EP1269239A2 - Emetteur-recepteur optique integre et procedes connexes - Google Patents

Emetteur-recepteur optique integre et procedes connexes

Info

Publication number
EP1269239A2
EP1269239A2 EP01920210A EP01920210A EP1269239A2 EP 1269239 A2 EP1269239 A2 EP 1269239A2 EP 01920210 A EP01920210 A EP 01920210A EP 01920210 A EP01920210 A EP 01920210A EP 1269239 A2 EP1269239 A2 EP 1269239A2
Authority
EP
European Patent Office
Prior art keywords
wafer
light source
detector
optical transceiver
detectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01920210A
Other languages
German (de)
English (en)
Inventor
Michael R. Feldman
James E. Morris, Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DigitalOptics Corp East
Original Assignee
Tessera North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera North America Inc filed Critical Tessera North America Inc
Publication of EP1269239A2 publication Critical patent/EP1269239A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Definitions

  • the present invention is therefore directed to an integrated optical transceiver which substantially overcomes one or more of the problems due to the limitations and disadvantages of the related art.
  • an optical transceiver including at least one light source on a first surface of a substrate, at least one detector on the first surface of the substrate, at least one of the at least one light source and the at least one detector being mounted on the substrate, the at least one detector to receive light other than from the at least one light source, and an optics block having optics thereon.
  • the optics are for both the at least one light source and the at least one detector.
  • the optics block is attached to the substrate.
  • the at least one light source and the at least one detector may be of different materials.
  • One of the at least one light source and the at least one detector may be monolithically integrated with the substrate.
  • a spacer may be provided between the substrate and the optics block. The spacer may completely surround the periphery of the optics block.
  • the spacer may include a plurality of separate spacers provided in the periphery of the optics block.
  • Optics for the at least one light source and the at least one detector have the same design.
  • Optics for the at least one light source may be formed on an opposite side of the optics block from optics for the at least one detector.
  • the at least one light source may be a vertical cavity surface emitting laser.
  • Interconnection features may be provided on the first surface of the substrate for the at least one light source and the at least one detector. The interconnection features may be on a same side or may be on opposite side of the first surface of the substrate for the at least one light source and the at least one detector.
  • the at least one light source may be an array of light sources and the at least one detector may be an array of detectors.
  • the array of light sources and the array of detectors may be parallel or may form a line.
  • an optical transceiver including providing a plurality of detectors on a first surface of a first wafer, providing a plurality of light sources on the first surface of the first wafer, at least one of the plurality of detectors and the plurality of light sources being mounted on the first wafer, providing electrical interconnections for each of the plurality of detectors and each of the plurality of light sources on the first surface of the first wafer, providing an optics block having at least one optical element for each of the plurality of detectors and each of the plurality of light sources, providing a vertical spacer between the optics block and the first wafer, attaching the vertical spacer, the optics block and the first wafer to one another, and separating the first wafer into a plurality of transceiver, each transceiver having at least one light source and at least one detector.
  • the providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the first wafer before the separating, the separating allowing access to the electrical interconnections.
  • the providing of the vertical spacer may include forming vertical spacers for each of the transceivers on a spacer wafer and attaching the spacer wafer to the first wafer before the separating, the separating allowing access to the electrical interconnections.
  • the providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the spacer wafer and the first wafer before the separating, the separating allowing access to the electrical interconnections.
  • the attaching may include directly attaching the second wafer to the spacer wafer.
  • the providing of one of the plurality of light sources and the plurality of detectors may include monolithically integrating into the first wafer.
  • the providing of electrical interconnections for each of the plurality of detectors and each of the plurality of light sources may include using a same mask for both interconnections to the detectors and the light sources.
  • Figure 1 is an elevational exploded top view of an optical transceiver of the present invention
  • Figure 2 is an elevational side view of another optical transceiver of the present invention.
  • Figure 3 is a top view of another configuration of the light sources and detectors on the same substrate
  • Figure 4 is a schematic side view of the creation of multiple transceivers in accordance with the present invention
  • Figure 5 is an exploded elevational perspective view of an interface in conjunction with fibers in a housing and the transceiver of the present invention.
  • an optical transceiver 100 includes a light source array 102, here shown as a vertical cavity side emitting laser (VCSEL) array, and a detector array 104 are integrated on a silicon wafer 106. Silicon interconnect tracks 108 supply power to the active elements 102, 106 and pads 110 allow the detector signals to be read out.
  • VCSEL vertical cavity side emitting laser
  • An optics block 120 contains two sets of integrated optics, one set 122 for the light source array 102 and one set 124 for the detector array 104.
  • the integrated optics 122 for the light source receive light from the light source array 102 and direct the light to a desired application.
  • the integrated optics 124 for the detectors receive light from a desired application and direct the light to the detector array 104.
  • the optics may be diffractives, refractives or hybrids thereof and may be formed lithographically on the optics block 120.
  • the integrated optics 122, 124 for the light source array and the detector array may include optical elements formed on either or both surfaces of the optics block 120. Since the optics for both the light source array and the detector array are aligned simultaneously, the assembly and alignment steps required for creating a transceiver are reduced. Further, the integration allows the transceiver to be smaller and have fewer parts. Depending upon the material used for the substrate, either the detector array or the light source array may be monolithically integrated therein.
