EP1194616A1 - Technique de realimentation en cuivre dans un systeme de placage au cuivre precis - Google Patents

Technique de realimentation en cuivre dans un systeme de placage au cuivre precis

Info

Publication number
EP1194616A1
EP1194616A1 EP99921825A EP99921825A EP1194616A1 EP 1194616 A1 EP1194616 A1 EP 1194616A1 EP 99921825 A EP99921825 A EP 99921825A EP 99921825 A EP99921825 A EP 99921825A EP 1194616 A1 EP1194616 A1 EP 1194616A1
Authority
EP
European Patent Office
Prior art keywords
solution
plating
copper
chemical
cartridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99921825A
Other languages
German (de)
English (en)
Other versions
EP1194616A4 (fr
Inventor
Chiu H. Ting
Peter Cho
Frank Lin
Tanya Andryushchenko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STEAG CUTEK, INC.
Original Assignee
Cutek Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cutek Research Inc filed Critical Cutek Research Inc
Priority claimed from PCT/US1999/010193 external-priority patent/WO2000068468A1/fr
Publication of EP1194616A1 publication Critical patent/EP1194616A1/fr
Publication of EP1194616A4 publication Critical patent/EP1194616A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Definitions

  • the present invention relates to the field of copper plating systems and, more particularly, to a technique for replenishing copper in a plating solution.
  • Plating systems in which an object is immersed in a plating solution to plate
  • metal onto the object are well known in the art.
  • a variety of metals can be plated by
  • a plating solution such as a mixture of copper sulfate (CuSOJ and
  • sulfuric acid H 2 SO is used as the source of copper to plate copper onto an object.
  • a cathode is connected to the object that is to.be plated (so that the object
  • the anode electrode is usually
  • copper containing material is
  • replenishment techniques generally rely on the introduction of copper sourcing
  • intermediary container or bath
  • the copper sourcing material is in powder or granular form, the contamination factor
  • undisolved particles from the addition of solid material into the solution, may have
  • the present invention describes a replenishment system for replenishing a plating material which is depleted from a solution during a plating process.
  • the replenishment is achieved by the use of a compact cartridge, which is inserted into a recirculating loop for the solution.
  • the replenishment system generally has a vessel for holding the plating solution and the loop for recirculating the solution. Within that loop is inserted a container (canister) holding the material replenishment cartridge.
  • the cartridge contains chemicals, when reacting with the solution, will introduce the plating material into the solution to bring the plating material concentration level to a desired level.
  • the cartridge is a porous filter assembly having a hollow core.
  • the chemical utilized for replenishing the plating material is contained in the filter element.
  • the filter cartridge holds the chemical in a contained unit during transport, handling and storage of the cartridge.
  • the plating material is released only when the chemical reacts with the plating solution.
  • the unitary packaging and simplicity allows the replenishment chemical to be introduced into the plating system, by simple insertion of the cartridge into the system. Furthermore, the cartridge is simply replaced when the chemical in the filter is exhausted.
  • the invention is used to replenish copper in a copper plating system.
  • the system is used for plating copper onto semiconductor wafers.
  • the filter cartridge of the preferred embodiment uses copper oxide or copper hydroxide to replenish copper ions into the plating solution.
  • a sensor is used to monitor the concentration level of the copper in the solution and valves insert the filter cartridge into the recirculation loop when the copper concentration falls below a preset level.
  • sensor can be a device to monitor the ampere-minutes (or coulombs) used in the
  • a processor is used to automatically determine the parameters of the parameters.
  • Figure 1 is a schematic diagram of a plating replenishment system of the present invention.
  • Figure 2 is a pictorial diagram of a container shell and a filter cartridge, which cartridge is used to replenish the plating material back into a plating solution.
  • FIG 3 is a detailed diagram of the filter cartridge shown in Figure 2.
  • Figure 4 is the plating replenishment system of Figure 1 , but now under processor control.
  • a technique for replenishing copper for use in a copper plating system is described.
  • numerous specific details are set forth, such as specific chemicals, structures, materials, processes, etc., in order to provide a thorough understanding of the present invention.
  • the present invention may be practiced without these specific details.
  • well known techniques, structures and chemistry have not been described in detail in order not to obscure the present invention.
  • the preferred embodiment of the invention is described in reference to copper replenishment for a copper plating system and in which copper oxide or copper hydroxide is utilized to replenish the copper ions in the solution.
  • the practice of the present invention can be achieved with other copper replenishing chemicals and is not limited to copper oxide or copper hydroxide.
  • the present invention can be readily adapted for use in the plating of other metals and is not limited to the plating of copper.
  • a copper replenishment system 10 of the present invention is shown.
  • System 10 is comprised of a vessel 11 , recirculation loop 12, copper replenishment source 13 and a variety of pumps, valves and filters for recirculating a plating solution 15.
  • the vessel 11 can be a tank, container, or any other housing which is generally used for holding a liquid plating solution. In this instance, vessel 11 holds the copper plating solution 15. The particular chemistry of the plating solution 15 will depend on the plating process being performed.
  • the vessel 1 1 can be utilized for the plating process itself, in which case the object being plated is placed within vessel 1 1 .
  • electroplating copper can also be introduced into the vessel 1 1 .
  • the plating process can be performed external to the vessel 1 1 .
  • the vessel 1 1 will function as a sourcing tank for the plating solution 15 and some form
  • a feed-line 16 transports the solution 15 from
  • the feed-line 16 transports the
  • a return line (shown as line 17) is used to return the liquid back into the vessel
  • the present invention is in the replenishment of copper, which is depleted from the solution 15 when the solution
  • the recirculation loop 12 is used to draw a sample of the solution 15 from the
  • a pump 20 pumps
