EP1290346A1 - Regulation thermique pour dispositif de generation de vide - Google Patents
Regulation thermique pour dispositif de generation de videInfo
- Publication number
- EP1290346A1 EP1290346A1 EP01945446A EP01945446A EP1290346A1 EP 1290346 A1 EP1290346 A1 EP 1290346A1 EP 01945446 A EP01945446 A EP 01945446A EP 01945446 A EP01945446 A EP 01945446A EP 1290346 A1 EP1290346 A1 EP 1290346A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- liquid
- circuit
- thermal
- thermal bonding
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title description 3
- 239000007788 liquid Substances 0.000 claims abstract description 81
- 230000001105 regulatory effect Effects 0.000 claims abstract description 5
- 230000001276 controlling effect Effects 0.000 claims abstract description 3
- 230000001174 ascending effect Effects 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
- F04C29/04—Heating; Cooling; Heat insulation
Definitions
- the present invention relates to vacuum generation devices.
- One of the frequent uses of vacuum generation devices is the generation of vacuum in a semiconductor processing enclosure.
- material deposits or etchings are carried out on a semiconductor wafer.
- the yield of the deposits is relatively low, so that the vacuum generation device sucks up a large part of the materials which it is desired to deposit on the semiconductor wafer. And the vacuum generation device sucks the materials which are extracted from the semiconductor wafer during the etching operations.
- the vacuum generation devices comprise at least one primary pump which delivers the gases pumped at atmospheric pressure or at a relatively high pressure.
- the pumped gases tend to condense and solidify in the form of deposits when their temperature is too low, or when the temperature variations are too great. These deposits disturb the operation of the pump and the quality of the vacuum generation, which can cause pollution by backscattering in the semiconductor processing enclosure.
- the thermal regulation of the pump body is ensured by a temperature control system of the vacuum pump comprising at least one heat exchange circuit in which circulates a heat transfer liquid and at least one first portion of the circuit. is thermally connected with the pump vacuum and a second portion of the circuit is connected to a thermal source. Means are provided for circulating the heat transfer liquid in the heat exchange circuit.
- control means make it possible to vary the flow rate of the heat transfer liquid in the heat exchange circuit, thus modulating the heat exchange capacity of the heat exchange circuit as a function of a control signal to adapt it to the need for heat exchange to maintain the temperature of the pump within an appropriate temperature range.
- the heat exchanges necessary for the thermal regulation of the pump lead to a large variation in the flow rate of the heat transfer liquid.
- the speed of the heat transfer liquid is variable, and is found to be low during certain operating steps, and its temperature is also variable and is found to be high during certain operating steps.
- control means make it possible to vary the power of the thermal source, for example by adjusting an electric heating current as described in the document JP 01 008388, or by adjusting the speed of a fan of cooling as described in document JP 07 174099.
- the temperature of the heat transfer liquid is very variable depending on the calorific power to be transmitted.
- a problem encountered in these known temperature control systems is the formation of deposits in the pipes and in the parts to be cooled when using common tap water as heat transfer liquid. The limestone naturally present in suspension in the water solidifies and forms deposits in the pipes and in the parts to be cooled, initially altering the quality of the heat exchanges, and which can go as far as obstructing said pipes or parts.
- the problem proposed by the present invention is to design a new structure of temperature control system in vacuum generation devices, allowing to ensure efficient thermal regulation while avoiding the lime deposits mentioned above.
- the idea which is the basis of the present invention consists in circulating in the heat exchange circuit a heat transfer liquid having permanently a relatively high speed and a relatively low temperature, whatever the operating steps of the generation device. vacuum, by providing other means than a speed variation to regulate the temperature of the pumps.
- the proposed principle is based on an adjustable thermal conductance between the heat transfer liquid and the vacuum pump. It is thus possible to permanently maintain a circulation of heat transfer liquid at maximum flow rate and low temperature, the flow rate being at least equal to the flow rate necessary to ensure sufficient heat exchange under the extreme operating conditions of the vacuum pump.
- a vacuum generating device comprises at least one vacuum pump and a temperature control system of the vacuum pump, the temperature control system having at least one heat exchange circuit in which a coolant circulates and at least a first portion of the circuit is thermally connected with the pump body of the vacuum pump, with circulation means for circulating the coolant in the circuit heat exchange, and with control means for controlling the heat exchange capacity of the heat exchange circuit as a function of a control signal;
- thermal conduction means with adjustable thermal conductance by the control means thermally connect the first portion of the circuit to the pump body, the control means are adapted to vary the thermal conductance of the thermal conduction means maintaining the temperature of the pump body near a predetermined set temperature
- the circulation means for circulating the heat-transfer liquid, are adapted to permanently circulate the heat transfer liquid in the heat exchange circuit at a flow rate at least equal to the flow rate necessary to ensure sufficient heat exchange under the extreme operating conditions of the vacuum pump.
