EP1224433A1 - Procede pour determiner des structures geometriques sur ou dans un substrat, ainsi que des parametres de materiaux - Google Patents

Procede pour determiner des structures geometriques sur ou dans un substrat, ainsi que des parametres de materiaux

Info

Publication number
EP1224433A1
EP1224433A1 EP00969341A EP00969341A EP1224433A1 EP 1224433 A1 EP1224433 A1 EP 1224433A1 EP 00969341 A EP00969341 A EP 00969341A EP 00969341 A EP00969341 A EP 00969341A EP 1224433 A1 EP1224433 A1 EP 1224433A1
Authority
EP
European Patent Office
Prior art keywords
substrate
structures
light intensity
reflection
intensity values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP00969341A
Other languages
German (de)
English (en)
Inventor
Rolf Hertling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Eta-Optik GmbH
Steag ETA Optik GmbH
Original Assignee
Steag Eta-Optik GmbH
Steag ETA Optik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Eta-Optik GmbH, Steag ETA Optik GmbH filed Critical Steag Eta-Optik GmbH
Publication of EP1224433A1 publication Critical patent/EP1224433A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry

Definitions

  • the invention relates to a method for determining geometric structures on or in a substrate on which light diffraction occurs, and a method for determining parameters of the materials present on or in a substrate, geometric structures leading to light diffraction being present in or on the substrate ,
  • Structured substrates are, for example, optical storage media (CD, CD-R, DVD, CD-RW, DVD-RW, DVD-R, MO / MD, etc.), the trenches, so-called grooves, for writing, reading and / or erasing of data, whose geometries such as depth, width and distance are different for the different media types and manufacturer-specific.
  • optical storage media CD, CD-R, DVD, CD-RW, DVD-RW, DVD-R, MO / MD, etc.
  • the trenches so-called grooves, for writing, reading and / or erasing of data, whose geometries such as depth, width and distance are different for the different media types and manufacturer-specific.
  • different layers with different refraction and / or absorption indices and different layer thicknesses are applied to the structured substrates, preferably polycarbonate blanks, so that the desired optical, thermal, electrical and mechanical properties of the storage medium result.
  • the invention is therefore based on the object of creating a method which not only enables the determination of thicknesses of continuous layers, but also geometric structures on or in a substrate.
  • Another object of the present invention is to provide a method for determining parameters of the materials present on or in a substrate. In a method for determining geometric parameters on or in a substrate on which light diffraction occurs, the object is achieved by the following method steps:
  • the method according to the invention it is possible not only to measure the surface structures present in a substrate, such as grooves or grooves, but also to determine the geometric structures of layers and layers of different materials which are applied to the substrate. For example, it is possible with the method according to the invention to also determine existing segmentations, that is to say lateral structures, perpendicular to the direction of the layer structure, such as are present, for example, in the case of information-carrying substances from CD (CD-R) which can be written once.
  • CD information-carrying substances from CD
  • the inventive measure to simulate by amplitude and / or phase-correct superimposition of all partials the optical spectra and by varying the geometric parameters to determine this so that the measured and modeled spectra optimally match ', it is possible, even over the substrate with to determine existing or applied layers of different layer thicknesses in a spatially resolved manner. Since the spectra are very sensitive to changes in the thickness of thin layers, for example in the nanometer range, the accuracy of the method according to the invention is accordingly high. That invented In addition, the method according to the invention works non-destructively and without the need for sample preparations, as is the case with conventional methods.
  • the reflection and / or transmission light intensity values of the diffracted light are measured as a function of the wavelength. It is particularly advantageous to measure the diffracted light of the zero diffraction order, although the diffracted light of the higher diffraction order can also be evaluated for this measurement.
  • the determination of the geometric dimensions of the structures in and / or on the substrate is particularly advantageous.
  • the geometric structures are preferably determined by the thicknesses of the layers applied to the substrate.
  • the local structures on the substrate surface are determined. This makes it possible to ascertain spatially resolved lateral segmentations or relief differences across the substrate area.
  • the structures on the substrate change continuously across the substrate surface
  • the method according to the invention determine, for example, bevels or round surface areas by dividing the structures into a grid into segments or cells, the accuracy of the structure determination being selectable by the fineness of the grid.
  • the structure of such a multi-component division is thus determined by suitable screening with cells of any material, thickness, depth and / or width.
  • the structures, which may also change at least partially continuously across the substrate surface are preferably formed by layers which are applied to the substrate.
