EP1190430A1 - Procede de production d'une lampe a decharge plate - Google Patents

Procede de production d'une lampe a decharge plate

Info

Publication number
EP1190430A1
EP1190430A1 EP01905615A EP01905615A EP1190430A1 EP 1190430 A1 EP1190430 A1 EP 1190430A1 EP 01905615 A EP01905615 A EP 01905615A EP 01905615 A EP01905615 A EP 01905615A EP 1190430 A1 EP1190430 A1 EP 1190430A1
Authority
EP
European Patent Office
Prior art keywords
frame
discharge vessel
filling opening
spacer element
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01905615A
Other languages
German (de)
English (en)
Inventor
Michael Seibold
Michael Ilmer
Angela Eberhardt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH filed Critical Patent Treuhand Gesellschaft fuer Elektrische Gluehlampen mbH
Publication of EP1190430A1 publication Critical patent/EP1190430A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/30—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/30—Vessels; Containers
    • H01J61/305—Flat vessels or containers

Definitions

  • the invention relates to a method for producing a discharge vessel of a flat gas discharge lamp.
  • the invention is directed to the production of flat gas discharge lamps which are designed for dielectrically impeded discharges, in which at least the electrodes of one polarity are separated from the discharge volume in the discharge vessel by a dielectric layer (dielectric barrier discharge lamps).
  • Such lamps are also suitable for backlighting liquid crystal displays (LCD) and for decoration and advertising purposes.
  • LCD liquid crystal displays
  • Flat gas discharge lamps of the generic type have a discharge vessel which is formed by a base plate, a cover plate and a frame arranged between them.
  • a discharge vessel which is formed by a base plate, a cover plate and a frame arranged between them.
  • the technology of flat gas discharge lamps for dielectrically impeded discharges is assumed to be state of the art.
  • the discharge vessel of this lamp comprises two plates which are parallel to one another, a frame and spacer elements which support the two plates against one another.
  • Each spacer element consists of a high-viscosity and a low-viscosity component at the joining temperature.
  • the respective vertical dimension of each spacer element is greater than the intended end spacing of the two plates.
  • the circumferential gap-like opening which is thereby initially kept free serves as a pumping or filling opening of the discharge vessel.
  • the respective low-viscosity component of each spacer element compensates for possible local deviations in the distances between the two plates when the discharge vessel is assembled.
  • At least one space as a pump and fill opening is initially kept open during manufacture, at least between one of the two discharge vessel plates and the frame. After pumping out purge gases and possible volatile impurities and then filling them with the filler gas or gases, for example Xenon, the filling opening is eliminated by melting at least part of the frame.
  • at least one spacer element is arranged between the floor and ceiling plate, for example in the form of a ball, column or the like. The spacer elements are not softened or even melted during the previously described joining process, but rather remain hard. In this way it is achieved that the distance between the floor and ceiling slab is defined by the vertical dimension of the or each spacer element.
  • the low-viscosity component can be dispensed with here for the spacer elements. This means, in particular in the case of large-area lamps or lamps with relatively thin vessel plates, which consequently require a relatively large number of spacer elements for reasons of stability, a considerable saving in material and production expenditure.
  • the individual discharge vessel parts are usually assembled in an oven.
  • the frame or at least the part of the frame provided for this purpose then softens, but not the two vessel plates and the spacing elements.
  • the frame or the part of the frame intended for softening which can also comprise a separate glass solder layer or local elevation, is made of a material with a relatively low viscosity at the joining temperature, for example approximately 10 6 dPa s (deci-Pascal times second) or less.
  • Suitable for this purpose include glass solders or sintered glasses, for example made of Pb-Si-BO, Bi-Si-BO, Zn-Si-BO, Zn-Bi-Si-BO, Sn-Zn-PO.
  • the two vessel plates and the spacer elements and, if appropriate, the remaining frame part are selected from a material with a relatively high viscosity at the joining temperature, for example approximately 10 10 dPa s or more.
  • Soft glasses and crystallized glass solders or ⁇ are suitable for this.
  • com- Sit-solder and stable glass lots with a high softening point e.g. Bi-Si-BO, Sn-Zn-PO, Zn-B-Si-O, Pb-B-Si O and Zn-Bi-Si-BO.
