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EP1525630A2 - Electronic component comprising predominantly organic functional materials and method for the production thereof - Google Patents

Electronic component comprising predominantly organic functional materials and method for the production thereof

Info

Publication number
EP1525630A2
EP1525630A2 EP20030787642 EP03787642A EP1525630A2 EP 1525630 A2 EP1525630 A2 EP 1525630A2 EP 20030787642 EP20030787642 EP 20030787642 EP 03787642 A EP03787642 A EP 03787642A EP 1525630 A2 EP1525630 A2 EP 1525630A2
Authority
EP
Grant status
Application
Patent type
Prior art keywords
layer
functional
material
via
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20030787642
Other languages
German (de)
French (fr)
Inventor
Adolf Bernds
Wolfgang Clemens
Alexander Friedrich Knobloch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0021Formation of conductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0032Selection of organic semiconducting materials, e.g. organic light sensitive or organic light emitting materials
    • H01L51/0034Organic polymers or oligomers
    • H01L51/0035Organic polymers or oligomers comprising aromatic, heteroaromatic, or arrylic chains, e.g. polyaniline, polyphenylene, polyphenylene vinylene
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0032Selection of organic semiconducting materials, e.g. organic light sensitive or organic light emitting materials
    • H01L51/0034Organic polymers or oligomers
    • H01L51/0035Organic polymers or oligomers comprising aromatic, heteroaromatic, or arrylic chains, e.g. polyaniline, polyphenylene, polyphenylene vinylene
    • H01L51/0036Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H01L51/0037Polyethylene dioxythiophene [PEDOT] and derivatives

Abstract

The invention relates to an electronic component made of predominantly organic functional materials having improved through-plating. The through-plating is provided in the form of a free-standing elevation prior to application of the insulating layer.

Description

description

Electronic component with predominantly organic functional materials and manufacturing method thereof

The invention relates to an electronic component with predominantly organic functional materials with improved via.

There are components eg from GR2001P03239; 2001P20024 known in the so-called "plastic electronics *. Thus, the new, not the traditional known semiconducting materials on silicon-based electronic foot of substantially organic materials, in particular Schich- th of organic plastic materials (plastics) meant. With the system for producing vias (vias formation) of the polymer electronics conductive connections between layers are made possible in different component levels. Here, a via penetrating one or more insulating or semiconducting interlayers, so-called "middle functional layers *. These vias are essential for the production of logic efficient, integrated circuits.'They can be produced both with a printing technique, as well as in the conventional way by means of optical Li thographie. By a printing process, this process step can be integrated into mass production, which is essential especially in the production of low-cost articles.

In the production of these electronic components predominantly organic material is deposited over thin film processes. Because the thin films have a high sensitivity to mechanical stress and / or chemical solvents, high demands are made on the processes for forming the vias. These high standards are reflected, of course, reflected in the cost of production. So far vias are made on the finished thin layers, with the risk that the thin layers damage, very serious one because the functionality of the overall structure is in question, as soon as one of the functional layers is damaged.

The object of the invention is therefore to provide a mass production-compatible process for producing at least one via hole, carrying the properties of the sensitive thin layers of organic material charged. In addition, it is an object of the invention to provide an electronic component which has at least one via, which was applied prior to the insulating layer.

The invention is, therefore, an electronic component with predominantly organic function layers, which has at least a via whose cross-sectional profile is so characteristic that can be recognized by the fact that at least one lower layer was treated locally before applying at least one central functional layer. The invention additionally relates to a process for the preparation of at least one plated-through hole of an electronic component of predominantly organic material in which the via is formed before the application of the insulating layer.

So far Vias are always formed by the fact that holes are made subsequently in existing layers by drilling, etching or conventional methods of non-crosslinking such as lithography, etc., are filled the via the then conductive material for educational fertil. In this case, usually, a constant cross section of the via hole is formed, which is characteristic and easy to recognize on the finished product by means of a cross-sectional profile results.

With the first method proposed here, the via (vias) on the substrate, the conductive and / or semiconductive layer, in any case before the durchzukontak- animal ends, so usually the insulating deposit layer, vias are created which, at least according to some embodiments have a cross sectional profile which tapers from bottom to top, similar to a truncated cone. The contours of the vias typically have a typical shape for the method of production, such as printing. The following durchzukontaktierenden layers adapt to the vias around this largely shape. The contour shape is, for example, in one embodiment - viewed microscopically - not sharply drawn and / or even jagged, whereas the contours of conventional, commercially available by subsequent drilling vias typically have sharp contours.

