EP1164574A1 - Electroacoustic transducer and method of manufacture thereof - Google Patents
Electroacoustic transducer and method of manufacture thereof Download PDFInfo
- Publication number
- EP1164574A1 EP1164574A1 EP00971825A EP00971825A EP1164574A1 EP 1164574 A1 EP1164574 A1 EP 1164574A1 EP 00971825 A EP00971825 A EP 00971825A EP 00971825 A EP00971825 A EP 00971825A EP 1164574 A1 EP1164574 A1 EP 1164574A1
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- EP
- European Patent Office
- Prior art keywords
- curing
- adhesive
- magnet
- frame
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R13/00—Transducers having an acoustic diaphragm of magnetisable material directly co-acting with electromagnet
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
- G10K9/13—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using electromagnetic driving means
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
- G10K9/22—Mountings; Casings
Definitions
- the present invention relates to an electro-acoustic transducer for use in cellular phones and the like devices to make call sounds, etc.
- a method of manufacturing the transducers is also contained in the invention.
- FIG. 3 is a cross sectional view of a conventional electromagnetic type electro-acoustic transducer.
- a conventional electro-acoustic transducer comprises:
- the adhesive 6 is an epoxy resin.
- the above described electromagnetic type electro-acoustic transducer generates sounds with the diaphragm 7, which vibrates when electric current is applied to a coil 3 from an external power supply source (not shown) via a terminal section (not shown).
- An epoxy resin is used for the adhesive 6 as recited above.
- epoxy resin adhesive 6 needs a long curing time to provide a sufficient adhesive strength. Therefore, during a production of the electro-acoustic transducers, the semi-assembled units have to be stored in an oven or the like heating apparatus for a duration of approximately one hour or more in order to heat-cure the epoxy resin.
- the heat-curing process is a necking factor in automating a production line for the conventional electromagnetic type electro-acoustic transducers.
- the manufacturing productivity could be improved by raising a heating temperature.
- the adhesive 6 may evaporate and scatter in the high temperature.
- the evaporation and scattering of adhesive 6 leads to a deteriorated adhesive strength.
- the evaporated adhesive 6 scattered and deposited on the diaphragm 7 decreases a sound pressure.
- the high temperature curing has not been employed in most of the manufacturing process.
- the present invention relates to an electro-acoustic transducer for use in cellular phones and the like devices to make call sounds, etc.
- the present invention also provides a method of manufacturing the electro-acoustic transducers.
- the present invention aims to provide an electro-acoustic transducer with a stable quality and high productivity.
- An electro-acoustic transducer of the present invention comprises:
- the heat-curing and UV-curing adhesive used in the above-configured electro-acoustic transducer is processed with,
- Another electro-acoustic transducer of the present invention comprises:
- the UV-curing resin layer is cured by a UV irradiation, before the heat-curing adhesive is cured. This prevents the upward evaporation and scattering of the heat-curing adhesive that could occur during a later heat-curing process. As a result, a magnet can be bonded on a frame within a short time, and the manufacturing productivity is improved.
- FIG. 1 is a cross sectional side view of an electromagnetic type electro-acoustic transducer in accordance with a first exemplary embodiment of the present invention.
- an adhesive 6a coated in the form of a layer is a heat-curing and UV-curing adhesive that cures by heat within a shorter period of time as compared with an epoxy resin.
- a frame 2 is integrally molded with a case 1 at the bottom.
- a magnet 5 is provided on the frame 2 via the heat-curing and UV-curing adhesive 6a.
- the heat-curing and UV-curing adhesive 6a is applied on at least one of the joining faces of the frame 2 and the magnet 5.
- a diaphragm 7 is provided above the magnet 5, and a resonance case 8 is bonded on the case 1.
- the above electro-acoustic transducer is assembled in following processes:
- the electro-acoustic transducer of the first exemplary embodiment is assembled.
- the crept out adhesive 6a is cured in the first step. Then, when it is heated at a high temperature, the adhesive 6a staying between the magnet 5 and the frame 2 is heat-cured bringing the two components into a firmly bonded state.
