EP1266730B1 - Procédé de fabrication des panneaux de fibres résistant à l'humidité - Google Patents

Procédé de fabrication des panneaux de fibres résistant à l'humidité Download PDF

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Publication number
EP1266730B1
EP1266730B1 EP01850102A EP01850102A EP1266730B1 EP 1266730 B1 EP1266730 B1 EP 1266730B1 EP 01850102 A EP01850102 A EP 01850102A EP 01850102 A EP01850102 A EP 01850102A EP 1266730 B1 EP1266730 B1 EP 1266730B1
Authority
EP
European Patent Office
Prior art keywords
formaldehyde
chips
tannin
condensed tannins
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01850102A
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German (de)
English (en)
Other versions
EP1266730A1 (fr
Inventor
Edmone Roffael
Björn Mansson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROFFAEL, EDMONE
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to EP01850102A priority Critical patent/EP1266730B1/fr
Priority to DE50109378T priority patent/DE50109378D1/de
Priority to AT01850102T priority patent/ATE321636T1/de
Publication of EP1266730A1 publication Critical patent/EP1266730A1/fr
Application granted granted Critical
Publication of EP1266730B1 publication Critical patent/EP1266730B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material

Definitions

  • the invention relates to a process for the production of moisture-resistant chipboards and fibreboards in the dry process, such as medium-density fiberboard (MDF).
  • MDF medium-density fiberboard
  • Wood chipboards and fibreboards are produced by gluing chips or fibers with a binder, scattering the glued chips or fibers into mats and then pressing them to chipboard or fiberboard at temperatures of 140 ° C to 220 ° C.
  • chipboard gluing is usually done after drying the chips
  • MDF medium-density fiberboard
  • the gluing of the fibers before or even after the drying of the fibers take place.
  • the wood fibers are first glued in a so-called blow-line process and then dried in one or two stages.
  • Aminoplast resins in particular urea-formaldehyde (UF resins) and urea-melamine-formaldehyde resins (MUF resins) are mainly used as binders for the production of particleboard and fiberboard.
  • Other binders such as phenol-formaldehyde (PF) alkaline curing resins, tannin-formaldehyde (TF) resins and polymeric diisocyanate (PMDI) based adhesives may also be used. These binders have so far been of relatively little importance. In multilayer chipboard and fiberboard, different binders can be used in the different layers. Thus, e.g.
  • OSB Oriented Strandboards
  • MUF resins in the outer layers.
  • chipboard fiberboard in which the outer layers of fibers and the middle layers consist of chips.
  • binders can be used in the chip and fiber layers.
  • UF resins urea-formaldehyde resins
  • UF resins adhere to two disadvantages as a binder. These are the subsequent release of formaldehyde and the low moisture resistance of wood-based materials produced with UF resins.
  • UF resins can not be used to produce chipboard or fiberboard that is suitable for use with UF resins Resistivity test according to DIN 68763 exist. With UF resins also chipboard and fiberboard are extremely or hardly producible with extremely low Thickenqellung. This is especially true when the molar ratio of formaldehyde: urea in the UF resins is low. From a certain molar ratio of (formaldehyde: urea) increases the thickness swelling significantly with reducing the formaldehyde content in the resin.
  • This method has the disadvantage of reducing the moisture resistance of the binder based on formaldehyde.
  • Their use is in the use of resins with a molar ratio of formaldehyde: urea of 1: 1 and below very critical (DE 3222195).
  • Urea-formaldehyde resins containing melamine-formaldehyde resins are used in the chipboard industry for the production of chipboard and fiberboard with low thickness swelling and increased moisture resistance.
  • the bonds produced with such resins lack the high weather resistance (DE-PS 2020481).
  • DE-PS 2020481 it is therefore proposed to produce weathering-providing wood glues based on melamine and optionally urea by adding small amounts to an aqueous melamine resin which may be blended with up to 600 mole percent with urea under specific conditions added to phenol.
  • melamine-urea phenol-formaldehyde resins which are regarded as mixed condensates of melamine, urea and phenol with the formaldehyde, are also used in the wood-based material industry for the production of particleboards.
