EP1508444B1 - Inkjet printer with electrostatically actuated plates - Google Patents
Inkjet printer with electrostatically actuated plates Download PDFInfo
- Publication number
- EP1508444B1 EP1508444B1 EP04024058A EP04024058A EP1508444B1 EP 1508444 B1 EP1508444 B1 EP 1508444B1 EP 04024058 A EP04024058 A EP 04024058A EP 04024058 A EP04024058 A EP 04024058A EP 1508444 B1 EP1508444 B1 EP 1508444B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ink
- nozzle
- actuator
- ink jet
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 56
- 238000004519 manufacturing process Methods 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 45
- 238000010276 construction Methods 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 12
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000009849 deactivation Effects 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 32
- 238000007641 inkjet printing Methods 0.000 abstract description 18
- 230000004913 activation Effects 0.000 abstract description 5
- 239000012530 fluid Substances 0.000 abstract description 5
- 239000000976 ink Substances 0.000 description 284
- 239000010410 layer Substances 0.000 description 38
- 230000007246 mechanism Effects 0.000 description 21
- 238000005516 engineering process Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 18
- 230000008901 benefit Effects 0.000 description 17
- 238000007639 printing Methods 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 14
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 13
- 239000004810 polytetrafluoroethylene Substances 0.000 description 13
- 230000035882 stress Effects 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 239000000049 pigment Substances 0.000 description 10
- 230000009467 reduction Effects 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000000806 elastomer Substances 0.000 description 8
- 230000005684 electric field Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 235000009899 Agrostemma githago Nutrition 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 244000178320 Vaccaria pyramidata Species 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000005686 electrostatic field Effects 0.000 description 6
- 239000012943 hotmelt Substances 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 6
- 230000005499 meniscus Effects 0.000 description 6
- 229910001172 neodymium magnet Inorganic materials 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- -1 styrene-ethylene-butylene-styrene Chemical class 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000003321 amplification Effects 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 229910052746 lanthanum Inorganic materials 0.000 description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 235000021251 pulses Nutrition 0.000 description 3
- 238000007514 turning Methods 0.000 description 3
- 229910003321 CoFe Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910010380 TiNi Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000003115 biocidal effect Effects 0.000 description 2
- 239000003139 biocide Substances 0.000 description 2
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 235000009508 confectionery Nutrition 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003906 humectant Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002715 modification method Methods 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 241001164374 Calyx Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001279 Dy alloy Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910001117 Tb alloy Inorganic materials 0.000 description 1
- 229910001329 Terfenol-D Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 238000007567 mass-production technique Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012899 standard injection Substances 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/44—Typewriters or selective printing mechanisms having dual functions or combined with, or coupled to, apparatus performing other functions
- B41J3/445—Printers integrated in other types of apparatus, e.g. printers integrated in cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17596—Ink pumps, ink valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2002/041—Electromagnetic transducer
Definitions
- the present invention relates to the field of ink jet printing systems.
- Ink jet printers themselves come in many different types.
- the utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein US Patent No. 1941001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.
- US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al )
- Piezo-electric ink jet printers are also one form of commonly utilized ink jet printing device. Piezo-electric systems are disclosed by Kyser et. al. in US Patent No. 3946398 (1970 ) which utilises a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970 ) which discloses a squeeze .mode of operation of a piezo electric crystal, Stemme in US Patent No. 3747120 (1972 ) discloses a bend mode of piezo-electric operation, Howkins in US Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a sheer mode type of piezo-electric transducer element.
- the ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979 ) and Vaught et al in US Patent 4490728 . Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media.
- Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.
- JP6106725 describes an inkjet nozzle comprising a rigid electrode and an opposed elastic electrode. Upon actuation, the elastic electrode deforms towards the rigid electrode by an electrostatic attracting force, causing ejection of an ink droplet from the nozzle.
- a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
- esoteric techniques are also often utilized. These can include electroforming of nickel stage ( Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985) ), etectro-discharge machining, laser ablation ( U.S. Patent No. 5,208,604 ), micro-punching, etc.
- the preferred embodiments and other embodiments will be discussed under separate headings with the heading including an IJ number for ease of reference.
- the headings also include a type designator with T indicating thermal, S indicating shutter type and F indicating a field type.
- a stacked capacitive actuator which has alternative electrode layers sandwiched between a compressible polymer.
- the plates are drawn together compressing the polymer thereby storing energy in the compressed polymer.
- the capacitor is then deactivated or drained with the result that the compressed polymer acts to return the actuator to its original position and thereby causes the ejection of ink corn and ink ejection port.
- the nozzle arrangement 310 includes an ink ejection portal 311 for the ejection of ink on demand.
- the ink is ejected from a nozzle chamber 312 by means of a stacked capacitor-type device 313.
- the stacked capacitor device 313 consists of capacitive plates sandwiched between a compressible polymer. Upon charging of the capacitive plates, the polymer is compressed thereby resulting in a general "accordion" or “concertinaing" of the actuator 313 so that it's top surface moves away from the ink ejection portal 311. The compression of the polymer sandwich stores energy in the compressed polymer.
- the capacitors are subsequently rapidly discharged resulting in the energy in the compressed polymer being released upon the polymer's return to quiescent position.
- the return of the actuator to ifs quiescent position results in the ejection of ink from the nozzle chamber 312.
- the process is illustrated schematically in Fig. 38 to Fig. 41, with Fig. 38 illustrating the nozzle chamber 310 in it's quiescent or idle state, having an ink meniscus 314 around the nozzle ejection portal 311.
- the electrostatic actuator 313 is activated resulting in it's contraction as indicated in Fig. 39.
- the contraction results in the meniscus 314 changing shape as indicated with the resulting surface tension effects resulting in the drawing in of ink around the meniscus and consequently ink 316 flows into nozzle chamber 312.
- the meniscus 314 After sufficient time, the meniscus 314 returns to its quiescent position with the capacitor 313 being loaded ready for firing (Fig. 40).
- the capacitor plates 313 are then rapidly discharged resulting, as illustrated in Fig. 41, in the rapid return of the actuator 313 to it's original position.
- the rapid return imparts a momentum to the ink within the nozzle chamber 312 so as to cause the expansion of the ink meniscus 314 and the subsequent ejection of ink from the nozzle chamber 312.
- the actuator 313 consists of a series of interleaved plates 320, 321 between which is sandwiched a compressive material 322, for example styrene-ethylene-butylene-styrene block co-polymer.
- a compressive material 322 for example styrene-ethylene-butylene-styrene block co-polymer.
- One group of electrodes, e.g. 320, 323, 325 jut out at one side of the stacked capacitor layout.
- a second series of electrodes, e.g. 321, 324 jut out a second side of the capacitive actuator.
- the electrodes are connected at one side to a first conductive material 327 and the other series of electrodes, e.g. 321, 324 are connected to second conductive material 328 (Fig. 37).
- the two conductive materials 327, 328 are electrically isolated from one another and are in turn interconnected to lower signal and drive layers as will become more readily apparent here and
- the stacked capacitor device 313 consists of other thin film materials in place of the example styrene-ethylene-butylene-styrene block co-polymer.
- Such materials may include:
- the electrode actuator 313 can be rapidly constructed utilizing chemical vapor deposition (CVD) techniques.
- the various layers, 320, 321, 322 can be layed down on a planer wafer one after another covering the whole surface of the wafer.
- a stack can be built up rapidly utilizing CVD techniques.
- the two sets of electrodes are preferably deposited utilizing separate metals. For example, aluminum and tantalum could be utilized as materials for the metal layers.
- the utilisation of different metal layers allows for selective etching utilizing a mask layer so as to form the structure as indicated in Fig. 42.
- the CVD sandwich can be first layed down and then a series of selective etchings utilizing appropriate masks can be utilized to produced the overall stacked capacitor structure.
- the utilisation of the CVD process substantially enhances the efficiency of production of the stacked capacitor devices.
- Fig. 43 there is shown an exploded perspective view illustrating the construction of a single ink jet nozzle in accordance with an embodiment.
- the ink jet nozzle arrangement 310 is constructed on a standard silicon wafer 330 on top of which is constructed data drive circuitry which can be constructed in the usual manner such as a two-level metal CMOS layer 331.
- CMOS layer 331 On top of the CMOS layer 331 is constructed a nitride passivation layer 332 which provides passivation protection for the lower layers during operation an also should an etchant be utilized which would normally dissolve the lower layers.
- the various layers of the stacked device 313, for example 320, 321, 322, can be layed down utilizing CVD techniques.
- the stacked device 313 is constructed utilizing the aforementioned production steps including utilizing appropriate masks for selective etchings to produce the overall stacked capacitor structure. Further, interconnection can be provided between the electrodes 327, 328 and the circuitry in the CMOS layer 331.
- a nitride layer 333 is provided so as to form the walls of the nozzle chamber, e.g. 334, and posts, e.g. 335, in one open wall 336 of the nozzle chamber.
- the surface layer 337 of the layer 333 can be deposited onto a sacrifical material. The sacrificial material is subsequently etched so as to form the nozzle chamber 312 (Fig. 37).
- the top layer 337 includes etchant holes, e.g. 338, so as to speed up the etching process in addition to the ink ejection portal 311.
- the diameter of the etchant holes, e.g. 338, is significantly smaller than that of the ink ejection portal 311.
- an additional nitride layer may be provided on top of the layer 320 to protect the stacked device 313 during the etching of the sacrificial material to form the nozzle chamber 312 (Fig. 37) and during operation of the inkjet nozzle.
- the presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- inventions of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable:
- thermal inkjet The most significant problem with thermal inkjet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal inkjet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momemum (and increased surface area) out.
- piezoelectric inkjet The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per print head, but is a major impediment to the fabrication of pagewide print heads with 19,200 nozzles.
- the inkjet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications.
- new inkjet technologies have been created.
- the target features include:
- inkjet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems
- the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing.
- the print head is 100 mm long, with a width which depends upon the inkjet type.
- the smallest print head designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm.
- the print heads each contain 19,200 nozzles plus data and control circuitry.
- Ink is supplied to the back of the print head by injection molded plastic ink channels.
- the molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool.
- Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer.
- the print head is connected to the camera circuitry by tape automated bonding.
- inkjet configurations can readily be derived from these 45 examples by substituting alternative configurations along one or more of the 11 axes.
- Most of the IJ01 to IJ45 examples can be made into inkjet print heads with characteristics superior to any currently available inkjet technology.
- Suitable applications include: Home printers, Office network printers. Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.
- Actuator mechanism (applied only to selected ink drops)
- Actuator Mechanism Description Advantages Disadvantages Examples Thermal bubble An electrothermal heater heats the ink to above bolling point, transferring significant heat to the aqueous ink. A bubble nucleates and quickly forms, expelling the ink. The efficiency of the process is low, with typically less than 0.05% of the electrical energy being transformed into kinetic energy of the drop.
- Perovskite materials such as tin modified lead lanthanum zirconate titanate (PLZSnT) exhibit large strains of up to 1% associated with the AFE to FE phase transition.
- ⁇ Low power consumption ⁇ Many ink types can be used ⁇ Fast operation ( ⁇ 1 ⁇ s) ⁇ Relatively high longitudinal strain ⁇ High efficiency ⁇ Electric field strength of around 3 V/ ⁇ m can be readily provided ⁇ Difficult to Integrate with electronics ⁇ Unusual materials such as PLZSnT are required ⁇ Actuators require a large area ⁇ IJ04 Electrostatic plates Conductive plates are separated by a compressible or fluid dielectric (usually air).
- the conductive plates may be in a comb or honeycomb structure, or stacked to increase the surface area and therefore the force.
- Low power consumption ⁇ Many ink types can be used ⁇ Fast operation ⁇ Difficult to operate etectrostatic devices in an aqueous environment ⁇
- the electrostatic actuator will normally need to be separated from the ink ⁇ Very large area required to achieve high forces ⁇ High voltage drive transistors may be required ⁇ Full pagewidth print heads are not competitive due to actuator size ⁇ IJ02, IJ04 Electrostatic pull on ink A strong electric field is applied to the Ink, whereupon electrostatic attraction accelerates the ink towards the print medium.
- Examples are: Samarium Cobalt (SaCo) and magnetic materials in the neodymium iron boron family (NdFeB, NdDyFeBNb, NdDyFeB, etc) ⁇ Low power consumption ⁇ Many ink types can be used ⁇ Fast operation ⁇ High efficiency ⁇ Easy extension from single nozzles to pagewidth print heads ⁇ Complex fabrication ⁇ Permanent magnetic material such as Neodymium Iron Boron (NdFeB) required.
- SaCo Samarium Cobalt
- NdDyFeBNb neodymium iron boron family
- NdDyFeB neodymium iron boron family
- NdFeB Neodymium Iron Boron
- the actuator should be pre-stressed to approx. 8 MPa.
- Many ink types can be used ⁇ Fast operation ⁇ Easy extension from single nozzles to pagewidth print. heads ⁇ High force is available ⁇ Force acts as a twisting motion ⁇ Unusual materials such as Terfenol-D are required ⁇ High local currents required ⁇ Copper metalization should be used for long electromigration lifetime and low resistivity ⁇ Pre-stressing may be required ⁇ Fischenbeck, USP 4,032,929 ⁇ IJ25 Surface tension reduction Ink under positive pressure is held in a nozzle by surface tension. The surface tension of the ink is reduced below the bubble threshold, causing the ink to egress from the nozzle.