- the crept out portion of the heat-curing and UV-curing adhesive 6a exposed out of the magnet 5 and the case 1 is cured in the first place by the UV light irradiation.
- the cured portion works to suppress evaporation and scattering of the adhesive 6a during the heat-curing process.
- the magnet 5 can be firmly bonded on the frame 2 within a short time, without inviting a deterioration in the adhesive strength.
- the experiment compares the adhesive strength of the electro-acoustic transducer samples using the adhesive in the first embodiment and that of the electro-acoustic transducer samples using a conventional adhesive.
- the samples in the first embodiment and the conventional samples were manufactured using adhesives of different type. After the magnet 5 is placed on the frame 2, UV light irradiation was applied on the samples in the first embodiment, while no UV light irradiation was applied on the conventional samples.
- the adhesive strength was measured by pushing the magnet 5 from behind the bottom through a small hole provided in the frame 2, and a force when the magnet 5 separates from the frame 2 was recorded.
- the method of measuring the adhesive strength remains the same for both of the samples, the first embodiment and the conventional.
- Electro-acoustic transducer samples in embodiment 1 Conventional electro-acoustic transducer samples Adhesive strength 100N - 130N 90N - 110N
- the adhesive strength with the electro-acoustic transducer samples in accordance with the first embodiment of the present invention is not inferior to that of the sample pieces of conventional electro-acoustic transducers in which a conventional epoxy resin was used.
- the adhesive strength with the samples in the first embodiment is on a slight higher level, as compared with that of the samples using a conventional epoxy resin.
- the higher adhesive strength seems to have been brought about by the adhesive 6a that has been entirely staying, without being scattered, in a gap between the magnet 5 and the case 1 to be cured.
- the samples of electro-acoustic transducer manufactured in accordance with the present invention used in the above experiment 1 have been completed as the finished transducer samples by adding a diaphragm 7 and a resonance case 8 thereon.
- the resonance case 8 is attached to the case 1 through an ultrasonic welding.
- the conventional sample pieces were added with a diaphragm 7 and a resonance case 8 to be completed as the finished transducer samples.
- Both of the sample transducers were measured with respect to the sound pressure characteristic, and then heated in an atmosphere of 260°C for 5 min.
- the heating conditions, 260°C, 5 min. are based on a simulated reflow soldering of electro-acoustic transducers mounted on a circuit board of an appliance.
- Electro-acoustic transducer samples in embodiment 1 Conventional electro-acoustic transducer samples Adhesive strength 60N - 80N 5N - 10N Change in sound pressure characteristic No change observed Changed due to the adhesive sputtered on the diaphragm (decreased by 10db - 15db)
- the conventional adhesive 6 cured at a relatively low temperature in the conventional samples partly remains uncured, because of the low temperature applied thereto.
- the uncured portion of adhesive 6 undergoes a high temperature, the portion evaporates to become a gas.
- the evaporated gas escapes through the gaps between the magnet 5 and the case 1 as well as cracks and voids existing within the magnet 5, and it is deposited on the diaphragm 7 from the above.
- An assumption with the adhesive 6a used in the sample electro-acoustic transducers in the first embodiment is that:
- the exposed portion of adhesive 6a is cured in the first place by the UV light irradiation, sealing the gaps and the cracks and voids. This prevents the adhesive components from sticking on the surface of diaphragm 7. So, the adhesive can be cured at a high temperature, which was not allowed for the conventional electro-acoustic transducers. The high temperature curing shortens the curing time to an improved productivity in the production. This makes it possible to manufacture the electro-acoustic transducers on an automatic (mechanized) assembly line.
- the electro-acoustic transducer in accordance with the first embodiment of the present invention where a heat-curing and UV-curing adhesive 6a is applied in between the magnet 5 and the frame 2, provides a new device structure that is suitable to the production at a high manufacturing efficiency. At the same time, a new method of manufacturing the transducers is provided by the present invention.