  • MUPF and MUF resins are expensive.
  • the incorporation of melamine in urea-formaldehyde resins also reduces the curing rate of the resin and thus leads, albeit slightly, partially to an extension of the required pressing times.
  • melamine as a formaldehyde scavenger in UF resins with a high molar ratio of formaldehyde: urea (1.5: 1) is known (DE-OS 1653167). Also known is the addition of melamine to urea-formaldehyde resins having a low molar ratio of formaldehyde: urea (1: 1 to about 1.2: 1) from EP 0062389.
  • the moisture resistance which is determined according to DIN 68763 as V100 value, decreases considerably if the amount of formaldehyde in the binder is reduced.
  • the V100 value decreases considerably when the ratio F / NH 2 (formaldehyde / NH 2 groups) in the resin drops below 0.65. This appears to be due to the fact that as the proportion of formaldehyde in the resin decreases, the crosslink density of the cured resin decreases.
  • an increase in the formaldehyde content has the disadvantage that the formaldehyde release of the produced chipboard or fiberboard is increased.
  • EP-A-0013447 proposes to use aminoplast resins in combination with 2 to 20% of soluble or dispersible protein as a binder.
  • the use of PMDI as an additive for UF resins or MUF resins leads to an increase in binder costs and requires special precautions during operation.
  • the object of this invention therefore, was to find a new way to produce moisture-resistant wood chip board and wood fiber boards without reducing the curing rate of the binders used, in particular those based on MUF resins, or reduce the moisture resistance of the plates produced or to increase the formaldehyde release. It is also an object of the invention to produce sheets with high moisture resistance when using MUF resins with extremely low formaldehyde content.
  • the condensed tannin is added to the fibers prior to gluing in the blow-line.
  • the tannin is also added prior to drying the fibers. This procedure has the advantage that the condensed tannins are also applied in dilute form to the chips or to the fibers.
  • the condensed tannins can react with and trap the formaldehyde which may be released during the drying of wood shavings or fibers.
  • the emission of formaldehyde during the drying of the chips and fibers is also significantly reduced.
  • the formaldehyde release of the plates made of the chips and fibers is surprisingly significantly reduced in this way.
  • the tannins can be added to both the fibers and the chips in varying amounts.
  • the teaching of the present invention also differs from the teaching of DE-OS 4402341, which provides a treatment of chips with alkaline tannin formaldehyde resins, preferably at a pH above 12 and subsequent drying of the glued chips before the pressing process.
  • the aim of DE-OS 4402341 is to induce self-condensation of the tannins without the addition of a crosslinking agent such as formaldehyde. Up to what moisture content the chips must be dried, can not be found in DE-OS 4402341.
  • the example listed in DE-OS 4402341 contains no information about the pressing temperature. With the procedure according to DE-OS 440234A1 can not achieve plates with moisture-resistant glue. However, this is the object of the present invention.
  • the amount of tannin solution, based on the weight of the chips, is 3.33% (or 1% solid tannin based on dry chips).
  • the chips were immediately dried to a humidity of 1-2%.
  • the dried chips were glued with a MUF resin.
  • the binder was 11% (based on the Atro weight of the chips). The glued chips were then spread to mats and pressed hot to 19 mm thick chipboard.
  • the pine wood chips were dried to a moisture of 1-2% without the addition of condensed tannins and glued with a MUF resin in amounts of 12% based on the atro weight of the chips and then sprinkled into mats and hot pressed.
  • a tannin-formaldehyde resin or a mixture of tannin-formaldehyde resin and melamine-urea-formaldehyde resin may also be used as a binder.
  • the chips are treated with condensed tannins before drying and after drying - as usual - glued with a mixture of tannin formaldehyde resin and Melaminhamstofformaldehydharz, sprinkled into mats and then pressed into chipboard.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Inorganic Fibers (AREA)

