IL145890A0 - Process for electroplating a work piece coated with an electrically conducting polymer - Google Patents

Process for electroplating a work piece coated with an electrically conducting polymer

Info

Publication number
IL145890A0
IL145890A0 IL14589001A IL14589001A IL145890A0 IL 145890 A0 IL145890 A0 IL 145890A0 IL 14589001 A IL14589001 A IL 14589001A IL 14589001 A IL14589001 A IL 14589001A IL 145890 A0 IL145890 A0 IL 145890A0
Authority
IL
Israel
Prior art keywords
electroplating
work piece
electrically conducting
conducting polymer
piece coated
Prior art date
Application number
IL14589001A
Other languages
English (en)
Original Assignee
Ethone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ethone Inc filed Critical Ethone Inc
Publication of IL145890A0 publication Critical patent/IL145890A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
IL14589001A 2000-02-18 2001-02-20 Process for electroplating a work piece coated with an electrically conducting polymer IL145890A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10007435A DE10007435A1 (de) 2000-02-18 2000-02-18 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks
PCT/US2001/001235 WO2001061079A1 (en) 2000-02-18 2001-02-20 Process for electroplating a work piece coated with an electrically conducting polymer

Publications (1)

Publication Number Publication Date
IL145890A0 true IL145890A0 (en) 2002-07-25

Family

ID=7631430

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14589001A IL145890A0 (en) 2000-02-18 2001-02-20 Process for electroplating a work piece coated with an electrically conducting polymer

Country Status (11)

Country Link
US (1) US20020157959A1 (de)
EP (1) EP1198624A4 (de)
KR (1) KR20020021629A (de)
CN (1) CN1366563A (de)
AU (1) AU2001237942A1 (de)
BR (1) BR0104544A (de)
CA (1) CA2369687A1 (de)
DE (1) DE10007435A1 (de)
IL (1) IL145890A0 (de)
MX (1) MXPA01010570A (de)
WO (1) WO2001061079A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL355475A1 (en) * 2000-02-21 2004-05-04 Trek 2000 International Ltd. A portable data storage device
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
WO2013074702A1 (en) 2011-11-15 2013-05-23 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
CN103046031B (zh) * 2012-12-11 2014-08-13 胜宏科技（惠州）股份有限公司 一种线路板电镀金方法
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN110499527B (zh) * 2019-08-12 2021-07-13 嘉兴市上村电子有限公司 Bt树脂基材电镀的安装方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
DE3810992A1 (de) * 1988-03-31 1989-10-12 Hoechst Ceram Tec Ag Verfahren und vorrichtung zum plattieren von pin-grid-arrays
US5114558A (en) * 1989-02-15 1992-05-19 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5516416A (en) * 1994-12-14 1996-05-14 International Business Machines Corporation Apparatus and method for electroplating pin grid array packaging modules
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
US5871629A (en) * 1996-09-18 1999-02-16 International Business Machines Corporation Method and apparatus for fixturing substrate assemblies for electrolytic plating
US5869139A (en) * 1997-02-28 1999-02-09 International Business Machines Corporation Apparatus and method for plating pin grid array packaging modules
EP0889680A3 (de) * 1997-07-01 2000-07-05 Deutsche Thomson-Brandt Gmbh Verfahren zur Entfernung und/oder Aufbringung von leitendem Material
DE19822075C2 (de) * 1998-05-16 2002-03-21 Enthone Gmbh Verfahren zur metallischen Beschichtung von Substraten
US6214180B1 (en) * 1999-02-25 2001-04-10 International Business Machines Corporation Method for shorting pin grid array pins for plating
US6197171B1 (en) * 1999-03-31 2001-03-06 International Business Machines Corporation Pin contact mechanism for plating pin grid arrays

Also Published As

Publication number Publication date
EP1198624A4 (de) 2003-05-21
KR20020021629A (ko) 2002-03-21
EP1198624A1 (de) 2002-04-24
CA2369687A1 (en) 2001-08-23
DE10007435A1 (de) 2001-08-23
BR0104544A (pt) 2002-01-08
MXPA01010570A (es) 2003-09-04
AU2001237942A1 (en) 2001-08-27
WO2001061079A1 (en) 2001-08-23
CN1366563A (zh) 2002-08-28
US20020157959A1 (en) 2002-10-31

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