- FIG. 2 is a cross sectional side view of an electromagnetic type electro-acoustic transducer in accordance with a second exemplary embodiment of the present invention.
- the second embodiment is a modification of the electromagnetic type electro-acoustic transducer in the first embodiment.
- the components identical to those in the conventional technology and to the first embodiment are represented by using the same reference numerals, and description on which are omitted.
- a magnet 5 is placed on a frame 2 via a heat-curing adhesive 6b.
- the heat-curing adhesive 6b is applied on at least one of the joining faces of the frame 2 and the magnet 5.
- a UV-curing adhesive 6c is provided from above a case 1 including frame 2 and magnet 5.
- a diaphragm 7 is placed on the UV-curing adhesive 6c provided on magnet 5, and a resonance case 8 is bonded on the case 1.
- the electromagnetic type electro-acoustic transducers in the second embodiment have the above-described configuration, and are assembled according to the above processes.
- the curing time can be made shorter with the above structure.
- the electro-acoustic transducers in the second embodiment can be manufactured on an automatic (mechanized) assembly line, like those in the first embodiment.
- a heat-curing adhesive 6b is used for bonding magnet 5 onto frame 2.
- a self-curing adhesive for example an acrylic adhesive using a primer including a polymerization initiator, may be used instead for the purpose.
- the electro-acoustic transducers in the second embodiment have the same advantage as that in the first embodiment, in that the sound generating characteristic in the present invention is hardly ill-affected by the heat of a reflow solder bath, which is used when mounting a transducer on a circuit board of an appliance.
- the surface, the gaps and voids of the case and magnet among them are filled with UV-curing adhesive, and it is cured. Therefore, a possible evaporation and gas generation of the adhesive existing between the frame and the magnet to be caused by a heat applied in a later stage can be suppressed; hence, the influence therefrom on the diaphragm is eliminated. Furthermore, the curing time can be made shorter for an improved productivity.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
An electro-acoustic transducer having a layer of a heat-curing and UV-curing adhesive 6a formed on a frame 2 integrally molded at the bottom of a case 1. A magnet 5 is placed on the frame 2 via the adhesive. Said case 1 is irradiated with a UV light from the above, at least before the adhesive is heat-cured, so that the adhesive is cured in the portion exposed to the UV light. This prevents the adhesive 6a from evaporating, scattering and prevents the adhesive components depositing on a diaphragm 7, that could be caused by a later high temperature process for heat-curing the adhesive 6a. Furthermore, time for the heat-curing in the present invention can be made shorter by the high temperature curing. The shorter curing time improves productivity of the production, and enables to have the transducers manufactured on an automatic assembly line. <IMAGE>
Description
The present invention relates to an electro-acoustic transducer for use in
cellular phones and the like devices to make call sounds, etc. A method of
manufacturing the transducers is also contained in the invention.
Conventional technologies are described with reference to drawings.
FIG. 3 is a cross sectional view of a conventional electromagnetic type electro-acoustic
transducer.
As shown in FIG. 3, a conventional electro-acoustic transducer
comprises:
The adhesive 6 is an epoxy resin.
The above described electromagnetic type electro-acoustic transducer
generates sounds with the diaphragm 7, which vibrates when electric current is
applied to a coil 3 from an external power supply source (not shown) via a
terminal section (not shown).
An epoxy resin is used for the adhesive 6 as recited above. And epoxy
resin adhesive 6 needs a long curing time to provide a sufficient adhesive strength.
Therefore, during a production of the electro-acoustic transducers, the semi-assembled
units have to be stored in an oven or the like heating apparatus for a
duration of approximately one hour or more in order to heat-cure the epoxy resin.
The heat-curing process is a necking factor in automating a production line for the
conventional electromagnetic type electro-acoustic transducers.
The manufacturing productivity could be improved by raising a heating
temperature. However, the adhesive 6 may evaporate and scatter in the high
temperature. The evaporation and scattering of adhesive 6 leads to a
deteriorated adhesive strength. Besides, the evaporated adhesive 6 scattered and
deposited on the diaphragm 7 decreases a sound pressure. In view of these
drawbacks, the high temperature curing has not been employed in most of the
manufacturing process.
