EP1382048A4 - Condensateurs electrolytiques et leur procede de fabrication - Google Patents

Condensateurs electrolytiques et leur procede de fabrication

Info

Publication number
EP1382048A4
EP1382048A4 EP02700547A EP02700547A EP1382048A4 EP 1382048 A4 EP1382048 A4 EP 1382048A4 EP 02700547 A EP02700547 A EP 02700547A EP 02700547 A EP02700547 A EP 02700547A EP 1382048 A4 EP1382048 A4 EP 1382048A4
Authority
EP
European Patent Office
Prior art keywords
film
valve
aluminum
surface area
high specific
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02700547A
Other languages
German (de)
English (en)
Other versions
EP1382048A2 (fr
Inventor
Dina Katsir
Zvi Finkelstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acktar Ltd
Original Assignee
Acktar Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acktar Ltd filed Critical Acktar Ltd
Publication of EP1382048A2 publication Critical patent/EP1382048A2/fr
Publication of EP1382048A4 publication Critical patent/EP1382048A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H01G9/0032—Processes of manufacture formation of the dielectric layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H01G9/0036—Formation of the solid electrolyte layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Definitions

  • the present invention relates to a method for making electrolytic capacitors and especially flexible and integrated electrolytic capacitors and capacitors for dynamic RAM (DRAM) applications, and in particular those having a high surface area anode.
  • DRAM dynamic RAM
  • An electrolytic capacitor is a capacitor in which one plate is metallic and the other plate is an electrolyte. Intervening between the two plates is a dielectric consisting of a surface oxide coating (e.g. of aluminum oxide) on the metal plate; it is known that the electrostatic capacity of such capacitors may be increased by including a complex oxide such as barium titanate or barium lanthanate with the oxide coating.
  • a complex oxide such as barium titanate or barium lanthanate with the oxide coating.
  • the metal plate on which the dielectric coating is formed is referred to as the anode.
  • anode is used herein to refer both to the metal plate itself and to the combination of the metal plate with the dielectric coating. It will be clear from the context, which meaning of “anode” is intended.
  • a transition between ionic conduction in the electrolyte and electronic conduction in an external circuit is provided by a second metal plate, which is referred to herein as the cathode.
  • the anode and the cathode are referred to herein collectively as electrodes.
  • the "plates" are in fact thin films.
  • the metal of the electrodes is a valve metal, i.e., a metal which, when oxidized, allows current to pass if used as a cathode but opposes the flow of current if used as an anode.
  • the capacitance of an electrolytic capacitor is proportional to the surface areas of its two plates.
  • the surface areas of the electrodes are increased by etching, but in the case of thin film electrodes it is questionable whether they are capable of being etched sufficiently to afford the desired increase of surface area, while at the same time maintaining the mechanical integrity of the electrodes.
  • Vacuum deposition for increasing the surface areas of capacitor electrodes is known.
  • Kakinoki et al. in US Patent No.4,970,626, describe vacuum deposition of titanium on aluminum foil, at an angle, to produce a titanium surface with a rough, columnar structure.
  • Disadvantages of this method include the large costs of working with relatively thick layers of titanium.
  • Ohtika et al. make an aluminum capacitor plate including a sponge-like layer formed by chemical or electrochemical etching, overplated by vacuum deposition of titanium particles.
  • a disadvantage of this method is the additional cost of working with two sysyems: first etching in electrochemical baths and then sputtering in a vacuum system.
  • Drake in US Patent No. 4,309,810, also teaches vacuum deposition of a metal vapor at a low angle onto a foil substrate, and presents an example of the deposition of aluminum on aluminum to give a columnar structure; however, the product has been found to be too brittle for use in electrolytic capacitors.
  • Neumann et al. in German Patent No. 4,127,743, describe vacuum deposition of aluminum on aluminum in a low pressure oxygen atmosphere to give a surface structure of columns of aluminum separated by aluminum oxide.
  • Allegret et al. in US Patents Nos. 5,431 ,971 and 5,482,743, also describe co-deposition, under a low pressure oxidizing atmosphere, of a mixture of aluminum and aluminum oxide.
  • Such mixed AI/AI 2 O 3 surfaces are more robust mechanically than pure aluminum surfaces, but electrolytic capacitors incorporating them are known to have relatively high resistive losses and relatively low stability over time.
  • electrolytic capacitors incorporating them are known to have relatively high resistive losses and relatively low stability over time.
  • the presence of both aluminum and large quantities of aluminum oxide in the surface of the foil makes subsequent treatments such as conventional chemical or electrochemical stabilization, and structure coarsening by annealing, both difficult and less effective.
  • TCNQ complexes As solid electrolytes, and to coat them on electrolytically anodized metal surfaces by vapor deposition techniques (see e.g., JP 6036966, and JP 62094912, -3 and -4).
  • JP 63069149 polyethylene oxide and a lithium salt are vapor deposited on a substrate for use as a solid electrolyte.
  • a solid electrolyte need not be TCNQ and it need not be vapor deposited.
  • capacitors are made by dipping capacitor elements in molten TCNQ complex salt, or in a solution thereof, respectively.
