EP1493183B1 - Procede de fabrication d'entrefer contenant des dispositifs a semiconducteur et dispositif a semiconducteur resultant - Google Patents
Procede de fabrication d'entrefer contenant des dispositifs a semiconducteur et dispositif a semiconducteur resultant Download PDFInfo
- Publication number
- EP1493183B1 EP1493183B1 EP03728320A EP03728320A EP1493183B1 EP 1493183 B1 EP1493183 B1 EP 1493183B1 EP 03728320 A EP03728320 A EP 03728320A EP 03728320 A EP03728320 A EP 03728320A EP 1493183 B1 EP1493183 B1 EP 1493183B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alkyl
- sacrificial
- alkenyl
- aryl
- alkynyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 230000008569 process Effects 0.000 title description 6
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- 239000000463 material Substances 0.000 claims description 43
- 239000000047 product Substances 0.000 claims description 43
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- -1 vinylaromatics Chemical class 0.000 claims description 31
- 238000000354 decomposition reaction Methods 0.000 claims description 25
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 24
- OOVQLEHBRDIXDZ-UHFFFAOYSA-N 7-ethenylbicyclo[4.2.0]octa-1,3,5-triene Chemical class C1=CC=C2C(C=C)CC2=C1 OOVQLEHBRDIXDZ-UHFFFAOYSA-N 0.000 claims description 22
- 150000004756 silanes Chemical class 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 19
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- 125000003601 C2-C6 alkynyl group Chemical group 0.000 claims description 16
- 239000003989 dielectric material Substances 0.000 claims description 16
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 14
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- 125000002252 acyl group Chemical group 0.000 claims description 10
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- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 claims description 2
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- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
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- PHDBEHXEGZYQMR-UHFFFAOYSA-N 1,3-dibromo-5-(2-phenylethynyl)benzene Chemical compound BrC1=CC(Br)=CC(C#CC=2C=CC=CC=2)=C1 PHDBEHXEGZYQMR-UHFFFAOYSA-N 0.000 description 3
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- FQQOMPOPYZIROF-UHFFFAOYSA-N cyclopenta-2,4-dien-1-one Chemical group O=C1C=CC=C1 FQQOMPOPYZIROF-UHFFFAOYSA-N 0.000 description 3
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- CSDQQAQKBAQLLE-UHFFFAOYSA-N 4-(4-chlorophenyl)-4,5,6,7-tetrahydrothieno[3,2-c]pyridine Chemical compound C1=CC(Cl)=CC=C1C1C(C=CS2)=C2CCN1 CSDQQAQKBAQLLE-UHFFFAOYSA-N 0.000 description 2
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- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
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Images
Classifications
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
- H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31695—Deposition of porous oxides or porous glassy oxides or oxide based porous glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Claims (12)
- Une méthode de formation d'au moins un entrefer partiel à l'intérieur d'un dispositif semi-conducteur comprenant les étapes consistant : (a) à déposer une composition polymère sacrificielle dans une ou plusieurs couches du dispositif pendant sa formation ; (b) à revêtir le dispositif d'une ou plusieurs couches d'un matériau diélectrique isolant, polymère, organique,
relativement non poreux (masque dur) ayant une masse volumique inférieure à 2,2 g/cm3 ; et (c) à décomposer la composition polymère sacrificielle de telle sorte que les produits de décomposition s'infiltrent au moins partiellement dans ces une ou plusieurs couches de masque dur,
formant de cette façon au moins un entrefer partiel à l'intérieur du dispositif, caractérisée en ce que le polymère sacrificiel est un copolymère d'un premier monomère sélectionné parmi les acrylates, les vinylaromatiques,
les norbornènes, et les diacrylates d'alkyldiol avec un second monomère sélectionné parmi les vinylbenzocyclobutènes et le 1,3 bis 2[4-benzocyclobutényl (éthényl)] benzène. - Une méthode de la revendication 1, dans laquelle le polymère sacrificiel est un copolymère de 5-éthylidène-2-norbornène et de vinylbenzocyclobutène ou d'un dérivé du vinylbenzocyclobutène.
- Une méthode de la revendication 1, dans laquelle le polymère sacrificiel est un copolymère de styrène ou d'un dérivé du styrène et de vinylbenzocyclobutène ou d'un dérivé du vinylbenzocyclobutène.
