EP1483609A1 - Module optoelectronique et ensemble fiche male - Google Patents

Module optoelectronique et ensemble fiche male

Info

Publication number
EP1483609A1
EP1483609A1 EP02722007A EP02722007A EP1483609A1 EP 1483609 A1 EP1483609 A1 EP 1483609A1 EP 02722007 A EP02722007 A EP 02722007A EP 02722007 A EP02722007 A EP 02722007A EP 1483609 A1 EP1483609 A1 EP 1483609A1
Authority
EP
European Patent Office
Prior art keywords
housing
plug
coupling
receiving
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP02722007A
Other languages
German (de)
English (en)
Inventor
Nikolaus Schunk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP1483609A1 publication Critical patent/EP1483609A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/389—Dismountable connectors, i.e. comprising plugs characterised by the method of fastening connecting plugs and sockets, e.g. screw- or nut-lock, snap-in, bayonet type
    • G02B6/3893—Push-pull type, e.g. snap-in, push-on
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to an opto-electronic module according to the preamble of claim 1 and a connector arrangement according to the preamble of claim 19, which is preferably used in conjunction with an opto-electronic module according to claim 1.
  • a preferred area of application of the invention is inexpensive optoelectronic modules which are coupled to POF (Plastic Optical Fiber) optical waveguides.
  • the invention is particularly suitable for use in multimedia networks in the in-house area and in the automotive area.
  • an optoelectronic module in which a carrier with an optoelectronic converter is positioned in a module housing and cast with a translucent, moldable material.
  • Light is coupled in or out via an optical fiber, which is coupled to a socket on the module housing.
  • the driver module or receiver module for the optoelectronic converter is also located on the carrier.
  • the object of the present invention is to provide an optoelectronic module which enables the use of additional electrical circuits in a converter module cast into a casting body and which at the same time avoids undesired heating of the casting body. Furthermore, a connector arrangement for POF transmission systems is to be made available which enables optical fibers to be coupled to an optoelectronic module.
  • the electrical control and / or Receiving circuit is arranged outside the receiving and coupling part for the transmitting and / or receiving element, namely on a subcarrier, which lies in a plane that runs parallel to the longitudinal axis of the coupling area.
  • these components can be individually optimized. Only the transmitting and / or receiving element and possibly also a monitor diode are accommodated in the receiving and coupling part.
  • the arrangement of the subcarrier parallel to the longitudinal axis or optical axis of the coupling area enables the subcarrier to be arranged directly on a main circuit board.
  • the subcarrier with the electrical control and / or reception circuit represents a pre-testable unit. It is pointed out that the electrical control and / or reception circuit can, in addition to the actual converter module or reception module, also have the additional electrical circuit mentioned at the outset, by means of which a resonant behavior of the converter module, in particular an RCLED, can be reduced.
  • the receiving and coupling part forms a cylindrical recess, one end of which contains the transmitting and / or receiving element and the other end of which is the coupling area for one
  • the receiving and coupling part is accordingly essentially a cylinder, on one of which End in the potting material, the transmitting and / or receiving element is arranged and the other end is used to receive an optical fiber.
  • the optical axis of the transmitting and / or receiving element lies on the longitudinal axis of the cylinder or coupling area.
  • the inner wall of the cylinder serves for passive fiber guidance and fixing the fiber with respect to transverse deflections.
  • the carrier for the transmitting and / or receiving element is preferably a lead frame which provides the electrical connection of the transmitting and / or receiving element (in particular by means of bond wires between the individual contacts of the lead frame and the transmitting and / or receiving element).
  • the leadframe is electrically connected to the subcarrier and, for this purpose, has, for example, at one end an area which is angled by 90 ° and is fastened to the subcarrier.