  • a capacitor is made by sequentially screen printing on a valve metal (e.g. Ta) substrate, a mixture of valve metal (e.g. Ta) powder plus binder, sintering the printed layer, forming a dielectric oxide, applying a solid manganese dioxide electrolyte layer, and forming a counter electrode.
  • JP 63105962 a thin film of solid electrolyte, said to have superior ionic conductivity, and selected from RbCI, Rbl, KCI, Kl, CuCI and Cul is deposited on a copperplate by thermal evaporation.
  • an integrated capacitor typically comprising a "sandwich" formed by two layers of suitably doped polycrystalline silicon separated by a film or thin layer of silicon oxide; one of the silicon layers can be replaced by aluminum.
  • a high specific surface area vapor deposited valve metal film has not been previously suggested as the anode in an integrated electrolytic capacitor, nor when this is combined with a vapor-deposited film of solid electrolyte, nor when combined with an oxide layer produced by plasma anodizing and a vapor-deposited film of solid electrolyte.
  • the present invention provides, in one aspect, a method for making an integrated electrolytic capacitor, wherein a substrate is coated with at least one sequence of each of the following layers: a vacuum deposited film having a high specific surface area, which is selected from the group consisting of valve metals and mixtures of valve metals with valve metal oxides; superimposed on the film having a high specific surface area, at least one dielectric film comprising a substance selected from the group consisting of valve metal oxides, their complex oxides with at least one rare earth metal and their complex oxides with at least one alkaline earth metal; and a solid electrolyte film superimposed on the at least one film. It will be appreciated that applying more than one sequence of layers will afford a capacitor with a progressively increasing capacitance.
  • the invention provides a method for making an integrated electrolytic capacitor, wherein a substrate is coated with at least one sequence of each of the following layers: a vacuum deposited film having a high specific surface area, the film being selected from the group consisting of valve metals and mixtures of valve metals with valve metal oxides; superimposed on the film having a high specific surface area, at least one film of an oxide applied by electrolytic anodization, of at least one valve metal present in the vacuum deposited film having a high specific surface area; and a solid electrolyte film superimposed on the at least one film.
  • the invention provides a method for making an integrated electrolytic capacitor, wherein a substrate is coated with each of the following layers: a vacuum deposited film of high specific surface area, which has a fractal surficial structure including both a valve metal and an oxide thereof, provided that where the valve metal is aluminum and the film having a high specific surface area contains no more than about 30.3% of the total aluminum as aluminum oxide; superimposed on the film having a high specific surface area, at least one film of an oxide applied by electrolytic anodization, of at least one valve metal present in the vacuum deposited film having a high specific surface area; and a solid electrolyte film superimposed on the at least one film.
  • the invention provides a method for making an integrated electrolytic capacitor, wherein a substrate is coated with each of the following layers: a vacuum deposited film of high specific surface area, which is selected from the group consisting of valve metals and mixtures of valve metals with valve metal oxides; superimposed on the film a discontinuous non-anodized layer of an oxide of a valve metal; and a solid electrolyte film superimposed on the at least one film.
  • the invention provides a method for making a plurality of integrated electrolytic capacitors, wherein pre-designated areas in a planar metallic substrate are each coated with at least one sequence of each of the following layers: a vacuum deposited film having a high specific surface area, which is selected from the group consisting of valve metals and mixtures of valve metals with valve metal oxides; superimposed on the film having a high specific surface area, at least one dielectric film comprising a substance selected from the group consisting of valve metal oxides, their complex oxides with at least one rare earth metal and their complex oxides with at least one alkaline earth metal; and a solid electrolyte film superimposed on the at least one film; connecting electrically and mechanically the solid electrolyte film in each of the pre- designated areas with a metallic member parallel to the substrate; if desired injecting insulating material into the voids between each pre-designated area; and thereafter cutting through the substrate and the metallic member, and the insulating material if present, in order to separate from each other the
  • an integrated electrolytic capacitor which comprises at least one sequence of each of the following layers coated on a substrate: a non-anodized vacuum deposited film having a high specific surface area, which is selected from the group consisting of valve metals and mixtures of valve metals with valve metal oxides; superimposed on the film having a high specific surface area, at least one dielectric film comprising a substance selected from the group consisting of valve metal oxides, their complex oxides with at least one rare earth metal and their complex oxides with at least one alkaline earth metal; an optional additional metal oxide film formed by electrolytic anodization and superimposed on the at least one film; and a solid electrolyte film superimposed on the at least one film, or additionally or alternatively on the additional metal oxide film if present.