  • a second pump 21 is included in the replenishment path 18 to pump the liquid through the copper replenishment source 13.
  • the second pump 21 is not necessary if the path 19 is completely shut-off, since the pump 20 will pump the liquid through the path 18. Accordingly, by corresponding operations of the valves 22 and 23, the liquid from the vessel 1 1 can be pumped through the replenishment path 18 or bypass it.
  • filters and sensors which are typically utilized with the system 10.
  • two filters 25 and 26 are utilized to filter the liquid.
  • the actual number of filters employed is a design choice.
  • the sensors are utilized to monitor the liquid at various stages and, accordingly, the use, location and number of such sensors is also a design choice dictated by the needs of the particular application.
  • a sensor S1 is disposed to monitor the solution prior to the copper replenishment stage.
  • Sensor S2 is disposed to monitor the liquid after the replenishment stage.
  • a third sensor S3 is also shown.
  • the sensor S3 is disposed to monitor the solution in the vessel 11. It is appreciated that sensor S3 can provide the same function as the sensor S2. Furthermore, for simplicity, the copper ion concentration monitoring can be achieved more simply by the use of the sensor S3 only, if desired. What is important is that some form of monitoring is utilized to sense and monitor the concentration level of the copper ions in the solution 15 so that when required, additional copper can be added into the solution 15. It is appreciated that one sensor can be a device to monitor the ampere-minutes (or coulombs) used in the plating process. The amount of coulombs (or charge) can be directly translated into the amount of copper (grains or weight) depleted from the plating process. Again, the type of sensor employed is a design choice dependent on the plating process being practiced.
  • the bypass path 19 is utilized for fluid flow.
  • the liquid is monitored by the sensor(s) to track the amount of copper ions in the solution.
  • the liquid is pumped through the replenishment path 18, so that additional copper ions can be introduced into the system.
  • the processing flow loop (of lines 16 and 17) can be combined with the recirculating loop 12.
  • the plating solution 15 is distributed to the processing equipment after passing through valve 23 and the return line is coupled to the input of filter 25. That is, in the schematic of Figure 1 , the processing equipment is inserted in the loop 12 between the filters 25, 26 and the vessel 11. Accordingly, under normal processing operation, the bypass path 19 is used to supply the plating solution from the vessel 11 to the processing equipment.
  • the cartridge 30 is inserted in the loop to replenish the copper.
  • the use of one or two circulating loops is a choice dictated more by the needs of the processing equipment and the process being performed.
  • the means for introducing additional copper ions is provided by the copper replenishment source 13.
  • the present invention utilizes a replenishment cartridge 30, which is inserted into a container shell (or canister) 29.
  • the inlet flow to the canister 29 is at the top and the outlet is at the bottom (preferably at the center), so that the plating liquid flows into the canister 29 along the periphery, traverses
  • the cartridge 30 of the preferred embodiment is
  • the cartridge 30 is comprised of an outer filter element 31 and an inner
  • the filter 31 is filled with the necessary chemical to introduce the plating
  • the inner core 32 is left hollow (empty) so as to improve the fluid flow through
  • the inner core 32 mates to the flow exit opening of the canister
  • the filter element 31 can be configured in several ways. Generally, it is
  • the filter formed from a porous material for permitting a liquid to flow through the filter.
  • filter may be configured as a dual-wall filter (having an outer and inner skin or
  • the top and the bottom of the cylinder is
  • the filter 31 usually sealed (such as by the filtration material), typically where the replenishment chemical is in powder form. It is appreciated that the actual configuration of the filter 31 is a design choice. What is important is that some form of filtration is needed for the passage of the liquid and the replenishment chemical is distributed within the cartridge 30, so that as the liquid passes through the filter 31 , the chemical is introduced into the solution.
  • the cartridge 30 is manufactured as a packaged unit to provide convenience in handling. Because of its unitary packaging, the cartridge 30 can be transported and stored, until it is to be used. When ready for use in the system 10, the packaging is removed from the cartridge 30 and the cartridge 30 is inserted into the canister 29. Once in the canister 29 and sealed, the plating solution 15 flows into the canister to react with the chemical in the cartridge 30. Generally, it is preferred to have the cartridge 30 be of sufficient height, so that the two ends of the cartridge 30 seal against the bottom and top cover of the canister 29.
  • the chemical in the filter element 31 can be comprised of a variety of known chemicals which replenish copper ions into a plating solution.
  • the replenishment chemical can be copper hydroxide (Cu(OH) 2 ) or copper oxide (CuO).
  • the core 31 is comprised of CuO. Accordingly, CuO in powder form is inserted into fill the open regions of the filter element 31. The top and bottom of the cartridge 30 are sealed so as to seal the CuO in the filter element 31.
  • the plating solution 15 is made to flow into the canister when copper replenishment is desired.
  • the plating solution is comprised of a mixture of copper sulfate (CuS0 ) and sulfuric acid (H 2 S0 4 )
  • the copper oxide will react in the solution by the chemical reaction
  • the cartridge 30 of the present invention is a significant improvement over the known technique of dumping copper containing chemicals into the plating solution.
  • System 40 is system 10 with the additional inclusion of a processor (such as a computer), which is identified as CPU 41.
  • a processor such as a computer
  • the monitoring and control functions of the recirculation loop 12 are processor controlled. Accordingly, the sensors, pumps and valves are coupled to the CPU 41.
  • the CPU 41 monitors the copper concentration level of the plating solution 15 and when copper replenishment is needed, inserts the replenishment path 18 into the system 40. Once appropriate copper levels have been restored, the replenishment path 18 is closed and the solution flow is through the bypass path 19. It is appreciated that the CPU 41 may be the same processing unit which is used to control the plating process, whether the plating is being performed in the vessel 1 1 or at some other
  • present invention can be readily implemented for plating of other metals besides