  • the leadframe runs at least in the region of the receiving and coupling part, preferably perpendicular to the longitudinal axis of the coupling region or to the plane in which the
  • Subcarrier is arranged.
  • the potting material in the receiving and coupling part preferably forms an integrated lens on the side facing the coupling area.
  • a filler cap is introduced into the coupling area before the filling process, on the end face of which the coupling lens is formed in the negative. After filling the receiving and coupling part with the potting material and hardening of the material, the filler cap is removed again, the desired coupling lens being integrated in the
  • a fiber stop ring is also preferably provided in the potting material around the lens, which prevents the End face of an optical fiber inserted into the coupling area can touch the lens apex of the lens.
  • the fiber stop ring also leads to a positioning in the longitudinal direction of the coupling area, so that there is fiber guidance in all three spatial axes.
  • the optoelectronic module is mechanically coupled to a plug receptacle.
  • the coupling takes place via the outer wall of the receiving and coupling part.
  • Self-coupling structures can be provided, which enable simple and automatic coupling between the receiving and coupling part and the connector housing.
  • the corresponding optical fiber is introduced into the coupling area of the receptacle and coupling part.
  • the module is mechanically coupled to a naked fiber adapter.
  • the optical fiber is clamped, for example, with a clamp in a trough-shaped area of the naked fiber adapter.
  • the naked fiber adapter is formed in one piece with the receiving and coupling part and is formed by an extension of the cylindrical coupling area of the receiving and coupling part.
  • the arrangement of a naked fiber adapter represents a structurally simple and inexpensive variant for coupling the optical fiber to the optoelectronic module.
  • the subcarrier can be fastened to a main circuit board, in particular via an SMD assembly.
  • the main circuit board is preferably used as a heat sink for the subcarrier and the electrical components arranged thereon.
  • the subcarrier preferably has plated-through holes which, in addition to an electrical connection, also conduct heat between the electrical components of the subcarrier and the Prepare the main circuit board.
  • connection solder contacts on the underside of the subcarrier, via which the subcarrier is attached to the main circuit board by means of SMD mounting.
  • Lithographic techniques for circuit wiring make it possible to make the electrical subcarrier very compact, so that the entire transceiver structure is less than 13.5 mm wide and thus fulfills the industrial criterion "small form factor".
  • Coupling parts are arranged next to one another or also one above the other on the main circuit board, the receiving and coupling part possibly being held by other structures such as a connector housing.
  • the receiving and coupling part and / or the subcarrier preferably have self-coupling structures which enable automatic adjustment between these parts and / or with a main circuit board.
  • Corresponding structures can also be on a connector housing or
  • Naked fiber adapter can be provided.
  • the electrical contacts on the underside of the subcarrier are preferably designed such that they are as far apart as possible, for example by offset.
  • the underside of the subcarrier and the connector housing or a naked fiber adapter are thus designed such that plugging the module onto a main circuit board leads to a precise pre-adjustment and the module can be fixed in a subsequent soldering process without causing electrical faulty contacts.
  • a housing cover which surrounds the subcarrier and / or the one end of the receiving and coupling part.
  • the receiving and coupling part and / or the aforementioned housing cover is provided with an electrically conductive layer.
  • the receiving and coupling part and / or the housing cover consist of an electrically conductive plastic material, which is produced, for example, by adding electrically conductive beads to the plastic and is known per se.
  • the housing cover of the receiving and coupling part as well as the mass layer on the subcarrier form a cage that prevents or greatly reduces the penetration of interference radiation.
