EP1351551A2 - Dispositif de contact pour prothèse auditive - Google Patents

Dispositif de contact pour prothèse auditive Download PDF

Info

Publication number
EP1351551A2
EP1351551A2 EP03006363A EP03006363A EP1351551A2 EP 1351551 A2 EP1351551 A2 EP 1351551A2 EP 03006363 A EP03006363 A EP 03006363A EP 03006363 A EP03006363 A EP 03006363A EP 1351551 A2 EP1351551 A2 EP 1351551A2
Authority
EP
European Patent Office
Prior art keywords
plastic
molded body
injection molded
metal contact
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03006363A
Other languages
German (de)
English (en)
Other versions
EP1351551B1 (fr
EP1351551A3 (fr
Inventor
Joseph Sauer
Christian Schmitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sivantos GmbH
Original Assignee
Siemens Audioligische Technik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Audioligische Technik GmbH filed Critical Siemens Audioligische Technik GmbH
Publication of EP1351551A2 publication Critical patent/EP1351551A2/fr
Publication of EP1351551A3 publication Critical patent/EP1351551A3/fr
Application granted granted Critical
Publication of EP1351551B1 publication Critical patent/EP1351551B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24Assembling by moulding on contact members
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/57Aspects of electrical interconnection between hearing aid parts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/602Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of batteries
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/658Manufacture of housing parts