- EUP 572,220 Thermoelastic bend actuator An actuator which relies upon differential thermal expansion upon Joule heating is used. ⁇ Low power consumption ⁇ Many ink types can be used ⁇ Simple planar fabrication ⁇ Small chip area required for each actuator ⁇ Fast operation ⁇ High efficiency ⁇ CMOS compatible voltages and currents ⁇ Standard MEMS processes can be used ⁇ Easy extension from single nozzles to pagewidth print heads ⁇ Efficient aqueous operation requires a thermal insulator on the hot side ⁇ Corrosion prevention can be difficult ⁇ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator ⁇ IJ03, IJ09, IJ 17, IJ18 ⁇ IJ19, IJ20, IJ21, IJ22 ⁇ IJ23, IJ24, IJ27, IJ28 ⁇ IJ29, IJ30, IJ31, IJ32 ⁇ IJ33, IJ34, IJ35, IJ36 ⁇ IJ37, I
- a heater fabricated from a conductive material is incorporated.
- a 50 ⁇ m long PTFE bend actuator with polysilicon heater and 15 mW power input can provide 180 ⁇ N force and 10 ⁇ m deflection.
- Actuator motions include: 1) Bend 2) Push 3) Buckle 4) Rotate ⁇ High force can be generated ⁇ PTFE is a candidate for low dielectric constant insulation in ULSI ⁇ Very low power consumption ⁇ Many ink types can be used ⁇ Simple planar fabrication ⁇ Small chip area required for each actuator ⁇ Fast operation ⁇ High efficiency ⁇ CMOS compatible voltages and currents ⁇ Easy extension from single nozzles to pagewidth print heads ⁇ Requires special material (e.g.
- PTFE Requires a PTFE deposition process, which is not yet standard in ULSI fabs ⁇ PTFE deposition cannot be followed with high temperature (above 350 °C) processing ⁇ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator ⁇ IJ09, IJ17, IJ18, IJ20 ⁇ IJ21, U22, IJ23, IJ24 ⁇ IJ27, IJ28, IJ29, IJ30 ⁇ IJ31, IJ42, IJ43, IJ44 Conductive polymer thermoelastic actuator A polymer with a high coefficient of thermal expansion (such as PTFE) is doped with conducting substances to increase its conductivity to about 3 orders of magnitude below that of copper.
- the conducting polymer expands when resistively heated.
- conducting dopants include: 1) Carbon nanotubes 2) Metal fibers 3) Conductive polymers such as doped polythiophene 4) Carbon granules ⁇ High force can be generated ⁇ Very low power consumption ⁇ Many ink types can be used ⁇ simple planar fabrication ⁇ Small chip area required for each actuator ⁇ Fast operation ⁇ High efficiency ⁇ CMOS compatible voltages and currents and ⁇ Easy extension from single nozzles to pagewidth print heads ⁇ Requires special materials development (High CTE conductive polymer) ⁇ Requires a PTFE deposition process, which is not yet standard in ULSI fabs ⁇ PTFE deposition cannot be followed with high temperature (above 350 °C) processing ⁇ Evaporation and CVD deposition techniques cannot be used ⁇ Pigmented inks may be infeasible, as pigment particles may jam the bend pigment particles may jam the bend actuator ⁇ IJ24 Shape memory alloy A shape memory alloy such as TiNi (also known
- Linear Magnetic Actuator Linear magnetic actuators include the Linear Induction Actuator (LIA), Linear Permanent Magnet Synchronous Actuator (LPMSA), Linear Reluctance Synchronous Actuator (LRSA), Linear Switched Reluctance Actuator (LSRA), and the Linear Step
- Linear Magnetic actuators can be constructed with high thrust, long travel, and high efficiency using planar semiconductor fabrication techniques ⁇ Long actuator travel is available ⁇ Medium force is available ⁇ Low voltage operation ⁇ Requires unusual semiconductor materials such as soft magnetic alloys (e.g. CoNiFe [1]) ⁇ Some varieties also require permanent magnetic materials such as Neodymium iron boron (NdFeB) ⁇ Requires complex multi-phase drive circuitry ⁇ High current operation ⁇ IJ12
- Actuator directly pushes Ink This is the simplest mode of operation: the actuator directly supplies sufficient kinetic energy to expel the drop. The drop must have a sufficient velocity to overcome the surface tension. ⁇ Simple operation.
- Very simple print head fabrication can be used ⁇
- the drop selection means does not need to provide the energy required to separate the drop. from the nozzle ⁇ Requires very high electrostatic field ⁇ Electrostatic field for small nozzle sizes is above air breakdown Electrostatic field may attract dust ⁇ Silverbrook, EP 0771 658 A2 and related patent applications ⁇ Tone-Jet Magnetic pull on ink
- the drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong magnetic field acting on the magnetic ink.
- Very simple print head fabrication can be used ⁇
- the drop selection means does not need to provide the energy required to separate the drop from the nozzle ⁇
- Requires magnetic ink ⁇
- Ink colors other than black are difficult ⁇
- Requires very high magnetic fields ⁇
- Silverbrook, EP 0771 658 A2 and related patent applications Shutter The actuator moves a shutter to block Ink flow to the nozzle.
- the ink pressure is pulsed at a multiple of the drop ejection frequency.
- Actuators with small travel can be used
- Actuators with small force can be used
- High speed (>50 KHz) operation can be achieved
- Moving parts are required
- Requires ink pressure modulator ⁇ Friction and wear must be considered
- Stiction is possible
- Pulsed magnetic pull on ink pusher A pulsed magnetic field attracts an 'ink pusher'at the drop ejection frequency.
- An actuator controls a catch, which prevents the ink pusher from moving when a drop is not to be ejected.
- Extremely low energy operation is possible
- No heat dissipation problems ⁇ Requires an external pulsed magnetic field
- Requires special materials for both the actuator and the ink pusher ⁇ Complex construction ⁇ IJ10
- the ink pressure oscillation may be achieved by vibrating the print head, or preferably by an actuator in the ink supply.
- ⁇ Oscillating ink pressure can provide a refill pulse, allowing higher operating speed
- the actuators may operate with much lower energy
- ⁇ Acoustic lenses can be used to focus the sound on the nozzles
- Requires external ink pressure oscillator ⁇ Ink pressure phase and amplitude must be carefully Controlled ⁇ Acoustic reflections in the ink chamber must be designed for ⁇ Silverbrook, EP 0771658 A2 and related patent applications ⁇ IJOB, IJ13, IJ15, IJ17 ⁇ IJ18, IJ19, IJ21 Media proximity
- the print head is placed in close proximity to the print medium.
- a transfer roller can also be used for proximity drop separation ⁇
- High accuracy ⁇ Wide range of print substrates can be used
- Ink can be dried on the transfer roller ⁇ Bulky ⁇ Expensive ⁇ Complex construction ⁇ Silverbrook, EP 0771658 A2 and related patent applications ⁇ Tektronix hot melt piezoelectric inkjet ⁇ Any of the IJ series Electrostatic An electric field is used to accelerate selected drops towards the print medium.
- Low power ⁇ Simple print head construction ⁇ Field strength required for separation of small drops is near or above air breakdown ⁇ Silverbrook, EP 0771 658 A2 and related patent applications ⁇ Tone-Jet Direct magnetic field A magnetic field is used to accelerate selected drops of magnetic ink towards the print medium.
- the actuator directly drives the drop ejection process.
- Operational simplicity ⁇ Many actuator mechanisms have insufficient travel, or insufficient force, to efficiently drive the drop ejection process ⁇
- Thermal Bubble Inkjet ⁇ IJ01, IJ02, IJ06, IJ07 ⁇ IJ16, IJ25,IJ26
- Differential expansion bend actuator An actuator material expands more on one side than on the other. The expansion may be thermal, piezoelectric, magnetostrictive, or other mechanism.
- the bend actuator converts a high force low travel actuator mechanism to high travel, lower force mechanism.
- the actuator only responds to transient heating of one side or the other ⁇ Very good temperature stability ⁇ High speed, as a new drop can be fired before heat dissipates ⁇ Cancels residual stress of formation ⁇ High stresses are involved ⁇ Care must be taken that the materials do not delaminate ⁇ IJ40, IJ41 Actuator stack A series of thin actuators are stacked. This can be appropriate where actuators require high electric field strength, such as electrostatic and piezoelectric actuators. ⁇ Increased travel ⁇ Reduced drive voltage ⁇ Increased fabrication complexity ⁇ Increased possibility of short circuits due to pinholes ⁇ Some piezoelectric ink jets ⁇ IJ04 Multiple actuators Multiple smaller actuators are used simultaneously to move the ink.
- Each actuator need provide only a portion of the force required. ⁇ Increases the force available from an actuator ⁇ Multiple actuators can be positioned to control ink flow accurately ⁇ Actuator forces may not add linearly, reducing efficiency ⁇ IJ12, IJ13, IJ18, U20 ⁇ IJ22, IJ28, IJ42 IJ43 Linear Spring A linear spring is used to transform a motion with small travel and high force into a longer travel, lower force motion. ⁇ Matches low travel actuator with higher travel requirements ⁇ Non-contact method of motion transformation ⁇ Requires print head area for the spring ⁇ IJ15 Reverse spring The actuator loads a spring. When the actuator is turned off, the spring releases.
- the actuator flexing is effectively converted from an even coiling to an angular bend, resulting in greater travel of the actuator tip.
- Simple means of increasing travel of a bend actuator ⁇ Care must be taken not to exceed the elastic limit in the flexure area ⁇ Stress distribution is very uneven ⁇ Difficult to accurately model with finite element analysis ⁇ IJ10, IJ19, IJ33 Gears Gears can be used to increase travel at the expense of duration. Circular gears, rack and pinion, ratchets, and other gearing methods can be used. ⁇ Low force, low travel actuators.
- IJ13 Catch The actuator controls a small catch. The catch either enables or disables movement of an ink pusher that is controlled in a bulk manner. ⁇ Very low actuator energy ⁇ Very small actuator size ⁇ Complex construction ⁇ Requires external force ⁇ Unsuitable for pigmented inks ⁇ IJ10 Buckle plate.
- a buckle plate can be used to change a slow actuator into a fast motion. It can also convert a high force, low travel actuator into a high travel, medium force motion.
- acoustic lens is used to concentrate sound waves.
- No moving parts Large area required ⁇ Only relevant for acoustic ink jets ⁇ 1993 Hadimioglu et al, EUP 550,192 ⁇ 1993 Elrod et al, EUP 572,220 Sharp conductive point A sharp point is used to concentrate an electrostatic field.
- Simple construction ⁇ Difficult to fabricate using standard VLSI processes for a surface ejecting ink-jet ⁇ Only relevant for electrostatic ink jets ⁇ Tone-jet .
- Actuator motion Description Advantages Disadvantages: Volume expansion The volume of the actuator changes, pushing the ink in all directions. ⁇ Simple construction in the case of thermal inkjet ⁇ High energy is typically required to achieve volume expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations ⁇ Hewlett-Packard Thermal Inkjet ⁇ Canon Bubblejet Linear, normal to chip surface The actuator moves in a direction normal to the print head surface.
- the nozzle is typically in the line of movement, ⁇ Efficient coupling to ink drops ejected normal to the surface ⁇ High fabrication complexity may be required to achieve perpendiculer motion ⁇ IJ01, IJ02, IJ04, IJ07 ⁇ IJ11, IJ14 Linear, parallel to chip surface The actuator moves parallel to the print head surface. Drop ejection may still be normal to the surface. ⁇ Suitable for planar fabrication ⁇ Fabrication complexity ⁇ Friction ⁇ Stiction ⁇ IJ12, IJ13, IJ15, IJ33, ⁇ IJ34, IJ35, IJ36 Membrane push An actuator with a high force but small area is used to push a stiff membrane that is in contact with the ink.
- the effective area of the actuator becomes the membrane area ⁇ Fabrication complexity ⁇ Actuator size ⁇ Difficulty of Integration in a VLSI process ⁇ 1982 Howkins USP 4,459,601 Rotary
- the actuator causes the rotation of some element, such a grill or impeller ⁇
- Rotary levers may be used to increase travel ⁇ Small chip area requirements ⁇
- Device complexity ⁇ May have friction at a pivot point ⁇ IJ05, IJ08, IJ13, IJ28 Bend
- the actuator bends when energized. This may be due to differential thermal expansion, piezoelectric expansion, magnetostriction, or other form of relative dimensional change. ⁇ A very small change in dimensions can be converted to a large motion.
- the actuator ⁇ Requires the actuator to be made from at least two distinct layers, or to have a thermal difference across the actuator ⁇ 1970 Kyser et al 3,946,398 USP ⁇ 1973 Stemme 3,747,120 USP ⁇ IJ03, IJ09, IJ10, IJ19 ⁇ IJ23, IJ24, IJ25, IJ29 ⁇ IJ30, IJ31, IJ33, IJ34 ⁇ IJ35 Swivel
- the actuator swivels around a central pivot. This motion is suitable where there are opposite forces applied to opposite sides of the paddle, e.g. Lorenz force.
- Nozzle refill method Description Advantages Disadvantages Examples Surface tension After the actuator is energized, it typically returns rapidly to its normal position. This rapid return sucks in air through the nozzle opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area.
- a filter is located between the ink inlet and the nozzle chamber.
- the filter has a multitude of small holes or slots, restricting ink flow.
- the filter also removes particles which may block the nozzle.
- ⁇ Additional advantage of ink filtration ⁇ Ink filter may be fabricated with no additional process steps ⁇ Restricts refill rate ⁇ May result in complex construction ⁇ IJ04, IJ12, IJ24, IJ27 ⁇ U29, U30 Small inlet compared to nozzle The ink inlet channel to the nozzle chamber has a substantially smaller cross section than that of the nozzle, resulting in easier ink egress out of the nozzle than out of the inlet. ⁇ Design simplicity ⁇ Restricts refill rate ⁇ May result in a relatively large chip area ⁇ Only partially effective ⁇ IJ02, IJ37, U44 Inlet shutter A secondary actuator controls the position of a shutter, closing off the ink inlet when the main actuator is energized.