- the heat exchange circuit is adapted to heat the vacuum pump. The device is then used in the areas of the vacuum generating device in which it is necessary to heat the vacuum line to avoid solid deposits.
- the heat exchange circuit is adapted to cool the vacuum pump. The device is then used in the areas of vacuum generating device in which the pumping produces excessive heating.
- a combination of the two applications can be provided, allowing sometimes to heat, sometimes to cool the same area of the vacuum generating device.
- the thermal conduction means with adjustable thermal conductance may comprise: - at least one adjustment chamber, interposed between the first portion of the circuit and the pump body,
- a source of thermal bonding liquid connected to the adjustment chamber, and adapted to supply the adjustment chamber with a thermal bonding liquid according to an adjustable quantity so as to adjust the heat exchange surface occupied by the bonding liquid between the first portion of the circuit and the pump body.
- the source of thermal bonding liquid may comprise a pipe for passing thermal bonding liquid, a reserve of thermal bonding liquid, and means for adjusting the liquid to cause the passage of thermal bonding liquid between the chamber. and the reserve of thermal bonding liquid.
- the liquid adjustment means may comprise a piston placed in the reserve of thermal bonding liquid and biased by an actuator controlled by a control member as a function of a temperature setpoint signal and as a function of measured pump temperature signals from temperature sensors associated with the pump body.
- the adjustment chamber can be a cavity produced in the pump body, traversed by an exchange pipe forming said first portion of the circuit, and closed by closure means making it airtight, the exchange pipe having at least an ascending portion between two distinct extreme levels defining the extreme levels of adjustment of the thermal bonding liquid.
- the adjustment chamber can have two opposite ends and can be crossed by the exchange pipe between a lower orifice and an upper orifice.
- the adjustment chamber can be closed at its end (s) by one or more tight plugs, or by crimps around the exchange pipe.
- FIG. 1 is a block diagram illustrating a vacuum generation device according to an embodiment of the present invention
- FIG. 2 is a block diagram illustrating the detail of the thermal conduction means with adjustable thermal conductance according to an embodiment of the present invention
- FIG. 3 schematically illustrates, in section, a vacuum pump body with a cooling system according to two embodiments of the present invention.
- FIG. 4 is a cross section of an adjustment chamber according to a particular embodiment of the invention.
- a vacuum generating device comprises at least one vacuum pump 100 and a temperature control system
- the pump vacuum 100 comprises a pump body 1 having a suction inlet 3 connected directly or indirectly to a vacuum enclosure 4, for example a process enclosure for processing semiconductor wafers.
- the vacuum pump 100 delivers via an outlet 5 at a higher pressure, for example at atmospheric pressure.
- the temperature control system 2 comprises a heat exchange circuit 6 in which a heat transfer liquid such as water, oil, glycol, for example, circulates.
- the heat exchange circuit 6 comprises an external pipe 7 connected to at least a first portion of circuit 8 and to at least a second portion of circuit 9.
- the first portion of circuit 8 is connected thermally with the pump body 1 of the vacuum pump 100.
- the second portion of circuit 9 is thermally connected with a thermal source 10.
- Circulation means such as a circulation pump 11 are provided for circulating the heat transfer liquid in the heat exchange circuit 6.
- Control means make it possible to control the heat exchange capacity of the heat exchange circuit 6 as a function of a control signal.
- the variation of heat exchange capacity of the heat exchange circuit 6 is achieved by interposing heat conduction means with adjustable thermal conductance at the interface between the first portion of circuit 8 and the pump body 1 of the vacuum pump 100.
- a plurality of first circuit portions 8 may be provided, for example, and heat conduction means with adjustable thermal conductance thermally connecting the pump body 1 to each first circuit portion such as the first portion 8 Considering more particularly FIGS.
- the heat conduction means with adjustable thermal conductance comprise at least one adjustment chamber 12, interposed between the first portion of circuit 8 and the pump body 1.
- a source of thermal bonding liquid 13 is connected to the adjustment chamber 12 and is adapted to supply the adjustment chamber 12 with ec thermal bonding liquid 15 such as water, oil or glycol, for example, in an adjustable amount.
- the first portion of the circuit 8 for example in the form of a straight tubular exchange pipe 14, is in contact with the thermal bonding liquid 15 along a portion of its lateral surface, the bonding liquid thermal 15 itself being in contact with a portion of the peripheral surface of the adjustment chamber 12 constituted by the pump body 1.
- the thermal bonding liquid thus ensures the thermal bond between the pump body 1 and the heat transfer liquid contained in the exchange pipe 14 of the heat exchange circuit 6.