  • the receiving and coupling part is designed as a double chamber, which has a transmitting element and a receiving element in parallel, separate areas. Each of these parallel areas in turn has its own coupling area, over which one
  • Optical fiber is coupled.
  • two subcarriers are preferably provided, in each case one subcarrier for the transmitting element and one subcarrier for the receiving element.
  • a common housing cover provided with an electrically conductive layer preferably separates the two subcarriers and thus prevents electrical crosstalk.
  • this provides a connector arrangement with a connector housing and a housing assigned to the connector.
  • the connector arrangement is particularly suitable in connection with 02 00904
  • the opto-electronic module of claim 1 wherein the outer contour of the receiving and coupling part is coupled to the connector receptacle.
  • the plug has a protective bracket which is movable relative to the housing of the plug and has at least one opening for an optical fiber of the plug.
  • the protective bracket is arranged to protect against the light guide protruding from the housing of the plug.
  • the connector housing that can be coupled to the connector is designed in several stages, one stage of the connector housing serving as a stop for the protective bracket of the connector.
  • the protective bar comes to this stop and is then pulled back into the housing of the plug, the optical fiber or fibers emerging in the housing of the plug through the corresponding openings in the protective bar.
  • the arrangement of a protective bracket permits "blind” insertion, as is often required in automotive versions, and protects the end face of the fiber from dirt.
  • the fiber is protected in a kind of "heavy shank” (Japanese: Kuchiri) in such a way that the fiber can only emerge from the protective environment after the plug has been inserted into the connector housing and can protect itself from contamination without contamination corresponding transducer positioned.
  • the plug preferably has two optical fibers, the center axes of which are at a distance of 5 mm.
  • the plug preferably has a width of 13.5 mm, so that it meets the "Small Form Factor" industrial standard.
  • the protective bracket is preferably fastened to the housing of the plug by means of fastening arms, the fastening arms being resiliently and displaceably mounted on the plug housing.
  • fastening arms are provided, which protrude perpendicularly from the surface of the protective bracket arranged in front of the ends of the optical fibers.
  • the latching arms have latching elements, via which the plug can be latched in the connector housing.
  • Figure 1 shows a first embodiment of an optoelectronic module in a sectional view
  • Figure 2 shows the embodiment of Figure 1, wherein the module is coupled to a connector housing
  • Figure 3 shows a second embodiment of an optoelectronic module which is coupled to a connector housing
  • Figure 4a shows a third embodiment of an optoelectronic module in which the module is coupled to a bare fiber adapter
  • Figure 4b shows a cross section through the module of Figure 4a
  • FIG. 5 shows a fourth exemplary embodiment of an optoelectronic module, the module forming a naked fiber adapter;
  • FIG. 6a shows a perspective view of the plug of a plug arrangement for POF transmission systems,
  • FIG. 6b shows a sectional view of the plug of FIG. 6a
  • Figure 6c is a plan view of the locking device between the connector and connector housing of Figure 6b;
  • Figure 7 is a sectional view of a connector housing of a connector assembly for a POF transmission system
  • FIG. 8 shows the connection between a plug according to FIG. 6a, 6b and a plug housing according to FIG. 7 in a position in which the plug has not yet been fully inserted into the plug housing;
  • FIG 9 shows a connector assembly according to Figure 8, wherein the
  • Connector is fully inserted into the connector housing
  • FIG. 10 shows an optoelectronic module according to FIG. 1 in
  • FIG. 11 shows an optoelectronic module according to FIG. 3 in conjunction with a plug arrangement according to FIGS. 6 to 9.
  • FIG. 1 shows an optoelectronic module 1 which, as the main components, has a receiving and coupling part 2, also known as a CAI (Caviaty-AS-Interface) housing, and a subcarrier 3 with electrical components.
  • a receiving and coupling part 2 also known as a CAI (Caviaty-AS-Interface) housing
  • subcarrier 3 with electrical components.