- Nozzle Clearing method Description Advantages Disadvantages Examples Normal nozzle firing All of the nozzles are fired periodically, before the ink has a chance to dry. When not in use the nozzles are sealed (capped) against air. The nozzle firing is usually performed during a special clearing cycle, after first moving the print head to a cleaning station.
- the blade is usually fabricated from a flexible polymer, e.g. rubber or synthetic elastomer.
- ⁇ Effective for planar print head surfaces ⁇ Low cost ⁇ Difficult to use if print head surface is non-plonar or very fragile ⁇ Requires mechanical parts ⁇ Blade can wear out in high volume print systems ⁇ Many ink jet systems Separate ink boiling heater A separate heater is provided at the nozzle although the normal drop e-ection mechanism does not require it. The heaters do not require Individual drive circuits, as many nozzles can be cleared simultaneously, and no imaging is required. ⁇ Can be effective where other nozzle clearing methods cannot be used ⁇ Can be implemented at no additional cost in some inkjet configurations ⁇ Fabrication complexity ⁇ Can be used with many U series Ink jets
- Nozzle plate construction Description Advantages Disadvantages Examples Electroformed nickel A nozzle plate is separately fabricated from electroformed nickel, and bonded to the print head chip. ⁇ Fabrication simplicity ⁇ High temperatures and pressures are required to bond nozzle plate ⁇ Minimum thickness constraints ⁇ Differential thermal expansion ⁇ Hewlett Packard Thermal Inkjet Laser ablated or drilled polymer Individual nozzle holes are ablated by an Intense UV laser in a nozzle plate, which is typically a polymer such as polyimide or polysulphone ⁇ No masks required ⁇ Can be quite fast ⁇ Some control over nozzle profile is possible ⁇ Equipment required is relatively low cost ⁇ Each hole must be individually formed ⁇ Special equipment required ⁇ Slow where there are many thousands of nozzles per print head ⁇ May produce thin burrs at exit holes ⁇ Canon Bubblejet ⁇ 1988 Sercel et al., SPIE, Vol.
- Nozzle chambers are etched in the front of the wafer, and the wafer is thinned from the back side. Nozzles are then etched in the etch stop layer.
- High accuracy ( ⁇ 1 ⁇ m) ⁇ Monolithic ⁇ Low cost ⁇ No differential expansion ⁇ Requires long etch times ⁇ Requires a support wafer ⁇ IJ03, IJ05, IJ06, IJ07 ⁇ IJ08, IJ09, IJ10, IJ13 ⁇ IJ14, IJ15, U16, IJ19 ⁇ IJ21, IJ23, IJ25, IJ26
- Various methods have been tried to eliminate the nozzles entirely, to prevent nozzle clogging.
- Suitable for piezoelectric print heads require several thousand connections to drive circuits ⁇ Cannot be manufactured in standard CMOS fabs ⁇ Complex assembly required ⁇ Epson Stylus ⁇ Tektronix hot melt piezoelectric ink jets
- Aqueous, dye Water based ink which typically contains: water, dye, surfactant, humectant, and biocide.
- Modem ink dyes have high water-fastness, light fastness ⁇
- Environmentally friendly ⁇ No odor ⁇ Slow drying ⁇ Corrosive ⁇ Bleeds on paper ⁇ May strikethrough ⁇ Cockles paper ⁇
- Most existing inkjets ⁇ All U series ink jets ⁇ Silverbrook, EP 0771 658 A2 and related patent applications
- Aqueous, pigment Water based ink which typically contains: water, pigment, surfactant, humectant, and biocide. Pigments have an advantage in reduced bleed, wicking and Strikethrough.
- ink jet printers A large number of new forms of ink jet printers have been developed to facilitate alternative ink jet technologies for the image processing and data distribution system. Various combinations of ink jet devices can be included in printer devices incorporated as part of the present invention.
- the present application may utilize advanced semiconductor fabrication techniques in the construction of large arrays of ink jet printers.
- the present application may utilize an ink delivery system to the ink jet head.
- the present application may utilize advanced semiconductor microelectromechanical techniques in the construction of large arrays of ink jet printers.
- the present application may include the utilization of a disposable camera system.
- the present application may include the utilization of a data distribution system.
- the present application may include the utilization of camera and data processing techniques such as an Artcam type device.
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Abstract
Description
- The present invention relates to the field of ink jet printing systems.
- Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.
- In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.
- Many different techniques of ink jet printing have been invented. For a survey of the field. reference is made to an article by J Moore, "Non-Impact Printing: Introduction and Historical Perspective", Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207 - 220 (1988).
- Ink jet printers themselves come in many different types. The utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein
US Patent No. 1941001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing. -
US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see alsoUS Patent No. 3373437 by Sweet et al ) - Piezo-electric ink jet printers are also one form of commonly utilized ink jet printing device. Piezo-electric systems are disclosed by Kyser et. al. in
US Patent No. 3946398 (1970 ) which utilises a diaphragm mode of operation, by Zolten inUS Patent 3683212 (1970 ) which discloses a squeeze .mode of operation of a piezo electric crystal, Stemme inUS Patent No. 3747120 (1972 ) discloses a bend mode of piezo-electric operation, Howkins inUS Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck inUS 4584590 which discloses a sheer mode type of piezo-electric transducer element. - Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by
Endo et al in GB 2007162 (1979 Vaught et al in US Patent 4490728 . Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.JP6106725 - As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
- Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often adds a substantially expense in manufacturing.
- Additionally, side shooting ink jet technologies (
U.S. Patent No. 4,899,181 ) are often used but again, this limit the amount of mass production throughput given any particular capital investment - Additionally, more esoteric techniques are also often utilized. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), etectro-discharge machining, laser ablation (
U.S. Patent No. 5,208,604 ), micro-punching, etc. - The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet print heads and therefore add substantially to their final cost.
- It would therefore be desirable if an efficient efficient system for the mass production of ink jet print heads could be developed.
- It is an object of the present invention to provide for an ink jet printing mechanism having a series of ink ejection nozzles, with the nozzles including an internal selective actuator mechanism activated on a nozzle by nozzle basis by the placement of a field around said nozzles. Accordingly the invention provides an inkjet nozzle according to claim 1. Advantageous embodiments are detailed in the dependent claims.
- Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:
- Fig. 37 is a perspective view through a single ink jet nozzle constructed in accordance with an embodiment of the present invention;
- Fig. 38 is a schematic cross-sectional view of the ink nozzle constructed in accordance with an embodiment of the present invention, with the actuator in its quiescent state;
- Fig. 39 is a schematic cross-sectional view of the ink nozzle immediately after activation of the actuator.
- Fig. 40 is a schematic cross-sectional view illustrating the ink jet nozzle ready for firing;
- Fig. 41 is a schematic cross-sectional view of the ink nozzle immediately after deactivation of the actuator;
- Fig. 42 is a perspective view, in part exploded, of the actuator of a single ink jet nozzle constructed in accordance with an embodiment of the present invention;
- Fig. 43 is an exploded perspective view illustrating the construction of a single inkjet nozzle in accordance with an embodiment of the present invention;
- Fig. 44 provides a legend of the materials indicated in Fig. 45 to Fig. 58; and
- Fig. 45 to Fig. 58 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle.
- The preferred embodiments and other embodiments will be discussed under separate headings with the heading including an IJ number for ease of reference. The headings also include a type designator with T indicating thermal, S indicating shutter type and F indicating a field type.
- In an embodiment, a stacked capacitive actuator is provided which has alternative electrode layers sandwiched between a compressible polymer. Hence, on activation of the stacked capacitor the plates are drawn together compressing the polymer thereby storing energy in the compressed polymer. The capacitor is then deactivated or drained with the result that the compressed polymer acts to return the actuator to its original position and thereby causes the ejection of ink corn and ink ejection port.
- Turning now to Fig. 37, there is illustrated a
single nozzle arrangement 310 as constructed in accordance with an embodiment. Thenozzle arrangement 310 includes anink ejection portal 311 for the ejection of ink on demand. The ink is ejected from anozzle chamber 312 by means of a stacked capacitor-type device 313. In a first design, thestacked capacitor device 313 consists of capacitive plates sandwiched between a compressible polymer. Upon charging of the capacitive plates, the polymer is compressed thereby resulting in a general "accordion" or "concertinaing" of theactuator 313 so that it's top surface moves away from theink ejection portal 311. The compression of the polymer sandwich stores energy in the compressed polymer. The capacitors are subsequently rapidly discharged resulting in the energy in the compressed polymer being released upon the polymer's return to quiescent position. The return of the actuator to ifs quiescent position results in the ejection of ink from thenozzle chamber 312. The process is illustrated schematically in Fig. 38 to Fig. 41, with Fig. 38 illustrating thenozzle chamber 310 in it's quiescent or idle state, having anink meniscus 314 around thenozzle ejection portal 311. Subsequently, theelectrostatic actuator 313 is activated resulting in it's contraction as indicated in Fig. 39. The contraction results in themeniscus 314 changing shape as indicated with the resulting surface tension effects resulting in the drawing in of ink around the meniscus and consequentlyink 316 flows intonozzle chamber 312. - After sufficient time, the
meniscus 314 returns to its quiescent position with thecapacitor 313 being loaded ready for firing (Fig. 40). Thecapacitor plates 313 are then rapidly discharged resulting, as illustrated in Fig. 41, in the rapid return of theactuator 313 to it's original position. The rapid return imparts a momentum to the ink within thenozzle chamber 312 so as to cause the expansion of theink meniscus 314 and the subsequent ejection of ink from thenozzle chamber 312. - Turning now to Fig. 42, there is illustrated a perspective view of a portion of the
actuator 313 exploded in part. Theactuator 313 consists of a series of interleavedplates compressive material 322, for example styrene-ethylene-butylene-styrene block co-polymer. One group of electrodes, e.g. 320, 323, 325 jut out at one side of the stacked capacitor layout. A second series of electrodes, e.g. 321, 324 jut out a second side of the capacitive actuator. The electrodes are connected at one side to a firstconductive material 327 and the other series of electrodes, e.g. 321, 324 are connected to second conductive material 328 (Fig. 37). The twoconductive materials - In alternative designs, the stacked
capacitor device 313 consists of other thin film materials in place of the example styrene-ethylene-butylene-styrene block co-polymer. Such materials may include: - 1) Piezo electric materials such as PZT
- 2) Electrostrictive materials such as PLZT
- 3) Materials, that can be electrically switched between a ferro-electric and an anti-ferro-electric phase such as PLZSnT.
- Importantly, the
electrode actuator 313 can be rapidly constructed utilizing chemical vapor deposition (CVD) techniques. The various layers, 320, 321, 322 can be layed down on a planer wafer one after another covering the whole surface of the wafer. A stack can be built up rapidly utilizing CVD techniques. The two sets of electrodes are preferably deposited utilizing separate metals. For example, aluminum and tantalum could be utilized as materials for the metal layers. The utilisation of different metal layers allows for selective etching utilizing a mask layer so as to form the structure as indicated in Fig. 42. For example, the CVD sandwich can be first layed down and then a series of selective etchings utilizing appropriate masks can be utilized to produced the overall stacked capacitor structure. The utilisation of the CVD process substantially enhances the efficiency of production of the stacked capacitor devices. - Turning now to Fig. 43 there is shown an exploded perspective view illustrating the construction of a single ink jet nozzle in accordance with an embodiment. The ink
jet nozzle arrangement 310 is constructed on astandard silicon wafer 330 on top of which is constructed data drive circuitry which can be constructed in the usual manner such as a two-levelmetal CMOS layer 331. On top of theCMOS layer 331 is constructed anitride passivation layer 332 which provides passivation protection for the lower layers during operation an also should an etchant be utilized which would normally dissolve the lower layers. The various layers of thestacked device 313, for example 320, 321, 322, can be layed down utilizing CVD techniques. Thestacked device 313 is constructed utilizing the aforementioned production steps including utilizing appropriate masks for selective etchings to produce the overall stacked capacitor structure. Further, interconnection can be provided between theelectrodes CMOS layer 331. Finally, anitride layer 333 is provided so as to form the walls of the nozzle chamber, e.g. 334, and posts, e.g. 335, in oneopen wall 336 of the nozzle chamber. Thesurface layer 337 of thelayer 333 can be deposited onto a sacrifical material. The sacrificial material is subsequently etched so as to form the nozzle chamber 312 (Fig. 37). To this end, thetop layer 337 includes etchant holes, e.g. 338, so as to speed up the etching process in addition to theink ejection portal 311. The diameter of the etchant holes, e.g. 338, is significantly smaller than that of theink ejection portal 311. If required an additional nitride layer may be provided on top of thelayer 320 to protect thestacked device 313 during the etching of the sacrificial material to form the nozzle chamber 312 (Fig. 37) and during operation of the inkjet nozzle. - One form of detailed manufacturing process which can be used to fabricate monolithic ink jet print heads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
- 1. Using a double sided polished wafer, complete a 0.5 micron, one poly, 2 metal CMOS process. This step is shown in Fig. 45. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. Fig. 44 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced inkjet configurations.
- 2. Etch the CMOS oxide layers to second level metal using Mask 1. This mask defines the contact vias from the electrostatic stack to the drive circuitry.
- 3. Deposit 0.1 microns of aluminum.
- 4. Deposit 0.1 microns of elastomer.
- 5. Deposit 0.1 microns of tantalum.
- 6. Deposit 0.1 microns of elastomer.