The vias are formed according to an embodiment in the form of free-standing elevations. The via is done here with only application of the thin and / or insulating layer. It is advantageous if the surface of the vias is rough for later contact with the upper circuit. If it is in (n) the insulating layer (s) is (a) thin (n) film (e), the vias are created automatically in the sequence, because the film of organic material to the Durchkontaktierungspunkten, even if the survey does not the whole thickness of the layer is high, breaks. By the so-generated holes in the insulating film, an electrical connection between the various levels of an electronic component can be produced. Either the holes can be only subsequently filled with a conductive metal dium, or applied first vias are conductive.

In the event that this is not a thin film that breaks independently, can be achieved by targeted mechanical treatment see make a breakthrough to the Durchkontaktierungs-. In any case, an insulating layer according to the invention, the vias before the intermediate functional layer, that is usually applied, and thus the photosensitive preferably structured layers by the process of the via spared.

The term "organic material" -or "function material" or λ (functional) polymer "as used herein encompasses all types of organic, organometallic and / or organic-inorganic polymers (hybrids), particularly those in English, for example, denoted by" plastics " . are These are all kinds of materials except of the semiconductor, which is the classical transistors form (germanium, silicon), and the typical metallic conductors. A limitation in the dogmatic sense to organic material as a carbon-containing material, therefore, is not provided, rather is the broad use of eg silicones thought. Furthermore, the term to any limitation on the molecular size, particularly to polymeric and / or oligomeric re materials subject, but it is certainly also the use of "small molecules" possible. the word component "polymer" in the functional polymer is historically derived and makes no statement about there s presence of an actually polymeric compound.

In the following, embodiments of the invention will be explained in more detail yet with reference to figures which, for the purposes of a better clarification show exaggerated exemplary cross-sectional profiles.

1 shows a carrier substrate (such as a PET film) 1 with the corresponding lower conductor tracks 2 (eg, gold, poly-aniline, PEDOT, carbon black, graphite, conductive silver).

Figure 2 shows to the structure of Figure 1, the free-standing

Via 3, which was applied to a bottom strip conductor and / or layer. 2 The through 3 has been applied lithographically for example by a printing technique and / or. Any production method that produces such a plated-through hole 3 on a lower layer 2, is also conceivable. The via 3 comprises, for example polyaniline, PEDOT, carbon black, graphite, conductive silver. but it can be created from a different conductive or non-conductive material. The shape of these via hole 3 can, for example turmföri-iig to be tapered shape having from bottom to top. The surface can have a certain roughness, which supports the later contacting. Since the substrate 1 and the conductor track (s) 2 usually have a high mechanical stability, a Massenferti- can be used without any problems supply process for the preparation of the via. 3

Figure 3 again shows the same structure in a different process stage, where two additional layers 4 and 5 are already applied which may consist of semiconducting or insulating material. As semiconductors, for example, out of the question: polyalkylene kylthiophen or polyfluorene, as an insulator, for example, polyhydroxy xystyrol, poly ethyl methacrylate or polystyrene. The via 3 pierces because of their size and / or nature the two central functional layers 4.5 and thus forms the desired contact.

In Figure 4 one can see the upper wiring 6 on the known from the other figures construction and it can be seen that through the via 3 is a conductive connection between the lower wiring 2 and the upper. Conductor path 6 is concluded.

In Figure 5 one can see the same layer structure as shown in Figures 1-3, except that in Figure 5, the two functional layers are limited to a layer 4.5. 4 In Figure 6, two of such assemblies are as shown in Figure 5, wherein a construction 180 degrees is rotated so that the respective plated-through holes 3 face each other.

In Figure 7, the two structures are brought into contact with each other, as happens for example in a Laminati- onsprozess. This form both the respective functional layers 4.5 and the respective vias one unit and provide the defined electrical connection. The shape of this resulting via 3, which can be seen in the cross-sectional profile, here is a hyperboloid, so the form of two "head to head * linked truncated cones.

In Figure 8, another way of producing the clocking of Durchkon- shown. a defined impurity 7 was applied to the lower conducting track. 2 This can consist of conductive and insulating material. Furthermore, the defect may be caused by a local chemical or physical treatment. 7 The forming of the via 3 is done by tearing the functional layer (s) 4 at the defect 7 and subsequently filling up the area around the defect around 7 with conductive material of the upper conductor. 6

The impurity 7 causes around them the subsequently applied (n) average functional layer (s) ruptures 4.5 and / or fails due to non-wetting, or in any other way, so that a region around the defect 7 is formed, in which the which is to be contacted by the lower layer 2 in the formation of the upper layer 6 to be contacted freely.

The contacting of the conducting layer 2 with the conductive layer 6 functions in that the exposed portion is larger on the layer 2 and the defect 7. Therefore, the impurity 7 may consist both of conductive and insulating material. The via 3 is thus produced in the manner that the lower conductor layer is not wetted locally in Figure 1 2, when applying the semiconductor and insulator layer. Ie be aware generates holes in the durchzukon- lactating layers at the site of vias. The actual via hole 3 then takes place by filling these holes with conductive material of the upper conductor 6. This can be accomplished automatically upon application of the gate level.