The present invention relates to an electro-acoustic transducer for use in
cellular phones and the like devices to make call sounds, etc. The present
invention also provides a method of manufacturing the electro-acoustic
transducers. The present invention aims to provide an electro-acoustic
transducer with a stable quality and high productivity.
An electro-acoustic transducer of the present invention comprises:
The heat-curing and UV-curing adhesive used in the above-configured
electro-acoustic transducer is processed with,
Another electro-acoustic transducer of the present invention comprises:
In the above-described structure, the UV-curing resin layer is cured by a
UV irradiation, before the heat-curing adhesive is cured. This prevents the
upward evaporation and scattering of the heat-curing adhesive that could occur
during a later heat-curing process. As a result, a magnet can be bonded on a
frame within a short time, and the manufacturing productivity is improved.
Examples of preferred embodiments of the present invention are
described in the following with reference to the drawings. In the drawings, those
components of the transducers of the present invention having the same functions
as those in the conventional technology are represented by the same numerals or
symbols used in describing the conventional technology, and descriptions on these
components are omitted.
FIG. 1 is a cross sectional side view of an electromagnetic type electro-acoustic
transducer in accordance with a first exemplary embodiment of the
present invention. Referring to FIG. 1, an adhesive 6a coated in the form of a
layer is a heat-curing and UV-curing adhesive that cures by heat within a shorter
period of time as compared with an epoxy resin.
In an electromagnetic type electro-acoustic transducer of the first
embodiment, a frame 2 is integrally molded with a case 1 at the bottom. A
magnet 5 is provided on the frame 2 via the heat-curing and UV-curing adhesive
6a. The heat-curing and UV-curing adhesive 6a is applied on at least one of the
joining faces of the frame 2 and the magnet 5. A diaphragm 7 is provided above
the magnet 5, and a resonance case 8 is bonded on the case 1.
The above electro-acoustic transducer is assembled in following
processes:
Thus, the electro-acoustic transducer of the first exemplary embodiment
is assembled.
Next, the reason why a heat-curing and UV-curing adhesive 6a is used for
the adhesive, and why a UV light irradiation is applied from above the case 1
before it is cured by heat is described in detail. Physical property of the adhesive
6a is viscous. When the magnet 5 is placed on the frame 2, they attract each
other, pushing part of the adhesive out, the amount depending on the viscosity of
the adhesive, through small gaps between the case 1 and the magnet 5. In a case
where the magnet 5 is a molded plastic magnet, there are cracks and voids within
it which occur at the time of molding, and the adhesive sometimes oozes out also
through the cracks and voids to appear on the upper surface of the magnet 5.
When the case 1 is exposed to a UV radiation from above, the crept out
adhesive 6a is cured in the first step. Then, when it is heated at a high
temperature, the adhesive 6a staying between the magnet 5 and the frame 2 is
heat-cured bringing the two components into a firmly bonded state.
As described above, the crept out portion of the heat-curing and UV-curing
adhesive 6a exposed out of the magnet 5 and the case 1 is cured in the first
place by the UV light irradiation. The cured portion works to suppress
evaporation and scattering of the adhesive 6a during the heat-curing process.
Thus the magnet 5 can be firmly bonded on the frame 2 within a short time,
without inviting a deterioration in the adhesive strength.
Now in the following, results of experiments are described, which were
conducted to confirm the above statements.
The experiment compares the adhesive strength of the electro-acoustic
transducer samples using the adhesive in the first embodiment and that of the
electro-acoustic transducer samples using a conventional adhesive.
As described above, the samples in the first embodiment and the
conventional samples were manufactured using adhesives of different type.
After the magnet 5 is placed on the frame 2, UV light irradiation was applied on
the samples in the first embodiment, while no UV light irradiation was applied on
the conventional samples.