- 7. Repeat steps 2 to 5 twenty times to create a stack of alternating metal and elastomer which is 8 microns high, with 40 metal layers and 40 elastomer layers. This step is shown in Fig. 46.
- 8. Etch the
stack using Mask 2. This leaves a separate rectangular multi-layer stack for each nozzle. This step is shown in Fig. 47. - 9. Spin on resist, expose with Mask 3, and develop. This mask defines one side of the stack. This step is shown in Fig. 48.
- 10. Etch the exposed elastomer layers to a horizontal depth of 1 micron.
- 11. Wet etch the exposed aluminum layers to a horizontal depth of 3 microns.
- 12. Foam the exposed elastomer layers by 50 nm to close the 0.1 micron gap left by the etched aluminum.
- 13. Strip the resist. This step is shown in Fig. 49.
- 14. Spin on resist, expose with Mask 4, and develop. This mask defines the opposite side of the stack. This step is shown in Fig. 50.
- 15. Etch the exposed elastomer layers to a horizontal depth of 1 micron.
- 16. Wet etch the exposed tantalum layers to a horizontal depth of 3 microns.
- 17. Foam the exposed elastomer layers by 50 nm to close the 0.1 micron gap left by the etched aluminum.
- 18. Strip the resist. This step is shown in Fig. 51.
- 19. Deposit 1.5 microns of tantalum. This metal contacts all of the aluminum layers on one side of the stack, and all of the tantalum layers on the other side of the stack
- 20. Etch the tantalum using Mask 5. This mask defines the electrodes at both edges of the stack. This step is shown in Fig. 52.
- 21. Deposit 18 microns of sacrificial material (e.g. photosensitive polyimide).
- 22. Expose and develop the sacrificial
layer using Mask 6 using a proximity aligner. This mask defines the nozzle chamber walls and inlet filter. This step is shown in Fig. 53. - 23. Deposit 3 microns ofPECVD glass.
- 24. Etch to a depth of 1 micron using Mask 7. This mask defines the nozzle rim. This step is shown in Fig. 54. _
- 25. Etch down to the sacrificial layer using Mask 8. This mask defines the roof of the nozzle chamber, and the nozzle itself. This step is shown in Fig. 55.
- 26. Back-etch completely through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 9. This mask defines the ink inlets which are etched through the wafer. The wafer is also diced by this etch. This step is shown in Fig. 56.
- 27. Back-etch through the CMOS oxide layer through the holes in the wafer.
- 28. Etch the sacrificial material. The nozzle chambers are cleared, and the chips are separated by this etch. This step is shown in Fig. 57.
- 29. Mount the print heads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets at the back of the wafer.
- 30. Connect the print heads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.
- 31. Hydrophobize the front surface of the print heads.
- 32. Fill the completed print heads with ink and test them. A filled nozzle is shown in Fig. 58.
- The presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable:
- The most significant problem with thermal inkjet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal inkjet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momemum (and increased surface area) out.
- The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per print head, but is a major impediment to the fabrication of pagewide print heads with 19,200 nozzles.
- Ideally, the inkjet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new inkjet technologies have been created. The target features include:
- low power (less than 10 Watts)
- high resolution capability (1,600 dpi or more)
- photographic quality output
- low manufacturing cost
- small size (pagewidth times minimum cross section)
- high speed (< 2 seconds per page).
- All of these features can be met or exceeded by the inkjet systems described below with differing levels of difficulty. 45 different inkjet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table below.
- The inkjet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems
- For ease of manufacture using standard process equipment, the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the print head is 100 mm long, with a width which depends upon the inkjet type. The smallest print head designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The print heads each contain 19,200 nozzles plus data and control circuitry.
- Ink is supplied to the back of the print head by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The print head is connected to the camera circuitry by tape automated bonding.
- The following table is a guide to cross-referenced patent applications filed concurrently herewith and discussed hereinafter with the reference being utilized in subsequent tables when referring to a particular case:
Docket No. Reference Title IJ01US IJ01 Radiant Plunger Ink Jet Printer IJ02US U02 Electrostatic Ink Jet Printer IJ03US IJ03 Planar Thermoelastic Bend Actuator Ink Jet U04US U04 Stacked ElectroStatic Ink Jet Printer IJ05US IJ05 Reverse Spring Lever Ink Jet Printer U06US IJ06 Paddle Type Ink Jet Printer IJ07US U07 Permanent Magnet Electromagnetic Ink Jet Printer IJ08US IJ08 Planar Swing Grill Electromagnetic Ink Jet Printer IJ09US IJ09 Pump Action Refill Ink Jet Printer IJ10US IJ10 Pulsed Magnetic Field Ink Jet Printer IJ11US IJ11 Two Plate Reserve Firing Electromagnetic Ink JET Printer IJ12US IJ12 Linear Stepper Actuator Ink Jet Printer IJ13US IJ13 Gear Driven Shutter Ink Jet Printer IJ14US IJ14 Tapered Magnetic Pole Electromagnetic Ink Jet Printer IJ15US IJ15 Linear Spring Electromagnetic Grill Ink Jet Printer IJ16US IJ16 Lorenz Diaphragm Electromagnetic Ink Jet Printer IJ17US IJ17 PTFE Surface Shooting Shuttered Oscillating Pressure Ink Jet Printer IJ18US IJ18 Buckle Grip Oscillating Pressure Ink Jet Printer IJ19US IJ19 Shutter Based Ink Jet Printer IJ20US U20 Curling Calyx Thermoelastic lnk Jet Printer IJ21US IJ21 Thermal Actuated Ink Jet Printer U22US U22 Iris Motion Ink Jet Printer IJ23US IJ23 Direct Firing Thermal Bend Actuator Ink Jet Printer IJ24US U24 Conductive PTFE Ben Activator Vented Ink Jet Printer U25US IJ25 Magnetostrictive Ink Jet Printer U26US IJ26 Shape Memory Alloy Ink Jet Printer U27US IJ27 Buckle Plate Ink Jet Printer IJ28US IJ28 Thermal Elastic Rotary Impeller Ink Jet Printer IJ29US IJ29 Thermoelastic Bend Actuator Ink Jet Printer U30US U30 Thermoelastic Bend Actuator Using PTFE and Corrugated Copper Ink Jet Printer IJ31US IJ31 Bend Actuator Direct Ink Supply Ink Jet Printer IJ32US IJ32 A High Young's Modulus Thermoelastic Ink Jet Printer IJ33US IJ33 Thermally actuated slotted chamber wall ink jet printer U34US U34 Ink Jet Printer having a thermal actuator comprising a external coiled spring U35US IJ35 Trough Container Ink Jet Printer IJ36US U36 Dual Chamber Single Vertical Actuator Ink Jet IJ37US IJ37 Dual Nozzle Single Horizontal Fulcrum Actuator Ink Jet IJ38US IJ38 Dual Nozzle Single Horizontal Actuator Ink Jet IJ39US U39 A single bend actuator cupped paddle ink jet printing device IJ40US IJ40 A thermally actuated ink jet printer having a series of thermal actuator units U41US IJ41 A thermally actuated ink jet printer including a tapered heater element IJ42US 1J42 Radial Back-Curling Thermoelastic Ink Jet IJ43US IJ43 Inverted Radial Back-Curling Thermoelastic Ink Jet IJ44US IJ44 Surface bend actuator vented ink supply ink jet printer IJ45US IJ45 Coil Actuated Magnetic Plate Ink Jet Printer - Eleven important characteristics of the fundamental operation of individual inkjet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.
- The following tables form the axes of an eleven dimensional table of inkjet types.
- Actuator mechanism (18 types)
- Basic operation mode (7 types)
- Auxiliary mechanism (8 types)
- Actuator amplification or modification method (17 types)
- Actuator motion (19 types)
- Nozzle refill method (4 types)
- Method of restricting back-flow through inlet (10 types)
- Nozzle clearing method (9 types)
- Nozzle plate construction (9 types)
- Drop ejection direction (5 types)
- ink type (7 types)
- The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of inkjet nozzle. While not all of the possible combinations result in a viable inkjet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain inkjet types have been investigated in detail. These are designated IJ01 to IJ45 above.
- Other inkjet configurations can readily be derived from these 45 examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into inkjet print heads with characteristics superior to any currently available inkjet technology.
- Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, a printer may be listed more than once in a table, where it shares characteristics with more than one entry.
- Suitable applications include: Home printers, Office network printers. Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.
- The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.
-
Actuator Mechanism Description Advantages Disadvantages Examples Thermal bubble An electrothermal heater heats the ink to above bolling point, transferring significant heat to the aqueous ink. A bubble nucleates and quickly forms, expelling the ink. The efficiency of the process is low, with typically less than 0.05% of the electrical energy being transformed into kinetic energy of the drop. ◆ Large force generated
◆ Simple construction
◆ No moving parts
◆ Fast operation
◆ Small chip area required for actuator◆ High power
◆ Ink carrier limited to water
◆ Low efficiency
◆ High temperatures required
◆ High mechanical stress
◆ Unusual materials required
◆ Cavitation causes actuator failure
◆ Kogation reduces bubble formation
◆ Large print heads are difficult to fabricate◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162
◆ Xerox heater-in-pit 1990 Hawkins et al USP 4,899,181 Vaught et al USP 4,490,728Piezoelectric A piezoelectric crystal such as lead lanthanum zirconate (PZT) is electrically activated, and either expands, shears, or bends to apply pressure to the ink, ejecting drops. ◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation
◆ High efficiency◆ Very large area required for actuator
◆ Difficult to integrate with electronics
◆ High voltage drive transistors required
◆ Full pagewidth print heads impractical due to actuator size
◆ Requires electrical poling in high field. strengths during manufacture◆ Kyser et al USP 3,946,398
◆ Zoltan USP 3,683,212
◆ 1973 Stemme USP 3,747,120
◆ Epson Stylus
◆ Tektronix
◆ IJ04Electro-strictive An electric field is used to activate electrostriction in relaxor materials such as lead lanthanum zirconate titanate (PLZT) or lead magnesium niobate (PMN). ◆ Low power consumption
◆Many ink types can be used
◆ Low thermal expansion
◆ Electric field strength required (approx. 3.5 V/µm) can be generated without difficulty
◆ Does not require electrical poling◆ Low maximum strain (approx. 0.01%)
◆ Large area required for actuator due to low strain
◆ Response speed is marginal (~ 10 µs)
◆ High voltage drive transistors required
◆ Full pagewidth print heads Impractical due to actuator size◆ Seiko Epson, Usui et all JP 253401/96
◆ IJ04Ferroelectric An electric field is used to Induce a phase transition between the antiferroelectric (AFE) and ferroelectric (FE) phase. Perovskite materials such as tin modified lead lanthanum zirconate titanate (PLZSnT) exhibit large strains of up to 1% associated with the AFE to FE phase transition. ◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation (< 1 µs)
◆ Relatively high longitudinal strain
◆ High efficiency
◆ Electric field strength of around 3 V/µm can be readily provided◆ Difficult to Integrate with electronics
◆ Unusual materials such as PLZSnT are required
◆ Actuators require a large area◆ IJ04 Electrostatic plates Conductive plates are separated by a compressible or fluid dielectric (usually air). Upon application of a voltage, the plates attract each other and displace ink, causing drop ejection. The conductive plates may be in a comb or honeycomb structure, or stacked to increase the surface area and therefore the force. ◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation◆ Difficult to operate etectrostatic devices in an aqueous environment
◆ The electrostatic actuator will normally need to be separated from the ink
◆ Very large area required to achieve high forces
◆ High voltage drive transistors may be required
◆ Full pagewidth print heads are not competitive due to actuator size◆ IJ02, IJ04 Electrostatic pull on ink A strong electric field is applied to the Ink, whereupon electrostatic attraction accelerates the ink towards the print medium. ◆ Low current consumption
◆ Low temperature◆High voltage required
◆ May be damaged by sparks due to air breakdown
◆ Required field strength increases as the drop size decreases
◆ High voltage drive transistors required
◆ Electrostatic field attracts dust◆ 1989 Saito et al, USP 4,799,068
◆ 1989 Miura et al, USP 4,810,954
◆ Tone-jetPermanent magnet electromagnetic An electromagnet directly attracts a permanent magnet, displacing ink and causing drop ejection. Rare earth magnets with a field strength around 1 Tesla can be used. Examples are: Samarium Cobalt (SaCo) and magnetic materials in the neodymium iron boron family (NdFeB, NdDyFeBNb, NdDyFeB, etc) ◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation
◆ High efficiency
◆ Easy extension from single nozzles to pagewidth print heads◆ Complex fabrication ◆ Permanent magnetic material such as Neodymium Iron Boron (NdFeB) required.
◆ High local currents required
◆ Copper metalization should be used for long electromigration lifetime and low resistivity
◆ Pigmented inks are usually infeasible
◆ Operating temperature limited to the Curie temperature (around 540 K)◆ IJ07, IJ10 Soft magnetic core electro-magnette A solenoid induced a magnetic field in a soft magnetic core or yoke fabricated from a ferrous material such as electroplated iron alloys such as CoNiFe [1], CoFe, or NiFe alloys. Typically, the soft magnetic material is in two parts, which are normally held apart by a spring. When the solenoid is actuated, the two parts attract, displacing the ink. ◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation
◆ High efficiency
◆ Easy extension from single nozzles to pagewidth print heads
◆Electroplating◆ Complex fabrication
◆ Materials not usually present in a CMOS fab such as NiFe, CoNiFe, or CoFe are required
◆ High local currents required
◆ Copper metalization should be used for long electromigration lifetime and low resistivity is required
◆ High saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [1])◆ IJ01, IJ05, IJ08, IJ10
◆ IJ12, IJ14, IJ15, IJ17Magnetic Lorenz force The Lorenz force acting on a current carrying wire in a magnetic field is utilized. This allows the magnetic field to be supplied externally to the print head, for example with rare earth permanent magnets.