- Une méthode de la revendication 1, dans laquelle le polymère sacrificiel est un copolymère de diacrylate de bis [3-(4-benzocyclobutényl)]1,n (n = 2 à 12) alkyldiol et de 1,3 bis 2[4-benzocyclobutényl (éthényl)] benzène.
- Une méthode de la revendication 1, dans laquelle le polymère sacrificiel est un copolymère comprenant de 99 à 40 pour cent en moles de styrène ou d'un dérivé du styrène et de 1 à 60 pour cent en moles de vinylbenzocyclobutène ou d'un dérivé du vinylbenzocyclobutène sur la base des moles totales de monomères incorporés dans le polymère.
- Une méthode de la revendication 1, dans laquelle le polymère sacrificiel est un copolymère d'α-méthylstyrène et de vinylbenzocyclobutène.
- Une méthode de n'importe laquelle des revendications précédentes dans laquelle le masque dur est le produit durci formé à partir des produits de réaction hydrolysés ou partiellement hydrolysés d'alcoxysilanes substitués ou d'acyloxysilanes substitués.
- Une méthode de la revendication 7 dans laquelle le masque dur comprend le produit de réaction hydrolysé d'un alcoxy ou acyloxy silane substitué de la formule :
- Une méthode de la revendication 8 dans laquelle le masque dur comprend le produit hydrolysé ou partiellement hydrolysé d'un mélange comprenant(a) de 50 à 95 pour cent en moles (des moles totales de silanes (a), (b) et (c) dans la composition de masque dur) de silanes de la formule :(b) de 5 à 40 pour cent en moles de silanes (des moles totales de silanes (a), (b) et (c) dans la composition de masque dur) de la formule :(c) de 0 à 45 pour cent en moles (des moles totales de silanes (a), (b) et (c) dans la composition de masque dur) de silanes de la formule :
- Une méthode de n'importe laquelle des revendications précédentes dans laquelle le matériau diélectrique comprend une résine polyarylène.
- Une méthode de n'importe lesquelles des revendications précédentes dans laquelle le matériau diélectrique comprend une substance formant des pores qui est activée ou éliminée, soit simultanément avec, soit avant la décomposition du matériau sacrificiel, introduisant de cette façon des pores ou des vides dans la couche.
- Une méthode de la revendication 11 dans laquelle la substance formant des pores est un copolymère polymérisé en émulsion réticulé.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36949002P | 2002-04-02 | 2002-04-02 | |
US369490P | 2002-04-02 | ||
PCT/US2003/009956 WO2003085719A2 (fr) | 2002-04-02 | 2003-04-01 | Procede de fabrication d'entrefer contenant des dispositifs a semiconducteur et dispositif a semiconducteur resultant |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1493183A2 EP1493183A2 (fr) | 2005-01-05 |
EP1493183B1 true EP1493183B1 (fr) | 2012-12-05 |
Family
ID=28791959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03728320A Expired - Lifetime EP1493183B1 (fr) | 2002-04-02 | 2003-04-01 | Procede de fabrication d'entrefer contenant des dispositifs a semiconducteur et dispositif a semiconducteur resultant |
Country Status (5)
Country | Link |
---|---|
US (1) | US6946382B2 (fr) |
EP (1) | EP1493183B1 (fr) |
JP (1) | JP4531400B2 (fr) |
AU (1) | AU2003233470A1 (fr) |
WO (1) | WO2003085719A2 (fr) |
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-
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- 2003-04-01 AU AU2003233470A patent/AU2003233470A1/en not_active Abandoned
- 2003-04-01 JP JP2003582804A patent/JP4531400B2/ja not_active Expired - Fee Related
- 2003-04-01 EP EP03728320A patent/EP1493183B1/fr not_active Expired - Lifetime
- 2003-04-01 US US10/505,511 patent/US6946382B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2003085719A3 (fr) | 2004-07-01 |
JP2005522049A (ja) | 2005-07-21 |
WO2003085719A2 (fr) | 2003-10-16 |
US20050124172A1 (en) | 2005-06-09 |
AU2003233470A8 (en) | 2003-10-20 |
US6946382B2 (en) | 2005-09-20 |
AU2003233470A1 (en) | 2003-10-20 |
JP4531400B2 (ja) | 2010-08-25 |
EP1493183A2 (fr) | 2005-01-05 |
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