  • the arrangement of CAI housing 2 and subcarrier 3 is covered by a housing cover 4.
  • the housing cover is positively connected to the CAI housing 2 via a projection 41.
  • the CAI housing 2 serves on the one hand to accommodate and Introduction of a carrier 5 with a transmitting and / or receiving element, which is designed here as an opto-electronic converter 6, and secondly the formation of a coupling region 27 for receiving an optical fiber.
  • the CAI housing has one at one end
  • Casting body 21 made of transparent potting material, which envelops the carrier 5 with the opto-electronic converter 6, which can be designed as a transmitting or receiving element.
  • a lens 22 is integrated in one piece in the transparent casting body 21 in order to increase the light transmission power to be coupled into an optical fiber by means of a transmission element or the light reception power imaged on a photodiode.
  • the casting body 21 forms a fiber stop ring or protective ring 23, which protects the integrated lens 22 against mechanical impairment due to fiber contact.
  • the CAI housing 2 is essentially designed as a cylinder 24 which encloses a cylindrical recess 25.
  • the casting body 21 is located at one end of the cylindrical recess.
  • the adjoining area 27 of the cylindrical recess, together with the inner wall 28 of the cylinder 24, serves for passive guidance and fixing with respect to transverse deflections of an optical fiber which can be inserted into the cylindrical recess 25.
  • the transmitting and / or receiving element 6 is centered on the optical axis 29 of the CAI housing.
  • a leadframe is used as the carrier 5, which is oriented perpendicular to the optical axis 29 and is soldered to the subcarrier 3 at its lower end 51, which is bent through 90 °, by means of an SMD contact. Furthermore, self-alignment markings 61, 62 are provided on the CAI housing and on the subcarrier, which serve for the self-adjustment and coupling of the CAI housing 2 to the subcarrier 3 or a plug housing which is coupled to the outer wall of the CAI housing 2 ( see Figure 2).
  • the subcarrier 3 is an at least two-layer printed circuit board which contains an external circuit 31 and an IC driver module 32 or a receiving module 32.
  • the external circuit 31 is used to optimize performance and is used in particular when using RCLEDs as transmission elements.
  • the subcarrier 3 assigns several plated-through holes 33
  • the through-contacts 33 provide very good heat dissipation from the transmitter module or receiver module 32 to one
  • Main circuit carrier instead, which serves as a heat sink coupled to the subcarrier 3.
  • connection contacts 34 are designed on the underside of the subcarrier.
  • the contacts 34 are made very compact by offset from one another with the greatest possible distance. Additional adjustment pins, advantageously with ground potential, can optionally be provided, which ensure a precise fit of the subcarrier into a main circuit carrier.
  • the subcarrier 3 runs in a plane which is arranged parallel to the optical axis 29 of the CAI housing.
  • the CAI housing 2 and the housing cover 4 have a metallically conductive surface which, together with the ground layer of the subcarrier, provides EMC shielding. To it is conceivable to form the CAI housing 2 and the housing cover 4 from an electrically conductive plastic material.
  • FIG. 2 shows the optoelectronic module of FIG. 1 in connection with an SMI connector arrangement for
  • Plastic fiber links are made from plastic fiber links.
  • SMI Small Multimedia Interface
  • connection with the opto-electronic module 1 can be used, in particular that the plug-in system explained below with reference to FIGS. 6 to 9.
  • the SMI connector housing 71 is plugged onto the cylinder 24 of the CAI housing 2.
  • the plug 72 is shown in plan view. It can be seen that a fiber 73 guided in the plug 72 is inserted in the cylindrical receiving opening 25 of the CAI housing 2 and with its end face in mechanical contact with the
  • Fiber stop ring 23 of the casting body 21 stands.
  • the connector housing 71 is arranged on a main circuit carrier 8, on which the subcarrier 3 is also located.
  • the connector housing 71 snaps into the main circuit carrier 8 via latching elements 71a.
  • CAI housing 2 and the connector housing 71 is used.
  • the CAI housing 2 has a lateral opening 2a through which the carrier 5 with the transmitting and / or receiving element 6 can be inserted into the CAI housing 2.