Only the current carrying wire need be fabricated on the print-head, simplifying materials requirements.◆ Low power consumption
◆ Many ink types can be used
◆ Fast operation
◆ High efficiency
◆ Easy extension from single nozzles to pagewidth print heads◆ Force acts as a twisting motion
◆ Typically, only a quarter of the solenoid length provides force in a useful direction
◆ High local currents required
◆ Copper metalization should be used for long electromigration lifetime and low resistivity
◆ Pigmented inks are usually infeasible◆ IJ06, IJ11, IJ13, IJ16 Magneto-striction The actuator uses the giant magnetostrictive effect of materials such as Tedenol-D (an alloy of terbium, dysprosium and iron developed at the Naval Ordnance Laboratory, hence Ter-Fe- NOL). For best efficiency, the actuator should be pre-stressed to approx. 8 MPa. ◆ Many ink types can be used
◆ Fast operation
◆ Easy extension from single nozzles to pagewidth print. heads
◆ High force is available◆ Force acts as a twisting motion
◆ Unusual materials such as Terfenol-D are required
◆ High local currents required
◆ Copper metalization should be used for long electromigration lifetime and low resistivity
◆ Pre-stressing may be required◆ Fischenbeck, USP 4,032,929
◆ IJ25Surface tension reduction Ink under positive pressure is held in a nozzle by surface tension. The surface tension of the ink is reduced below the bubble threshold, causing the ink to egress from the nozzle. ◆ Low power consumption
◆ Simple construction
◆ No unusual materials required in fabrication
◆ High efficiency
◆ Easy extension from single nozzles to pagewidth print heads◆ Requires supplementary force to effect drop separation
◆ Requires special ink surfactants
◆ Speed may be limited by surfactant properties◆ Silverbrook, EP 0771 658 A2 and related patent applicationsViscosity reduction The ink viscosity is locally reduced to select which drops are to be ejected. A viscosity reduction can be achieved electrothermally with most inks, but special inks can be engineered for a 100: 1 viscosity reduction. ◆ Simple construction
◆ No unusual materials required in fabrication
◆ Easy extension from single nozzles to pagewidth print heads◆Requires supplementary force to effect drop separation
◆ Requires special ink viscosity properties
◆ High speed is difficult to achieve
◆ Requires oscillating ink pressure
◆ A high temperature difference (typically 80 degrees) is required◆ Silverbrook, EP 0771 658 A2 and related patent applicationsAcoustic An acoustic wave is generated and focussed upon the drop ejection region. ◆ Can operate without a nozzle plate ◆ Complex drive circuitry
◆ Complex fabrication
◆ Low efficiency
◆ Poor control of drop position
◆ Poor control of drop volume◆ 1993 Hadimioglu et al, EUP 550,192
◆1993 Elrod et al. EUP 572,220 Thermoelastic bend actuator An actuator which relies upon differential thermal expansion upon Joule heating is used. ◆ Low power consumption
◆ Many ink types can be used
◆Simple planar fabrication
◆ Small chip area required for each actuator
◆ Fast operation
◆ High efficiency
◆CMOS compatible voltages and currents
◆ Standard MEMS processes can be used
◆ Easy extension from single nozzles to pagewidth print heads◆ Efficient aqueous operation requires a thermal insulator on the hot side
◆ Corrosion prevention can be difficult
◆Pigmented inks may be infeasible, as pigment particles may jam the bend actuator◆ IJ03, IJ09, IJ 17, IJ18
◆ IJ19, IJ20, IJ21, IJ22
◆ IJ23, IJ24, IJ27, IJ28
◆ IJ29, IJ30, IJ31, IJ32
◆IJ33, IJ34, IJ35, IJ36
◆ IJ37, IJ38 ,IJ39, IJ40
◆ IJ41High CTE thermoelastic actuator A material with a very high coefficient of thermal expansion (CTE) such as polytetrafluoroethylene (PTFE) is used. As high CTE materials are usually non-conductive, a heater fabricated from a conductive material is incorporated. A 50µ m long PTFE bend actuator with polysilicon heater and 15 mW power input can provide 180 µN force and 10 µm deflection. Actuator motions include:
1) Bend
2) Push
3) Buckle
4) Rotate◆ High force can be generated
◆ PTFE is a candidate for low dielectric constant insulation in ULSI
◆ Very low power consumption
◆ Many ink types can be used
◆ Simple planar fabrication
◆ Small chip area required for each actuator
◆ Fast operation
◆ High efficiency
◆ CMOS compatible voltages and currents
◆ Easy extension from single nozzles to pagewidth print heads◆ Requires special material (e.g. PTFE)
◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs
◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing
◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator◆ IJ09, IJ17, IJ18, IJ20
◆ IJ21, U22, IJ23, IJ24
◆ IJ27, IJ28, IJ29, IJ30
◆ IJ31, IJ42, IJ43, IJ44Conductive polymer thermoelastic actuator A polymer with a high coefficient of thermal expansion (such as PTFE) is doped with conducting substances to increase its conductivity to about 3 orders of magnitude below that of copper. The conducting polymer expands when resistively heated. Examples of conducting dopants include:
1) Carbon nanotubes
2) Metal fibers
3) Conductive polymers such as doped polythiophene
4) Carbon granules◆ High force can be generated
◆ Very low power consumption
◆ Many ink types can be used
◆ simple planar fabrication
◆ Small chip area required for each actuator
◆ Fast operation
◆ High efficiency
◆ CMOS compatible voltages and currents and
◆ Easy extension from single nozzles to pagewidth print heads◆ Requires special materials development (High CTE conductive polymer)
◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs
◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing
◆ Evaporation and CVD deposition techniques cannot be used
◆ Pigmented inks may be infeasible, as pigment particles may jam the bend pigment particles may jam the bend actuator◆ IJ24 Shape memory alloy A shape memory alloy such as TiNi (also known as Nitinol-Nickel Titanium alloy developed at the Naval Ordnance Laboratory) is thermally switched between its weak martensitic state and its high stiffness austenic state. The shape of the actuator in its martensitic state is deformed relative to the austenic shape. The shape change causes ejection of a drop. ◆ High force is available (stresses of hundreds of MPa)
◆ Large strain is available (more than 3%)
◆ High corrosion resistance
◆ Simple construction
◆ Easy extension from single nozzles to pagewidth print heads
◆ Low voltage operation◆ Fatigue limits maximum number of cycles
◆ Low strain (1%) is required to extend fatigue resistance
◆ Cycle rate limited by heat removal
◆ Requires unusual materials (TiNi)
◆ The latent heat of transformation must be provided
◆ High current operation
◆ Requires pro-stressing to distort the martensitic state◆ IJ26 Linear Magnetic Actuator Linear magnetic actuators include the Linear Induction Actuator (LIA), Linear Permanent Magnet Synchronous Actuator (LPMSA), Linear Reluctance Synchronous Actuator (LRSA), Linear Switched Reluctance Actuator (LSRA), and the Linear Stepper Actuator (LSA). ◆ Linear Magnetic actuators can be constructed with high thrust, long travel, and high efficiency using planar semiconductor fabrication techniques
◆ Long actuator travel is available
◆ Medium force is available
◆ Low voltage operation◆ Requires unusual semiconductor materials such as soft magnetic alloys (e.g. CoNiFe [1])
◆ Some varieties also require permanent magnetic materials such as Neodymium iron boron (NdFeB)
◆ Requires complex multi-phase drive circuitry
◆ High current operation◆ IJ12 -
Operational mode Description Advantages Disadvantages Examples Actuator directly pushes Ink This is the simplest mode of operation: the actuator directly supplies sufficient kinetic energy to expel the drop. The drop must have a sufficient velocity to overcome the surface tension. ◆ Simple operation.
◆ No external fields required
◆ Satellite drops can be avoided if drop velocity is less than 4 m/s
◆Can be efficient, depending upon the actuator used◆ Drop repetition rate is usually limited to less than 10 KHz However, this is not fundamental to the method, but is related to the refill method normally used
◆All of the drop kinetic energy must be provided by the actuator
◆ Satellite drops usually form if drop velocity is greater than 4.5 m/s◆ Thermal inkjet
◆ Piezoelectric inkjet
◆ IJ01, IJ02, IJ03, IJ04
◆ IJ05, IJ06, IJ07, IJ09
◆ IJ11, IJ12, IJ14, IJ16
◆ 1J20, IJ22, IJ23, IJ24
◆ 1J25, 1J26, 1127, IJ28
◆ IJ25,1J26, IJ27, IJ28
◆ 1J29, IJ30, IJ31, IJ32
◆ IJ33, IJ34, IJ35, IJ36
◆ IJ37, IJ38, IJ39, IJ40
◆ IJ41, IJ42, U43, U44Proximity The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by contact with the print medium or a transfer roller. ◆ Very simple print head fabrication can be used
◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle◆ Requires close proximity between the print head and the print media or transfer roller
◆ May require two print heads printing alternate rows of the image
◆ Monolithic color print heads are difficult◆ Silverbrook, EP 0771 658 A2 and related patent applicationsElectrostatic pull on ink The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong electric field. ◆ Very simple print head fabrication can be used
◆ The drop selection means does not need to provide the energy required to separate the drop. from the nozzle◆ Requires very high electrostatic field
◆ Electrostatic field for small nozzle sizes is above air breakdown Electrostatic field may attract dust◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ Tone-JetMagnetic pull on ink The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong magnetic field acting on the magnetic ink. ◆ Very simple print head fabrication can be used
◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle◆ Requires magnetic ink
◆ Ink colors other than black are difficult
◆ Requires very high magnetic fields◆ Silverbrook, EP 0771 658 A2 and related patent applicationsShutter The actuator moves a shutter to block Ink flow to the nozzle. The ink pressure is pulsed at a multiple of the drop ejection frequency. ◆High speed (>50 KHz) operation can be achieved due to reduced refill time
◆ Drop timing can be very accurate
◆ The actuator energy can be very low◆ Moving parts are required
◆ Requires ink pressure modulator
◆ Friction and wear must be considered
◆ Stiction is possible◆ IJ13, IJ17, IJ21 Shuttered grill The actuator moves a shutter to block ink flow through a grill to the nozzle. The shutter movement need only be equal to the width of the grill holes. ◆ Actuators with small travel can be used
◆ Actuators with small force can be used
◆High speed (>50 KHz) operation can be achieved◆ Moving parts are required
◆ Requires ink pressure modulator
◆ Friction and wear must be considered
◆ Stiction is possible◆ IJ08, IJ15, IJ18, IJ19 Pulsed magnetic pull on ink pusher A pulsed magnetic field attracts an 'ink pusher'at the drop ejection frequency. An actuator controls a catch, which prevents the ink pusher from moving when a drop is not to be ejected. ◆ Extremely low energy operation is possible
◆ No heat dissipation problems◆ Requires an external pulsed magnetic field
◆Requires special materials for both the actuator and the ink pusher
◆ Complex construction◆ IJ10 -
Auxiliary Mechanism Description Advantages Disadvantages Examples None The actuator directly fires the ink drop, and there is no external field or other mechanism required. ◆ Simplicity of construction
◆ Simplicity of operation
◆ Small physical size◆ Drop ejection energy must be supplied by individual nozzle actuator ◆ Most inkjets, including piezoelectric and thermal bubble.
◆ IJ01- IJ07, IJ09, IJ11
◆ IJ12, IJ14, IJ20, IJ22
◆ IJ23-IJ45Oscillating ink pressure (including acoustic stimulation) The ink pressure oscillates, providing much of the drop ejection energy. The actuator selects which drops are to be fired by selectively blocking or enabling nozzles. The ink pressure oscillation may be achieved by vibrating the print head, or preferably by an actuator in the ink supply. ◆ Oscillating ink pressure can provide a refill pulse, allowing higher operating speed
◆ The actuators may operate with much lower energy
◆Acoustic lenses can be used to focus the sound on the nozzles◆ Requires external ink pressure oscillator
◆ Ink pressure phase and amplitude must be carefully Controlled
◆Acoustic reflections in the ink chamber must be designed for◆ Silverbrook, EP 0771658 A2 and related patent applications
◆ IJOB, IJ13, IJ15, IJ17
◆IJ18, IJ19, IJ21Media proximity The print head is placed in close proximity to the print medium. Selected drops protrude from the print head further than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation. ◆ Low power
◆ High accuracy
◆ Simple print head construction◆Precision assembly required
◆ Paper fibers may cause problems
◆ Cannot print on rough substrates◆ Silverbrook, EP 0771658 A2 and related patent applicationsTransfer roller Drops are printed to a transfer roller instead of straight to the print medium. A transfer roller can also be used for proximity drop separation ◆ High accuracy
◆ Wide range of print substrates can be used
◆ Ink can be dried on the transfer roller◆ Bulky
◆ Expensive
◆ Complex construction◆ Silverbrook, EP 0771658 A2 and related patent applications
◆ Tektronix hot melt piezoelectric inkjet
◆ Any of the IJ seriesElectrostatic An electric field is used to accelerate selected drops towards the print medium. ◆ Low power
◆ Simple print head construction◆ Field strength required for separation of small drops is near or above air breakdown ◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ Tone-JetDirect magnetic field A magnetic field is used to accelerate selected drops of magnetic ink towards the print medium. ◆ Low power
◆ Simple print head construction◆ Requires magnetic ink
◆ Requires strong magnetic field◆ Silverbrook, EP 0771658 A2 and related patent applicationsCross magnetic field The print head is placed in a constant magnetic field. The Lorenz force in a current carrying wire is used to move the actuator. ◆ Does not require magnetic materials to be integrated in the print head manufacturing process ◆ Requires external magnet
◆ Current densities may be high, resulting in electromigration problems◆ IJ06, IJ16 Pulsed magnetic field A pulsed magnetic field is used to cyclically attract a paddle, which pushes on the ink. A small actuator moves a catch, which selectively prevents the paddle from moving. ◆ Very low power operation is possible
◆ Small print head size◆ Complex print head construction
◆ Magnetic materials required In print head◆ IJ10 -
Actuator amplification Description Advantages Disadvantages Examples None No actuator mechanical amplification is used. The actuator directly drives the drop ejection process. ◆ Operational simplicity ◆ Many actuator mechanisms have insufficient travel, or insufficient force, to efficiently drive the drop ejection process ◆ Thermal Bubble Inkjet
◆ IJ01, IJ02, IJ06, IJ07
◆ IJ16, IJ25,IJ26Differential expansion bend actuator An actuator material expands more on one side than on the other. The expansion may be thermal, piezoelectric, magnetostrictive, or other mechanism. ◆ Provides greater travel in a reduced print head area
◆ The bend actuator converts a high force low travel actuator mechanism to high travel, lower force mechanism.◆ High stresses are involved
◆ Care must be taken that the materials do not delaminate
◆ Residual bend resulting from high temperature or high stress during formation◆ Piezoelectric.
