Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
  • H01J5/50—Means forming part of the tube or lamps for the purpose of providing electrical connection to it
  • H01J5/54—Means forming part of the tube or lamps for the purpose of providing electrical connection to it supported by a separate part, e.g. base
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J61/00—Gas-discharge or vapour-discharge lamps
  • H01J61/02—Details
  • H01J61/56—One or more circuit elements structurally associated with the lamp
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
  • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
  • H01J9/30—Manufacture of bases
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0388—Other aspects of conductors
  • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09118—Moulded substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
  • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
  • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Definitions

• the invention relates to a lamp base according to the preamble of claim 1 and a manufacturing method for such a lamp base.
• the US Pat. No. 6,068,180 describes the contacting of a semiconductor component on a mounting plate which has conductor tracks embedded in plastic.
• the contacting areas of the conductor tracks are arranged at different heights in order to facilitate the contacting of the connections of the semiconductor component.
• the lamp base according to the invention has an electronic unit with a mounting plate and electronic SMD components fixed thereon.
• the mounting plate has a surface provided for mounting the electronic components and metal webs embedded in a dimensionally stable, electrically insulating material, which serve as conductor tracks and / or for electrical contacting of the electronic components on the mounting plate.
• the mounting plate has angled sections, so that for mounting the electronic components provided surface has areas arranged in different planes.
• the electronic assembly can be fitted into a housing of a predetermined shape and with predetermined internal dimensions.
• the size and shape of the angled sections of the mounting plate can be matched to the spatial conditions of a housing in which the electronic assembly is to be used.
• the electronic SMD components attached to the surface of the mounting plate of the electronic assembly make optimum use of the available space because they are no longer essentially planar, but spatially arranged.
• a particularly good use of space can be achieved with a meandering mounting plate.
• the angled sections of the mounting plate are advantageously connected via curved areas. This enables surface mounting of the electronic SMD components by means of an automatic placement machine on the still flat mounting plate.
• the mounting plate or the electronic component is only given its final shape in a subsequent manufacturing step by bending the mounting plate in the area of the bending points. In this way, the advantages of an automatic assembly of the mounting plate with electronic SMD components and an arrangement of the electronic components in the lamp base that is optimally adapted to the spatial conditions are combined.
• the manufacturing method according to the invention for this lamp base comprises the following method steps:
• the manufacturing method according to the invention permits automated surface mounting of the electronic SMD components on the mounting plate by means of an automatic placement machine and adaptation of the shape of the electronic unit to the internal dimensions of a housing.
• the metal frame is advantageously produced by punching out the conductor track structure and the supporting webs from the metal sheet. Etching processes are not so well suited due to the comparatively large sheet thickness.
• a simple embedding of the metal frame in a dimensionally stable, electrically insulating material is advantageously achieved by extrusion-coating the metal frame with a plastic.
• the metal sheet advantageously has a reduced sheet thickness in order to facilitate bending of the mounting plate in this area.
• the lamp base according to the invention can, for example, be part of a high-pressure discharge lamp that can be used as a headlight lamp of a motor vehicle.
• the electronic unit advantageously contains electronic components which are connected as voltage converters to generate the lamp operating voltage are, as well as other electronic components that are part of the ignition device required to ignite the gas discharge in the high-pressure discharge lamp.
• Figure 1 shows a schematic cross section through the electronic unit of a lamp base according to the invention
• Figure 2 shows a cross section through the base of a high-pressure discharge lamp with an electronic module arranged therein
• the electronic component shown in FIG. 1 consists of a large number of electronic components 10, in particular SMD components (surface-mounted device components), which are attached to a meandering mounting plate 20.