  • the filling opening can be realized, for example, by choosing the height of the spacer elements to be greater than the height of the uniformly surrounding frame. This creates a gap between the frame and one of the two plates. After filling, the gap is closed by softening or melting the frame. If the frame is connected to the upper ceiling panel, i.e. is the gap between the base plate and the frame, the closing process is supported by the gravitational forces, so that even relatively large gaps can be reliably closed in this way. Further details can be found in the description of the exemplary embodiments.
  • the filling opening can be realized in that a sealing surface between one of the vessel plates and the frame has unevenness.
  • the sealing surface can be corrugated or at least increased at an excellent point.
  • the elevations for example, prefabricated sintered glass parts are considered, which are arranged on the frame.
  • the elevations can also be made in one piece with the remaining part of the frame.
  • the increases can also be realized in that the frame is assembled from individual parts by melting the joints of the individual parts beforehand, for example by means of a laser. The increases then arise from the melted material when joining the frame parts.
  • FIG. 1 shows a schematic side view of a flat radiator discharge vessel before closing according to the invention in accordance with a first exemplary embodiment according to the invention
  • FIG. 2 shows a schematic side view of a further exemplary embodiment of the invention
  • FIG. 3a shows a schematic side view of a third exemplary embodiment of the invention
  • FIG. 3b shows a top view of the exemplary embodiment from FIG. 3a along the line AB
  • FIG. 3c shows a view of the exemplary embodiment from FIG. 3a in viewing direction C
  • Figure 4 is a schematic side view of a fourth embodiment of the invention.
  • the first exemplary embodiment in FIG. 1 has a base plate 1 and ceiling plate 2 and a frame 3 made of soft glass.
  • the frame 3 can be connected to the base plate 1 in various ways or can be made in one piece with it. In particular, it could also be joined to the base plate 1 by melting glass as a result of light irradiation (joining by means of laser radiation).
  • the resulting discharge vessel has an essentially rectangular cross section and a rectangular plan (not shown). It is used to manufacture a flat spotlight with dielectrically disabled discharges for backlighting a flat screen or for general lighting. Accordingly, are on 3 strips of electrode are printed on the upper side of the base plate 1 in the figure, part of the electrodes being covered with a dielectric layer. These details are of no further interest here and are therefore not shown.
  • the disclosure content of W098 / 43277 already cited is referred to.
  • the exemplary embodiment in FIG. 1, however, serves to illustrate the connection of the ceiling plate 2 to the frame 3.
  • a glass solder layer with an upper side 4 is placed on the frame 3, which is locally raised in the corners of the discharge vessel with small columns 5 made of sintered glass.
  • the ceiling plate 2 lies in the remaining area with a distance corresponding to the height difference between the columns 5 and the rest of the support 3 above the top 4 of the support, ie the sealing surface.
  • columns 5 are provided in all four corners of a flat radiator discharge vessel which is rectangular in plan. Accordingly, there are four gaps 6 between the sealing surface 4 and the ceiling plate 2, each to one side of the rectangular plan. Depending on the requirements of the line cross section for pumping out and filling the discharge vessel, the height of the columns 5 can be adjusted.
  • the above-described individual parts are joined to the discharge vessel after being filled with the filling gas - here xenon - by heating in an oven (not shown).
  • the temperature in the furnace is increased to such an extent that the glass solder 4 and the sintered glass columns 5 soften, ie assume a viscosity of typically below 10 6 dPa s.
  • an intimate closure of the discharge vessel is achieved over the entire upper circumference of the frame 3, that is to say over the entire sealing surface 4.
  • Temperatures of 520 ° C are typically required for this.
  • the distance between the top plate 2 and the bottom plate 1 results from the height of the hard spacer elements 7, the viscosity of which is typically more than 10 10 dPa s at the joining temperature.
  • This embodiment is preferably used for frame heights from approx. 3 mm. It is also advantageous that the size of the pump or filling opening 6 can be influenced relatively easily on the basis of the height of the columns 5.
  • the frame is made up of at least two individual parts made of crystallized glass solder or composite solder, for example Bi-Si-BO, Sn-Zn-PO, Zn-B-Si-O or Zn-Bi-Si-BO Level composed.
  • the individual frame parts are sintered glass parts, e.g. made of Pb-Si-B-O, Sn-Zn-P-O, Bi-B-Si-O or Zn-Si-B-O, fused in a vacuum-tight manner.
  • the sintered glass parts are selected to be higher than the individual frame parts.
  • the raised areas of the frame produced in this way result in spaces for filling, comparable to the above exemplary embodiment.