The local non-wetting can also take place so that is deliberately generated interference there, on tearing open the film, thus forming a hole. The disorder can be a - by printing - be applied material, the natural form of the material (particles) or in the form produced (peak) process the product supports of tearing. A further possibility for the local non-wetting includes that there the physical / chemical properties of the surface are changed. The Altered physical / chemical properties may for example be an increased surface energy, making it a no vornher- comes from wetting this point, which again has the same effect, namely the hole formation. The increased surface energy is possible, for example by printing a chemical solution (solvent, acid, base, a reactive compound), followed by removal and / or self-constant evaporation.

A physical (local) treatment of the lower functional layer can be done by roughening, laser irradiation, plasma treatment (for example corona), UV radiation, IR radiation and / or thermal treatment.

Further, it is possible locally, for example, a material (paint, wax ...) apply, has the non-wetting properties or prevents the wetting (compared to the above interference filters). This material can be removed before or after application of the intermediate layers, thus forming a hole in the outer layer is present at the location of the via, which is then filled with the conductive upper layer.

In the embodiment, the via as an elevation with conductive or non-conductive material, both the tip of the survey may be pierced through the functional layer "* and shorter than the thickness of the functional layer, so a simple survey, which does not pass through the functional layer. In which, on the formation of the vias folic constricting, the printing process of the gate electrode, the conductive components (upper and lower layer / conductor 2 and 6) are brought into contact by pressure anyway, because the intermediate layers are comparatively thin 4.5.

The fast processing speeds of a mass production process, a mechanical stress on the printing material is extremely critical and should always be avoided if possible. Direct manipulation of the insulating layer would cause uncontrollable defects. The described herein possibility of producing the vias integrating the via is the first time allows in a mass production process.

Claims

claims
1. An electronic component with predominantly organic function layers, which has at least one via (3) whose cross-sectional profile (Figures 1 to 8) is so characteristic that can be recognized by the fact that, prior to applying at least one central functional layer (4,5) at least one lower functional layer (2) was treated locally.
2. The electronic component according to claim 1, wherein the cross-sectional profile as shown via (3) a free-standing elevation of electrically conductive or non-conductive material.
3. The electronic component according to claim 2, wherein the conductive material is polyaniline, PEDOT, carbon black, graphite, conductive silver and / or metal and / or a mixture comprising these.
4. The electronic component of claim 2, wherein the average functional layer (4,5) and / or the non-conductive material, an insulating material such as polyhydroxystyrene, polymethylmethacrylate and / or polystyrene and / or a semiconducting material such as polyalkylthiophene and / or polyfluorene and / or comprising a mixture thereof.
5. The electronic component according to any one of the preceding claims, wherein the surface of the survey as gebilde- th via (3) has a roughness which supports a subsequent contacting.
6. The electronic component of any preceding claim, wherein the cross-sectional profile shows a chemical treatment at least a lower functional layer (2).
7. The electronic component according to any one of the preceding claims, wherein the cross-sectional profile showing a physical treatment of at least one lower functional layer (2).
8. The electronic component according to any one of the preceding claims, wherein the cross-sectional profile of said at least one lower functional layer shows a local defect (7).
9. The electronic component of any preceding claim, wherein the cross-sectional profile showing a previous localized change in the surface energy of the lower functional layer (2), at the networking no loading by a subsequently applied organic material of a following average functional layer (4,5) took place.
is removed 10.Elektronisches component according to one of the preceding claims arrival, in which a locally on the lower functional layer (2) deposited material (7) before or after application of the average functional layer (4,5).
11.Elektronisches component according to one of the preceding claims, in which the component is mounted on a plastic substrate comprising one of the following materials: PET, PP, PEN, polyimide, polyamide and / or coated paper.
12.A method for producing at least one plated-through hole of an electronic component of predominantly organic material in which the via is formed before the application of the insulating layer.
3.The use of a component according to one of claims 1 to 11 for the manufacture of electronic lowest-cost products, such as RFID tags, labels, and / or otherwise.
EP20030787642 2002-07-29 2003-07-09 Electronic component comprising predominantly organic functional materials and method for the production thereof Withdrawn EP1525630A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10234646 2002-07-29
DE10234646 2002-07-29
PCT/DE2003/002303 WO2004017439A3 (en) 2002-07-29 2003-07-09 Electronic component comprising predominantly organic functional materials and method for the production thereof

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Publication Number Publication Date
EP1525630A2 true true EP1525630A2 (en) 2005-04-27

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US (1) US8044517B2 (en)
EP (1) EP1525630A2 (en)
WO (1) WO2004017439A3 (en)

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