Prior to measurement with respect to the adhesive strength, respective
frames of the samples in the first embodiment and those of conventional samples
were placed on a 150°C heating plate for 5 min. The heating conditions remain
the same for both of the samples.
After the 150°C heating was finished, adhesive strength between the
magnet 5 and the frame 2 was measured.
The adhesive strength was measured by pushing the magnet 5 from
behind the bottom through a small hole provided in the frame 2, and a force when
the magnet 5 separates from the frame 2 was recorded. The method of
measuring the adhesive strength remains the same for both of the samples, the
first embodiment and the conventional.
Table 1 shows results of the measurement, with respect to the adhesive
strength.
| Electro-acoustic transducer samples in | Conventional electro-acoustic transducer samples | |
| Adhesive strength | 100N - 130N | 90N - 110N |
From the above results, it has been confirmed that the adhesive strength
with the electro-acoustic transducer samples in accordance with the first
embodiment of the present invention is not inferior to that of the sample pieces of
conventional electro-acoustic transducers in which a conventional epoxy resin
was used.
The adhesive strength with the samples in the first embodiment is on a
slight higher level, as compared with that of the samples using a conventional
epoxy resin. The higher adhesive strength seems to have been brought about by
the adhesive 6a that has been entirely staying, without being scattered, in a gap
between the magnet 5 and the case 1 to be cured.
The samples of electro-acoustic transducer manufactured in accordance
with the present invention used in the above experiment 1 have been completed as
the finished transducer samples by adding a diaphragm 7 and a resonance case 8
thereon. The resonance case 8 is attached to the case 1 through an ultrasonic
welding. Likewise, the conventional sample pieces were added with a
diaphragm 7 and a resonance case 8 to be completed as the finished transducer
samples. Both of the sample transducers were measured with respect to the
sound pressure characteristic, and then heated in an atmosphere of 260°C for 5
min. The heating conditions, 260°C, 5 min., are based on a simulated reflow
soldering of electro-acoustic transducers mounted on a circuit board of an
appliance. After the above heating for 5 min., both of the sample transducers
were again measured with respect to the sound pressure, to be compared with
those before the 260°C heating. Table 2 shows the results of sound pressure
measurement. After the measurement was finished, the resonance case 8 and the
diaphragm 7 were removed, and the diaphragm 7 was inspected as to whether
there was any foreign material sticking on the diaphragm 7. And the adhesive
strength between the magnet 5 and the frame 2 was also measured with both of
the samples. The results of measurement in adhesive strength are shown in
Table 2.
| Electro-acoustic transducer samples in | Conventional electro-acoustic transducer samples | |
| Adhesive strength | 60N - 80N | 5N - 10N |
| Change in sound pressure characteristic | No change observed | Changed due to the adhesive sputtered on the diaphragm (decreased by 10db - 15db) |
As Table 2 shows, it has been confirmed, after undergoing the 260°C, 5
min. heating, that the samples in the first embodiment are superior to the
conventional samples with respect to all of the measurement items, such as
change in the sound pressure, the adhesive strength and sticking of foreign
materials on the diaphragm 7. The foreign material sticking on the diaphragm of
the conventional samples has been confirmed to be components of the adhesive.
Based on the above-described results, it is assumed that the conventional
adhesive 6 cured at a relatively low temperature in the conventional samples
partly remains uncured, because of the low temperature applied thereto. When
the uncured portion of adhesive 6 undergoes a high temperature, the portion
evaporates to become a gas. The evaporated gas escapes through the gaps
between the magnet 5 and the case 1 as well as cracks and voids existing within
the magnet 5, and it is deposited on the diaphragm 7 from the above.
An assumption with the adhesive 6a used in the sample electro-acoustic
transducers in the first embodiment is that:
When a magnet 5 is placed on a frame 2, part of the adhesive 6a is pushed
out through the gaps and the cracks and voids to be exposed on the surface. The
exposed adhesive 6a is cured in the first place by a UV light irradiation, and the
gaps and the cracks and voids are sealed. Thus the channels of upward escaping
are blocked, and deposition of the adhesive on the diaphragm 7 has been avoided.