  • the individual frame parts are provided with a sintered glass layer on their sealing surfaces.
  • the individual frame parts, the two plates and the spacing elements remain hard, whereas the sintered glass layer and the sintered glass parts soften.
  • the ceiling plate sinks to the suitably dimensioned spacer elements in such a way that the filling opening closes by the frame and the vessel plate being connected to one another.
  • FIG. 2 shows another exemplary embodiment relating to a flat radiator of the type mentioned in the first exemplary embodiment.
  • a frame 8 between the base plate 1 and the cover plate 2 consists of glass solder (at least in the upper area).
  • the upper area of the frame 8 and the sealing surface 4 'lying thereon are corrugated, so that the ceiling plate 2 rests on the frame 8 at a larger number of points, between which individual filling openings 9 - corresponding to the valleys of the undulations - occur.
  • the ceiling plate 2 By softening or melting at least the upper region of the frame 8, in particular in the region of the mountains of the ripple, the ceiling plate 2 also sinks flatly onto the sealing surface 13 ′ and thus closes the discharge vessel.
  • the desired distance between the top plate 2 and the bottom plate 1 is also achieved here by the appropriately selected height of the spacer elements 7, which are still sufficiently hard at the joining temperature.
  • An advantage during production is the more stable position of the ceiling slab due to the numerous contact points (wave crests).
  • a more uniform lowering of the ceiling panel can be achieved during the joining phase.
  • the risk of the ceiling plate moving or slipping is significantly reduced.
  • the disadvantage is the relatively high precision required in the manufacture of the frame.
  • FIGS. 3a, 3b, 3c show a schematic side view, a top view along line AB and a view in viewing direction C of a third exemplary embodiment of the invention.
  • a frame between the base plate 1 and the cover plate 2 consists of four straight individual parts 10 alod made of glass solder.
  • the first two individual frame parts 10a, 10b are arranged directly on the base plate 1 parallel to one another (first layer).
  • the two remaining individual frame parts 10c and 10d are each at right angles to it and on each end of the first two individual frame parts 10a, 10b. set (second layer).
  • the ceiling plate 2 is initially arranged at a distance of twice the height of each individual part 10a-10d from the base plate 1.
  • the four gaps 11 a-lld - two in each of the two layers - act as filling openings, which result from the “stacking” of the two times two frame individual parts 10 a, 10 b and 10 c, 10 d, rotated by 90 °.
  • each spacer element 12 On the base plate 1, five column-like spacer elements 12 are arranged upright and at a uniform mutual distance.
  • the cross section of each spacer element 12 has the shape of a cross. Against the background of the lowest possible visibility of the spacer elements 12 when viewing the luminous ceiling panel 2, this shape has proven to be suitable.
  • the above-described individual parts are joined to the discharge vessel in a manner analogous to the manner described above by heating in an oven (not shown).
  • the frame parts 10a-10d soften or melt
  • the desired distance between the top plate 2 and the bottom plate 1 is in turn realized by the correspondingly selected height of the spacer elements 12 which are still sufficiently hard at the joining temperature.
  • the fourth exemplary embodiment shown schematically in FIG. 4 has a base plate 1 and a cover plate 2 made of soft glass. Five (only three are visible) column-like spacer elements 7 made of soft glass are arranged on edge on the base plate 1. The ceiling panel 2 rests on the spacer elements 7. A frame 13 connected to the ceiling panel 2 is arranged between the base panel 1 and the ceiling panel 2. Its height is specifically selected such that a gap 14, which acts as a filling opening, remains between the frame 13 and the base plate 1.
  • the frame 13 is made of glass solder.
  • the discharge vessel After filling, the discharge vessel is sealed gas-tight in an oven by heating.
  • the softened frame 13 sags to the base plate 1, whereby this is connected to the frame 13.
  • the discharge vessel After controlled cooling (to avoid tension), the discharge vessel is suitable for further use.
  • This embodiment is preferably used for frame heights of up to approx. 3 mm. It is a relatively inexpensive process.
  • the frame can be applied in an initially pasty form, for example by means of a so-called dispenser, directly to the ceiling panel.
  • the frame can be freely shaped.
  • different frame contours e.g. round or angular.
  • the usually increased outgassing of the frame paste during the joining process is disadvantageous. Gas cleanliness may deteriorate as a result.
  • a relatively exact temperature control is required during the joining process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