  • a wound capacitor which comprises a vacuum deposited film having a high specific surface area, and superimposed thereon a vacuum deposited solid electrolyte film.
  • the integrated electrolytic capacitor of the invention comprises a substrate coated with each of the following layers: a vacuum deposited film of high specific surface area, which has a fractal surficial structure including both a valve metal and an oxide thereof; superimposed on the film having a high specific surface area, at least one film of an oxide applied by electrolytic anodization, of at least one valve metal present in the vacuum deposited film having a high specific surface area; and a solid electrolyte film superimposed on the at least one film.
  • the integrated electrolytic capacitor of the invention comprises an electrically conductive substrate; a dielectric coating, on the surface of the substrate, having a bimodal morphology, in that the coating includes both a non- electrolytically formed valve or other metal oxide layer and an electrolytically formed valve metal oxide layer, wherein the non-electrolytically formed layer is homogeneous and the electrolytically formed layer is increasingly porous towards its outer surface; a solid electrolyte film superimposed on the dielectric coating; and an optional vacuum deposited metal film superimposed on the solid electrolyte film.
  • the present invention still further includes a method for making an electrolytic capacitor, wherein a metallic foil substrate is coated with at least one sequence of each of the following layers: a vacuum deposited film having a high specific surface area, which is selected from valve metals and mixtures of valve metals with valve metal oxides; superimposed on such film having a high specific surface area, at least one dielectric film comprising a substance selected from valve metal oxides, their complex oxides with at least one rare earth metal and their complex oxides with at least one alkaline earth metal; and a solid electrolyte film superimposed on said at least one film; provided that this method includes at least one of the following features: forming the at least one dielectric film by a procedure selected from vacuum deposition and plasma anodic oxidation; and/or forming the solid electrolyte film by vacuum deposition.
  • capacitor comprising a metallic foil substrate which is coated as set forth in the preceding paragraph.
  • FIGURE 1A is a photomicrograph of an aluminum surface of an anode or cathode according to an embodiment of the present invention at a magnification of 2000;
  • FIGURE 1B is a photomicrograph of the surface of FIGURE 1A at a magnification of 20,000;
  • FIGURE 2 is a contour plot of capacitance vs. oxygen pressure (as a fraction of nitrogen pressure) and aluminum deposition rate;
  • FIGURE 3A is a schematic cross-section of an aluminum foil with a smooth surface
  • FIGURE 3B (prior art) is a schematic cross-section of the foil of FIGURE 2A anodized conventionally;
  • FIGURE 3C is a schematic cross-section of the foil of FIGURE 2A with a discontinuous surface deposit of aluminum oxide;
  • FIGURE 3D is a schematic cross-section of the foil of FIGURE 2C after anodization
  • FIGURE 3E is a schematic cross-section of an aluminum foil with a rough surface, after deposition of a discontinuous surface oxide deposit and after anodization;
  • FIGURE 4 compares capacitances of prior art anodes with capacitances of anodes for use according to an embodiment of the present invention.
  • FIGURE 5 is a schematic cross-section of a capacitor made according to an embodiment of the present invention.
  • valve metal means any one or more of aluminum, titanium, tantalum niobium, zirconium, silicon, thorium, cadmium and tungsten
  • alkaline earth metal means any one or more of magnesium, calcium, strontium and barium
  • a rare earth metal means any one or more of scandium, yttrium, lanthanum and the elements of atomic numbers 58-71
  • anodization means liquid phase electrolytic anodic oxidation
  • plasma anodic oxidation means gas phase plasma anodic oxidation (which is also known outside the present application as "plasma anodization").
  • the substrate used in the method of the invention may be made from any suitable material including metals and polymers. As mentioned above, however, the preferred substrate is one which is adapted to be used as a printed circuit board substrate. Printed circuit boards and substrates used therefor are very well known, and per se do not form an innovative part of the present invention.
  • a valve metal such as aluminum is evaporated onto a substrate in a low pressure, preferably anhydrous, atmosphere of an inert gas (e.g. having a pressure in the range between about 10 "3 torr and about 10 "2 torr), preferably in the presence of a still lower, e.g. by between one and two orders of magnitude lower, pressure of oxygen.
  • the high specific area film may have a cauliflower-like morphology.
  • the inert gas may be any gas that does not react with the valve metal under the process conditions, including noble gases such as helium and argon.
  • the valve metal is aluminum and the inert gas is nitrogen.
  • oxygen is introduced into the inert atmosphere prior to the evaporating of the at least one valve metal, and preferably the substrate is heated to between about 350°C and about 550°C during the evaporating of the at least one valve metal.
  • the thus-formed valve metal film has a fractal structure, with a fractal dimension greater than 2.
  • Capacitors made according to this embodiment of the method of the invention, where the anode is based on such valve metal film (which may then be coated with a film of e.g. an oxide of the same or different valve metal) and/or a cathode produced preferably by a similar vapor deposition procedure and having preferably a similar structure will have a higher capacitance than prior art cathodes of similar bulk composition and overall dimensions.