  • the method according to the invention for regulating the structure formation is used in a manufacturing process.
  • the method according to the invention is therefore preferably used “inline” in a manufacturing process.
  • the reflection and / or transmission light intensity values of the diffracted light are simulated as a function of the wavelength in order to form desired optical target data.
  • the method according to the invention also enables the simulation of desired optical target data and thus the determination, that is to say a structural design of the structure to be applied to a substrate, for example a multi-component system in the case of optical storage media.
  • the substrates are blanks for data storage media, the structures being formed as grooves in the blank, and the structures applied to the blank being formed from layers of information-carrying substances, so-called dyes.
  • CD-R writable CD
  • the method according to the invention is of course not limited to the use in connection with optical storage media and their production.
  • the present method is also suitable not only for determining surface structures, but also for parameters of materials that are present on or in a substrate.
  • This object is achieved according to the invention with a method for determining parameters of the materials present on or in a substrate, geometric structures leading to light diffraction being present in or on the substrate, namely through the following method steps:
  • Such a measuring method can in turn be used non-destructively and can be used both in “offline” and in “inline” applications in connection with optical storage media but also with other objects, such as displays and their manufacture.
  • the invention as well as its design and advantages will be explained below using the example of measuring or coating a CD-R under
  • FIG. 1 shows a schematic cross section through a region of a layered substrate for a CD-R
  • Fig. 4 shows an example for the determination of spatially resolved dimensions of the structure in the land area.
  • FIG. 1 the lateral dimensions of a cross-sectional area through a CD-R, which extend in the x-y plane, and the layer thicknesses are plotted in the vertical direction on the z-axis.
  • the blank 1 made of polycarbonate in the present exemplary embodiment has a so-called land area in the first lateral segment area A, which continuously falls into a so-called groove area C in the lateral segment area B, which then in the x direction in a further transition area D in the Land area E merges, which corresponds to land area A.
  • the blank 1 is thus formed with a groove or groove C, the transition areas B, D of which merge into the land areas A, E.
  • a layer, a so-called dye layer 2 is applied to this blank 1. It is thinner in land areas A, E than in groove area C, the layer thickness increasing from groove area C to land area A, E in transition areas B, D. This results in a different structure in the lateral direction x for the dye layer 2 with a greater thickness but a lower overall height in the groove area C and higher overall dimensions in the land area A, E.
  • Continuously changing structures, for example the transition areas B, D are preferably detected with the method according to the invention in that these areas are divided into segments and polygonized. The individual segments and their thicknesses are then subjected to the method according to the invention in a corresponding manner.
  • the accuracy of the structure determination of such transition areas B, D can be specified by the choice of the segmentation or polygonization fineness.
  • the reflectivity according to curve 21 is calculated from initially specified optical models. Thereafter, the dimensions of the segment areas and the layer thicknesses and / or the spectral material parameters, such as the refractive index n and / or the absorption index k, are varied with each calculation step until a curve 21 results which has the smallest possible deviation from the curve 22. This then results in the parameters of the structures examined, such as the depth, the width and / or the spacing of the substrate and layer structures.
  • DE 198 52 323 A1 which did not pre-publish and goes back to the same applicant, and which is made the content of the present application to avoid repetition.
  • the determination of the substrate and layer structure is carried out across the surface of the substrate point by point or in sections in the lateral direction, so that a measurement of the structures in the lateral direction, for example in the x and y directions, is also obtained, such as this can be seen from FIGS. 3 and 4 for segments with different structural dimensions in the groove area and in the land area across the substrate area.
  • FIGS. 3 and 4 each show the dye thicknesses for the color or gray gradations in nanometers (nm). The invention was previously explained in connection with a very simple embodiment in which only one layer is applied to the substrate.
  • the method according to the invention can also be used for objects and their manufacture in which a multiplicity of layers, layer thicknesses and lateral segmentations are provided, it being possible for geometric parameters to also have the value zero.
  • the geometric parameters for example the structures, can not only occur periodically, as is the case with the grooves of optical storage media, but can also be non-periodic and change not only in the x direction but in particular also in the y direction , as is the case for example with objects with irregular structures in the x and y direction, for example with displays.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