As described above, the exposed portion of adhesive 6a is cured in the
first place by the UV light irradiation, sealing the gaps and the cracks and voids.
This prevents the adhesive components from sticking on the surface of diaphragm
7. So, the adhesive can be cured at a high temperature, which was not allowed
for the conventional electro-acoustic transducers. The high temperature curing
shortens the curing time to an improved productivity in the production. This
makes it possible to manufacture the electro-acoustic transducers on an automatic
(mechanized) assembly line.
The electro-acoustic transducer in accordance with the first embodiment
of the present invention, where a heat-curing and UV-curing adhesive 6a is
applied in between the magnet 5 and the frame 2, provides a new device structure
that is suitable to the production at a high manufacturing efficiency. At the same
time, a new method of manufacturing the transducers is provided by the present
invention.
FIG. 2 is a cross sectional side view of an electromagnetic type electro-acoustic
transducer in accordance with a second exemplary embodiment of the
present invention. The second embodiment is a modification of the
electromagnetic type electro-acoustic transducer in the first embodiment. The
components identical to those in the conventional technology and to the first
embodiment are represented by using the same reference numerals, and
description on which are omitted.
Referring to FIG. 2, a magnet 5 is placed on a frame 2 via a heat-curing
adhesive 6b. The heat-curing adhesive 6b is applied on at least one of the
joining faces of the frame 2 and the magnet 5. After the magnet 5 is placed on
frame 2, a UV-curing adhesive 6c is provided from above a case 1 including
frame 2 and magnet 5. A diaphragm 7 is placed on the UV-curing adhesive 6c
provided on magnet 5, and a resonance case 8 is bonded on the case 1.
The above electro-acoustic transducer is assembled as follows:
The electromagnetic type electro-acoustic transducers in the second
embodiment have the above-described configuration, and are assembled
according to the above processes.
The curing time can be made shorter with the above structure. The
electro-acoustic transducers in the second embodiment can be manufactured on an
automatic (mechanized) assembly line, like those in the first embodiment.
In the above description, a heat-curing adhesive 6b is used for bonding
magnet 5 onto frame 2. However, a self-curing adhesive, for example an acrylic
adhesive using a primer including a polymerization initiator, may be used instead
for the purpose.
The electro-acoustic transducers in the second embodiment have the same
advantage as that in the first embodiment, in that the sound generating
characteristic in the present invention is hardly ill-affected by the heat of a reflow
solder bath, which is used when mounting a transducer on a circuit board of an
appliance.
In the transducers of the present invention having the above-described
structures, the surface, the gaps and voids of the case and magnet among them are
filled with UV-curing adhesive, and it is cured. Therefore, a possible
evaporation and gas generation of the adhesive existing between the frame and the
magnet to be caused by a heat applied in a later stage can be suppressed; hence,
the influence therefrom on the diaphragm is eliminated. Furthermore, the curing
time can be made shorter for an improved productivity.
Claims (5)
- An electro-acoustic transducer comprising:a case molded integrally with a frame at the bottom;a heat-curing and UV(ultra violet ray)-curing adhesive layer formed on said frame;a magnet bonded on said frame via said heat-curing and UV-curing adhesive layer; anda diaphragm provided above said magnet.
- A method of manufacturing electro-acoustic transducers comprising steps of:a. forming a layer of a heat-curing and UV-curing adhesive on a frame integrally molded at the bottom of a case, and disposing a magnet on said frame via said layer of a heat-curing and UV-curing adhesive;b. irradiating UV light to said case, with said magnet placed thereon, so that said heat-curing and UV-curing adhesive is cured in the portion exposed to the UV light;c. heating, after curing said heat-curing and UV-curing adhesive, said heat-curing and UV-curing adhesive so that said magnet is bonded on said frame; andd. mounting, after said magnet is bonded on said frame, a diaphragm above said magnet.
- An electro-acoustic transducer comprising:a case molded integrally with a frame at the bottom;a magnet mounted on said frame with an adhesive,a UV-curing resin layer formed on said case having said magnet mounted thereon, anda diaphragm provided above said magnet.