  • a potting material is also poured into the CAI housing via this opening 2a.
  • a filler cap is inserted into the receiving opening 25 and is removed again after the potting material has hardened.
  • this filler cap has the lens 22 assigned to the transmitting and / or receiving element 6.
  • FIG. 3 shows an alternative embodiment of an optoelectronic module 1 'in conjunction with a plug housing 71'.
  • the subcarrier 3 is placed below the CAI housing 2 and on the underside of the connector housing 71 '.
  • the height of the plug housing 71 had to be adjusted, i.e. the distance between the optical axis 29 and the main circuit carrier 8 is increased somewhat. Compared to the embodiment of Figures 1 and 2, however, is
  • the underside 71a 'of the plug housing 71' is made metallized, so that EMC shielding of the electronic components 32 and 31 is provided.
  • the CAI housing 2 is fixed to the connector housing 71 ', for example, by means of a clamp 71b' on the connector housing 71 'which engages around an edge of the CAI housing 2 in a form-fitting manner.
  • FIGS. 4a and 4b show an embodiment of an opto Electronic module shown, in which the connector housing of Figures 2 and 3 is replaced by a naked fiber adapter 9.
  • FIG. 4a shows a schematic longitudinal section corresponding to the illustration from FIGS. 1 to 3.
  • FIG. 4b shows a cross section along the line IVb-IVb from FIG. 4a.
  • the CAI housing 2 is inserted into the naked fiber adapter 9.
  • the CAI housing 2 and the naked fiber adapter 9 can also be made in one piece.
  • An optical fiber 12 is inserted into the CAI housing 2 and clamped in a trough-shaped region 91 of the naked fiber adapter 9 by means of a clamp 11.
  • the inside of the clamping device 11, the formation of the trough shape and the fixing of the clamping device in the naked fiber adapter 9 are designed in such a way that the fiber 12 is prevented from being pulled back.
  • clamp 11 covers the cylindrical CAI housing 2 at its open end, so that contamination is prevented.
  • a clamping device (insulation displacement device) can alternatively be provided in the area of the fiber coupling in the CAI housing itself.
  • FIG. 5 shows a further embodiment with a bare fiber connection, the CAI housing and the
  • Bare fiber adapter form a one-piece molding 13.
  • the molded part 13 is coated with a metallically conductive layer, so that EMC shielding is provided for the transmitting and / or receiving element.
  • the optical waveguide 12 is fixed by a clamping device 14 which surrounds the jacket of the optical waveguide 12 used.
  • the molded part 13 is firmly connected to the main circuit board 8 by means of clamping elements 13a.
  • the underside 13b is in turn metallized for electro-magnetic shielding.
  • FIGS. 6a, 6b show a novel plug of a plug arrangement, which is preferably coupled to the CAI transceiver 2 of the optoelectronic module of FIGS. 1 to 5.
  • the plug 15 has a housing 151 with two plastic optical fibers 152 arranged at a distance of 5 mm from one another and a protective bracket 153.
  • the protective bracket 153 is positioned in front of the end faces of the optical fibers 152 when the plug 15 is not inserted, so that the optical fiber ends protruding from the housing 151 are protected by the protective bracket 153.
  • the protective bracket In the area of the optical fibers 152, the protective bracket each has a cutout 153a.
  • the protective bracket 153 has three fastening arms 153b, by means of which it is slidably attached to the housing 151 of the plug.
  • Fastening arms 153b are resiliently guided in the corresponding grooves or receptacles of the housing 151 due to their geometric configuration.
  • the plug 15 has a locking part 154 for releasably locking the fastening arms 153b.
  • Unlocking part 165 which is designed, for example, as a web on the plug housing 71, 71 ', 16, enables the locking to be released by lifting the fastening arm 153b.
  • FIG. 6c shows the locking device from FIG. 6b separately as a plan view along the direction of extent of the unlocking part 165. It can be seen that the fastening bracket 153b assigned to the unlocking part 165 has the unlocking part 165 with a
  • Latch 153c overlaps. To unlock the connector 15 and connector housing 16, the catch 153c interacts with the locking part 154.
  • FIG. 7 shows a connector housing 16 belonging to the connector 15 of FIGS. 6a and 6b.
