WO2000068468A1 - Copper replenishment technique for precision copper plating system - Google Patents
Copper replenishment technique for precision copper plating system Download PDFInfo
- Publication number
- WO2000068468A1 WO2000068468A1 PCT/US1999/010193 US9910193W WO0068468A1 WO 2000068468 A1 WO2000068468 A1 WO 2000068468A1 US 9910193 W US9910193 W US 9910193W WO 0068468 A1 WO0068468 A1 WO 0068468A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solution
- plating
- copper
- chemical
- cartridge
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/050,769 US5997712A (en) | 1998-03-30 | 1998-03-30 | Copper replenishment technique for precision copper plating system |
CNB998167851A CN1253609C (en) | 1999-05-10 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
KR1020017014316A KR100764272B1 (en) | 1999-05-10 | 1999-05-10 | Material replenishment method and apparatus for precision plating system |
AU38936/99A AU3893699A (en) | 1998-03-30 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
EP99921825A EP1194616A4 (en) | 1999-05-10 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
JP2000617236A JP2003502495A (en) | 1999-05-10 | 1999-05-10 | Apparatus and method for replenishing copper for a copper precision plating system |
PCT/US1999/010193 WO2000068468A1 (en) | 1998-03-30 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/050,769 US5997712A (en) | 1998-03-30 | 1998-03-30 | Copper replenishment technique for precision copper plating system |
PCT/US1999/010193 WO2000068468A1 (en) | 1998-03-30 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000068468A1 true WO2000068468A1 (en) | 2000-11-16 |
Family
ID=26728656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/010193 WO2000068468A1 (en) | 1998-03-30 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
Country Status (3)
Country | Link |
---|---|
US (1) | US5997712A (en) |
AU (1) | AU3893699A (en) |
WO (1) | WO2000068468A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7556722B2 (en) * | 1996-11-22 | 2009-07-07 | Metzger Hubert F | Electroplating apparatus |
TW522455B (en) * | 1998-11-09 | 2003-03-01 | Ebara Corp | Plating method and apparatus therefor |
US8298395B2 (en) | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
JP3794613B2 (en) * | 2000-05-18 | 2006-07-05 | 三井金属鉱業株式会社 | Electrolytic equipment for electrolytic copper foil |
US20040079633A1 (en) * | 2000-07-05 | 2004-04-29 | Applied Materials, Inc. | Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing |
US6527934B1 (en) | 2000-10-31 | 2003-03-04 | Galvan Industries, Inc. | Method for electrolytic deposition of copper |
AU2002248343A1 (en) * | 2001-01-12 | 2002-08-19 | University Of Rochester | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
US6402592B1 (en) | 2001-01-17 | 2002-06-11 | Steag Cutek Systems, Inc. | Electrochemical methods for polishing copper films on semiconductor substrates |
JP3819840B2 (en) * | 2002-07-17 | 2006-09-13 | 大日本スクリーン製造株式会社 | Plating apparatus and plating method |
US20040026255A1 (en) * | 2002-08-06 | 2004-02-12 | Applied Materials, Inc | Insoluble anode loop in copper electrodeposition cell for interconnect formation |
WO2004033763A1 (en) * | 2002-10-11 | 2004-04-22 | Electroplating Engineers Of Japan Limited | Cup type plating equipment |
US20050016857A1 (en) * | 2003-07-24 | 2005-01-27 | Applied Materials, Inc. | Stabilization of additives concentration in electroplating baths for interconnect formation |
US20050082172A1 (en) * | 2003-10-21 | 2005-04-21 | Applied Materials, Inc. | Copper replenishment for copper plating with insoluble anode |
US8522585B1 (en) * | 2006-05-23 | 2013-09-03 | Pmx Industries Inc. | Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article |
EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
JP5293276B2 (en) * | 2008-03-11 | 2013-09-18 | 上村工業株式会社 | Continuous electrolytic copper plating method |
US9017528B2 (en) * | 2011-04-14 | 2015-04-28 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
US9005409B2 (en) | 2011-04-14 | 2015-04-14 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
JP5795965B2 (en) * | 2011-05-30 | 2015-10-14 | 株式会社荏原製作所 | Plating equipment |
CN102995096A (en) * | 2012-11-05 | 2013-03-27 | 江苏三鑫电子有限公司 | Automatic electroplating solution feeding system and automatic electroplating solution feeding method |
CN109898130B (en) * | 2019-04-28 | 2024-04-02 | 广东天承科技股份有限公司 | Copper ion supplementing device and method for electroplating |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649509A (en) * | 1969-07-08 | 1972-03-14 | Buckbee Mears Co | Electrodeposition systems |
US4692222A (en) * | 1984-11-19 | 1987-09-08 | Pellegrino Peter P | Electroplating method and apparatus for electroplating high aspect ratio thru-holes |
US4961845A (en) * | 1988-12-23 | 1990-10-09 | Diajet, Inc. | Apparatus and method for filtering particulate matter from dielectric fluids |
US5332485A (en) * | 1991-06-18 | 1994-07-26 | Contamco Corporation | Electrostatic filter |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5573652A (en) * | 1994-02-28 | 1996-11-12 | Kawasaki Steel Corporation | Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021240B2 (en) * | 1980-01-12 | 1985-05-25 | 株式会社小糸製作所 | Method and apparatus for replenishing plating solution with deposited copper |
DE69219484D1 (en) * | 1992-09-15 | 1997-06-05 | Atr Wire & Cable Co | METHOD AND DEVICE FOR ELECTROLYTIC COATING WITH COPPER |
US5609747A (en) * | 1995-08-17 | 1997-03-11 | Kawasaki Steel Corporation | Method of dissolving zinc oxide |
-
1998
- 1998-03-30 US US09/050,769 patent/US5997712A/en not_active Expired - Lifetime
-
1999
- 1999-05-10 WO PCT/US1999/010193 patent/WO2000068468A1/en not_active Application Discontinuation
- 1999-05-10 AU AU38936/99A patent/AU3893699A/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649509A (en) * | 1969-07-08 | 1972-03-14 | Buckbee Mears Co | Electrodeposition systems |
US4692222A (en) * | 1984-11-19 | 1987-09-08 | Pellegrino Peter P | Electroplating method and apparatus for electroplating high aspect ratio thru-holes |
US4961845A (en) * | 1988-12-23 | 1990-10-09 | Diajet, Inc. | Apparatus and method for filtering particulate matter from dielectric fluids |
US5332485A (en) * | 1991-06-18 | 1994-07-26 | Contamco Corporation | Electrostatic filter |
US5344491A (en) * | 1992-01-09 | 1994-09-06 | Nec Corporation | Apparatus for metal plating |
US5573652A (en) * | 1994-02-28 | 1996-11-12 | Kawasaki Steel Corporation | Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same |
Non-Patent Citations (1)
Title |
---|
See also references of EP1194616A4 * |
Also Published As
Publication number | Publication date |
---|---|
AU3893699A (en) | 2000-11-21 |
US5997712A (en) | 1999-12-07 |
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