◆ IJ03, IJ09, IJ17-IJ24
◆ IJ27, IJ29-IJ39, IJ42,
◆ IJ43, IJ44Transient bend actuator A trilayer bend actuator where the two outside layers are identical. This cancels bend due to ambient temperature and residual stress. The actuator only responds to transient heating of one side or the other ◆ Very good temperature stability
◆ High speed, as a new drop can be fired before heat dissipates
◆ Cancels residual stress of formation◆ High stresses are involved
◆ Care must be taken that the materials do not delaminate◆ IJ40, IJ41 Actuator stack A series of thin actuators are stacked. This can be appropriate where actuators require high electric field strength, such as electrostatic and piezoelectric actuators. ◆ Increased travel
◆ Reduced drive voltage◆ Increased fabrication complexity
◆ Increased possibility of short circuits due to pinholes◆ Some piezoelectric ink jets
◆ IJ04Multiple actuators Multiple smaller actuators are used simultaneously to move the ink. Each actuator need provide only a portion of the force required. ◆Increases the force available from an actuator
◆ Multiple actuators can be positioned to control ink flow accurately◆Actuator forces may not add linearly, reducing efficiency ◆ IJ12, IJ13, IJ18, U20
◆ IJ22, IJ28, IJ42 IJ43Linear Spring A linear spring is used to transform a motion with small travel and high force into a longer travel, lower force motion. ◆ Matches low travel actuator with higher travel requirements
◆ Non-contact method of motion transformation◆ Requires print head area for the spring ◆ IJ15 Reverse spring The actuator loads a spring. When the actuator is turned off, the spring releases. This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. ◆ Better coupling to the ink ◆ Fabrication complexity
◆ High stress in the spring◆ IJ05, IJ11 Coiled actuator A bend actuator is coiled to provide greater travel in a reduced chip area. ◆ Increases travel
◆ Reduces chip area
◆ Planar implementations are relatively easy to fabricate◆ Generally restricted to planar implementations due to extreme fabrication difficulty in other orientations. ◆IJ17, IJ21, IJ34, IJ35 Flexure bend actuator A bend actuator has a small region near the fixture point, which flexes much more readily than the remainder of the actuator. The actuator flexing is effectively converted from an even coiling to an angular bend, resulting in greater travel of the actuator tip. ◆ Simple means of increasing travel of a bend actuator ◆ Care must be taken not to exceed the elastic limit in the flexure area
◆ Stress distribution is very uneven
◆ Difficult to accurately model with finite element analysis◆ IJ10, IJ19, IJ33 Gears Gears can be used to increase travel at the expense of duration. Circular gears, rack and pinion, ratchets, and other gearing methods can be used. ◆ Low force, low travel actuators. can be used
◆ Can be fabricated using standard surface MEMS processes◆ Moving parts are required
◆ Several actuator cycles are required More complex drive electronics
◆ Complex construction
◆ Friction, friction, and wear are possible◆ IJ13 Catch The actuator controls a small catch. The catch either enables or disables movement of an ink pusher that is controlled in a bulk manner. ◆ Very low actuator energy
◆ Very small actuator size◆ Complex construction
◆ Requires external force
◆ Unsuitable for pigmented inks◆ IJ10 Buckle plate. A buckle plate can be used to change a slow actuator into a fast motion. It can also convert a high force, low travel actuator into a high travel, medium force motion. ◆ Very fast movement achievable ◆ Must stay within elastic limits of the materials for long device life
◆ High stresses involved
◆ Generally high power◆ S. Hirata et al, «An Ink-jet Head ...", requirement MEMS, Feb. 1996, pp 418- 423 .
◆ IJ18, IJ27Tapered magnetic pole A tapered magnetic pole can increase travel at the expense of force. ◆ Linearizes the magnetic force/distance curve ◆ Complex construction ◆ IJ14 Lever A lever and fulcrum bused to transform a motion with small travel and high force into a motion with longer travel and lower force. The lever can also reverse the direction of travel. ◆ Matches low travel actuator with higher travel requirements
◆ Fulcrum area has no linear movement, and can be used for a fluid seal◆ High stress around the fulcrum ◆ IJ32, IJ36, IJ37 Rotary impeller The actuator is connected to a rotary impeller. A small angular deflection of the actuator results in a rotation of the impeller vanes, which push the ink against stationary vanes and out of the nozzle. ◆ High mechanical advantage
◆ The ratio of force to travel of the actuator can be matched to the nozzle requirements by varying the number of impeller vanes◆ Complex construction
◆ Unsuitable for pigmented inks◆ IJ28 Acoustic lens A refractive or diffractive (e.g. zone plate) acoustic lens is used to concentrate sound waves. ◆ No moving parts ◆ Large area required
◆ Only relevant for acoustic ink jets◆ 1993 Hadimioglu et al, EUP 550,192
◆1993 Elrod et al, EUP 572,220 Sharp conductive point A sharp point is used to concentrate an electrostatic field. ◆ Simple construction ◆ Difficult to fabricate using standard VLSI processes for a surface ejecting ink-jet
◆ Only relevant for electrostatic ink jets◆ Tone-jet . -
Actuator motion Description Advantages Disadvantages Examples Volume expansion The volume of the actuator changes, pushing the ink in all directions. ◆ Simple construction in the case of thermal inkjet ◆High energy is typically required to achieve volume expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations ◆ Hewlett-Packard Thermal Inkjet
◆ Canon BubblejetLinear, normal to chip surface The actuator moves in a direction normal to the print head surface. The nozzle is typically in the line of movement, ◆Efficient coupling to ink drops ejected normal to the surface ◆High fabrication complexity may be required to achieve perpendiculer motion ◆ IJ01, IJ02, IJ04, IJ07
◆ IJ11, IJ14Linear, parallel to chip surface The actuator moves parallel to the print head surface. Drop ejection may still be normal to the surface. ◆ Suitable for planar fabrication ◆ Fabrication complexity
◆ Friction
◆ Stiction◆ IJ12, IJ13, IJ15, IJ33,
◆ IJ34, IJ35, IJ36Membrane push An actuator with a high force but small area is used to push a stiff membrane that is in contact with the ink. ◆ The effective area of the actuator becomes the membrane area ◆ Fabrication complexity
◆ Actuator size
◆ Difficulty of Integration in a VLSI process◆ 1982 Howkins USP 4,459,601 Rotary The actuator causes the rotation of some element, such a grill or impeller ◆ Rotary levers may be used to increase travel
◆Small chip area requirements◆ Device complexity
◆May have friction at a pivot point◆ IJ05, IJ08, IJ13, IJ28 Bend The actuator bends when energized. This may be due to differential thermal expansion, piezoelectric expansion, magnetostriction, or other form of relative dimensional change. ◆ A very small change in dimensions can be converted to a large motion. ◆ Requires the actuator to be made from at least two distinct layers, or to have a thermal difference across the actuator ◆ 1970 Kyser et al 3,946,398 USP
◆1973 Stemme 3,747,120 USP
◆ IJ03, IJ09, IJ10, IJ19
◆ IJ23, IJ24, IJ25, IJ29
◆ IJ30, IJ31, IJ33, IJ34
◆ IJ35Swivel The actuator swivels around a central pivot. This motion is suitable where there are opposite forces applied to opposite sides of the paddle, e.g. Lorenz force. ◆ Allows operation where the net linear force on the paddle is zero
◆ Small chip area requirements◆ Inefficient coupling to the ink motion ◆ IJ06 Straighten The actuator is normally bent, and straightens when energized. ◆ Can be used with shape memory alloys where the austenic phase is planar ◆ Requires careful balance of stresses to ensure that the quiescent bend is accurate ◆ IJ26, IJ32 Double bend The actuator bends in one direction when one element is energized, and bends the other way when another element is energized. ◆ One actuator can be used to power two nozzles.
◆ Reduced chip size.
◆ Not sensitive to ambient temperature◆ Difficult to make the drops ejected by both bend directions identical.
◆ A small efficiency loss compared to equivalent single bend actuators.◆ IJ36, IJ37, IJ38 Shear Energizing the actuator causes a shear motion in the actuator material. ◆ Can increase the effective travel of piezoelectric actuators ◆ Not readily applicable to other actuator mechanisms ◆ 1985 Fishbeck USP 4,584,590 Radial constriction The actuator squeezes an ink reservoir, forcing ink from a constricted nozzle. ◆ Relatively easy to fabricate single nozzles from glass tubing as macroscopic structures ◆ High force required
◆ Inefficient
◆ Difficult to integrate with VLSI processes◆ 1970 Zoltan USP 3,683,212 Coil/uncoil A coiled actuator uncoils or coils more tightly. The motion of the free end of the actuator ejects the ink. ◆ Easy to fabricate as a planar VLSI process
◆ Small area required, therefore low cost◆ Difficult to fabricate for non-planar
◆ devices
◆ Poor out-of-plane stiffness◆IJ17, IJ21, IJ34, IJ35 Bow The actuator bows (or buckles) in the middle when energized. ◆ Can increase the speed of travel
◆ Mechanically rigid◆ Maximum travel is constrained
◆ High force required◆ IJ16, IJ18, IJ27 Push-Pull Two actuators control a shutter. One actuator pulls the shutter, and the other pushes it. ◆ The structure is pinned at both ends, so has a high out-of-plane rigidity ◆ Not readily suitable for inkjets which directly push the ink ◆ IJ18 Curl inwards A set of actuator curl inwards to reduce the volume of Ink that they enclose. ◆ Good fluid flow to the region behind the actuator increases efficiency ◆ Design complexity ◆ IJ20, IJ42 Curl outwards A set of actuators curl outwards, pressurizing ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber. ◆ Relatively simple construction ◆ Relatively large chip area ◆ IJ43 Iris Multiple vanes enclose a volume of ink. These simultaneously rotate, reducing the volume between the vanes. ◆High efficiency
◆ Small chip area◆High fabrication complexity
◆ Not suitable for pigmented inks◆IJ22 Acoustic vibration The actuator vibrates at a high frequency. ◆ The actuator can be physically distant from the ink ◆ Large area required for efficient operation at useful frequencies
◆ Acoustic coupling and crosstalk
◆ Complex drive circuitry
◆ Poor control of drop volume and position◆1993 Hadimioglu et al, EUP 550,192
◆1993 Elrod et al, EUP 572,220 None In various ink jet designs the actuator does not move. ◆ No moving parts ◆ Various other tradeoffs are required to eliminate moving parts ◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ Tone-jet -
Nozzle refill method Description Advantages Disadvantages Examples Surface tension After the actuator is energized, it typically returns rapidly to its normal position. This rapid return sucks in air through the nozzle opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. ◆ Fabrication simplicity
◆ Operational simplicity◆ Low speed
◆ Surface tension force relatively small compared to actuator force
◆ Long refill time usually dominates the total repetition rate◆ Thermal inkjet
◆ Piezoelectric ink jet
◆IJ01-IJ07, IJ10-IJ14
◆ IJ16, IJ20, IJ22-IJ45Shuttered oscillating Ink pressure Ink to the nozzle chamber is provided at a pressure that oscillates at twice the drop ejection frequency. When a drop is to be ejected, the shutter is opened for 3 half cycles: drop ejection, actuator return, and refill. ◆ High speed
◆ Low actuator energy, as the actuator need only open or close the shutter, Instead of ejecting the ink drop◆ Requires common ink pressure oscillator
◆ May not be suitable for pigmented inks◆ IJ08, IJ13, IJ15, IJ17
◆ IJ18, IJ19, IJ21Refill actuator After the main actuator has ejected a drop a second (refill) actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. ◆ High speed, as the nozzle is actively refilled ◆ Requires two independent actuators per nozzle ◆ IJ09 Positive Ink pressure The ink is held a slight positive pressure. After the ink drop is ejected, the nozzle chamber fills quickly as surface tension and ink pressure both operate to refill the nozzle. ◆ High refill rate, therefore a high drop repetition rate is possible ◆ Surface spill must be prevented
◆ Highly hydrophobic print head surfaces are required◆Silverbrook, EP 0771 658 A2 and related patent applications ◆Alternative for:
◆ IJ01-IJ07, IJ10-IJ14
◆ IJ16, IJ20, IJ22-IJ45 -
Inlet back-flow restriction method Description Advantages Disadvantages Examples Long inlet channel The ink inlet channel to the nozzle chamber is made long and relatively narrow, relying on viscous drag to reduce inlet back-flow. ◆ Design simplicity
◆ Operational simplicity
◆Reduces crosstalk◆ Restricts refill rate
◆ May result in a relatively large chip area
◆ Only partially effective◆ Thermal inkjet
◆ Piezoelectric inkjet
◆ 1142, 1J43Positive ink pressure The ink is under a positive pressure, so that in the quiescent state some of the ink drop already protrudes from the nozzle. This reduces the pressure in the nozzle chamber which is required to eject a certain volume of ink. The reduction in chamber pressure results in a reduction in ink pushed out through the inlet. ◆ Drop selection and separation forces can be reduced
◆ Fast refill time◆ Requires a method (such as a nozzle rim or effective hydrophobizing, or both) to prevent flooding of the ejection surface of the print head. ◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ Possible operation of the following:
◆ IJ01-IJ07, IJ09- IJ12
◆IJ14, IJ16, IJ20, U22,
◆ IJ23-IJ34, IJ36-IJ41
◆IJ44Baffle One or more baffles are placed in the inlet ink flow. When the actuator is energized, the rapid ink movement creates eddies which restrict the flow through the inlet. The slower refill process is unrestricted, and does not result in eddies. ◆ The refill rate is not as restricted as the long inlet method.
