EP1198624A4 - Verfahren zum elektroplattieren eines elektrisch mit leitendem polymer beschichteten werkstücks - Google Patents

Verfahren zum elektroplattieren eines elektrisch mit leitendem polymer beschichteten werkstücks

Info

Publication number
EP1198624A4
EP1198624A4 EP01910324A EP01910324A EP1198624A4 EP 1198624 A4 EP1198624 A4 EP 1198624A4 EP 01910324 A EP01910324 A EP 01910324A EP 01910324 A EP01910324 A EP 01910324A EP 1198624 A4 EP1198624 A4 EP 1198624A4
Authority
EP
European Patent Office
Prior art keywords
electroplating
work piece
electrically conducting
conducting polymer
piece coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01910324A
Other languages
English (en)
French (fr)
Other versions
EP1198624A1 (de
Inventor
Walter Kronenberg
Juergen Hupe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of EP1198624A1 publication Critical patent/EP1198624A1/de
Publication of EP1198624A4 publication Critical patent/EP1198624A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
EP01910324A 2000-02-18 2001-02-20 Verfahren zum elektroplattieren eines elektrisch mit leitendem polymer beschichteten werkstücks Withdrawn EP1198624A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10007435A DE10007435A1 (de) 2000-02-18 2000-02-18 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks
DE10007435 2000-02-18
PCT/US2001/001235 WO2001061079A1 (en) 2000-02-18 2001-02-20 Process for electroplating a work piece coated with an electrically conducting polymer

Publications (2)

Publication Number Publication Date
EP1198624A1 EP1198624A1 (de) 2002-04-24
EP1198624A4 true EP1198624A4 (de) 2003-05-21

Family

ID=7631430

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01910324A Withdrawn EP1198624A4 (de) 2000-02-18 2001-02-20 Verfahren zum elektroplattieren eines elektrisch mit leitendem polymer beschichteten werkstücks

Country Status (11)

Country Link
US (1) US20020157959A1 (de)
EP (1) EP1198624A4 (de)
KR (1) KR20020021629A (de)
CN (1) CN1366563A (de)
AU (1) AU2001237942A1 (de)
BR (1) BR0104544A (de)
CA (1) CA2369687A1 (de)
DE (1) DE10007435A1 (de)
IL (1) IL145890A0 (de)
MX (1) MXPA01010570A (de)
WO (1) WO2001061079A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314031C (zh) * 2000-02-21 2007-05-02 特科2000国际有限公司 便携式数据存储装置
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
ES2637799T3 (es) 2011-11-15 2017-10-17 Ashwin-Ushas Corporation, Inc. Dispositivo electrocrómico con polímeros complementarios
CN103046031B (zh) * 2012-12-11 2014-08-13 胜宏科技（惠州）股份有限公司 一种线路板电镀金方法
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN110499527B (zh) * 2019-08-12 2021-07-13 嘉兴市上村电子有限公司 Bt树脂基材电镀的安装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767538A (en) * 1971-01-11 1973-10-23 Siemens Ag Method of coating plastic films with metal
US5516416A (en) * 1994-12-14 1996-05-14 International Business Machines Corporation Apparatus and method for electroplating pin grid array packaging modules
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US6197171B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Pin contact mechanism for plating pin grid arrays
US6214180B1 (en) * 1999-02-25 2001-04-10 International Business Machines Corporation Method for shorting pin grid array pins for plating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE3810992A1 (de) * 1988-03-31 1989-10-12 Hoechst Ceram Tec Ag Verfahren und vorrichtung zum plattieren von pin-grid-arrays
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
US5871629A (en) * 1996-09-18 1999-02-16 International Business Machines Corporation Method and apparatus for fixturing substrate assemblies for electrolytic plating
EP0889680A3 (de) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Verfahren zur Entfernung und/oder Aufbringung von leitendem Material
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767538A (en) * 1971-01-11 1973-10-23 Siemens Ag Method of coating plastic films with metal
US5516416A (en) * 1994-12-14 1996-05-14 International Business Machines Corporation Apparatus and method for electroplating pin grid array packaging modules
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
US6214180B1 (en) * 1999-02-25 2001-04-10 International Business Machines Corporation Method for shorting pin grid array pins for plating
US6197171B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Pin contact mechanism for plating pin grid arrays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0161079A1 *

Also Published As

Publication number Publication date
CA2369687A1 (en) 2001-08-23
BR0104544A (pt) 2002-01-08
CN1366563A (zh) 2002-08-28
MXPA01010570A (es) 2003-09-04
EP1198624A1 (de) 2002-04-24
AU2001237942A1 (en) 2001-08-27
IL145890A0 (en) 2002-07-25
US20020157959A1 (en) 2002-10-31
WO2001061079A1 (en) 2001-08-23
DE10007435A1 (de) 2001-08-23
KR20020021629A (ko) 2002-03-21

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