Definitions

  • the present invention relates to a device for contacting electrical components of a hearing aid with a Plastic injection molded body for carrying contact elements and at least one metal contact element that is in the plastic injection molded body is injected. Furthermore, the present invention a method of making such Contraption.
  • the electrical components of a hearing device are in the hearing device housing to contact in an appropriate manner.
  • This is a contacting device from European patent specification EP 0 988 776 B1 known the connections to an electrical Module has.
  • Metal spring elements attached for contact a hearing aid battery and for holding the device in the cover plate of the hearing aid.
  • Insert Mold technology known, stamped metal parts and wire connectors in plastic injection molds to insert them in the injection molding process Inject plastic body. Through the injection molded body the contact points receive well-defined positions.
  • the injection molded body can also by means of its contact elements used to carry electronic components in the hearing aid become. Nevertheless, some components are in contact of the hearing aid further wire connections necessary not as metal contact elements injected into the plastic body let it be realized.
  • the object of the present invention is that of Miniaturization of the necessary elements and devices and rationalize their manufacture.
  • this object is achieved by a device for contacting electrical components of a hearing aid with a plastic injection molded body for carrying contact elements and at least one metal contact element, which in the plastic injection molded body is injected, and by at least one wiring element that is like a conductor track applied to the surface of the plastic injection molded body is for wiring the electrical components and / or the Metal contact element.
  • the above object is achieved by a method for manufacturing such a device by injection molding at least one structural element from a activated plastic, especially with palladium is activated, inserting the at least one structural element together with the at least one metal contact element in a Injection mold, overmolding of the at least one structural element and the at least one metal contact element with an insulating plastic to the plastic injection molded body, wherein the structural element at least partially protrudes the surface of the plastic injection molded body, whereby a surface area is defined, and metallizing the surface area predetermined by the structural element of the plastic injection molded body.
  • the above problem can be solved by Method of manufacturing the above device by loading of the at least one metal contact element in a Injection mold for the plastic injection molded body, injection molding the injection mold with an insulating plastic, irradiate a conductor pattern on the surface of the Injection molded plastic body and coating the irradiated Pattern with a conductive metal.
  • a method for manufacturing is also provided according to the invention an above device by inserting the at least a metal contact element in an injection mold for the plastic injection molded body, injection molding of the injection mold with an insulating plastic and printing of conductor tracks on the plastic injection molded body.
  • the metal contact elements which are injected into the plastic injection molded body should be stamped out of sheet metal at the best price. If the Metal contact elements on the components to be contacted Metal springs can be used to apply pressure become.
  • Wiring elements, the conductor tracks on the plastic injection molded body represent can not only according to the invention used to make injected metal contact elements to connect with each other, but also to make contacts to manufacture to the outside. So it is advantageous to use the wiring elements to be equipped with contact points from the Protruding surface of the plastic injection molded body and thus a good electrical contact possibility to components offer, which are not formed with resilient metal contacts Need to become.
  • the wiring elements or conductor tracks are if for production with activated plastic structural elements is worked over the parts of the structural elements arranged, which protrude to the surface of the injection molded body.
  • activated plastic structural elements is worked over the parts of the structural elements arranged, which protrude to the surface of the injection molded body.
  • Structural elements favorably doped with palladium.
  • the electronic modules and batteries of a hearing aid contacted can be a so-called In-the-ear hearing aid as well as a so-called behind-the-ear hearing aid act.
  • the manufacture of the contact devices according to the invention is preferably done by inserting appropriate contact elements, the metal contact elements and structural elements Include plastic in an injection mold like they already do was initially introduced as insert-mold technology. To are the necessary structural elements in your three-dimensional shape from a palladium, for example activated plastic injected. Then these molded structural elements together with the other metal contact elements or metal springs in the Injection mold for the molded body introduced. Thereupon will the injection mold with the metal contact and structural elements sprayed with insulating plastic. Finally the activated structural elements, insofar as they come from the Protruding surface, for example coated with metal in a bathroom.
  • the trace technology can usually be used Contact points where contact difficulties occur can reduce, resulting in an increase in the quality of Contact device leads. Furthermore, in the case of manufacture Insert parts saved using insert mold technology by contact points for external contacts the structural elements are molded. So the number the parts required for production, with what assembly time is also reduced and the degree of automation can be increased for production.
  • miniaturization is also possible possible that conductor tracks are applied to the injection molded body become.
  • the drawing shows a plastic injection molded body 1.
  • injected metal springs 2 and 3 the present Case for contacting a hearing aid battery, not shown serve.
  • the contacting device 1 under the conductor tracks or wiring elements 4, 5 and 6 structural elements injected. each this wiring elements 4, 5, 6 has a contact point 14, 15, 16, from the surface of the injection molded body 1 protrudes.
  • the structural elements are used to produce the injection molded body 1 made of activated plastic, together with the metal springs 2, 3 inserted in the injection mold and with encapsulated insulating plastic.
  • the contacting device shown in the drawing can also be created by, as already mentioned, initially according to the known insert mold method only the metal springs 2 and 3 are injected into the body 1. Then, for the wiring elements on the surface of the injection molded body 1 lanes activated with a laser. These activated courses are then marked with a coated conductive metal. Alternatively, the Printed conductors, as mentioned, printed on the injection molded body become.
  • the sound opening 7 for a microphone is on the top of the plastic injection molded body 1 visible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
EP03006363A 2002-04-02 2003-03-20 Dispositif de contact pour prothèse auditive Expired - Lifetime EP1351551B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10214542A DE10214542C1 (de) 2002-04-02 2002-04-02 Kontaktvorrichtung für Hörgeräte
DE10214542 2002-04-02

Publications (3)

Publication Number Publication Date
EP1351551A2 true EP1351551A2 (fr) 2003-10-08
EP1351551A3 EP1351551A3 (fr) 2006-10-18
EP1351551B1 EP1351551B1 (fr) 2008-05-07

Family

ID=27816101

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03006363A Expired - Lifetime EP1351551B1 (fr) 2002-04-02 2003-03-20 Dispositif de contact pour prothèse auditive

Country Status (5)

Country Link
US (1) US6843690B2 (fr)
EP (1) EP1351551B1 (fr)
AT (1) ATE394897T1 (fr)
DE (2) DE10214542C1 (fr)
DK (1) DK1351551T3 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013050014A1 (fr) * 2011-10-07 2013-04-11 Dreve Prodimed Gmbh Procédé de fabrication de coquilles auditives
US9408552B2 (en) 2009-07-02 2016-08-09 Widex A/S Ear plug with surface electrodes