• the mounting plate 20 essentially consists of a dimensionally stable, electrically insulating plastic in which metal webs 21 are embedded.
• the metal webs 21 are used for mounting and for electrical contacting of the electronic components 10 on the mounting plate 20. Some metal webs 21 additionally or even exclusively serve to maintain the cohesion and the mechanical stability of the mounting plate 20.
• the metal webs 21 are arranged such that their for Contacting the electronic components 10 provided surface 21a is accessible.
• the contacting surface 21a of the metal webs 21 preferably terminate with the surface 20a of the mounting plate 20 provided for the assembly of the electronic components 10.
• the mounting plate 20 has five angled sections 201-205, which are connected via curved regions 206 of the mounting plate 20. Accordingly, the surface 20a is divided into five areas 201a-205a, which are arranged in five different planes. In this way, a spatial arrangement of the electronic components 10 is achieved instead of an essentially planar arrangement.
• the shape and dimensions of the sections 201-205 as well as the placement of the curved areas 206 and the placement of the electronic cal components 10 on the mounting plate 20 matched to the inner dimensions of the base 30 of a motor vehicle high-pressure discharge lamp.
• the mounting plate 20 and the electronic components 10 mounted thereon are inserted as an electronic structural unit in the chamber provided for the base 30 and are connected to the high-voltage transformer 31 arranged in a separate chamber and to the power supply lines (not shown) of the high-pressure discharge lamp (not shown) ,
• the electronic assembly comprises all the electronic components of the ignition device and the electronic components of a full-bridge inverter which is used to operate the high-pressure discharge lamp.
• An approximately 0.3 mm thick, one-piece bronze sheet or brass sheet is used to produce the electronic unit.
• the bronze or brass sheet can have a reduced thickness, for example by notching.
• a coherent metal frame is punched out of this metal sheet according to a predetermined mask, the webs 21 of which form conductor tracks for the electronic components 10 to be mounted thereon and / or serve to maintain the mechanical stability and the cohesion of the metal frame.
• a plastic for example a polyamide, is then extrusion-coated around the metal frame. By overmolding the metal frame with plastic, the webs 21 are embedded in a positive manner in the plastic material.
• the molding of the metal frame with plastic takes place in such a way that the surface 21a of the metal webs 21 intended for contacting the electronic components 10 to be mounted remains accessible, that is to say is uncovered by the plastic.
• the predetermined bending points 206 are not overmolded with plastic.
• the metal bars that are no longer required and that were used only to maintain the mechanical stability and the cohesion of the metal frame are removed.
• the now dimensionally stable plastic takes on its function.
• the corresponding webs are therefore severed in a second stamping process in order to avoid an electrical short circuit between the electronic components 10 to be assembled.
• the dimensionally stable plastic and the metal webs 21 embedded therein form a mounting plate 20 with a substantially flat surface 20a, which is provided for mounting electronic SMD components 10.
• the contacting areas 21a of the metal webs 21 terminate with the surface 20a of the mounting plate 20.
• the electronic components 10 implemented using SMD technology are fixed on the surface 20a and soldered to the contacting areas 21a of the metal webs 21 serving as conductor tracks. A lead-free high-temperature solder is used for this.
• the mounting plate 20 is bent in a meandering manner in the area of the desired bending points 206.
• the electronic unit obtained in this way is inserted into the lamp base 30 and connected to the high-voltage transformer 31 and the electrical connections of the base 30 and to the power supply lines of the lamp (not shown).
• a receptacle 32 is provided in the base 30 for the high-pressure discharge lamp (not shown).

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Fastening Of Light Sources Or Lamp Holders (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=7657914

Family Applications (1)

Country Status (5)

Families Citing this family (5)

Citations (1)

Family Cites Families (4)

• 2001
  • 2001-09-24 EP EP01982133A patent/EP1320863A1/de not_active Withdrawn
  • 2001-09-24 US US10/381,414 patent/US20040046507A1/en not_active Abandoned
  • 2001-09-24 JP JP2002531440A patent/JP2004510301A/ja active Pending
  • 2001-09-24 WO PCT/DE2001/003678 patent/WO2002027746A1/de active Application Filing
  • 2001-09-24 CA CA002423466A patent/CA2423466A1/en not_active Abandoned

Patent Citations (1)

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