  • the connector housing 16 is designed in three stages.
  • a first stage 161 serves to receive and hold a CAI housing 2 according to FIGS. 1 to 5.
  • a second step 162 serves to guide the protective bracket 153 of the plug 15.
  • the stop 163 formed between the first and the second step represents a stop for the protective bracket 153 of the plug 15.
  • the third step 164 serves to guide the actual plug 15 or the housing 151 of the plug 15.
  • the first stage is designed as a circular opening, the diameter of which corresponds to the outer diameter of the cylinder 24 of the CAI housing 2.
  • the second stage has a rectangular shape corresponding to the outer shape of the protective bracket 153.
  • the third stage is also rectangular in shape in accordance with the cuboid shape of the housing 151 associated with the plug 15.
  • FIG. 8 shows that assembled in the plug housing 16 CAI housing 2 according to FIGS. 1 to 5.
  • the plug 15 is inserted into the plug housing 16 just enough that the protective bracket 153 bears against the protective bracket stop 163.
  • Unlocking part 165 for unlocking the protective bracket 153. Also shown schematically is a connector lock 156, by means of which the fully inserted connector 15 is locked on the connector housing 16. Of course, the plug lock 156 may also be used for unlocking.
  • FIG. 9 shows the plug 15 after it has been completely inserted into the plug housing 16. It can be seen that the protective bracket 153 is opposite the one shown in FIG.
  • the protective bracket 153 withdraws into the housing 151 of the plug 15 as soon as it reaches the step stop 163 of the plug housing 16.
  • the path is dimensioned such that the fiber 152 is placed in front of the integrated lens 22 in the casting body 21 and the connector 15 engages at the same time.
  • the plug 15 can then only be removed from the plug housing 16 again by releasing the release.
  • FIGS. 10 and 11 show the previously described new plug arrangement in connection with an opto-electronic module 1 according to FIGS. 1 and 3, respectively. The end position is shown with the plug 15 completely inserted into the plug housing 16.
  • the outer dimensions of the plug housing 16 are such that the plug housing 16 is on the
  • the transparent casting body 21 in this exemplary embodiment represents a lateral wall of the cylindrical CAI housing 2.
  • the CAI housing 2 is a cylinder which is open on both sides, one side of the cylinder being closed off by the casting body 21.
  • the carrier 5 is bent S-shaped so that it is completely surrounded by the casting body 21.
  • a preferably metallized protective cap 17 is positively connected on the one hand to the plug housing 16 and on the other hand to the main circuit board 8.
  • the carrier 5 is straight in this embodiment.
  • an embodiment of the CAI housing 2 can be used in which one end of the cylindrical CAI housing 2 is closed by a housing cover 4, 2b, as shown in FIGS. 1 to 5 and 10 and 11.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Module optoélectronique (1) qui comporte un élément émetteur et / ou récepteur (6), un support (5) sur lequel est placé l'élément émetteur et / ou récepteur (6), une partie de réception et de couplage (2) dans laquelle est logé l'élément émetteur et / ou récepteur (6), qui est remplie au moins partiellement d'une matière d'enrobage (21) et qui possède une zone de couplage (27) destinée au couplage d'une fibre optique, et un circuit électrique de commande et / ou de réception (32) pour l'élément émetteur et / ou récepteur (6). Selon la présente invention, le circuit électrique de commande et / ou de réception (32) est placé à l'extérieur de la partie de réception et / ou de couplage (2) sur un sous-support (3) se trouvant dans un plan qui est parallèle à l'axe longitudinal de la zone de couplage (27). Cela permet d'obtenir un corps moulé transparent très petit à partir de la matière d'enrobage (21), corps qui possède un comportement de dilatation largement homogène. Sur la plage de température maximale allant de -40 °C à 85 °C, tel que cela est nécessaire dans les applications automobiles, le corps moulé ne subit donc que de petites contraintes si bien que la stabilité de cycle s'en trouve considérablement améliorée.
EP02722007A 2002-03-08 2002-03-08 Module optoelectronique et ensemble fiche male Ceased EP1483609A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2002/000904 WO2003076998A1 (fr) 2002-03-08 2002-03-08 Module optoelectronique et ensemble fiche male