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260233B2 (en) * 2002-07-10 2007-08-21 Oticon A/S Hearing aid or similar audio device and method for producing a hearing aid
DE102006026753B3 (de) 2006-06-08 2007-12-06 Siemens Audiologische Technik Gmbh SMD-Batteriekontaktmodul
WO2010033077A1 (fr) * 2008-09-18 2010-03-25 Siemens Medical Instruments Pte Ltd Agencement de dalle pour aide auditive
DE102009013078A1 (de) * 2009-03-13 2010-05-27 Siemens Medical Instruments Pte. Ltd. Lautstärkestelleinrichtung und Hörhilfe
US8224006B2 (en) * 2009-08-28 2012-07-17 Siemens Medical Instruments Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
US8254608B2 (en) * 2009-08-28 2012-08-28 Siemens Medical Instruments Pte. Ltd. Hearing aid device and method of producing a hearing aid device
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
US9774964B2 (en) * 2010-12-28 2017-09-26 Sonova Ag PIM housing
DE102011082193A1 (de) * 2011-09-06 2012-09-20 Siemens Medical Instruments Pte. Ltd. Modulares Kontaktbauteil für eine Hörvorrichtung
CN202840021U (zh) 2012-08-14 2013-03-27 美国莫列斯股份有限公司 电连接器
DK3469815T3 (da) * 2016-06-10 2020-02-10 Sivantos Pte Ltd Elektronikramme til understøtning af elektroniske komponenter i et høreapparat, høreapparat og kit til et høreapparat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB719657A (en) * 1952-04-28 1954-12-08 R H Dent Ltd Improvements in electric plugs and sockets
DE9210542U1 (de) * 1992-08-06 1993-12-09 Schaltbau AG, 81677 München Stirnkontaktleiste für einen Druckkontaktsteckverbinder
EP0899821A2 (fr) * 1997-08-29 1999-03-03 GRUNDIG Aktiengesellschaft Interface utilisateur
WO2000065692A1 (fr) * 1999-04-23 2000-11-02 Microtronic A/S Connecteur et procede de creation de connexions sans soudure entre une carte de circuit imprime principale rigide et des conducteurs associes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2766436A (en) * 1953-06-15 1956-10-09 Collins Radio Co Terminal stand-off device
US4195893A (en) * 1978-08-02 1980-04-01 Bunker Ramo Corporation Flat ribbon cable mass termination connector assembly
DK42197A (da) * 1997-04-15 1998-10-16 Toepholm & Westermann Kompakt moduleret i-øret høreapparat

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB719657A (en) * 1952-04-28 1954-12-08 R H Dent Ltd Improvements in electric plugs and sockets
DE9210542U1 (de) * 1992-08-06 1993-12-09 Schaltbau AG, 81677 München Stirnkontaktleiste für einen Druckkontaktsteckverbinder
EP0899821A2 (fr) * 1997-08-29 1999-03-03 GRUNDIG Aktiengesellschaft Interface utilisateur
WO2000065692A1 (fr) * 1999-04-23 2000-11-02 Microtronic A/S Connecteur et procede de creation de connexions sans soudure entre une carte de circuit imprime principale rigide et des conducteurs associes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9408552B2 (en) 2009-07-02 2016-08-09 Widex A/S Ear plug with surface electrodes
US11161306B2 (en) 2009-07-02 2021-11-02 T&W Engineering A/S Ear plug with surface electrodes
WO2013050014A1 (fr) * 2011-10-07 2013-04-11 Dreve Prodimed Gmbh Procédé de fabrication de coquilles auditives

Also Published As

Publication number Publication date
DK1351551T3 (da) 2008-09-01
US6843690B2 (en) 2005-01-18
EP1351551B1 (fr) 2008-05-07
DE10214542C1 (de) 2003-11-13
US20030199204A1 (en) 2003-10-23
DE50309765D1 (de) 2008-06-19
ATE394897T1 (de) 2008-05-15
EP1351551A3 (fr) 2006-10-18