  • the fractal surficial structure allows the deposition (if desired) of relatively thick dielectric layers (e.g. a valve metal oxide) while preserving the surface area of the metal surface.
  • the high specific area film is provided by vapor deposition, increasing the surface area of a valve metal anode does not involve removing material (as e.g. in etching), and because the cathode is also made by vapor deposition (and thus, preferably also the other layers mentioned herein), the result is that capacitors having desirable relatively thinner electrodes may be obtained according to the method of the invention.
  • the fractal surficial structure may be formed on any substrate, including nonmetallic and even insulating substrates. This applies to the high specific area film of the anode, and/or to the valve metal film of the cathode, vacuum deposited on the solid electrolyte film.
  • the first valve metal film preferably a valve metal oxide film, optionally as a discontinuous surface layer. If the surface of the first valve metal film is rough, then to the extent that sharp points on the surface are covered by the oxide (etc.) thus deposited, those points are isolated from the surface-area-reducing effects of the optional subsequent electrolytic anodization. On smooth portions of an otherwise rough foil electrode surface in between the sharp points, the subsequent optional electrolytic anodization takes place predominantly on portions of the surface left exposed after the deposition, thereby actually increasing the area of the metal-dielectric interface.
  • the described optional electrolytic anodization gives an anode with its dielectric layer having a bimodal morphology; the non-electrolytically formed, preferably discontinuous layer is homogeneous, whereas the electrolytically formed layer is increasingly porous towards its outer surface, the pores being predominantly cylindrical and perpendicular to the outer surface.
  • the non-electrolytically formed surface oxide layer is preferably deposited by evaporation, either of the valve metal in presence of low pressure oxygen, or of the valve metal oxide itself.
  • the valve metal of the high specific are film be the same as the valve metal of the dielectric film.
  • the capacitor according to the invention - or made according to the method of the invention - includes, superimposed on the film having a high specific surface area, at least one dielectric film comprising a substance selected from the group consisting of valve metal oxides, their complex oxides with at least one rare earth metal and their complex oxides with at least one alkaline earth metal (e.g. magnesium, strontium or barium titanate).
  • the dielectric may consist of one or a plurality of films in which the said complex oxides form one or more separate layers or are intermixed with valve metal oxide(s) and includes also the case where the dielectric contains valve metal oxide(s) e.g. aluminum oxide together with e.g. an alkaline earth/rare earth complex oxide such as barium lanthanate.
  • the at least one dielectric film may be formed e.g. by a procedure selected from: plasma anodic oxidation; evaporating at least one valve metal onto the vacuum deposited film having a high specific surface area, in an oxidizing atmosphere, evaporating the oxide directly onto the vacuum deposited film having a high specific surface area, and thermally oxidizing the vacuum deposited film having a high specific surface area.
  • the dielectric film may be formed as a discontinuous layer.
  • an additional metal oxide film by electrolytic anodization, between the at least one dielectric film and the solid electrolyte film.
  • at least one metal film is vacuum deposited onto the solid electrolyte film.
  • valve metals in the various layers are selected independently from the list defined above and therefore may be the same (e.g. either aluminum or tantalum) or different, e.g. one or more layers of aluminum with ome or more layers of tantalum.
  • the present method comprises forming the at least one dielectric film by a procedure selected from vacuum deposition and plasma anodic oxidation, and/or forming the solid electrolyte film by vacuum deposition.
  • a procedure selected from vacuum deposition and plasma anodic oxidation it is presently more preferred to form the at least one dielectric film by a procedure selected from vacuum deposition and plasma anodic oxidation, and to form the solid electrolyte film by vacuum deposition, so that, without prejudice to embodiments of the invention which include electrolytic anodization, it is presently particularly preferred to carry out all steps in the present method in the gas phase.
  • the film having a high specific surface area may be vacuum deposited under such conditions that it has a columnar structure.
  • the substrate is a planar metallic substrate
  • the solid electrolyte film is connected electrically and mechanically to a metallic member parallel to and substantially coextensive with the substrate
  • the capacitor contains if desired injected insulating material in any internal or external voids, if present.
  • Aluminum was evaporated, by thermal resistive evaporation, onto clean aluminum foil substrates held at a temperature of 300°C in an anhydrous atmosphere of nitrogen at a pressure of between 0.002 torr and 0.005 torr and oxygen at pressures between 0.0002 torr and 0.0005 torr.
  • the deposition rate was about 300A/sec.
  • FIGS. 1A and 1 B are photomicrographs of a fractal aluminum surface so prepared.
  • This surface has a cauliflower-like morphology, as described for materials other than valve metals as defined herein, byBolzet al., in US Patent No.5,571,158.
  • the "cauliflower heads” are about 2 microns across.