- the source of thermal bonding liquid 13 is adapted to supply the adjustment chamber 12 with thermal bonding liquid 15 in an adjustable amount, so as to adjust the heat exchange surface occupied by the thermal bonding liquid 15 between the first portion 8 and the pump body 1.
- the source of thermal bonding liquid 13 comprises a pipe for passage of thermal bonding liquid 16, a reserve of thermal bonding liquid 17 and means for adjusting the liquid to cause the passage of the liquid. of thermal connection 15 in the two directions of passage between the adjustment chamber 12 and the reserve of thermal connection liquid 17.
- the liquid adjustment means comprise a piston 18 placed in the reserve of thermal bonding liquid 17 and urged by an actuator 19 controlled by a control member 20 (FIGS. 1 and 2).
- the control member is for example an electrical circuit making it possible to control the actuator 19 as a function of a temperature setpoint signal and as a function of measured pump temperature signals coming from temperature sensors 21 associated with the pump body 1
- the actuator 19 displaces the piston 18, thus modifying the quantity of thermal bonding liquid 15 contained in the adjustment chamber 12, which modifies the upper level 22 of the thermal bonding liquid 15 and thus the heat exchange surface occupied by the thermal bonding liquid 15 between the pump body 1 and the exchange pipe 14 of the first portion of circuit 8 in which circulates heat transfer liquid.
- control member 20, the actuator 19, the piston 18, the reserve of thermal bonding liquid 17, the pipe for passage of thermal bonding liquid 16, the adjustment chamber 12 and the thermal bonding liquid 15 constitute control means which are adapted to vary the thermal conductance of the thermal conduction means between the pump body 1 and the first circuit portion 8, so as to maintain the temperature of the pump body 1 near a temperature predetermined set point.
- circulation means such as the circulation pump 11 which are adapted to circulate the heat transfer liquid permanently in the heat exchange circuit 6 at a permanent flow rate at least equal to the flow rate necessary for ensuring the exchange.
- sufficient thermal under the extreme operating conditions of the vacuum pump 100. Under these extreme operating conditions, the vacuum pump 100 indeed needs maximum heat exchange, and this maximum heat exchange is ensured, at the chosen permanent flow rate heat transfer liquid, when the adjustment chamber 12 is full of thermal bonding liquid 15.
- the permanent flow can advantageously be a constant flow.
- FIG. 3 illustrates two embodiments of the adjustment chamber 12 in a pump body 1.
- the adjustment chamber 12 is a cavity produced directly in the pump body 1, and traversed by an exchange pipe 14 whose external section is less than the cross section of the adjustment chamber 12.
- the cavity constituting the adjustment chamber 12 is traversed by the exchange pipe 14 forming said first portion of circuit 8 in which the heat transfer liquid circulates.
- the adjustment chamber 12 is closed by shutter means which make it watertight with respect to the external atmosphere, while letting the exchange line 14 pass.
- the exchange line 14 comprises in the adjustment chamber 12 at least an ascending portion 23 between two separate extreme levels 24 and 25 which define the extreme adjustment levels of the level 22 of the thermal bonding liquid in the adjustment chamber 12.
- the adjustment chamber 12 is open at two opposite ends, namely a lower end 24 and an upper end 25, and is crossed by the exchange pipe 14.
- each of the lower, upper 24 and upper 25 ends is closed by a respective tight plug 26 and 27.
- the pipe for passage of thermal bonding liquid 16 communicates with the adjustment 12 near its lower end 24.
- the adjustment chamber 112 communicates with the heat-transfer liquid passage pipe 116 in the vicinity of its lower end 124, and is closed along its lower end 124 and its upper end 125 by respective crimps 126 and 127 around the exchange pipe 114.
- the vacuum pump 100 comprises, in the pump body 1, for example made of cast iron, two pumping chambers 28 and 29 each receiving a rotor driven by a shaft such as the shafts 30 and 31 In the pump body 1, the adjustment chambers 12 and
- 112 can for example be oriented in a substantially vertical direction.
- the walls of the adjustment chamber 12 or 112 are smooth, as is the external face of the exchange pipe 14 or 114.
- the wall peripheral of the adjustment chamber 12 constituted by the pump body 1 comprises radial fins such as the fin 32.
- the external surface of the exchange pipe 14 comprises radial fins such as the fin 33.
- the actuator 19, the reserve of thermal bonding liquid 17 and its piston 18, as well as the control member 20, can be moved away from the adjustment chambers 12 or 112, and can therefore be positioned in any suitable location, for example in unused areas around the pump body 1, making it possible to reduce the general volume of the vacuum generation device.