  • the transceiver 100 also includes a spacer 130 between the active elements and the optics block 120.
  • the spacer may be an integrated spacer surrounding the perimeter of the optics block, as shown in Figure 1.
  • the spacer may be a separate element, formed in the optics block or formed in the substrate.
  • the bonded structure of a transceiver 200 is shown. Rather than having a spacer 130 around the perimeter of the optics block 120, separate spacer elements 230 are positioned at the corners of the optics block. Also, the optics 222 for the light sources 202 are on a different surface of the optics block 220 than the optics 224 for the detectors 204. These optics for both the light sources and the detectors may have the same design. Again light sources 202 and detectors 204 are on the same substrate 206, and one of them may be monolithically integrated therein. Silicon tracks 208 and pads 208 for providing power and signals to and from the active elements are also on the substrate.
  • Figure 3 is a top view of a transceiver 300 in accordance with another embodiment of the present invention.
  • the active elements rather than having the active elements 102, 104 arranged in parallel arrays, the active elements form a linear array.
  • four light sources 102 and four detectors 104 are in a line. The spacing there between reduces cross-talk between the active devices.
  • Corresponding optical elements 122,124 are also now in a single line. This configuration allows a standard 1 x 12 fiber array to be connected with the transceiver. This configuration also allows all the required interconnection to be provided on a same side of the substrate 106, thereby allowing the optics block 120 and the substrate 106 to share a common edge, which may facilitate manufacturing at the wafer level.
  • the spacer wafer 130 in addition to surrounding the perimeter of the optics block 120, also includes an isolating portion 132 between the two types of electro- optical elements 102, 104.
  • This isolating portion 132 may be coated with a metal to further reduce cross-talk between the electro-optical elements. The closer the electro-optical components, the more important isolation becomes.
  • the isolating portion 132 may also be provided in any of the other configurations.
  • the components may be attached using wafer-to-wafer bonding techniques, as set forth, for example, in U.S. Patent Nos. 6,096,155 and 6,104,690, commonly assigned, which are hereby incorporated by reference in their entirety for all purposes.
  • wafer is meant to generally refer to any structure having more than one component which is to be separated for final use.
  • FIG. 4 A particular example of wafer bonding all three substrates together before separating is shown in Figure 4.
  • the individual transceivers may be realized by separating the substrate 106 containing the light sources 102 and detectors 304 at the appropriate points.
  • the detectors 304 are monolithically integrated into the substrate 106. Whichever active element to be provided on the substrate has the higher effective yield is preferably the monolithically integrated element, since the monolithically integrated elements will not be able to be substituted out.
  • the metalization required for the electrical connections for both the monolithically integrated element and the additional active element on the substrate are formed using the same mask set as that for forming the monolithically integrated element. This helps insure precise alignment, since the active element to be mounted can use its metalization to provide its alignment, e.g., by solder self-alignment.
  • the active elements that are to be mounted on the substrate may then be tested before being mounted. After mounting, they may be tested again and replaced if required before the wafer bonding.
  • bonding may include any type of attachment, including the use of bonding materials, surface tension or directly forming on the same substrate.
  • separating may include any means for realizing individual components, e.g., dicing. Further examples of separating wafers when creating modules having electro-optical elements may be found in related to the commonly assigned, co-pending application entitled “Separating of Electro-Optical Integrated Modules and Structures Formed Thereby", attorney docket number DOC.072P, filed concurrently herewith, the entire contents of which are hereby incorporated by reference for all purposes.
  • the alignment of the active elements to the input and output ports corresponding thereto, typically fibers, is particularly important.
  • FIG. 5 One configuration for insuring proper alignment between the transceiver and fibers is shown in Figure 5.
  • a plurality of fibers 410 are inserted into a ferrule 412.
  • the active elements of the present invention here the linear configuration as shown in Figure 3, which are to be in communication with the fibers 410, are preferably provided on a silicon bench or sub- mount 416, corresponding to the common substrate 106 in Figure 3.
  • this silicon bench 416 is preferably provided on a substrate 418.
  • An optics block 420 provides at least one optical element between each opto-electronic device on the sub-mount 416 and a corresponding fiber 410.
  • the optics block 420 is preferably spaced from the opto- electronic devices by a spacer 415.
  • the optical elements preferably include elements which collimate, focus, homogenize or otherwise couple the light. Since the optics block has two surfaces, two optical elements may be provided thereon. Further, if required, additional optics blocks may be bonded to and spaced from the optics block 420 to provide additional surfaces, as with any of the previous transceiver configurations..
  • a mechanical interface 422 aligns the optics block 420, which is already aligned with the electro-optical devices, with the fibers 410. This may be achieved by the provision of alignment features on both the mechanical interface 422 and the ferrule 412 housing the fibers 410.
  • these alignment features consist of holes 424 in the ferrule 412, which are already typically present for aligning the ferrule with other devices, and alignment holes 426 in the mechanical interface 422. Once these alignment holes 424, 426 are aligned, an alignment pin, not shown, may then be inserted therein to maintain the aligned position. Further details of such interfaces may be found, for example, in commonly assigned, co-pending application U.S. Serial No. 09/418,022 entitled "Optical Subassembly" which is incorporated by reference in its entirety for all purposes. While the present invention is described herein with reference to illustrative embodiments for particular applications, it should be understood that the present invention is not limited thereto.