◆Reduces crosstalk◆ Design complexity
◆ May increase fabrication complexity (e.g. Tektronix hot melt Piezoelectric print heads).◆ HP Thermal Ink Jet
◆ Tektronix piezoelectric inkjetFlexible flap restricts inlet In this method recently disclosed by Canon, the expanding actuator (bubble) pushes on a flexible flap that restricts the Inlet. ◆ Significantly reduces back-flow for edge-shooter thermal ink jet devices ◆ Not applicable to most inkjet configurations
◆ Increased fabrication complexity
◆Inelastic deformation of polymer flap results in creep over extended use◆ Canon Inlet filter A filter is located between the ink inlet and the nozzle chamber. The filter has a multitude of small holes or slots, restricting ink flow. The filter also removes particles which may block the nozzle. ◆ Additional advantage of ink filtration
◆ Ink filter may be fabricated with no additional process steps◆ Restricts refill rate
◆ May result in complex construction◆ IJ04, IJ12, IJ24, IJ27
◆ U29, U30Small inlet compared to nozzle The ink inlet channel to the nozzle chamber has a substantially smaller cross section than that of the nozzle, resulting in easier ink egress out of the nozzle than out of the inlet. ◆ Design simplicity ◆ Restricts refill rate
◆ May result in a relatively large chip area
◆ Only partially effective◆ IJ02, IJ37, U44 Inlet shutter A secondary actuator controls the position of a shutter, closing off the ink inlet when the main actuator is energized. ◆ Increases speed of the ink-jet print head operation ◆Requires separate refill actuator and drive circuit ◆ IJ09 The inlet is located behind the ink-pushing surface The method avoids the problem of inlet back-flow by arranging the Ink-pushing surface of the actuator between the inlet and the nozzle. ◆ Back-flow problem is eliminated ◆Requires careful design to minimize the negative pressure behind the paddle ◆ IJ011, IJ03, 1J05, IJ06
◆ IJ07, IJ10, IJ11, IJ14
◆IJ16 IJ22, IJ23, IJ25
◆IJ28, U31, IJ32, IJ33
◆ U34, IJ35, IJ36, IJ39
◆IJ40, IJ41Part of the actuator moves to shut off the Inlet The actuator and a wall of the ink chamber are arranged so that the motion of the actuator closes off the inlet. ◆ Significant reductions in back-flow can be achieved
◆ Compact designs possible◆ Small increase in fabrication complexity ◆IJ07, IJ20, IJ26, IJ38 Nozzle actuator does not result in Ink back-flow In some configurations of inkjet, there is no expansion or movement of an actuator which may cause ink back-flow through the inlet. ◆ ink back-flow problem is eliminated ◆ None related to ink back-flow on actuation ◆ Silverbrook. EP 0771658 A2 and related patent applications
◆ Valve-jet
◆ Tone-jet
◆ IJ08,IJ13, IJ15, IJI7
◆ IJ18, JJ19, IJ21 -
Nozzle Clearing method Description Advantages Disadvantages Examples Normal nozzle firing All of the nozzles are fired periodically, before the ink has a chance to dry. When not in use the nozzles are sealed (capped) against air.
The nozzle firing is usually performed during a special clearing cycle, after first moving the print head to a cleaning station.◆ No added complexity on the print head ◆ May not be sufficient to displace dried ink ◆ Most ink jet systems
◆ IJ01- IJ07,IJ09-IJ12
◆ IJ14, IJ16, IJ20, IJ22
◆IJ23- IJ34, IJ36-IJ45Extra power to ink heater In systems which heat the ink, but do not boil it under normal situations, nozzle clearing can be achieved by over-powering the heater and boiling ink at the nozzle. ◆ Can be highly effective if the heater is adjacent to the nozzle ◆ Requires higher drive voltage for clearing
◆ May require larger drive transistors◆ Silverbrook, EP 0771 658 A2 and related patent applicationsRapid succession of actuator pulses The actuator is fired in rapid succession. in some configurations, this may cause heat build-up at the nozzle which boils the ink, clearing the nozzle. In other situations, it may cause sufficient vibrations to dislodge clogged nozzles. ◆ Does not require extra drive circuits on the print head ◆Can be readily controlled and initiated by digital logic ◆ Effectiveness depends substantially upon the configuration of the inkjet nozzle ◆ May be used with:
◆IJ01-IJ07,IJ09-IJ11
◆IJ14, IJ16 IJ20, IJ22
◆ IJ23-IJ25, IJ27-IJ34
◆IJ36-IJ45Extra power to ink pushing actuator Where an actuator is not normally driven to the limit of its motion, nozzle clearing may be assisted by providing an enhanced drive signal to the actuator. ◆ A simple solution where applicable ◆ Not suitable where there is a hard limit to actuator movement ◆May be used with:
◆ IJ03, IJ09, IJ16, IJ20
◆ IJ23, IJ24, IJ25, IJ27
◆IJ29, IJ30, IJ31, IJ32
◆IJ39, IJ40, IJ41, IJ42
◆ IJ43, IJ44, IJ45Acoustic resonance An ultrasonic wave is applied to the ink chamber. This wave is of an appropriate amplitude and frequency to cause sufficient force at the nozzle to clear blockages. This is easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity. ◆ A high nozzle clearing Capability can be achieved
◆ May be implemented at very low cost in systems which already include acoustic actuators◆ High implementation cost if system does not already include an acoustic actuator ◆ IJ08, IJ13, IJ15,1J17
◆ IJ18, IJ19, IJ21Nozzle clearing plate A microfabricated plate is pushed against the nozzles. The plate has a post for every nozzle. The array of posts ◆ Can clear severely clogged nozzles ◆ Accurate mechanical alignment is required
◆ Moving parts are required
◆ There is risk of damage to the nozzles
◆ Accurate fabrication is required◆ Silverbrook, EP 0771 658 A2 and related patent applicationsInk pressure pulse The pressure of the ink is temporarily increased so that ink streams from all of the nozzles. This may be used in conjunction with actuator energizing. ◆ May be effective where other methods cannot be used ◆ Requires pressure pump or other pressure actuator
◆ Expensive
◆ Wasteful of ink◆ May be used with all IJ series ink jets Print head wiper A flexible 'blade' Is wiped across the print head surface. The blade is usually fabricated from a flexible polymer, e.g. rubber or synthetic elastomer. ◆ Effective for planar print head surfaces
◆ Low cost◆ Difficult to use if print head surface is non-plonar or very fragile
◆ Requires mechanical parts
◆ Blade can wear out in high volume print systems◆ Many ink jet systems Separate ink boiling heater A separate heater is provided at the nozzle although the normal drop e-ection mechanism does not require it. The heaters do not require Individual drive circuits, as many nozzles can be cleared simultaneously, and no imaging is required. ◆Can be effective where other nozzle clearing methods cannot be used
◆ Can be implemented at no additional cost in some inkjet configurations◆Fabrication complexity ◆ Can be used with many U series Ink jets -
Nozzle plate construction Description Advantages Disadvantages Examples Electroformed nickel A nozzle plate is separately fabricated from electroformed nickel, and bonded to the print head chip. ◆Fabrication simplicity ◆High temperatures and pressures are required to bond nozzle plate
◆ Minimum thickness constraints
◆ Differential thermal expansion◆ Hewlett Packard Thermal Inkjet Laser ablated or drilled polymer Individual nozzle holes are ablated by an Intense UV laser in a nozzle plate, which is typically a polymer such as polyimide or polysulphone ◆No masks required
◆ Can be quite fast
◆ Some control over nozzle profile is possible
◆ Equipment required is relatively low cost◆ Each hole must be individually formed
◆ Special equipment required
◆Slow where there are many thousands of nozzles per print head
◆ May produce thin burrs at exit holes◆Canon Bubblejet
◆1988 Sercel et al., SPIE, Vol. 998 Excimer Beam Applications, pp. 76-83
◆1993 Watanabe et al., USP 5,208,604 Silicon micro-machined A separate nozzle plate is micromachined from single crystal silicon, and bonded to the print head wafer. ◆ High accuracy is attainable ◆ Two part construction
◆ High cost
◆ Requires precision alignment
◆ Nozzles may be clogged by adhesive◆ K. Bean, IEEE Transactions on Electron Devices, Vol. ED-25, No. Vol. ED-25, No. 10, 1978, pp 1185-1195
◆ Xerox1990 Hawkins et al., USP 4,899,181 Glass capillaries Fine glass capillaries are drawn from glass tubing. This method has been used for making individual nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. ◆ No expensive equipment required
◆ Simple to make single nozzles◆ Very small nozzle sizes are difficult to form
◆ Not suited for mass production◆ 1970 Zoltan USP 3,683,212 Monolithic, surface micro-machined using VLSI lithographic processes The nozzle plate is deposited as a layer using standard VLSI deposition techniques. Nozzles are etched In the nozzle plate using VLSI lithography and etching. ◆ High accuracy (<1 µm)
◆ Monolithic
◆ Low cost
◆ Existing processes can be used◆ Requires sacrificial layer under the nozzle plate to form the nozzle chamber
◆ Surface may be fragile to the touch◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ IJ01, IJ02, IJ04, IJ11
◆ IJ12, IJ17, IJ18, IJ20
◆ IJ22, IJ24, IJ27, IJ28
◆ IJ29, IJ30, IJ31, IJ32
◆ IJ33, IJ34, IJ36, IJ37
◆ IJ38, IJ39, IJ40, IJ41
◆ IJ42, IJ43, IJ44Monolithic, etched through substrate The nozzle plate is a buried etch stop in the wafer. Nozzle chambers are etched in the front of the wafer, and the wafer is thinned from the back side. Nozzles are then etched in the etch stop layer. ◆ High accuracy (<1 µm)
◆ Monolithic
◆ Low cost
◆ No differential expansion◆ Requires long etch times
◆ Requires a support wafer◆ IJ03, IJ05, IJ06, IJ07
◆IJ08, IJ09, IJ10, IJ13
◆IJ14, IJ15, U16, IJ19
◆ IJ21, IJ23, IJ25, IJ26No nozzle plate Various methods have been tried to eliminate the nozzles entirely, to prevent nozzle clogging. These include thermal bubble mechanisms and acoustic lens mechanisms ◆ No nozzles to become clogged ◆ Difficult to control drop position accurately
◆ Crosstalk problems◆ Ricoh 1995 Sekiya et al USP 5,412,413
◆ 1993 Hadimioglu et al EUP550,192
◆ 1993 Eirod et al EUP572,220 Trough Each drop ejector has a trough through which a paddle moves. There is no nozzle plate. ◆ Reduced manufacturing complexity
◆ Monolithic◆ Drop firing direction is sensitive to wicking. ◆ IJ35 Nozzle slit Instead of individual nozzles The elimination of nozzle holes and replacement by a slit encompassing many actuator positions reduces nozzle clogging, but increases crosstalk due to ink surface waves. ◆ No nozzles to become clogged ◆ Difficult to control drop position accurately
◆ Crosstalk problems◆ 1989 Saito et al USP 4,799,068 -
Ejection direction Description Advantages Disadvantages Examples Edge. ('edge shooter') Ink flow is along the surface of the chip, and ink drops are ejected from the chip edge. ◆ Simple construction
◆ No silicon etching required
◆ Good heat sinking via substrate
◆ Mechanically strong
◆ Ease of chip handing◆ Nozzles limited to edge
◆ High resolution is difficult
◆ Fast color printing requires one print head per color◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162
◆ Xerox heater-in-pit 1990 Hawkins et alUSP 4,899,181
◆ Tone-jetSurface ('roof shooter') Ink flow is along the surface of the chip, and ink drops are ejected from the chip surface, normal to the plane of the chip. ◆ No bulk silicon etching required
◆ Silicon can make an effective heat sink
◆ Mechanical strength◆ Maximum ink flow is severely restricted ◆ Hewlett-Packard TIJ 1982 Vaught et al USP 4,490,728
◆ IJ02, IJ11, IJ12, IJ20
◆ IJ22Through chip, forward ('up shooter') Ink flow is through the chip, and ink drops are ejected from the front surface of the chip. ◆ High ink flow
◆ Suitable for pagewidth print
◆ High nozzle packing density therefore low manufacturing cost◆ Requires bulk silicon etching ◆ Silverbrook, EP 0771 658 A2 and related patent applications
◆ IJ04, IJ17, IJ18, IJ24
◆ IJ27-IJ45Through chip, reverse ('down shooter') Ink flow is through the chip, and ink drops are ejected from the rear surface of the chip. ◆ High ink flow
◆ Suitable for pagewidth print
◆ High nozzle packing density therefore low manufacturing cost◆ Requires wafer thinning
◆ Requires special handling during manufacture◆ IJ01, IJ03, U05, IJ06
◆ IJ07, IJ08, IJ09, IJ10
◆ IJ13, IJ14, IJ15, IJ16
◆ IJ19, IJ21, IJ23, IJ25
◆ IJ26Through actuator Ink flow is through the actuator, which is not fabricated as part of the same substrate as the drive transistors. ◆ Suitable for piezoelectric print heads
◆Pagewidth print heads require several thousand connections to drive circuits
◆ Cannot be manufactured in standard CMOS fabs
◆ Complex assembly required◆ Epson Stylus
◆ Tektronix hot melt piezoelectric ink jets -
Ink type Description Advantages Disadvantages Examples Aqueous, dye Water based ink which typically contains: water, dye, surfactant, humectant, and biocide. Modem ink dyes have high water-fastness, light fastness ◆ Environmentally friendly
◆ No odor◆ Slow drying
◆ Corrosive
◆ Bleeds on paper
◆ May strikethrough
◆ Cockles paper◆ Most existing inkjets
◆ All U series ink jets
◆ Silverbrook, EP0771 658 A2 and related patent applicationsAqueous, pigment Water based ink which typically contains: water, pigment, surfactant, humectant, and biocide.