  • the "florets” are about 0.2 microns across, so that the surface is self-similar at least on a distance scale from 0.2 microns to 2 microns. This is confirmed by the visual appearance of the surface.
  • this surface is black matte (diffusely reflective), showing that this surface has a fractal structure on the length scale of the wavelengths of visible light.
  • the aluminum be deposited to a thickness of between about 3 microns and about 6 microns.
  • the preferred range of oxygen pressures is between one and two orders of magnitude less than the nitrogen pressure. Less oxygen than this produces electrodes of inferior mechanical strength, while more oxygen produces capacitors of lower capacitance, because excessive aluminum oxide is included with the aluminum.
  • Figure 2 is a contour plot of the capacitance C of cathodes so produced, under nitrogen pressures between 0.002 torr and 0.004 torr, as a function of aluminum deposition rate, and as a function of oxygen pressure, expressed as a fraction of nitrogen pressure.
  • the capacitances of Figure 2 were measured in an ethylene-glycol-based electrolyte having a conductivity of 8:5 ⁇ -cm.
  • the cathodes were prepared by thermal resistive evaporation. Electron beam deposition would provide a faster deposition rate and would have different optimum process parameters.
  • the cathodes of Figure 2 were prepared by evaporating aluminum onto only one side of the aluminum foil substrates. If aluminum had been evaporated onto both sides of the substrates, the capacitances would have been doubled.
  • the surfaces may be coarsened by annealing at 330°C to 550°C under a reduced pressure of between about 10 "4 torr and about 10 "5 torr subsequent to evaporation.
  • This annealing is more effective on the fractal surfaces according to a preferred embodiment of the present invention than on the columnar surfaces of Neumann et al. because the excessive aluminum oxide in the surface of Neumann et al. inhibits the coarsening associated with annealing.
  • Annealing is also more effective on the surfaces of the present invention, which in a particular embodiment may include up to about 30% aluminum oxide, than on the surfaces of A ⁇ egret et al., which include more than 50% aluminum oxide.
  • FIGS. 3A through 3E illustrate the principle of a particular embodiment of the present invention as regards increasing the surface area of the interface between a valve metal film of and an overlying oxide dielectric layer in an anode.
  • FIGURE 3A shows, schematically, a cross-section of an aluminum foil 10 with a smooth, flat upper surface 12.
  • Figure 3B shows foil 10 after anodizing, with a dielectric layer 14 of aluminum oxide now present on interface 16.
  • FIG. 3C shows foil 10 after the deposition thereon of regions 18 of a discontinuous layer of aluminum oxide, separated by gaps 20.
  • Figure 3D shows foil 10 after deposition and subsequent anodizing to form a dielectric layer 14' of aluminum oxide. Because anodizing proceeds preferentially in gaps 20, interface 16' between foil 10 and layer 14' is not flat.
  • Figure 3E shows schematically another aluminum foil 22, the upper surface of which 24 has been roughened, for example by depositing thereon a layer of a valve metal such as aluminum by the preferred vapor deposition method according to the present invention, or by conventional etching of the upper surface.
  • a discontinuous layer of valve metal oxide has been deposited on surface 24 in accordance with the present invention.
  • This discontinuous layer consists of discrete regions 26 deposited at random on surface 24. Some of regions 26 cover peaks, such as peak 30, in surface 24, protecting those peaks from subsequent degradation when a more continuous dielectric layer grows downward into foil 22 in the course of anodization.
  • the layer formed by anodization has two portions, a lower barrier portion 28 and an upper portion 27.
  • the discontinuous layer is deposited to a thickness equal to or slightly less than the thickness of the layer formed by anodization, and with a density and porosity comparable to the density and porosity of the barrier portion of the anodized layer.
  • portions 27 and 28 that grow on the peaks on the valve metal surface are relatively thin, as illustrated in Figure 3E.
  • the thickness of the layer formed by anodization is between 10 and 15 A/V, where V is the forming voltage, which is generally between 1.5 and 2 times the working voltage of the final capacitor.
  • Example 2 Deposition of Discontinuous Aluminum Oxide Layer
  • Aluminum foils with fractal surfaces were prepared as in Example 1 , except that the foils were heated as described above during evaporation of the aluminum to promote the formation of coarser surface structures.
  • a discontinuous layer of aluminum oxide 500 A to 2000 A thick, was deposited by thermal resistive evaporation of aluminum in a pure oxygen atmosphere, at oxygen pressures of between 0.0015 torr and 0.007 torr. This deposition was effected in the same chamber as that in which the foil was prepared, to avoid uncontrolled oxidation in ambient air. Layer thicknesses were measured as described by Mattox on page 569.
  • aluminum oxide may be evaporated directly onto foil 10.
  • the direct evaporation of refractory oxides such as aluminum oxide has the disadvantage of requiring more heat than evaporation of the corresponding metals.
  • other valve metal oxides such as titanium oxide, may be deposited in discontinuous layers above discontinuous aluminum oxide layer 18. If this supplemental deposition is effected by evaporating the further valve metal in an oxygen atmosphere, the preferred oxygen pressure is e.g. between 0.003 torr and 0.007 torr, of the same order of magnitude as in the case of evaporation of aluminum.
