EP 1557476A1 EP 04468014 A EP04468014 A EP 04468014A EP 04468014 A EP04468014 A EP 04468014A EP 1557476 A1 EP1557476 A1 EP 1557476A1
Authority
EP
European Patent Office
Prior art keywords
tin
bismuth
antimony
low melting
low voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04468014A
Other languages
English (en)
French (fr)
Inventor
Ladislav Kosec
Milan Bizjak
Borut Kosec
Viktor Martincic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ETI Elektroelement dd
Original Assignee
ETI Elektroelement dd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SI200400014A external-priority patent/SI21705A/sl
Priority claimed from SI200400015A external-priority patent/SI21706A/sl
Application filed by ETI Elektroelement dd filed Critical ETI Elektroelement dd
Publication of EP1557476A1 publication Critical patent/EP1557476A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material

Definitions

  • the present invention relates to a low melting alloy of tin (Sn), bismuth (Bi) and antimony (Sb), designated as ETI-Sn-Bi-Sb in the continuation, which is ecologically safe, and to its use for fusible elements of low voltage fuses.
  • Low melting alloys are functional components of low voltage high capacity blade-contact fuses.
  • the fusible element representing a vital part of the fuse heats up. If the temperature exceeds the melting point of the low melting alloy, the latter melts and begins to melt the fusible element, which is normally made of copper, silver or new silver, at an exactly defined position. The higher the temperature the faster the melting, which is stopped by the breaking of the fusible element and an interruption of the circuit.
  • the low melting alloys there should be considered their physical-chemical, technological and ecological properties as well as economy. By taking all of them into account, the possibilities if choosing the alloy are relatively limited. It has turned out that the most suitable are tin-base alloys with chosen appropriate major alloying elements and a possible addition of minor alloying elements for the correction and optimization of the properties of the alloy.
  • each fusible element normally made of pure copper of very narrow tolerances (up to ⁇ 0.003 mm) and with a conductivity of 58.8 x 10 6 S/m, there is applied, at an exactly defined position, a layer of a solder made of a tin(Sn)-cadmium(Cd)-alloy and a few millimetres wide.
  • This alloy is very important for a correct action of the fuse since by a correct proportion of the two elements it is achieved that at a defined overload current the fuse interrupts the circuit within the prescribed time and thus protects the installation and the user (transformer, engine,...) from being destroyed.
  • cadmium (Cd) is an element, which, already in small amounts, is very toxic to natural substances and living beings. In EU countries the legislation forbids the production, processing and use of cadmium (Cd). By 2008 at the latest, all articles (colours, batteries) containing cadmium (Cd) will either have to be withdrawn from sale or an appropriate substitute for this heavy metal will have to be found.
  • Alloys that do not contain ecologically harmful elements like Cd and Pb e.g. combinations Zn-Ag-Bi-Cu and Zn-In-Al, are used as well, yet due to their technical and physical properties such as melting point, wettability etc., they are limited only to certain uses.
  • EP 1 189 252 Al there are described solders from tin(Sn)-base alloys in combination with bismuth (Bi), copper (Cu) and indium (In), which, however, are economically doubtful due to the high price of indium.
  • the present technology of production of fuses and the action thereof are adapted to the existing ecologically harmful alloy of tin (Sn) and cadmium (Cd) SnCd20, which ought to be replaced by one or more ecologically safe alloys with technological and application properties as similar as possible to the existing ones.
  • the ecologically safe low melting alloy of tin (Sn), bismuth (Bi) and antimony (Sb) ETI-Sn-Bi-Sb of the present invention by its technical and technological as well as physical properties entirely replaces the existing harmful alloys of tin (Sn) and cadmium (Cd) for fusible elements of low voltage fuses.
  • the first object of the present invention is the low melting alloy of tin (Sn), bismuth (Bi) and antimony (Sb) ETI-Sn-Bi-Sb containing from 4.0 % to 17.0 % by weight of bismuth (Bi) and from 1.0 % to 3.0 % by weight of antimony (Sb), the rest being tin (Sn).
  • the above-disclosed low melting alloy is produced in the form of definite or infinite wire of a round or square longitudinal section of dimensions (diameter or side length) from 0.5 mm to 3.0 mm.
  • the second object of the invention is the above-disclosed low melting alloy in the form of definite or infinite wire of round or square longitudinal section of dimensions (diameter or side length) from 0.5 mm to 3.0 mm.
  • the third object of the invention is the use of the above-disclosed low melting alloy for fusible elements of low voltage fuses.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fuses (AREA)
EP04468014A 2004-01-15 2004-08-27 Niedrig schmelzende Legierung aus Zinn, Wismut und Antimon für heissschmelzbare Elemente von Niedrigspannungssicherungen Withdrawn EP1557476A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
SI200400014A SI21705A (sl) 2004-01-15 2004-01-15 Nizkotaljiva zlitina kositra, bizmuta in antimona za talilne elemente nizkonapetostnih varovalk
SI200400015 2004-01-15
SI200400015A SI21706A (sl) 2004-01-15 2004-01-15 Nizkotaljiva zlitina kositra, bizmuta in antimona za talilne elemente nizkonapetostnih varovalk
SI200400014 2004-01-15

Publications (1)

Publication Number Publication Date
EP1557476A1 true EP1557476A1 (de) 2005-07-27

Family

ID=34635774

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04468014A Withdrawn EP1557476A1 (de) 2004-01-15 2004-08-27 Niedrig schmelzende Legierung aus Zinn, Wismut und Antimon für heissschmelzbare Elemente von Niedrigspannungssicherungen

Country Status (2)

Country Link
EP (1) EP1557476A1 (de)
RS (1) RS75404A (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11323465A (ja) * 1998-05-11 1999-11-26 Katsura Kogyosho:Kk 歯科印象採得トレー用合金
EP1189252A1 (de) * 2000-09-13 2002-03-20 Siemens Aktiengesellschaft Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
US20020155024A1 (en) * 2000-10-27 2002-10-24 H-Technologies Group, Inc. Lead-free solder compositions
EP1381066A2 (de) * 2002-07-11 2004-01-14 Uchihashi Estec Co., Ltd. Thermische Legierungsschmelzsicherung und Draht für ein Sicherungselement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11323465A (ja) * 1998-05-11 1999-11-26 Katsura Kogyosho:Kk 歯科印象採得トレー用合金
EP1189252A1 (de) * 2000-09-13 2002-03-20 Siemens Aktiengesellschaft Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
US20020155024A1 (en) * 2000-10-27 2002-10-24 H-Technologies Group, Inc. Lead-free solder compositions
EP1381066A2 (de) * 2002-07-11 2004-01-14 Uchihashi Estec Co., Ltd. Thermische Legierungsschmelzsicherung und Draht für ein Sicherungselement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29) *

Also Published As

Publication number Publication date
RS75404A (en) 2006-12-15

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