Pigments have an advantage in reduced bleed, wicking and Strikethrough.◆ Environmentally friendly
◆ No odor
◆Reduced bleed
◆ Reduced wicking
◆ Reduced strikethrough◆ Slow drying
◆ Corrosive
◆ Pigment may clog nozzles
◆ Pigment may clog actuator mechanisms
◆ Cockles paper◆ IJ02, IJ04, U21, IJ26
◆ IJ27, IJ30
◆ Silverbrook, EP0711 658 A2 and related patent applications
◆ Piezoelectric ink-jets
◆ Thermal ink jets (with significant restrictions)Methyl Ethyl Ketone (MEK) MEK is a highly volatile solvent used for industrial printing on difficult surfaces such as aluminum cans. ◆ Very fast drying
◆ Prints on various substrates such as metals and plastics◆ Odorous
◆ Flammable◆ All U series ink jets Alcohol (ethanol, 2-butanol, and others) Alcohol based inks can be used where the printer must operate at temperatures below the freezing point of water. An example of this is in-camera consumer photographic printing. ◆ Fast drying
◆ Operates at sub-freezing temperatures
◆ Reduced paper cockle
◆ Low cost◆ Slight odor
◆ Flammable◆ All IJ series ink jets Phase change (hot melt) The ink is solid at room temperature, and is melted in the print head before jetting. Hot melt inks are usually wax based, with a melting point around 80°C. After jetting the ink freezes almost instantly upon contacting the print medium or a transfer roller. ◆ No drying time- ink instantly freezes on the print medium
◆Almost any print medium can be used
◆No paper cockle occurs
◆ No wicking occurs
◆ No bleed occurs
◆ No strikethrough occurs◆High viscosity
◆ Printed ink typically has a 'waxy' feel
◆ Printed pages may 'block'
◆ Ink temperature may be above the curie point of permanent magnets
◆ Ink heaters consume power
◆ Long warm-up time◆ Tektronix hot melt piezoelectric ink jets
◆ 1989 Nowak USP4,820,346
◆ All IJ series ink jetsOil Oil based inks are extensively used in offset printing. They have advantages in improved characteristics on paper (especially no wicking or cockle). Oil soluble dies and pigments are required. ◆ High solubility medium for some dyes
◆ Does not cockle paper
◆ Does not wick through paper◆ High viscosity: this is a significant limitation for use in lnkjets, which usually require a low viscosity. Some, short chain and multi-branched oils have a sufficiently low viscosity.
◆ Slow drying◆ All IJ series ink jets - A large number of new forms of ink jet printers have been developed to facilitate alternative ink jet technologies for the image processing and data distribution system. Various combinations of ink jet devices can be included in printer devices incorporated as part of the present invention.
- Further, the present application may utilize advanced semiconductor fabrication techniques in the construction of large arrays of ink jet printers.
- Further, the present application may utilize an ink delivery system to the ink jet head.
- Further, the present application may utilize advanced semiconductor microelectromechanical techniques in the construction of large arrays of ink jet printers.
- Further, the present application may include the utilization of a disposable camera system.
- Further, the present application may include the utilization of a data distribution system.
- Further, the present application may include the utilization of camera and data processing techniques such as an Artcam type device.
- It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respect to be illustrative and not restrictive.
Claims (9)
- An inkjet nozzle comprising:a nozzle chamber having an ink ejection port in one wall of said chamber;an ink supply source interconnected to said nozzle chamber;an electrostatic actuator to eject ink from said nozzle chamber via said ink ejection port, characterized in that said electrostatic actuator comprises:a series of conductive parallel plates interleaved with a resiliently compressible material; such that, a potential difference across said plates attracts adjacent plates to one another thereby causing said compressible material to resiliently yield; and
reducing said potential difference returns said compressible material to its quiescent state, thereby resulting in the ejection of ink from said ejection port. - An ink jet nozzle as claimed in claim 1 wherein said resilient yielding of said compressible material results in ink being drawn into said nozzle chamber by means of surface tension effects around said ink ejection port.
- An ink jet nozzle as claimed in claim 1 wherein said compressible material comprises a material having a high dielectric constant.
- An ink jet nozzle as claimed in claim 1 wherein said electrostatic actuator is constructed utilising semiconductor fabrication techniques by laying down one planer layer at a time so as to form an initial sandwiched preform and subsequently selectively etching said preform so as to provide for an electrical interconnect to the conductive parallel plates.
- An ink jet nozzle as claimed in claim 1 wherein groups of said series of said conductive parallel plates are constructed from different materials so as to allow for selective etching of said plates so as to divide them into two groups of different polarities during operation.
- An ink jet nozzle as claimed in claim 5 wherein plates from each of said group are interconnected to a common conductive portion for the provision of a charge to said conductive plates.
- An ink jet nozzle as claimed in claim 1 wherein said plates are constructed utilising chemical vapour deposition techniques.
- An ink jet nozzle as claimed in claim 1 wherein an outer surface of said nozzle chambers includes a plurality of etchant holes provided so as to allow a more rapid etching of sacrificial layers during construction.
- An inkjet nozzle according to claim 1, further comprising:a control means for producing said potential difference across said plates so that said material is resiliently compressed such that, upon deactivation, said electrostatic actuator causes ink to be ejected via said ink ejection port.
Applications Claiming Priority (73)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPO807597 | 1997-07-15 | ||
AUPO805897 | 1997-07-15 | ||
AUPO806797 | 1997-07-15 | ||
AUPO8035A AUPO803597A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ06) |
AUPO804197 | 1997-07-15 | ||
AUPO7933A AUPO793397A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation_apparatus (IJM10) |
AUPO806197 | 1997-07-15 | ||
AUPO8044A AUPO804497A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ07) |
AUPO794997 | 1997-07-15 | ||
AUPO8048A AUPO804897A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ14) |
AUPO795097 | 1997-07-15 | ||
AUPO805497 | 1997-07-15 | ||
AUPO8071A AUPO807197A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ04) |
AUPO806597 | 1997-07-15 | ||
AUPO807197 | 1997-07-15 | ||
AUPO800197 | 1997-07-15 | ||
AUPO7936A AUPO793697A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM02) |
AUPO804797 | 1997-07-15 | ||
AUPO8069A AUPO806997A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ11) |
AUPO8065A AUPO806597A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM06) |
AUPO8059A AUPO805997A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM14) |
AUPO8060A AUPO806097A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM13) |
AUPO7949A AUPO794997A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM12) |
AUPO8072A AUPO807297A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ02) |
AUPO8036A AUPO803697A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ13) |
AUPO8053A AUPO805397A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM08) |
AUPO8001A AUPO800197A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ17) |
AUPO804897 | 1997-07-15 | ||
AUPO7950A AUPO795097A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM11) |
AUPO803597 | 1997-07-15 | ||
AUPO8066A AUPO806697A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ01) |
AUPO793697 | 1997-07-15 | ||
AUPO7935A AUPO793597A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM01) |
AUPO8056A AUPO805697A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ10) |
AUPO807797 | 1997-07-15 | ||
AUPO803697 | 1997-07-15 | ||
AUPO8070A AUPO807097A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ15) |
AUPO8047A AUPO804797A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ05) |
AUPO805997 | 1997-07-15 | ||
AUPO806697 | 1997-07-15 | ||
AUPO806397 | 1997-07-15 | ||
AUPO8049A AUPO804997A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ12) |
AUPO8054A AUPO805497A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM05) |
AUPO807397 | 1997-07-15 | ||
AUPO793397 | 1997-07-15 | ||
AUPO793597 | 1997-07-15 | ||
AUPO800497 | 1997-07-15 | ||
AUPO8055A AUPO805597A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM07) |
AUPO805597 | 1997-07-15 | ||
AUPO8076A AUPO807697A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM16) |
AUPO804997 | 1997-07-15 | ||
AUPO806097 | 1997-07-15 | ||
AUPO8058A AUPO805897A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM26) |
AUPO807097 | 1997-07-15 | ||
AUPO8073A AUPO807397A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM15) |
AUPO8075A AUPO807597A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM17) |
AUPO8063A AUPO806397A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ08) |
AUPO807697 | 1997-07-15 | ||
AUPO8004A AUPO800497A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ26) |
AUPO8067A AUPO806797A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ16) |
AUPO8077A AUPO807797A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM25) |
AUPO805397 | 1997-07-15 | ||
AUPO806997 | 1997-07-15 | ||
AUPO804497 | 1997-07-15 | ||
AUPO807297 | 1997-07-15 | ||
AUPO805697 | 1997-07-15 | ||
AUPO8061A AUPO806197A0 (en) | 1997-07-15 | 1997-07-15 | A method of manufacture of an image creation apparatus (IJM04) |
AUPO8041A AUPO804197A0 (en) | 1997-07-15 | 1997-07-15 | Image creation method and apparatus (IJ25) |
AUPP3982A AUPP398298A0 (en) | 1998-06-09 | 1998-06-09 | A method of manufacture of an image creation apparatus (ijm45) |
AUPP398398 | 1998-06-09 | ||
AUPP3983A AUPP398398A0 (en) | 1998-06-09 | 1998-06-09 | Image creation method and apparatus (ij45) |
AUPP398298 | 1998-06-09 | ||
EP98933350A EP0999933B1 (en) | 1997-07-15 | 1998-07-15 | Magnetic-field-acutated ink jet nozzle |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP98933350A Division EP0999933B1 (en) | 1997-07-15 | 1998-07-15 | Magnetic-field-acutated ink jet nozzle |
Publications (3)
Publication Number | Publication Date |
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EP1508444A2 EP1508444A2 (en) | 2005-02-23 |
EP1508444A3 EP1508444A3 (en) | 2005-03-16 |
EP1508444B1 true EP1508444B1 (en) | 2007-11-21 |
Family
ID=27586944
Family Applications (11)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04024060A Expired - Lifetime EP1510339B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle actuated by magnetic pulses |
EP04024066A Expired - Lifetime EP1508446B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with solenoid actuator |
EP04024057A Expired - Lifetime EP1508443B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet printer with electro-magnetically actuated ink plunger |
EP04024059A Expired - Lifetime EP1512535B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet printer with magnetic piston actuator |
EP04024062A Expired - Lifetime EP1508449B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with magnetic actuator chamber |
EP04024065A Expired - Lifetime EP1510341B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with electromagnetic shutter |
EP04024063A Expired - Lifetime EP1510340B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle actuated by slotted plunger |
EP04024061A Expired - Lifetime EP1508448B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with tapered magnetic plunger |
EP04024058A Expired - Lifetime EP1508444B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet printer with electrostatically actuated plates |
EP98933350A Expired - Lifetime EP0999933B1 (en) | 1997-07-15 | 1998-07-15 | Magnetic-field-acutated ink jet nozzle |
EP04024064A Expired - Lifetime EP1508445B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with Lorentz force actuator |
Family Applications Before (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04024060A Expired - Lifetime EP1510339B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle actuated by magnetic pulses |
EP04024066A Expired - Lifetime EP1508446B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with solenoid actuator |
EP04024057A Expired - Lifetime EP1508443B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet printer with electro-magnetically actuated ink plunger |
EP04024059A Expired - Lifetime EP1512535B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet printer with magnetic piston actuator |
EP04024062A Expired - Lifetime EP1508449B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with magnetic actuator chamber |
EP04024065A Expired - Lifetime EP1510341B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with electromagnetic shutter |
EP04024063A Expired - Lifetime EP1510340B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle actuated by slotted plunger |
EP04024061A Expired - Lifetime EP1508448B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with tapered magnetic plunger |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98933350A Expired - Lifetime EP0999933B1 (en) | 1997-07-15 | 1998-07-15 | Magnetic-field-acutated ink jet nozzle |
EP04024064A Expired - Lifetime EP1508445B1 (en) | 1997-07-15 | 1998-07-15 | Inkjet nozzle with Lorentz force actuator |
Country Status (4)
Country | Link |
---|---|
EP (11) | EP1510339B1 (en) |
JP (6) | JP4170582B2 (en) |
AT (8) | ATE353053T1 (en) |
WO (1) | WO1999003680A1 (en) |
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