  • Figure 4 compares the range of capacitances obtained for aluminum foil anodes, followed sequentially by discontinuous deposition of aluminum oxide and standard electrolytic anodization, with the range of capacitances obtained for aluminum foil anodes prepared only by standard electrolytic anodization.
  • the aluminum foils were first processed as described above to provide the foils with fractal surfaces.
  • the anodization was performed in an ethylene glycol based electrolyte at a temperature of 55°C and a current density of 5mA/cm 2 .
  • capacitors made from anodes prepared according to a preferred embodiment of the present invention have higher capacitances than corresponding capacitors which incorporate prior art anodes.
  • Example 3 Capacitors
  • FIGURE 5 A particular embodiment of the invention may be illustrated in FIGURE 5, according to which there is shown in schematic cross-section, a capacitor made according to an embodiment of the present invention, in which the thicknesses of the various films or layers are not shown to scale.
  • Reference numeral 42 is the first valve metal film having a high specific surface area, provided on substrate 40, and coated with film 44 of an oxide of a second valve metal by vacuum deposition.
  • Oxide film 44 is optionally electrolytically anodized to give a further oxide layer 46, whereby the combined oxide layers 44+46 have a bimodal morphology as described herein.
  • a solid electrolyte film 48 is deposited by vacuum deposition on film 44 in absence of the optional anodization step, or on layer 46 if anodization has been carried out.
  • a third valve metal film 50 intended to function as cathode, on the vapor deposited solid electrolyte film 48.
  • Fig. 5 is used to illustrate a different embodiment of the invention from that described in the preceding paragraph (a).
  • Substrate 40 may be of metal, ceramic or alternatively e.g. alumina having a thin film of metal sputtered on its surface, or a polyimide (e.g. in the case of a flexible wiring board), or other suitable material.
  • layer 42 of a good electrical conducting material such as tantalum, aluminum, or niobium.
  • the layer thickness is for example 5,000-9000 A.
  • This layer may be deposited by a number of alternative processes including cathodic sputtering and vacuum deposition.
  • a layer with high specific surface 44 is then formed as described elsewhere herein; it should however be noted that the first metallic layer 42 may not required since the high specific surface area layer may have sufficient conductivity, depending on specific requirements.
  • the metallic layer 42 coated with high specific surface area layer 44 may be masked by a known photoresist technique and etched to produce a plurality of metallic electrodes.
  • these electrodes may be formed by techniques other than the photoresist masking technique, such as e.g. ion beam machining.
  • a dielectric layer 46 is then formed on the entire surface of each electrode by anodizing the high specific surface area of the electrodes.
  • a plasma anodization process may be suitable for carrying out this step, as is fully described in U.S. Pat. No 3,556,966 issued Jan. 19,1971 to Waxman and Zaininger. This is essentially a low temperature process carried out at temperatures of about 50°C or less.
  • For anodization of aluminum more exact parameters are given in an article in Solid State Technology, April 1971 , pages27-31. Entitled plasma Grown AL2O3 for COS/MOS Integrated Circuits by Micheletti, Norris, and Zaininger.
  • the electrodes are anodized in an appropriate electrolyte, such as for example 0.01 % solution of citric acid .
  • an appropriate electrolyte such as for example 0.01 % solution of citric acid .
  • plasma anodization is presently believed to minimize contamination.
  • a layer of solid electrolyte 48 is then applied by ion beam assisted deposition for example as follows.
  • the ion source was set in the chamber so that an ion beam can bombard the substrate at an arbitrary angle from the normal axis to the substrate.
  • the layer of solid electrolyte was obtained by ion beam assisted thermal evaporation of 7,7,8,8-tetracyanoquinodimethane (TCNQ complex) from ceramic crucibles on the anodized (oxidized) high specific surface area electrodes.
  • TCNQ complex 7,7,8,8-tetracyanoquinodimethane
  • the chamber was pumped down to 1X10 " torr, then argon gas was allowed in until a pressure of 1x10 ⁇ 4 was achieved.
  • Ion beam energy is varied in the range 100eV-600eV and ion current density may be in the range from 100 nA/cm 2 to 1 ⁇ A/cm 2 .
  • a layer of Ag paste 50 is applied over the TCNQ complex layer; however, it is also possible to produce the Ag layer by vacuum deposition.
  • a counter-electrode 50 is constructed of a successive layers of graphite (carbon), silver, and solder.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un condensateur électrolytique intégré, ce procédé consistant à appliquer sur un substrat au moins une séquence de chacune des couches suivantes : un film déposé sous vide présentant une surface spécifique élevée, sélectionné dans le groupe comprenant les métaux valves et des mélanges de ceux-ci avec des oxydes de métaux valves ; par-dessus le film présentant une surface spécifique élevée, au moins un film diélectrique comprenant une substance sélectionnée dans le groupe comprenant les oxydes de métaux valves, leurs oxydes complexes associés à au moins un métal des terres rares et leurs oxydes complexes associés à au moins un métal alcalino-terreux ; et un film d'électrolyte solide disposé sur le dernier film.
EP02700547A 2001-02-22 2002-02-21 Condensateurs electrolytiques et leur procede de fabrication Withdrawn EP1382048A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IL14159201 2001-02-22
IL141592A IL141592A (en) 2001-02-22 2001-02-22 Electrolytic capacitors and method for making them
PCT/IL2002/000140 WO2002067278A2 (fr) 2001-02-22 2002-02-21 Condensateurs electrolytiques et leur procede de fabrication

