EP1269134A1 - Sensoranordnung - Google Patents
SensoranordnungInfo
- Publication number
- EP1269134A1 EP1269134A1 EP01927588A EP01927588A EP1269134A1 EP 1269134 A1 EP1269134 A1 EP 1269134A1 EP 01927588 A EP01927588 A EP 01927588A EP 01927588 A EP01927588 A EP 01927588A EP 1269134 A1 EP1269134 A1 EP 1269134A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor arrangement
- pressure
- circuit
- sensor
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
Definitions
- the invention relates to a sensor arrangement, in particular for a high pressure sensor according to the preamble of the main claim.
- a pressure sensor is known from DE 196 03 674.7 AI, in which the signal is detected by means of a pressure measuring cell made of stainless steel, in which a resistance measuring bridge, for example in thin-film technology, is arranged on a measuring membrane on the side facing away from the measuring medium. Movements of the measuring membrane due to changes in the pressure of the measuring medium lead to compression or stretching of the resistance tracks and thus to changes in resistance in the respective resistors. The exploitation of this change in resistance and the signal amplification takes place with an electronic evaluation circuit, which is arranged on a circuit board.
- the contacting from the pressure measuring cell to the evaluation circuit takes place here via a soldered flexible conductor track film or possibly also via an additional intermediate carrier, a so-called spacer.
- This spacer is contacted with the pressure measuring cell by means of bond connections and the evaluation circuit placed on the spacer is soldered.
- the evaluation circuit is then contacted to the device plug, which is still attached to the sensor arrangement, either by soldered flexible lines or directly via the plug pins, which are sealed in the transition to the housing of the sensor arrangement by soft rubber.
- the sensor arrangement of the type described at the outset is advantageous in the further development according to the invention with the characterizing features of claim 1 in that the evaluation circuit as a hybrid circuit with the sensor circuit, that is to say with the measuring bridge on the measuring membrane, with the establishment of electrical connections between the evaluation circuit and the sensor circuit and one Earth connection to the housing of the sensor arrangement, can be attached directly.
- the contacts of the connections of the hybrid circuit with the connector pins of the device connector are made in the sensor arrangement by means of pressure contacts.
- the pressure contacts can easily be either S-shaped leaf springs or helical compression springs, the helical springs being guided either on the hybrid circuit or on the device plug in a sleeve as a holder.
- the electronic evaluation circuit according to the invention is implemented in hybrid technology known per se, e.g. ASIC, manufactured and can be connected directly to a measuring cell carrying the measuring membrane by means of an adhesive.
- ASIC application-specific integrated circuit
- the necessary electrical connection to the housing mass of the sensor arrangement is advantageously achieved without further components. Complex soldering or bonding processes can be omitted here, since the electrical connections are made simultaneously with the attachment of the hybrid circuit.
- the flexible foils required in the prior art or an intermediate carrier, so-called spacer, as connecting elements are also not required here, which can save considerable costs.
- the pressure measuring cell is mounted on a multi-part pressure connector, in which the measuring cell is first attached to a threaded connector that can be screwed onto an assembly to introduce the measuring medium.
- the threaded connector is firmly connected to a basic housing.
- the basic housing can be designed in a simple manner as a hexagonal housing which is advantageous for mounting on an assembly, either a milled or a particularly inexpensive deep-drawn part being considered.
- a hexagon housing can be made of less solid and therefore less expensive material than the pressure port.
- an improved EMC behavior of the sensor arrangement is to be expected via the resulting metal sheathing of the evaluation circuit, this being particularly advantageous with the small signal strokes of the pressure measuring cell.
- the divided pressure connection means that mechanical stress is introduced into the measuring cell and thus Ne signal drift minimized by the tightening torque and the separate base housing enables a shorter plastic device plug, which improves its mechanical connection and thus the resistance to shaking of the entire arrangement.
- the sensor arrangement can preferably be a high-pressure sensor for determining the pressure of oil, diesel, gasoline or brake fluid in a motor vehicle.
- FIG. 1 shows a sectional illustration of a first exemplary embodiment of a high-pressure sensor with a hybrid circuit on a pressure measuring cell, which is fastened to a hexagonal housing via a separate threaded connector;
- Figure 2 shows a modification of the embodiment of Figure 1 with a deep-drawn part as a hexagon housing and 3 shows a cross section through the hexagonal housing according to FIG.