Abstract

L'invention concerne un émetteur-récepteur optique comprenant au moins une source lumineuse et au moins un détecteur montés sur la même surface du même substrat. Cette source de lumière et/ou ce détecteur sont montés sur la surface. Un bloc optique composé d'éléments optiques pour chaque source lumineuse et chaque détecteur est fixé à l'aide d'un élément d'espacement vertical sur le substrat. Les interconnexions électriques pour la source lumineuse et le détecteur sont accessibles depuis la même surface du substrat comprenant le bloc optique. La source lumineuse et/ou le détecteur peuvent être monolithiquement intégrés dans le substrat.
EP01920210A 2000-03-06 2001-03-06 Emetteur-recepteur optique integre et procedes connexes Withdrawn EP1269239A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18703400P 2000-03-06 2000-03-06
US187034P 2000-03-06
PCT/US2001/007053 WO2001067144A2 (fr) 2000-03-06 2001-03-06 Emetteur-recepteur optique integre et procedes connexes

Publications (1)

Publication Number Publication Date
EP1269239A2 true EP1269239A2 (fr) 2003-01-02

Family

ID=22687346

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01920210A Withdrawn EP1269239A2 (fr) 2000-03-06 2001-03-06 Emetteur-recepteur optique integre et procedes connexes

Country Status (6)

Country Link
EP (1) EP1269239A2 (fr)
JP (1) JP2003526909A (fr)
CN (1) CN100354671C (fr)
AU (1) AU2001247286A1 (fr)
CA (1) CA2401976A1 (fr)
WO (1) WO2001067144A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9112616B2 (en) 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
CN104039577B (zh) * 2011-08-29 2018-05-15 汽车交通安全联合公司 用于车辆驾驶员中的分析物的非侵入式测量的系统
CA2920796C (fr) 2013-08-27 2023-03-28 Automotive Coalition For Traffic Safety, Inc. Systemes et procedes pour commander un allumage de vehicule a l'aide de donnees biometriques
CN114206215A (zh) 2019-06-12 2022-03-18 汽车交通安全联合公司 用于车辆驾驶员中分析物的非侵入性测量的系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0335104A3 (fr) * 1988-03-31 1991-11-06 Siemens Aktiengesellschaft Dispositif pour relier optiquement un ou plusieurs émetteurs optiques d'un ou plusieurs circuits intégrés
US5093879A (en) * 1990-06-22 1992-03-03 International Business Machines Corporation Electro-optical connectors
US5170269A (en) * 1991-05-31 1992-12-08 Texas Instruments Incorporated Programmable optical interconnect system
US5237434A (en) * 1991-11-05 1993-08-17 Mcnc Microelectronic module having optical and electrical interconnects
US5266794A (en) * 1992-01-21 1993-11-30 Bandgap Technology Corporation Vertical-cavity surface emitting laser optical interconnect technology
JP3484543B2 (ja) * 1993-03-24 2004-01-06 富士通株式会社 光結合部材の製造方法及び光装置
JPH08235663A (ja) * 1995-02-24 1996-09-13 Sony Corp 光学素子
US5978401A (en) * 1995-10-25 1999-11-02 Honeywell Inc. Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver
US5771218A (en) * 1996-09-27 1998-06-23 Digital Optics Corporation Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same
US5912872A (en) * 1996-09-27 1999-06-15 Digital Optics Corporation Integrated optical apparatus providing separated beams on a detector and associated methods
JPH10126002A (ja) * 1996-10-23 1998-05-15 Matsushita Electron Corp 光伝送モジュール
JPH11311721A (ja) * 1998-02-27 1999-11-09 Oki Electric Ind Co Ltd 光結合モジュールおよびその製造方法
JP3610235B2 (ja) * 1998-07-22 2005-01-12 キヤノン株式会社 面型発光素子装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0167144A3 *

Also Published As

Publication number Publication date
JP2003526909A (ja) 2003-09-09
WO2001067144A2 (fr) 2001-09-13
CA2401976A1 (fr) 2001-09-13
CN1419659A (zh) 2003-05-21
AU2001247286A1 (en) 2001-09-17
WO2001067144A3 (fr) 2002-08-15
CN100354671C (zh) 2007-12-12

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