Publications (2)

Publication Number Publication Date
EP1382048A2 EP1382048A2 (fr) 2004-01-21
EP1382048A4 true EP1382048A4 (fr) 2008-05-28

Family

ID=11075164

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02700547A Withdrawn EP1382048A4 (fr) 2001-02-22 2002-02-21 Condensateurs electrolytiques et leur procede de fabrication

Country Status (5)

Country Link
EP (1) EP1382048A4 (fr)
JP (1) JP4390456B2 (fr)
AU (1) AU2002233612A1 (fr)
IL (1) IL141592A (fr)
WO (1) WO2002067278A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1619699B1 (fr) * 2003-03-31 2015-11-18 Toyo Aluminium Kabushiki Kaisha Feuille destinee a une electrode negative d'un condensateur et procede de production de celle-ci
US7149076B2 (en) * 2003-07-15 2006-12-12 Cabot Corporation Capacitor anode formed of metallic columns on a substrate
JP4561428B2 (ja) * 2004-07-05 2010-10-13 住友金属鉱山株式会社 多孔質バルブ金属薄膜、その製造方法および薄膜キャパシタ
JP4561293B2 (ja) * 2004-10-08 2010-10-13 住友金属鉱山株式会社 薄膜キャパシタおよび薄膜抵抗を有する回路部品ならびにその製造方法
IL173121A (en) * 2006-01-12 2011-07-31 Dina Katsir Electrodes, membranes, printing plate precursors and other articles including multi-strata porous coatings
JP2008258230A (ja) * 2007-03-31 2008-10-23 Nippon Chemicon Corp 固体電解コンデンサ
CN101981636B (zh) * 2008-04-08 2013-09-11 株式会社村田制作所 电容器及其制造方法
JP5816794B2 (ja) 2010-02-15 2015-11-18 パナソニックＩｐマネジメント株式会社 電極箔の製造方法
JP5692726B2 (ja) * 2010-08-31 2015-04-01 国立大学法人 鹿児島大学 アルミニウム薄膜の製造方法
MX2022009752A (es) * 2020-02-06 2023-01-11 Saras Micro Devices Inc Condensadores planos de aluminio de alta densidad para apilamiento e incorporacion.

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898539A (en) * 1972-03-17 1975-08-05 Matsushita Electric Ind Co Ltd Thin-film solid electrolytic capacitor and a method of making the same
JPS55158620A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Metallic oxide capacitor
EP0409668A2 (fr) * 1989-07-21 1991-01-23 Omron Corporation Circuits imprimés composites et leur méthode de fabrication
JPH0444204A (ja) * 1990-06-08 1992-02-14 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極
JPH0444203A (ja) * 1990-06-08 1992-02-14 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極の製造方法
EP0940828A2 (fr) * 1998-03-03 1999-09-08 Acktar Ltd. Procédé de production d'électrodes en feuille
EP1045409A2 (fr) * 1999-04-14 2000-10-18 Becromal S.p.A. Electrodes pour condensateurs électrolytiques et leur procédé de fabrication