- the crimping in the end regions 124 and 125 of the adjustment chamber 112 can be carried out by expansion or radial expansion of the exchange pipe 114 in the housing constituting the adjustment chamber 112.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Physical Vapour Deposition (AREA)
- Sampling And Sample Adjustment (AREA)
- Control Of Positive-Displacement Pumps (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0007627 | 2000-06-15 | ||
| FR0007627A FR2810375B1 (fr) | 2000-06-15 | 2000-06-15 | Regulation thermique a debit et temperature de refroidissement constants pour dispositif de generation de vide |
| PCT/FR2001/001866 WO2001096744A1 (fr) | 2000-06-15 | 2001-06-15 | Regulation thermique a debit et temperature de refroidissement constants pour dispositif de generation de vide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1290346A1 true EP1290346A1 (fr) | 2003-03-12 |
| EP1290346B1 EP1290346B1 (fr) | 2008-04-02 |
Family
ID=8851283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01945446A Expired - Lifetime EP1290346B1 (fr) | 2000-06-15 | 2001-06-15 | Regulation thermique pour dispositif de generation de vide |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6679676B2 (fr) |
| EP (1) | EP1290346B1 (fr) |
| JP (1) | JP2004503713A (fr) |
| AT (1) | ATE391237T1 (fr) |
| DE (1) | DE60133459D1 (fr) |
| FR (1) | FR2810375B1 (fr) |
| WO (1) | WO2001096744A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5172615B2 (ja) * | 2008-11-12 | 2013-03-27 | Ckd株式会社 | 温度制御装置 |
| CN103149949B (zh) * | 2013-01-09 | 2016-08-03 | 上海空间推进研究所 | 一种基于帕尔贴效应的气体微流量控制器 |
| CN114439725B (zh) * | 2020-11-02 | 2025-11-07 | 上海海立电器有限公司 | 一种压缩机用油位控制系统、工况控制系统及其应用 |
| CN117846931B (zh) * | 2024-03-08 | 2024-05-14 | 江苏纬恩复材科技有限公司 | 一种真空泵管道连接结构、热压罐及其工作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61236123A (ja) * | 1985-04-12 | 1986-10-21 | Hitachi Ltd | 真空処理装置 |
| JPS648388A (en) * | 1987-06-30 | 1989-01-12 | Oki Electric Ind Co Ltd | Vacuum pump device |
| JPS6419198A (en) * | 1987-07-15 | 1989-01-23 | Hitachi Ltd | Vacuum pump |
| FR2634829B1 (fr) * | 1988-07-27 | 1990-09-14 | Cit Alcatel | Pompe a vide |
| KR950007378B1 (ko) * | 1990-04-06 | 1995-07-10 | 가부시끼 가이샤 히다찌 세이사꾸쇼 | 진공펌프 |
| JPH04164188A (ja) * | 1990-10-26 | 1992-06-09 | Hitachi Ltd | 半導体製造装置排気用ターボ分子ポンプ |
| JPH05118296A (ja) * | 1991-10-25 | 1993-05-14 | Hitachi Ltd | ドライ真空ポンプ |
| JP3616639B2 (ja) * | 1992-06-19 | 2005-02-02 | ウナクシス ドイチュラント ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 気体摩擦真空ポンプ |
| JPH07174099A (ja) * | 1992-08-14 | 1995-07-11 | Hitachi Ltd | 真空ポンプの冷却装置 |
| JP3831113B2 (ja) * | 1998-03-31 | 2006-10-11 | 大晃機械工業株式会社 | 真空ポンプ |
-
2000
- 2000-06-15 FR FR0007627A patent/FR2810375B1/fr not_active Expired - Fee Related
-
2001
- 2001-06-15 EP EP01945446A patent/EP1290346B1/fr not_active Expired - Lifetime
- 2001-06-15 US US10/049,132 patent/US6679676B2/en not_active Expired - Fee Related
- 2001-06-15 DE DE60133459T patent/DE60133459D1/de not_active Expired - Lifetime
- 2001-06-15 WO PCT/FR2001/001866 patent/WO2001096744A1/fr not_active Ceased
- 2001-06-15 AT AT01945446T patent/ATE391237T1/de not_active IP Right Cessation
- 2001-06-15 JP JP2002510839A patent/JP2004503713A/ja not_active Withdrawn
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0196744A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2810375B1 (fr) | 2002-11-29 |
| FR2810375A1 (fr) | 2001-12-21 |
| DE60133459D1 (de) | 2008-05-15 |
| ATE391237T1 (de) | 2008-04-15 |
| EP1290346B1 (fr) | 2008-04-02 |
| JP2004503713A (ja) | 2004-02-05 |
| US6679676B2 (en) | 2004-01-20 |
| US20020106285A1 (en) | 2002-08-08 |
| WO2001096744A1 (fr) | 2001-12-20 |
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