EP1196943A4 - PROCESS FOR REMOVING CONTAMINATION FROM THE SURFACE AND USEFUL COMPOSITIONS THEREOF - Google Patents

PROCESS FOR REMOVING CONTAMINATION FROM THE SURFACE AND USEFUL COMPOSITIONS THEREOF

Info

Publication number
EP1196943A4
EP1196943A4 EP00936223A EP00936223A EP1196943A4 EP 1196943 A4 EP1196943 A4 EP 1196943A4 EP 00936223 A EP00936223 A EP 00936223A EP 00936223 A EP00936223 A EP 00936223A EP 1196943 A4 EP1196943 A4 EP 1196943A4
Authority
EP
European Patent Office
Prior art keywords
composition useful
removing contaminant
useful therefor
therefor
contaminant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00936223A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1196943A1 (en
Inventor
Emil A Kneer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/318,814 external-priority patent/US6147002A/en
Priority claimed from US09/533,114 external-priority patent/US6673757B1/en
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Publication of EP1196943A1 publication Critical patent/EP1196943A1/en
Publication of EP1196943A4 publication Critical patent/EP1196943A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/046—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2082—Polycarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2086—Hydroxy carboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP00936223A 1999-05-26 2000-05-23 PROCESS FOR REMOVING CONTAMINATION FROM THE SURFACE AND USEFUL COMPOSITIONS THEREOF Withdrawn EP1196943A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/318,814 US6147002A (en) 1999-05-26 1999-05-26 Process for removing contaminant from a surface and composition useful therefor
US09/533,114 US6673757B1 (en) 2000-03-22 2000-03-22 Process for removing contaminant from a surface and composition useful therefor
PCT/US2000/014181 WO2000072363A1 (en) 1999-05-26 2000-05-23 Process for removing contaminant from a surface and composition useful therefor
US318814 2002-12-13
US533114 2006-09-19

Publications (2)

Publication Number Publication Date
EP1196943A1 EP1196943A1 (en) 2002-04-17
EP1196943A4 true EP1196943A4 (en) 2007-01-17

Family

ID=26981682

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00936223A Withdrawn EP1196943A4 (en) 1999-05-26 2000-05-23 PROCESS FOR REMOVING CONTAMINATION FROM THE SURFACE AND USEFUL COMPOSITIONS THEREOF

Country Status (8)

Country Link
EP (1) EP1196943A4 (zh)
JP (1) JP2003500527A (zh)
KR (1) KR100672874B1 (zh)
CN (1) CN1158691C (zh)
AU (1) AU5157100A (zh)
IL (1) IL146733A (zh)
TW (1) TW463256B (zh)
WO (1) WO2000072363A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6627546B2 (en) 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
JP4583678B2 (ja) * 2001-09-26 2010-11-17 富士通株式会社 半導体装置の製造方法及び半導体装置用洗浄液
EP1501916B1 (en) * 2002-04-25 2009-06-17 FujiFilm Electronic Materials USA, Inc. Non-corrosive cleaning compositions for removing etch residues
US20040029494A1 (en) * 2002-08-09 2004-02-12 Souvik Banerjee Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques
CN1646732A (zh) * 2002-08-19 2005-07-27 伊默克化学科技股份有限公司 清洗液
US20070203041A1 (en) * 2006-02-24 2007-08-30 Ki-Jeong Lee Cleaning composition for removing impurities and method of removing impurities using the same
US7879783B2 (en) * 2007-01-11 2011-02-01 Air Products And Chemicals, Inc. Cleaning composition for semiconductor substrates
SG181854A1 (en) * 2009-12-23 2012-07-30 Lam Res Corp Post deposition wafer cleaning formulation
EP2626891A3 (en) * 2012-02-07 2018-01-24 Rohm and Haas Electronic Materials LLC Activation process to improve metal adhesion
US11560533B2 (en) 2018-06-26 2023-01-24 Versum Materials Us, Llc Post chemical mechanical planarization (CMP) cleaning

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0859404A2 (en) * 1997-01-16 1998-08-19 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
WO1999021220A1 (en) * 1997-10-21 1999-04-29 Ontrak Systems, Inc. Methods and apparatus for cleaning semiconductor substrates after polishing of copper film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477364A (en) * 1983-11-07 1984-10-16 Capetrol International, Inc. Acidic glass cleaning composition
US5662769A (en) * 1995-02-21 1997-09-02 Advanced Micro Devices, Inc. Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0859404A2 (en) * 1997-01-16 1998-08-19 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
WO1999021220A1 (en) * 1997-10-21 1999-04-29 Ontrak Systems, Inc. Methods and apparatus for cleaning semiconductor substrates after polishing of copper film

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0072363A1 *

Also Published As

Publication number Publication date
IL146733A0 (en) 2002-07-25
IL146733A (en) 2005-07-25
CN1360733A (zh) 2002-07-24
WO2000072363A1 (en) 2000-11-30
EP1196943A1 (en) 2002-04-17
AU5157100A (en) 2000-12-12
TW463256B (en) 2001-11-11
CN1158691C (zh) 2004-07-21
KR100672874B1 (ko) 2007-01-24
KR20020030743A (ko) 2002-04-25
JP2003500527A (ja) 2003-01-07

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20011221

AK Designated contracting states

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Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: KNEER, EMIL A.

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: AIR PRODUCTS AND CHEMICALS, INC.

A4 Supplementary search report drawn up and despatched

Effective date: 20061214

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/321 20060101ALI20061208BHEP

Ipc: H01L 21/02 20060101AFI20061208BHEP

17Q First examination report despatched

Effective date: 20070416

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20091201