EP1194616A4 - Copper replenishment technique for precision copper plating system - Google Patents

Copper replenishment technique for precision copper plating system

Info

Publication number
EP1194616A4
EP1194616A4 EP99921825A EP99921825A EP1194616A4 EP 1194616 A4 EP1194616 A4 EP 1194616A4 EP 99921825 A EP99921825 A EP 99921825A EP 99921825 A EP99921825 A EP 99921825A EP 1194616 A4 EP1194616 A4 EP 1194616A4
Authority
EP
European Patent Office
Prior art keywords
copper
plating system
precision
replenishment technique
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99921825A
Other languages
German (de)
French (fr)
Other versions
EP1194616A1 (en
Inventor
Chiu H Ting
Peter Cho
Frank Lin
Tanya Andryushchenko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STEAG CUTEK, INC.
Original Assignee
Cutek Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cutek Research Inc filed Critical Cutek Research Inc
Priority claimed from PCT/US1999/010193 external-priority patent/WO2000068468A1/en
Publication of EP1194616A1 publication Critical patent/EP1194616A1/en
Publication of EP1194616A4 publication Critical patent/EP1194616A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
EP99921825A 1999-05-10 1999-05-10 Copper replenishment technique for precision copper plating system Withdrawn EP1194616A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/010193 WO2000068468A1 (en) 1998-03-30 1999-05-10 Copper replenishment technique for precision copper plating system

Publications (2)

Publication Number Publication Date
EP1194616A1 EP1194616A1 (en) 2002-04-10
EP1194616A4 true EP1194616A4 (en) 2002-10-09

Family

ID=22272716

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99921825A Withdrawn EP1194616A4 (en) 1999-05-10 1999-05-10 Copper replenishment technique for precision copper plating system

Country Status (4)

Country Link
EP (1) EP1194616A4 (en)
JP (1) JP2003502495A (en)
KR (1) KR100764272B1 (en)
CN (1) CN1253609C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070098134A (en) * 2006-03-31 2007-10-05 신도플라텍 주식회사 Automatic supplying device for plating solution
JP5293276B2 (en) * 2008-03-11 2013-09-18 上村工業株式会社 Continuous electrolytic copper plating method
CN105442024A (en) * 2015-12-30 2016-03-30 桂林斯壮微电子有限责任公司 Automatic chemical liquid adding system
CN111501074B (en) * 2020-05-22 2021-07-16 佛山市诺诚科技有限公司 Electroplating method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0669410A1 (en) * 1994-02-28 1995-08-30 Kawasaki Steel Corporation Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324623A (en) * 1980-01-12 1982-04-13 Koito Seisakusho Co. Ltd. Method and apparatus for replenishing an electroplating bath with metal to be deposited
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
EP0669410A1 (en) * 1994-02-28 1995-08-30 Kawasaki Steel Corporation Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0068468A1 *

Also Published As

Publication number Publication date
CN1253609C (en) 2006-04-26
CN1371432A (en) 2002-09-25
KR20020001871A (en) 2002-01-09
EP1194616A1 (en) 2002-04-10
KR100764272B1 (en) 2007-10-05
JP2003502495A (en) 2003-01-21

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20031107

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Effective date: 20091201