Claims (14)

  1. Procédé de fabrication de panneaux de particules ou de fibres résistant à l'humidité d'après le traitement par voie sèche avec des résines phénolformaldéhyde ou des résines mélamine-urée-formaldéhyde ou des résines mélamine-urée-phénol ou des résines tanin-formaldéhyde ou PMDI comme liant, caractérisé en ce que les particules ou fibres humides sont traitées avec des tanins condensés avant le collage avec le liant et en ce que les particules ou fibres sont ensuite séchées jusqu'à une humidité de 5% maximum dans le cas de la fabrication de panneaux de particules et jusqu'à une humidité de 15% maximum dans le cas de la fabrication de panneaux de fibres.
  2. Procédé selon la revendication 1, caractérisé en ce que des extraits de bois de quebracho sont utilisés comme tanin.
  3. Procédé selon les revendications 1 et 2, caractérisé en ce que la solution de tanin présente une teneur en matière brute de 30%.
  4. Procédé selon les revendications 1, 2 et 3, caractérisé en ce que la valeur pH de la solution de tanin est dans la plage acide.
  5. Procédé selon la revendication 1, caractérisé en ce que la valeur pH de la solution est dans la plage alcaline.
  6. Procédé selon la revendication 1, caractérisé en ce que les particules traitées avec des tanins condensés avant le séchage ne sont utilisées que dans les couches extérieures de panneaux de particules de bois à trois couches.
  7. Procédé selon la revendication 1, caractérisé en ce que les particules traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche centrale de panneaux de particules à trois couches.
  8. Procédé selon la revendication 1, caractérisé en ce que les fibres traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche centrale de panneaux de fibres à trois couches.
  9. Procédé selon la revendication 1, caractérisé en ce que les fibres traitées avec des tanins condensés avant le séchage ne sont utilisées que dans la couche extérieure de panneaux de particules-fibres.
  10. Procédé selon la revendication 1, caractérisé en ce que la résine MUF utilisée comme liant présente un rapport molaire F/NH2 inférieur à 0,7.
  11. Procédé selon la revendication 1, caractérisé en ce que la résine MUF utilisée comme liant présente un rapport molaire F/NH2 inférieur à 0,5.
  12. Procédé selon la revendication 1, caractérisé en ce que, dans les couches dont les particules n'ont pas été traitées avec du tanin avant le séchage, le liant utilisé pour la fabrication de panneaux de particules et de fibres est un mélange de résines tanin-formaldéhyde et mélamine-urée-formaldéhyde.
  13. Procédé selon la revendication 1, caractérisé en ce que les particules ou les fibres ont une humidité supérieure à 12% avant le traitement au tanin.
  14. Procédé selon la revendication 1, caractérisé en ce que les particules ou les fibres ont une humidité supérieure à 50% avant le traitement au tanin.
EP01850102A 2001-06-12 2001-06-12 Procédé de fabrication des panneaux de fibres résistant à l'humidité Expired - Lifetime EP1266730B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01850102A EP1266730B1 (fr) 2001-06-12 2001-06-12 Procédé de fabrication des panneaux de fibres résistant à l'humidité
DE50109378T DE50109378D1 (de) 2001-06-12 2001-06-12 Verfahren zur Herstellung von feuchtebeständigen Span- und mitteldichten Faserplatten (MDF)
AT01850102T ATE321636T1 (de) 2001-06-12 2001-06-12 Verfahren zur herstellung von feuchtebeständigen span- und mitteldichten faserplatten (mdf)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01850102A EP1266730B1 (fr) 2001-06-12 2001-06-12 Procédé de fabrication des panneaux de fibres résistant à l'humidité

Publications (2)

Publication Number Publication Date
EP1266730A1 EP1266730A1 (fr) 2002-12-18
EP1266730B1 true EP1266730B1 (fr) 2006-03-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01850102A Expired - Lifetime EP1266730B1 (fr) 2001-06-12 2001-06-12 Procédé de fabrication des panneaux de fibres résistant à l'humidité

Country Status (3)

Country Link
EP (1) EP1266730B1 (fr)
AT (1) ATE321636T1 (fr)
DE (1) DE50109378D1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002953568A0 (en) * 2002-12-24 2003-01-16 Borden Chemical Australia Pty Ltd Novel chemical composition, method of making same, and products made therefrom
FR2850414B1 (fr) * 2003-01-24 2005-11-25 Espace Production Internationa Revetement de sol stratifie astatique
ATE495866T1 (de) * 2004-10-15 2011-02-15 Fraunhofer Ges Forschung Verfahren zur verminderung der abgabe von flüchtigen organischen verbindungen (voc) aus holz und holzzerkleinerungsprodukten und aus daraus hergestellten holzwerkstoffen, insbesondere holzspanplatten
DE102005019627B3 (de) * 2005-04-26 2006-10-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von mitteldichten Faserplatten und Faserformteilen mit verringerter Emission und niedriger Dickenquellung
EP2183081A1 (fr) 2007-08-08 2010-05-12 Kronospan SK S.R.O. Panneau de particules à une seule couche pour le batiment
ES2935907T3 (es) 2015-04-21 2023-03-13 Kastamonu Entegre Agac Sanayi Anonim Sirketi Proceso de producción de las resinas que contienen poliflavonoides y derivados y su aplicación en los productos de tableros de materiales compuestos a base de madera
CN105583934A (zh) * 2015-11-30 2016-05-18 万华生态板业股份有限公司 作为防霉剂使用的硼酸锌在秸秆板生产中的应用
WO2019117799A1 (fr) * 2017-12-15 2019-06-20 Nsr Ab Panneau de particules avec résine hybride

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4402341C2 (de) * 1994-01-27 2000-11-02 Bakelite Ag Bindemittellösungen für cellulosehaltige Produkte
DE4431316C1 (de) * 1994-09-02 1996-05-02 Schlingmann Gmbh & Co Verfahren zur Verminderung der Formaldehydabgabe von Holzspan- oder Faserplatten
DE19528492A1 (de) * 1995-08-03 1997-02-06 Raffael Etmone Prof Dr Ing Verfahren zur Herstellung von mit Tanninformeldehydharzen gebundenen mitteldichten Holzfaserplatten (MDF)
DE19704525A1 (de) * 1996-02-09 1997-08-14 Schlingmann Gmbh & Co Verfahren zur Herstellung von formaldehydarmen tanningebundenen Holzspan- und Faserplatten

Also Published As

Publication number Publication date
ATE321636T1 (de) 2006-04-15
EP1266730A1 (fr) 2002-12-18
DE50109378D1 (de) 2006-05-18

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