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

L'invention concerne un système de réalimentation en cuivre (10) permettant de réalimenter en cuivre une solution de placage au cuivre (15) lorsqu'elle est appauvrie. La réalimentation s'effectue au moyen d'une cartouche de filtre compacte (30) introduite dans une boucle de recirculation (12) de la solution. La cartouche de filtre (30) contient une substance chimique, qui lorsqu'elle réagit avec la solution réalimente ladite solution en cuivre. La cartouche de filtre (30) est une unité compacte pouvant facilement être manipulée, et réduire la quantité de contaminants qui pourrait être introduite du fait de la présence de la substance chimique de réalimentation.
EP99921825A 1999-05-10 1999-05-10 Technique de realimentation en cuivre dans un systeme de placage au cuivre precis Withdrawn EP1194616A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/010193 WO2000068468A1 (fr) 1998-03-30 1999-05-10 Technique de realimentation en cuivre dans un systeme de placage au cuivre precis

Publications (2)

Publication Number Publication Date
EP1194616A1 true EP1194616A1 (fr) 2002-04-10
EP1194616A4 EP1194616A4 (fr) 2002-10-09

Family

ID=22272716

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99921825A Withdrawn EP1194616A4 (fr) 1999-05-10 1999-05-10 Technique de realimentation en cuivre dans un systeme de placage au cuivre precis

Country Status (4)

Country Link
EP (1) EP1194616A4 (fr)
JP (1) JP2003502495A (fr)
KR (1) KR100764272B1 (fr)
CN (1) CN1253609C (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070098134A (ko) * 2006-03-31 2007-10-05 신도플라텍 주식회사 도금액 자동공급장치
JP5293276B2 (ja) * 2008-03-11 2013-09-18 上村工業株式会社 連続電気銅めっき方法
CN105442024A (zh) * 2015-12-30 2016-03-30 桂林斯壮微电子有限责任公司 药液自动添加系统
CN111501074B (zh) * 2020-05-22 2021-07-16 佛山市诺诚科技有限公司 一种电镀方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0669410A1 (fr) * 1994-02-28 1995-08-30 Kawasaki Steel Corporation Dispositif pour dissoudre en continu une poudre métallique utilisée pour le plaquage et procédé pour dissoudre de la poudre de nickel utilisant ce dispositif

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0669410A1 (fr) * 1994-02-28 1995-08-30 Kawasaki Steel Corporation Dispositif pour dissoudre en continu une poudre métallique utilisée pour le plaquage et procédé pour dissoudre de la poudre de nickel utilisant ce dispositif

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0068468A1 *

Also Published As

Publication number Publication date
KR100764272B1 (ko) 2007-10-05
CN1371432A (zh) 2002-09-25
JP2003502495A (ja) 2003-01-21
EP1194616A4 (fr) 2002-10-09
CN1253609C (zh) 2006-04-26
KR20020001871A (ko) 2002-01-09

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