- FIG. 1 shows a high-pressure sensor 1, the housing parts of which consist of a threaded connector 2, a hexagonal housing 3 and a device connector 4.
- the hexagon housing 3 With the hexagon housing 3, the entire arrangement is via the threaded connector 2 to an assembly or to a pressure-carrying line, e.g. a rail, screwable.
- the device plug 4 can be firmly inserted into the hexagon housing 3 via seals or other connection methods.
- the threaded connector 2 there is an inlet 5 for the pressure-carrying medium to be measured and a pressure measuring cell 6 with a measuring membrane is arranged at the end of the inlet 5.
- the pressure measuring cell 6 is radially welded to the threaded connector 2.
- a metal disc 7 or a metal sleeve is attached in an electrically conductive manner to the pressure measuring cell 6 in such a way that the disc or sleeve face forms a plane with the membrane surface on which a resistance measuring bridge working in a manner known per se is located.
- the circuit board with a hybrid circuit 8 is attached to this structure as an evaluation circuit.
- the hybrid circuit 8 for example a so-called ASIC, has, on the side facing the pressure measuring cell 6, contact surfaces 9 and 10 which are electrically connected to the opposite side of the component via vias.
- the contact surfaces 9 are arranged geometrically in such a way that when they are joined together with the contact surfaces of the resistance measuring bridge on the pressure measuring cell 6 they produce an electrical connection.
- On the possibly rotating Contact surface 10, the contact for the housing mass is made via the metal disc 7.
- the hybrid circuit 8 is bonded to the pressure measuring cell 6 and the metal disk 7 or the sleeve on the contact surfaces 9 and 10 using a conductive adhesive. In this way, both the contacting of the hybrid circuit 8 to the housing ground and the resistance measuring bridge, and also the attachment of the hybrid circuit 8, are established.
- the electrical connection from the hybrid circuit 8 to the connector pins 11 in the device connector 4 takes place in the exemplary embodiment according to FIG. 1, for example, via a compression spring or an S-shaped leaf spring 13.
- One side of the leaf spring 13 is here directly with a conductive adhesive on the hybrid circuit 8 glued and contacted on the other side, plug contacts 14 of the plug pins 11.
- a sleeve 15 is glued on the hybrid circuit 8 as a holder.
- FIG. 2 and FIG. 3 An exemplary embodiment can be seen from FIG. 2 and FIG. 3, in which a hexagonal housing 20 is produced as a deep-drawn part. The same or equivalent components are provided with the same reference numerals as in Figure 1.
- a pressure measuring cell 21 is only geometrically adapted to this design and the device connector 4 is held on the hexagon housing 20 by an adhesive 22.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10014992A DE10014992C2 (de) | 2000-03-25 | 2000-03-25 | Sensoranordnung |
DE10014992 | 2000-03-25 | ||
PCT/DE2001/001119 WO2001073391A1 (de) | 2000-03-25 | 2001-03-23 | Sensoranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1269134A1 true EP1269134A1 (de) | 2003-01-02 |
Family
ID=7636432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01927588A Withdrawn EP1269134A1 (de) | 2000-03-25 | 2001-03-23 | Sensoranordnung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6810746B2 (ko) |
EP (1) | EP1269134A1 (ko) |
JP (1) | JP2003529070A (ko) |
KR (1) | KR20020086683A (ko) |
CN (1) | CN1172168C (ko) |
DE (1) | DE10014992C2 (ko) |
RU (1) | RU2261419C2 (ko) |