L'invention concerne un procédé permettant de produire un récipient de décharge de lampe à décharge, selon lequel le récipient de décharge présente une plaque de base (1), un bâti (3) et une plaque de couverture (2), ainsi qu'au moins un élément écarteur (7) entre la plaque de base (1) et la plaque de couverture (2). Au moins un espace intermédiaire (6) est d'abord maintenu ouvert comme ouverture de remplissage, entre une des plaques (2) et le bâti (3). La fusion d'au moins une partie (4,5) du bâti qui peut également comprendre une couche d'apport de brasage en verre (4) et des surélévations locales (5) permet de supprimer l'ouverture de remplissage (6), une fois le remplissage terminé. L'écart entre les plaques du récipient (1,2) est défini par les éléments écarteurs (7) qui sont également rigides pendant le processus d'assemblage.
EP01905615A 2000-02-15 2001-01-09 Procede de production d'une lampe a decharge plate Withdrawn EP1190430A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10006750A DE10006750A1 (de) 2000-02-15 2000-02-15 Herstellungsverfahren für eine flache Gasentladungslampe
DE10006750 2000-02-15
PCT/DE2001/000043 WO2001061721A1 (fr) 2000-02-15 2001-01-09 Procede de production d'une lampe a decharge plate

Publications (1)

Publication Number Publication Date
EP1190430A1 true EP1190430A1 (fr) 2002-03-27

Family

ID=7631009

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01905615A Withdrawn EP1190430A1 (fr) 2000-02-15 2001-01-09 Procede de production d'une lampe a decharge plate

Country Status (9)

Country Link
US (1) US6976896B2 (fr)
EP (1) EP1190430A1 (fr)
JP (1) JP2003523605A (fr)
KR (1) KR100808695B1 (fr)
CN (1) CN1185676C (fr)
CA (1) CA2371993A1 (fr)
DE (1) DE10006750A1 (fr)
TW (1) TW498394B (fr)
WO (1) WO2001061721A1 (fr)

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Publication number Priority date Publication date Assignee Title
DE10138924A1 (de) * 2001-08-08 2003-02-20 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zum Herstellen eines stillen Flachstrahlers
DE102004004478A1 (de) * 2004-01-28 2005-08-18 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Verfahren zur Herstellung von Entladungslampen
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
WO2006058517A1 (fr) * 2004-12-01 2006-06-08 Elino Industrie-Ofenbau Carl Hanf Gmbh & Co.Kg Procede et dispositif pour realiser des unites destinees a la fabrication d'ecrans plats et analogues, et systeme pour vider/remplir l'espace intermediaire d'unites de ce type
DE102006003828A1 (de) * 2006-01-26 2007-08-02 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Herstellung von flachen dielektrischen Barriere-Entladungslampen
CN101772823B (zh) * 2007-08-01 2012-11-21 欧司朗股份有限公司 用于制造放电灯的炉和方法
KR101493817B1 (ko) * 2013-06-14 2015-03-02 현대엠엔소프트 주식회사 사용자 단말의 맵매칭 방법
KR20240011230A (ko) * 2017-05-29 2024-01-25 본스인코오포레이티드 유리 밀봉 가스 방전 튜브
KR102452622B1 (ko) 2018-06-11 2022-10-07 삼성전자주식회사 등화기 및 이를 포함하는 송신기

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EP0042003B1 (fr) * 1979-12-20 1985-03-13 United Technologies Corporation Procede de mise en forme d'une entretoise fusible pour panneau d'affichage a plasma
JP2952682B2 (ja) * 1990-04-13 1999-09-27 松下電器産業株式会社 平面形表示装置の製造方法
JPH08185802A (ja) * 1994-12-28 1996-07-16 Noritake Co Ltd 放電表示装置
WO1998026440A1 (fr) * 1996-12-12 1998-06-18 Candescent Technologies Corporation Systeme de saut de d'interstice permettant de sceller une structure
JP3264938B2 (ja) * 1997-03-21 2002-03-11 パテント―トロイハント―ゲゼルシヤフト フユア エレクトリツシエ グリユーランペン ミツト ベシユレンクテル ハフツング バックライト用平形蛍光ランプ及びこの平形蛍光ランプを備えた液晶表示装置
DE19817478B4 (de) * 1998-04-20 2004-03-18 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Flache Entladungslampe und Verfahren zu ihrer Herstellung
DE19826808C2 (de) * 1998-06-16 2003-04-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Entladungslampe mit dielektrisch behinderten Elektroden
FR2781308A1 (fr) * 1998-07-15 2000-01-21 Thomson Plasma Procede de realisation de moyens d'entretoisement pour panneaux de visualisation

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Also Published As

Publication number Publication date
CA2371993A1 (fr) 2001-08-23
JP2003523605A (ja) 2003-08-05
KR20010110765A (ko) 2001-12-13
US6976896B2 (en) 2005-12-20
CN1185676C (zh) 2005-01-19
DE10006750A1 (de) 2001-08-16
US20050176333A1 (en) 2005-08-11
TW498394B (en) 2002-08-11
WO2001061721A1 (fr) 2001-08-23
KR100808695B1 (ko) 2008-02-29
CN1363109A (zh) 2002-08-07

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