Similar Documents

Publication Publication Date Title
AT410727B (de) Verfahren zum unterbringen von sensoren in einem gehäuse
DE10214542C1 (de) Kontaktvorrichtung für Hörgeräte
DE102006018902B4 (de) Elektronisches Schaltungsgerät und Verfahren zur Herstellung desselben
EP2819492B1 (fr) Composant MID, procédé de fabrication
WO1998014357A1 (fr) Appareil de regulation de vanne avec carte de circuits tridimensionnelle realisee selon la technique des dispositifs d'interconnexion moules
DE19649549C1 (de) Anordnung, insbesondere zur Verwendung in einem elektronischen Steuergerät, und Verfahren zur Herstellung derselben
CH704988A1 (de) Stecker und Verfahren zu dessen Herstellung.
EP1317163A2 (fr) Appareil auditif
DE102013108535A1 (de) Verfahren zum Herstellen einer Platine, Platine und Rückblickvorrichtung
DE19955538B4 (de) Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht
EP3443825A1 (fr) Procédé de positionnement de cartes de circuit imprimé et ensemble de cartes de circuit imprimé
DE102014200936A1 (de) Elektronikbaugruppe
DE102007035794A1 (de) Leiterplattenverbund sowie Verfahren zum Herstellen eines Leiterplattenverbundes
DE102013201417A1 (de) Verfahren zur Herstellung eines MID-Bauteils, MID-Bauteil
DE2920091A1 (de) Kunststoff-formteil
WO1996010280A1 (fr) Connecteur multiple pourvu d'une reglette de contact a broches et d'une reglette de contact a douilles
EP0271163B1 (fr) Méthode de fabrication de plaques à circuit imprimé
DE3640760A1 (de) Anordnung mit elektrischen leiterbahnen und verfahren zur herstellung der anordnung
EP0917420A2 (fr) Appareil électronique, notamment appareil téléphonique, et son procédé de fabrication
DE69219488T2 (de) Verfahren zur Herstellung einer Speicherkarte und Speicherkarte so hergestellt
EP0789507B1 (fr) Dispositif électronique de contrôle encapsulé et procédé pour sa fabrication
DE19604614A1 (de) Elektronisches Steuergerät mit einem Gehäuse
DE102004010506A1 (de) Vorrichtung und Verfahren für eine elektrische Anbindung von Stellgliedern oder Sensorelementen an Leiterbahnen
DE10109086C2 (de) Formbauteil
EP3133696A1 (fr) Dispositif de mise en contact et procede de fabrication

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 4/48 20060101ALI20060911BHEP

Ipc: H04R 25/00 20060101AFI20030717BHEP

Ipc: H01R 13/03 20060101ALI20060911BHEP

17P Request for examination filed

Effective date: 20070122

17Q First examination report despatched

Effective date: 20070228

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REF Corresponds to:

Ref document number: 50309765

Country of ref document: DE

Date of ref document: 20080619

Kind code of ref document: P

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: SIEMENS SCHWEIZ AG

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080818

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080807

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081007

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: CH

Ref legal event code: PCAR

Free format text: SIEMENS SCHWEIZ AG;INTELLECTUAL PROPERTY FREILAGERSTRASSE 40;8047 ZUERICH (CH)

26N No opposition filed

Effective date: 20090210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080807

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20090325

Year of fee payment: 7

BERE Be: lapsed

Owner name: SIEMENS AUDIOLOGISCHE TECHNIK G.M.B.H.

Effective date: 20090331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090320

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080808

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100320

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090320

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20081108

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080507

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111001

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 50309765

Country of ref document: DE

Representative=s name: FDST PATENTANWAELTE FREIER DOERR STAMMLER TSCH, DE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 50309765

Country of ref document: DE

Representative=s name: FDST PATENTANWAELTE FREIER DOERR STAMMLER TSCH, DE

Ref country code: DE

Ref legal event code: R081

Ref document number: 50309765

Country of ref document: DE

Owner name: SIVANTOS GMBH, DE

Free format text: FORMER OWNER: SIEMENS AUDIOLOGISCHE TECHNIK GMBH, 91058 ERLANGEN, DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20190325

Year of fee payment: 17

Ref country code: GB

Payment date: 20190325

Year of fee payment: 17

Ref country code: FR

Payment date: 20190326

Year of fee payment: 17

Ref country code: DE

Payment date: 20190325

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20190325

Year of fee payment: 17

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 50309765

Country of ref document: DE

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

Effective date: 20200331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201001

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20200320

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200320