WO (1) | WO2001073391A1 (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10163165A1 (de) * | 2001-12-20 | 2003-07-03 | Endress & Hauser Gmbh & Co Kg | Feldgerät und Verfahren zum Betrieb des Feldgerätes |
DE10201000A1 (de) * | 2002-01-11 | 2003-07-31 | Infineon Technologies Ag | Integriertes Sensormodul und Verfahren zu seiner Herstellung |
DE10221303A1 (de) * | 2002-05-14 | 2003-11-27 | Valeo Schalter & Sensoren Gmbh | Sensor, insbesondere Ultraschallsensor, und Verfahren zur Herstellung |
US7363819B2 (en) | 2002-06-22 | 2008-04-29 | Robert Bosch Gmbh | High-pressure sensor housing which is simplified by means of a connection element (also emc) |
DE10228000A1 (de) | 2002-06-22 | 2004-01-08 | Robert Bosch Gmbh | Vorrichtung zur Druckmessung |
US6742395B1 (en) * | 2002-12-20 | 2004-06-01 | Texas Instruments Incorporated | Hermetic pressure transducer |
DE10354189A1 (de) * | 2003-04-24 | 2004-11-11 | Continental Teves Ag & Co. Ohg | Drucksensorbaugruppe |
DE10361769B4 (de) * | 2003-12-29 | 2014-10-23 | Robert Bosch Gmbh | Druckaufnehmer mit einteiligem Gehäuse |
JP3912400B2 (ja) * | 2004-03-30 | 2007-05-09 | 株式会社デンソー | 圧力センサ |
CN100541157C (zh) * | 2004-03-30 | 2009-09-16 | 株式会社电装 | 压力传感器 |
DE102007016474A1 (de) * | 2007-04-05 | 2008-10-09 | Robert Bosch Gmbh | Anschlusseinheit für eine Druckmesszelle |
DE102007016477A1 (de) * | 2007-04-05 | 2008-10-09 | Robert Bosch Gmbh | Anschlusseinheit für eine Druckmesszelle |
DE102007031980A1 (de) * | 2007-07-10 | 2009-01-15 | Robert Bosch Gmbh | Anschlusseinheit für eine Druckmesszelle |
KR100923202B1 (ko) * | 2007-12-05 | 2009-10-22 | 주식회사 만도 | 압력센서 |
DE102008054382A1 (de) | 2008-12-08 | 2010-06-10 | Robert Bosch Gmbh | Drucksensormodul |
KR101600089B1 (ko) * | 2009-10-14 | 2016-03-07 | 타이코에이엠피 주식회사 | 수직형 압력 센서 |
JP2011221006A (ja) * | 2010-03-23 | 2011-11-04 | Tokyo Electron Ltd | ウェハ型温度検知センサおよびその製造方法 |
CN101832797A (zh) * | 2010-05-21 | 2010-09-15 | 湖州爱迪电气有限公司 | 可直接密封导接的有线复合传感器 |
DE102012100942A1 (de) * | 2012-01-05 | 2013-07-11 | Trafag Ag | Messzelle, Hochdrucksensor und Herstellverfahren |
DE102012204904A1 (de) * | 2012-03-27 | 2013-10-02 | Robert Bosch Gmbh | Sensoreinheit |
DE102012210752A1 (de) * | 2012-06-25 | 2014-01-23 | Robert Bosch Gmbh | Druckerfassungsmodul sowie Drucksensorvorrichtung mit einem solchen Druckerfassungsmodul |
US20140102210A1 (en) * | 2012-10-11 | 2014-04-17 | Continental Automotive Systems, Inc. | Pressure Sensor With Robustness Against Mounting Stress |
DE102012222089A1 (de) | 2012-12-03 | 2014-06-05 | Robert Bosch Gmbh | Drucksensormodul |
DE102013223442A1 (de) * | 2013-11-18 | 2015-05-21 | Robert Bosch Gmbh | Drucksensoranordnung zur Erfassung eines Drucks eines fluiden Mediums in einem Messraum |
US9869599B2 (en) * | 2014-09-30 | 2018-01-16 | Rosemount Inc. | High-temperature pressure sensing |
US9702740B2 (en) * | 2015-04-17 | 2017-07-11 | Wika Alexander Wiegand Se & Co. Kg | Measuring instrument with connecting coupling |
DE102015224472A1 (de) | 2015-12-07 | 2017-06-08 | Robert Bosch Gmbh | Drucksensor zur Erfassung eines Drucks eines fluiden Mediums |
DE102016211704A1 (de) * | 2016-06-29 | 2018-01-04 | Robert Bosch Gmbh | Vorrichtung zur Erfassung eines Drucks eines fluiden Mediums |
DE102016113209A1 (de) * | 2016-07-18 | 2018-01-18 | Sensata Germany GmbH | Drucksensor |
DE102016214952A1 (de) * | 2016-08-11 | 2018-02-15 | Robert Bosch Gmbh | Druckmesszelle und Verfahren zum Beschichten eines Trägers einer Druckmesszelle |
JP6541083B1 (ja) | 2017-12-26 | 2019-07-10 | Smk株式会社 | センサ用コネクタ |
DE102019209443A1 (de) * | 2019-06-28 | 2020-12-31 | Continental Teves Ag & Co. Ohg | Sensoreinrichtung zum Ermitteln eines Fluiddrucks |