Publications (1)

Publication Number Publication Date
EP1483609A1 true EP1483609A1 (fr) 2004-12-08

Family

ID=27797460

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02722007A Ceased EP1483609A1 (fr) 2002-03-08 2002-03-08 Module optoelectronique et ensemble fiche male

Country Status (3)

Country Link
US (1) US7371012B2 (fr)
EP (1) EP1483609A1 (fr)
WO (1) WO2003076998A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319900A1 (de) * 2003-04-29 2004-11-25 Infineon Technologies Ag Optoelektronische Sende- und/oder Empfangsanordnung
DE10351704B4 (de) * 2003-11-03 2008-07-31 Infineon Technologies Ag Optoelektronische Sende- und/oder Empfangsanordnung mit einem opto-elektronischen Wandlermodul
US7805084B2 (en) * 2004-05-20 2010-09-28 Finisar Corporation Dual stage modular optical devices
US7334948B2 (en) * 2004-05-21 2008-02-26 Finisar Corporation Modular optical device with component insert
US20060153507A1 (en) * 2004-05-21 2006-07-13 Togami Chris K Modular optical devices compatible with legacy form factors
JP4210240B2 (ja) * 2004-06-03 2009-01-14 ローム株式会社 光通信モジュール
US20060110110A1 (en) * 2004-11-22 2006-05-25 Yi Robert H Optical turn system for optoelectronic modules
DE102007044555A1 (de) * 2007-07-18 2009-01-22 Siemens Ag Optische Koppelvorrichtung und Verfahren zu deren Herstellung
GB2454813B (en) * 2007-11-21 2010-06-09 Intel Corp High-volume on-wafer heterogeneous packaging of optical interconnects
CN101728686A (zh) * 2008-10-21 2010-06-09 鸿富锦精密工业（深圳）有限公司 连接器
US7731433B1 (en) * 2008-12-05 2010-06-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device
WO2010143175A1 (fr) * 2009-06-12 2010-12-16 Firecomms Limited Module de dispositif optique et procédé de fabrication
US8265487B2 (en) * 2009-07-29 2012-09-11 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Half-duplex, single-fiber (S-F) optical transceiver module and method
GB201012829D0 (en) * 2010-07-30 2010-09-15 Oclaro Technology Ltd Enclosure for a laser package and laser package comprising same
KR101266616B1 (ko) * 2011-11-29 2013-05-22 엘에스엠트론 주식회사 광전 배선 모듈
US9435965B2 (en) * 2012-02-01 2016-09-06 Cisco Technology, Inc. Single mode fiber array connector for opto-electronic transceivers
JP5962980B2 (ja) * 2012-08-09 2016-08-03 ソニー株式会社 光電気複合モジュール
JP5958364B2 (ja) * 2013-01-28 2016-07-27 日立金属株式会社 光モジュール
US9207414B2 (en) * 2013-12-04 2015-12-08 Opto Media Technology Inc. Optical engine
US20150323749A1 (en) * 2014-05-11 2015-11-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Surface mount device (smd) optical port
US10083885B1 (en) * 2017-06-06 2018-09-25 Cree, Inc. Multi-layer potting for electronic modules
US10598860B2 (en) * 2018-03-14 2020-03-24 Globalfoundries Inc. Photonic die fan out package with edge fiber coupling interface and related methods

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259052A (en) * 1984-06-08 1993-11-02 Amp Incorporated High precision optical fiber connectors
DE3604764A1 (de) 1986-02-14 1987-08-20 Dynamit Nobel Ag Elektrische steckverbindung
JPS63133683A (ja) * 1986-11-26 1988-06-06 Fujitsu Ltd 半導体発光装置
US5026134A (en) * 1988-03-01 1991-06-25 Kabushiki Kaisha Toshiba Optical communication apparatus with base for fixing elements
AU658999B2 (en) * 1992-05-20 1995-05-04 Diamond S.A. Plug connector for optical fibers
EP0613030B1 (fr) 1993-02-24 1998-02-04 Sumitomo Wiring Systems, Ltd. Connecteur fibre-optique
US5548676A (en) * 1993-06-29 1996-08-20 Savage, Jr.; John M. Light pipe optical coupling between led and fiber optics cable
US5879173A (en) * 1995-01-13 1999-03-09 Methode Electronics, Inc. Removable transceiver module and receptacle
US6220878B1 (en) * 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
DE29503807U1 (de) * 1995-03-06 1995-04-20 Diamond Sa Vorrichtung zum Ankoppeln eines Lichtwellenleiter-Steckerstifts an ein optisches Element
US6014476A (en) * 1996-05-24 2000-01-11 Siemens Aktiengesellschaft Electro-optical module
US5768456A (en) * 1996-11-22 1998-06-16 Motorola, Inc. Optoelectronic package including photonic device mounted in flexible substrate
JPH11119064A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 光伝送端末装置
DE19823691A1 (de) * 1998-05-27 1999-12-02 Siemens Ag Gehäuseanordnung für Lasermodul
AU5444399A (en) * 1998-08-28 2000-03-21 Fujikura Ltd. Method of mounting optical module and optical element, and optical module with receptacle
DE19909242A1 (de) 1999-02-22 2000-08-31 Siemens Ag Verfahren und Gießform zum Herstellen eines elektrooptischen Moduls und elektrooptisches Modul
US20030026168A1 (en) * 2001-07-16 2003-02-06 Input/Output, Inc. Apparatus and method for seismic data acquisition
US6890206B2 (en) * 2002-03-05 2005-05-10 Jds Uniphase Corporation Optical transceiver latch