Selon l'invention, pour déterminer des structures géométriques et/ou des paramètres de matériaux sur ou dans des substrat et à résolution locale sur toute la surface du substrat, il est prévu les dispositions suivantes: mesurer les valeurs d'intensité lumineuse de réflexion et/ou de transmission de la lumière diffractée en fonction de la longueur d'ondes ; calculer les valeurs d'intensité lumineuse de réflexion et/ou de transmission à l'aide d'un modèle d'itération dans lequel les paramètres individuels de structure de couche et/ou de matériaux entrent, et modifier lesdits paramètres jusqu'à ce que les valeurs mesurées et les valeurs calculées coïncident le plus possible.
EP00969341A 1999-10-20 2000-09-29 Procede pour determiner des structures geometriques sur ou dans un substrat, ainsi que des parametres de materiaux Ceased EP1224433A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950559A DE19950559B4 (de) 1999-10-20 1999-10-20 Verfahren zum Bestimmen von geometrischen Strukturen auf oder in einem Substrat sowie von Materialparametern
DE19950559 1999-10-20
PCT/EP2000/009533 WO2001029502A1 (fr) 1999-10-20 2000-09-29 Procede pour determiner des structures geometriques sur ou dans un substrat, ainsi que des parametres de materiaux

Publications (1)

Publication Number Publication Date
EP1224433A1 true EP1224433A1 (fr) 2002-07-24

Family

ID=7926301

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00969341A Ceased EP1224433A1 (fr) 1999-10-20 2000-09-29 Procede pour determiner des structures geometriques sur ou dans un substrat, ainsi que des parametres de materiaux

Country Status (4)

Country Link
US (1) US6753971B1 (fr)
EP (1) EP1224433A1 (fr)
DE (1) DE19950559B4 (fr)
WO (1) WO2001029502A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10345551A1 (de) * 2003-09-30 2005-05-04 Infineon Technologies Ag Verfahren zum Charakterisieren einer Schicht
DE10346850B4 (de) * 2003-10-09 2005-12-15 Infineon Technologies Ag Verfahren zum Ermitteln einer Eigenschaft einer strukturierten Schicht
DE102019213904A1 (de) 2019-09-12 2021-03-18 Carl Zeiss Smt Gmbh Verfahren zur Erfassung einer Objektstruktur sowie Vorrichtung zur Durchführung des Verfahrens

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US4555767A (en) * 1982-05-27 1985-11-26 International Business Machines Corporation Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance
CH666547A5 (de) 1984-12-20 1988-07-29 Fischer Ag Georg Optisch-elektronisches messverfahren, eine dafuer erforderliche einrichtung und deren verwendung.
DE4228870C2 (de) * 1992-08-29 1997-01-09 Inst Halbleiterphysik Gmbh Verfahren zum Bestimmen geometrischer Abmessungen an dünnen, optisch transparenten Schichten
US5412473A (en) * 1993-07-16 1995-05-02 Therma-Wave, Inc. Multiple angle spectroscopic analyzer utilizing interferometric and ellipsometric devices
US5604581A (en) * 1994-10-07 1997-02-18 On-Line Technologies, Inc. Film thickness and free carrier concentration analysis method and apparatus
JP3265879B2 (ja) * 1994-11-25 2002-03-18 日産自動車株式会社 ３次元直交格子データの生成装置
US5539213A (en) * 1995-01-27 1996-07-23 International Business Machines Corporation Process and apparatus for laser analysis of surface having a repetitive texture pattern
JPH08329534A (ja) * 1995-06-01 1996-12-13 Hitachi Maxell Ltd 光ディスク用原盤の製造方法
US5739909A (en) * 1995-10-10 1998-04-14 Lucent Technologies Inc. Measurement and control of linewidths in periodic structures using spectroscopic ellipsometry
US5867276A (en) * 1997-03-07 1999-02-02 Bio-Rad Laboratories, Inc. Method for broad wavelength scatterometry
DE19739794C2 (de) * 1997-09-10 1999-11-18 Steag Hama Tech Ag Verfahren zur Regelung eines Beschichtungsvorgangs
US5963329A (en) * 1997-10-31 1999-10-05 International Business Machines Corporation Method and apparatus for measuring the profile of small repeating lines
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
AU3778799A (en) * 1998-04-30 1999-11-16 Paul Derek Coon Alignment simulation
DE19852323C2 (de) * 1998-11-12 2001-08-16 Steag Hamatech Ag Verfahren zum Bestimmen der Dicke von auf einem Substrat vorgesehenen Schichten

Non-Patent Citations (1)

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Title
See references of WO0129502A1 *

Also Published As

Publication number Publication date
DE19950559B4 (de) 2006-08-17
WO2001029502A1 (fr) 2001-04-26
US6753971B1 (en) 2004-06-22
DE19950559A1 (de) 2001-05-17

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