DE102020212876A1 (de) | 2020-10-13 | 2022-04-14 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensorvorrichtung und Verfahren zur Herstellung einer Sensorvorrichtung |
KR102539993B1 (ko) * | 2022-04-14 | 2023-06-05 | 김정기 | 비틀림응력 차단성능이 향상된 컴팩트 압력센서 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US566780A (en) * | 1896-09-01 | Vehicle-wheel | ||
US4536820A (en) * | 1984-03-29 | 1985-08-20 | General Signal Corporation | Electrical feedthrough means for pressure transducer |
JPS61209334A (ja) * | 1985-03-13 | 1986-09-17 | Nippon Denso Co Ltd | 圧力検出器 |
DE3937573A1 (de) * | 1989-11-11 | 1991-05-16 | Gewerk Eisenhuette Westfalia | Elektrischer druckaufnehmer zur messung hydraulischer druecke, insbesondere zur verwendung in der bergbauhydraulik |
DE4009377A1 (de) * | 1990-03-23 | 1991-10-02 | Bosch Gmbh Robert | Druckgeber zur druckerfassung im brennraum von brennkraftmaschinen |
US5438876A (en) * | 1993-08-05 | 1995-08-08 | The Foxboro Company | Modular diaphragm pressure sensor with peripheral mounted electrical terminals |
JPH0864732A (ja) * | 1994-08-26 | 1996-03-08 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JP3465996B2 (ja) * | 1995-05-26 | 2003-11-10 | 株式会社シチズン電子 | 圧力センサ |
US5802912A (en) * | 1996-01-25 | 1998-09-08 | Delco Electronics Corporation | Electrical terminal apparatus |
DE19603674A1 (de) * | 1996-02-02 | 1997-08-07 | Bosch Gmbh Robert | Drucksensor |
US5656780A (en) * | 1996-03-28 | 1997-08-12 | Kavlico Corporation | Capacitive pressure transducer with an integrally formed front housing and flexible diaphragm |
US6131467A (en) * | 1997-05-09 | 2000-10-17 | Fujikoki Corporation | Pressure sensor including a joint for connecting a housing and connector case together |
US5974893A (en) * | 1997-07-24 | 1999-11-02 | Texas Instruments Incorporated | Combined pressure responsive transducer and temperature sensor apparatus |
DE69817497T2 (de) * | 1997-10-28 | 2004-06-24 | Toyoda Koki K.K., Kariya | Druckmessvorrichtung |
US6212955B1 (en) * | 1997-12-09 | 2001-04-10 | Hokuriku Electric Industry Co., Ltd. | Capacitance-type pressure sensor unit |
-
2000
- 2000-03-25 DE DE10014992A patent/DE10014992C2/de not_active Expired - Fee Related
-
2001
- 2001-03-23 WO PCT/DE2001/001119 patent/WO2001073391A1/de not_active Application Discontinuation
- 2001-03-23 CN CNB018071988A patent/CN1172168C/zh not_active Expired - Fee Related
- 2001-03-23 US US10/239,817 patent/US6810746B2/en not_active Expired - Fee Related
- 2001-03-23 KR KR1020027012581A patent/KR20020086683A/ko not_active Application Discontinuation
- 2001-03-23 RU RU2002127799/28A patent/RU2261419C2/ru not_active IP Right Cessation
- 2001-03-23 JP JP2001571065A patent/JP2003529070A/ja active Pending
- 2001-03-23 EP EP01927588A patent/EP1269134A1/de not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO0173391A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE10014992A1 (de) | 2001-10-04 |
US20030233881A1 (en) | 2003-12-25 |
RU2261419C2 (ru) | 2005-09-27 |
US6810746B2 (en) | 2004-11-02 |
JP2003529070A (ja) | 2003-09-30 |
DE10014992C2 (de) | 2002-01-31 |
CN1172168C (zh) | 2004-10-20 |
KR20020086683A (ko) | 2002-11-18 |
WO2001073391A1 (de) | 2001-10-04 |
CN1419649A (zh) | 2003-05-21 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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17P | Request for examination filed |
Effective date: 20021025 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
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RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB IT |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20071001 |