EP1068626A1 - Hybridschaltungsanordnung mit thermosicherung - Google Patents

Hybridschaltungsanordnung mit thermosicherung

Info

Publication number
EP1068626A1
EP1068626A1 EP99922032A EP99922032A EP1068626A1 EP 1068626 A1 EP1068626 A1 EP 1068626A1 EP 99922032 A EP99922032 A EP 99922032A EP 99922032 A EP99922032 A EP 99922032A EP 1068626 A1 EP1068626 A1 EP 1068626A1
Authority
EP
European Patent Office
Prior art keywords
resistance
die
ist
circuit carrier
widerstandsmäander
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP99922032A
Other languages
German (de)
English (en)
French (fr)
Inventor
Karl Rehnelt
Frank Templin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of EP1068626A1 publication Critical patent/EP1068626A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/04—Bases; Housings; Mountings
    • H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
    • H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the invention relates to a hybrid circuit arrangement with a resistance meander, which is applied to a plate-shaped circuit carrier, and with a thermal fuse thermally coupled to the circuit carrier and electrically connected to the resistance mander, which can be triggered by the resistance mander in the event of an overload due to the heating of the circuit carrier.
  • Thermal fuses used in public telephone exchange systems and usually manufactured in thick film or thin film technology. Thermal fuses of the type mentioned are described in detail, for example, in EP 0 352 771 A2 or in WO 94/03 913, each of which is a fuse, the pretensioned spring arm of which is soldered to a soldering point on the circuit substrate.
  • thermal ⁇ fuse While the thermal ⁇ fuse, is usually best positioned as described in the drawing of the above-mentioned DE 93 19 473 UI of space roughly in the middle of the circuit carrier, a prominent heat spot (hot spot) is usually not formed in the central region of the Wegungstragers, in which has a relatively large amount of substrate material for heat distribution, but in the area of the periphery. Due to the heat dissipation through the external connections of the hybrid circuit arrangement on the underside, there are usually one or more heat points on the upper periphery, the exact position of which cannot be predicted, but must be tested after the circuit has been developed.
  • the present invention is based on the object of achieving an optimized and predetermined effect of the thermal fuse without being fixed on the circuit arrangement during its positioning.
  • the resistance meander is designed in a limited area on the circuit carrier as a structure which is looped around it several times and which is based on the heat point to be generated with a defined position on the circuit carrier, and that the thermal fuse is thermally coupled to the circuit carrier at this heat point.
  • the drawing shows a top view of a resistance meander structured according to the invention and a thermal fuse.
  • a horrsmaander is shown, which loops do not form a uniform, parallel pattern, son ⁇ countries in the structure of which bends are provided, so that in each case one or more loops can not be arranged only side by side but also faced at an angle against each other or one another.
  • the individual loops which are in turn intertwined, thus create a structure that allows a particularly large output to be generated at a predetermined location and thus to generate a defined heat point 3 (hot spot).
  • the intertwined structure occupies only a limited area 4 of the circuit carrier 5, which is otherwise covered by a uniform resistance meander and / or flat resistors. These "normal" resistance structures are not shown in the drawing.
  • the adjustment of resistance meanders is preferably carried out by adjustment points which create a short circuit at the beginning of a loop and which can be cut through, for example by means of a laser, to produce a desired resistance value, so that the total resistance is increased by the resistance of this one loop.
  • This adjustment method can also be easily maintained within the scope of the present invention if no adjustment points are provided in the above-mentioned limited area 4 with the intertwined meandering structure, so that constant heating is generated in this area 4 regardless of the adjustment.
  • the invention as a whole ensures optimum triggering of the heating-based fuse by concentrating the heat turnover in the region 4, the total heating of the circuit arrangement remaining limited.
  • the drawing also shows a fuse 6 known per se, the spring arm of which is pretensioned is precisely soldered to a contact surface (not shown) of the circuit in the heat point 3 generated by the tortuous resistance meander.
  • the heating point 3 has in each 4 case over a certain extent, so that no precise positioning of the thermal fuse 6 is required.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
EP99922032A 1998-03-31 1999-03-16 Hybridschaltungsanordnung mit thermosicherung Ceased EP1068626A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19814445 1998-03-31
DE1998114445 DE19814445C1 (de) 1998-03-31 1998-03-31 Hybridschaltungsanordnung mit Thermosicherung
PCT/DE1999/000737 WO1999050871A1 (de) 1998-03-31 1999-03-16 Hybridschaltungsanordnung mit thermosicherung

Publications (1)

Publication Number Publication Date
EP1068626A1 true EP1068626A1 (de) 2001-01-17

Family

ID=7863143

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99922032A Ceased EP1068626A1 (de) 1998-03-31 1999-03-16 Hybridschaltungsanordnung mit thermosicherung

Country Status (4)

Country Link
EP (1) EP1068626A1 (zh)
CN (1) CN1294749A (zh)
DE (1) DE19814445C1 (zh)
WO (1) WO1999050871A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1811819B1 (de) * 2006-01-19 2011-03-23 Siemens Aktiengesellschaft Leiterplatte
JP2008021520A (ja) * 2006-07-12 2008-01-31 Nec Lighting Ltd 放電灯

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3825897A1 (de) * 1988-07-28 1990-02-01 Siemens Ag Schmelzsicherung mit federarm
KR920007514Y1 (ko) * 1990-12-24 1992-10-15 동아전기부품 주식회사 모우터의 회전속도 조정용 저항기
JP2615380B2 (ja) * 1992-08-07 1997-05-28 シーメンス アクチエンゲゼルシヤフト 温度ヒューズおよびその活性化方法
DE9319473U1 (de) * 1993-12-17 1994-06-23 Siemens Ag Hybridschaltungsanordnung
JPH0992110A (ja) * 1995-09-26 1997-04-04 Denso Corp 温度ヒューズ付抵抗器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9950871A1 *

Also Published As

Publication number Publication date
DE19814445C1 (de) 1999-06-24
WO1999050871A1 (de) 1999-10-07
CN1294749A (zh) 2001-05-09

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