- The electro-acoustic transducer of claim 3, wherein the adhesive bonding said magnet on said frame is a heat-curing adhesive.
- A method of manufacturing electro-acoustic transducers comprising steps of:a. forming a heat-curing adhesive layer on a frame integrally molded at the bottom of a case, and disposing a magnet on said frame via said heat-curing adhesive layer;b. forming a UV-curing resin layer on said case mounted with said magnet thereon;c. irradiating UV light to said case, after said UV-curing resin layer is formed thereon, so that said UV-curing resin is cured;d. heating, after said UV-curing resin is cured, the heat-curing adhesive layer so that said magnet is bonded on said frame; ande. mounting, after said magnet is bonded on said frame, a diaphragm above said magnet.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36025599A JP2001177898A (en) | 1999-12-20 | 1999-12-20 | Electroacoustic transducer and method of manufacturing the same |
| JP36025599 | 1999-12-20 | ||
| PCT/JP2000/007813 WO2001046943A1 (en) | 1999-12-20 | 2000-11-07 | Electroacoustic transducer and method of manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1164574A1 true EP1164574A1 (en) | 2001-12-19 |
| EP1164574A4 EP1164574A4 (en) | 2006-07-19 |
Family
ID=18468598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00971825A Withdrawn EP1164574A4 (en) | 1999-12-20 | 2000-11-07 | LECTROACOUSTIC TRANSDUCER AND METHOD OF MANUFACTURE |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1164574A4 (en) |
| JP (1) | JP2001177898A (en) |
| CN (1) | CN1168067C (en) |
| NO (1) | NO20014027L (en) |
| WO (1) | WO2001046943A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100418215B1 (en) * | 2001-08-21 | 2004-02-11 | 주식회사 삼부커뮤닉스 | Frame consolidation method of buzzer |
| KR101061226B1 (en) | 2009-07-01 | 2011-08-31 | 한국표준과학연구원 | Magnetostrictive transducer module for induction ultrasonic conversion |
| CN112165680B (en) * | 2020-10-15 | 2021-12-28 | 梅州国威电子有限公司 | Energy-concerving and environment-protective receiver of solidification is made and is used ultraviolet curing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446032A (en) * | 1977-09-19 | 1979-04-11 | Matsushita Electric Ind Co Ltd | Production of speaker |
| CA1194637A (en) * | 1982-04-26 | 1985-10-01 | Charles R. Morgan | Uv and thermally curable, thermoplastic-containing compositions |
| EP0790752A4 (en) * | 1995-09-04 | 2004-10-06 | Matsushita Electric Industrial Co Ltd | BUZZER |
| JPH09215091A (en) * | 1996-01-31 | 1997-08-15 | Kyocera Corp | Electromagnetic sounding body |
| DE19705027C2 (en) * | 1997-02-10 | 2002-09-19 | Infineon Technologies Ag | Method for gluing a component to a surface |
| JP3470025B2 (en) * | 1997-11-27 | 2003-11-25 | 京セラ株式会社 | Pronunciation body |
-
1999
- 1999-12-20 JP JP36025599A patent/JP2001177898A/en active Pending
-
2000
- 2000-11-07 EP EP00971825A patent/EP1164574A4/en not_active Withdrawn
- 2000-11-07 CN CNB008040516A patent/CN1168067C/en not_active Expired - Fee Related
- 2000-11-07 WO PCT/JP2000/007813 patent/WO2001046943A1/en not_active Ceased
-
2001
- 2001-08-17 NO NO20014027A patent/NO20014027L/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1168067C (en) | 2004-09-22 |
| EP1164574A4 (en) | 2006-07-19 |
| CN1341254A (en) | 2002-03-20 |
| WO2001046943A1 (en) | 2001-06-28 |
| NO20014027L (en) | 2001-10-19 |
| NO20014027D0 (en) | 2001-08-17 |
| JP2001177898A (en) | 2001-06-29 |
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