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03076998A1 *

Also Published As

Publication number Publication date
US20060013542A1 (en) 2006-01-19
WO2003076998A1 (fr) 2003-09-18
US7371012B2 (en) 2008-05-13

Similar Documents

Publication Publication Date Title
EP1483609A1 (fr) Module optoelectronique et ensemble fiche male
EP1174745B1 (fr) Module optoélectronique montable en surface
DE102008012570B4 (de) Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE19947889C2 (de) Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik
DE10001875C2 (de) Optisches Sende-/Empfangsmodul mit internem Lichtwellenleiter
DE69723630T2 (de) Optoelektronisches Modul und Verfahren zu dessen Herstellung
DE10004411A1 (de) Elektrooptisches Sende-/Empfangsmodul und Verfahren zu seiner Herstellung
DE102005026442A1 (de) Oberflächenmontagemodul
DE10351704B4 (de) Optoelektronische Sende- und/oder Empfangsanordnung mit einem opto-elektronischen Wandlermodul
EP1483613B1 (fr) Partie de reception et de couplage pour un element emetteur optoelectronique
DE69535016T2 (de) Hermetische kapselung von optoelektronischen komponenten
EP1330670B1 (fr) Agencement et procede pour bloquer des composants en position dans des cartes de circuits
DE10237403B4 (de) Opto-elektronisches Sende- und/oder Empfangsmodul und optischer Stecker
DE10150986A1 (de) Sende- und/oder Empfangseinrichtung
DE102015102717A1 (de) Ausgeformte Leiterrahmen für eine Leiterplatte-zu-Leiterplatte-Verbindung
DE102006045271B4 (de) Verfahren zur Herstellung eines optischen Sende- und/oder Empfangsmoduls
EP1477833B1 (fr) Dispositif optoélectronique émetteur et/ou récepteur
DE102006012780B3 (de) Optokoppler zur Übertragung von optischen in elektrische Signale und umgekehrt
DE10023463A1 (de) Steckverbinder
DE102016216811A1 (de) Optokoppler mit einer optischen Übertragungsstrecke und elektrischen Anschlüssen und elektronische Baugruppe, in der ein solcher Optokoppler eingebaut ist
DE10310616B3 (de) Modul mit Schaltungsträger und elektrooptischem Wandler sowie Verfahren zur Herstellung desselben
EP1447696B1 (fr) Composant optoéléctronique modulaire
DE19601949B4 (de) System zum Schaffen einer statischen Entladung und einer elektromagnetischen Abschirmung
DE10002328B4 (de) Optische Sende- und Empfangseinheit mit einer zwei Lichtdurchgangsöffnungen aufweisenden Montageplattform
DE102005002874B3 (de) Optoelektronisches Bauelement mit integrierter Wellenleiter-Ankopplung für passive Justage

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20040927

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: SCHUNK, NIKOLAUS

RTI1 Title (correction)

Free format text: OPTOELECTRONIC MODULE

17Q First examination report despatched

Effective date: 20050309

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20071001