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2056501A (en) * 1979-08-09 1981-03-18 Standard Telephones Cables Ltd Porous metal films
US4453199A (en) 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
WO1989001230A1 (fr) * 1987-07-30 1989-02-09 Matsushita Electric Industrial Co., Ltd. Condensateur electrolytique et procede de production d'un tel condensateur
JPH01119012A (ja) * 1987-10-30 1989-05-11 Marcon Electron Co Ltd 固体電解コンデンサ
US5851871A (en) 1987-12-23 1998-12-22 Sgs-Thomson Microelectronics, S.R.L. Process for manufacturing integrated capacitors in MOS technology
DE4207368A1 (de) * 1991-08-06 1993-02-11 Biotronik Mess & Therapieg Stimmulationselektrode
FR2688092B1 (fr) * 1992-02-14 1994-04-15 Traitement Metaux Alliages Sa Feuille pour electrode de condensateur electrolytique et procede de fabrication.
US5357399A (en) * 1992-09-25 1994-10-18 Avx Corporation Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor
US5589416A (en) 1995-12-06 1996-12-31 Lucent Technologies Inc. Process for forming integrated capacitors
DE19817405A1 (de) * 1998-04-20 1999-10-21 Becromal Spa Verfahren zur Herstellung einer Anode für elektrolytische Kondensatoren und so hergestellte Anoden

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898539A (en) * 1972-03-17 1975-08-05 Matsushita Electric Ind Co Ltd Thin-film solid electrolytic capacitor and a method of making the same
JPS55158620A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Metallic oxide capacitor
EP0409668A2 (fr) * 1989-07-21 1991-01-23 Omron Corporation Circuits imprimés composites et leur méthode de fabrication
JPH0444204A (ja) * 1990-06-08 1992-02-14 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極
JPH0444203A (ja) * 1990-06-08 1992-02-14 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極の製造方法
EP0940828A2 (fr) * 1998-03-03 1999-09-08 Acktar Ltd. Procédé de production d'électrodes en feuille
EP1045409A2 (fr) * 1999-04-14 2000-10-18 Becromal S.p.A. Electrodes pour condensateurs électrolytiques et leur procédé de fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198107, Derwent World Patents Index; AN 1981-10774D, XP002476483 *
See also references of WO02067278A2 *

Also Published As

Publication number Publication date
WO2002067278A3 (fr) 2002-12-27
JP4390456B2 (ja) 2009-12-24
IL141592A (en) 2007-02-11
AU2002233612A1 (en) 2002-09-04
EP1382048A2 (fr) 2004-01-21
JP2004524686A (ja) 2004-08-12
IL141592A0 (en) 2002-03-10
WO2002067278A2 (fr) 2002-08-29

Similar Documents

Publication Publication Date Title
EP0940828B1 (fr) Procédé de production d'électrodes en feuille
CA2158165C (fr) Wet-slug hybride et condensateur d'electrode electrochimique
US20060028787A1 (en) Wet electrolytic capacitor
US6865071B2 (en) Electrolytic capacitors and method for making them
EP1382048A2 (fr) Condensateurs electrolytiques et leur procede de fabrication
EP1808876B1 (fr) Électrodes, membranes, précurseurs de plaque d'impression et autres éléments comportant des revêtements poreux multi-strates, et leur procédé de fabrication
JP4665866B2 (ja) バルブ金属複合電極箔の製造方法
KR101237612B1 (ko) 벌크 커패시터 및 방법
JP2004524686A5 (fr)
EP2109124A1 (fr) Matériau de condensateur, procédé de fabrication du matériau de condensateur, condensateur comprenant le matériau de condensateur, tableau de câblage et dispositif électronique
JPH03150822A (ja) 電解コンデンサ用アルミニウム電極
JP2864477B2 (ja) 電解コンデンサ用アルミニウム電極
JPS6353688B2 (fr)
JP2008047755A (ja) バルブ金属複合電極箔の製造方法
JP4665854B2 (ja) バルブ金属複合電極箔およびその製造方法
JP2008252019A (ja) 薄膜キャパシタの製造方法
US3675086A (en) Electrical element laminated in structure
JP3548583B2 (ja) 電極箔
JPH118153A (ja) 高分子薄膜の製造方法とコンデンサの製造方法
JPH03150823A (ja) 電解コンデンサ用アルミニウム電極
JP5016472B2 (ja) 電解コンデンサ用電極箔の製造方法
JPH03150821A (ja) 電解コンデンサ用アルミニウム電極
JP2000277389A (ja) 固体電解コンデンサとその製造方法
JPH03147312A (ja) 電解コンデンサ用アルミニウム電極の製造方法
JPH03150824A (ja) 電解コンデンサ用アルミニウム電極

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030919

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/16 20060101ALN20080417BHEP

Ipc: H01G 9/15 20060101ALI20080417BHEP

Ipc: H01G 9/042 20060101AFI20080417BHEP

A4 Supplementary search report drawn up and despatched

Effective date: 20080424

17Q First examination report despatched

Effective date: 20100118

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130903