CN1294749A - 具有热熔丝的混合电路结构 - Google Patents

具有热熔丝的混合电路结构 Download PDF

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CN1294749A
CN1294749A CN 99804338 CN99804338A CN1294749A CN 1294749 A CN1294749 A CN 1294749A CN 99804338 CN99804338 CN 99804338 CN 99804338 A CN99804338 A CN 99804338A CN 1294749 A CN1294749 A CN 1294749A
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fuse
circuit substrate
thermo
resistance path
meander
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K·雷恩埃特
F·坦普林
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TE Connectivity Solutions GmbH
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Tyco Electronics Logistics AG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/04—Bases; Housings; Mountings
    • H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
    • H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

提供了一电连接于一曲折电阻通路(1)的热熔丝(6),它适于在因电路基底(5)发热造成的超载情况下由所述曲折电阻道路(1)触发。该曲折电阻通路(1)以围绕热点(3)的多交错结构的形式设置在电路基底(5)的一有限区域(4)中,这样该热点便将以最佳的方式产生于一限定位置。热熔丝(3)在所述热点(3)处热连接于电路基底(5)。

Description

具有热熔丝的混合电路结构
本发明涉及一种混合电路结构，它包括一施加于一板状电路基底上的曲折电阻通路和一热连接于电路基底并电连接于曲折电阻通路的热熔丝，在因电路基底发热造成的超载情况下，该热熔丝可由曲折电阻通路触发。
这种结构例如可从德国实用新型DE9319473U1中了解到。例如，这种混合结构可以在公共电话交换系统中作串联电阻器(安全网络)，并且通常用厚膜或薄膜技术制造。上述类型的热熔丝例如详细描述于EP0352771A2或WO94／03913中，它们均涉及这样的熔丝，即熔丝的偏压弹簧臂焊接于电路基底的焊接点。
这些具有机械触发熔丝的结构是基于按照电流或者先是载流曲折电阻通路的转换功率、再是被加热的电路基底的转换功率的发热。这种效应用来使一熔丝熔化，或用来使一热熔丝的焊接点断开。在混合组件的场合下，曲折电阻通路可通过将相应的胶质印制于电路基底上来制造，由于空间的原因，它基本覆盖其整个表面积。由于曲折电阻通路在有电流流过时均匀发热，因而就有一个问题，即如何以最佳方式将用于使热熔丝触发的热量集中于一受限的范围(热点)，从而使热熔丝实现较佳的效率。虽然如所述DE9319473U1的附图中所描述的热熔丝由于空间的原因通常最好是设置在电路基底的大致中央处，但在电路基底的中央区域通常没有形成一具有相对较多基底材料以便分布热量的突出热点，相反该热点是形成在周边区域。由于热量是通过混合电路结构的外部端子在其下侧而消散的，因而在上部周边上通常形成有一或多个热点，它们的准确位置无法进行预测，而必须根据电路的试制而测出。
本发明的目的在于使热熔丝实现最佳的可预测的效果，而无需使其在会有限制的电路结构上定位。
该目的是通过一种该说明书开头处所指类型的混合电路结构来实现的，其中，曲折电阻通路在电路基底上的一有限区域中形成为一围绕热点的多交错结构，这样热点便将形成于电路基底上一限定位置，并且热熔丝在该热点处热连接于电路基底。
本发明的进一步展开由所附权利要求书来限定特征。
本发明将在下面通过一个实施例和唯一的附图来进行说明。该图是一具有本发明的结构以及一热熔丝的曲折电阻通路的俯视图。
附图示出一曲折电阻通路，其回路没有构成一均匀的平行图案，而是它在其结构中具有弯曲，使得一或多个回路不仅能彼此相邻设置，而且也能彼此成角度地或以彼此相对的方式设置。由于也以交错方式设置的各个回路，因而可形成一个允许在一预定位置产生特别高的功率转换的结构，进而产生一个限定的热点3。在这方面，交错结构仅占据电路基底5的一有限的部分4，该部分原本是由一均匀的曲折电阻通路和／或片状电阻器覆盖。这些“普通的”电阻结构未在附图中示出。
最好通过调节点对曲折电阻通路进行调节，这些调节点在一回路的开头处构成一短路，并且为了获得所需的电阻值，例如可以通过激光将它们分开，使总的电阻因这一个回路的电阻而升高。如果在上述具有交错的曲折通路结构的有限区域4中没有提供调节点，则不管调节与否在该区域4中都可产生均匀的热量，因而这种调节技术也可很容易地包括在本发明的范围之内。
通过将热量转换集中在区域4上，本发明总的确保了熔丝根据发热而最佳触发，使电路结构的总的发热受限制。附图另外还示出一本身就公知的熔丝6，其偏压弹簧臂恰在由交错的曲折电阻通路所产生的热点3中焊接于电路的一接触区域(未图示)。热点3在任何情况下都有一定的延伸，因而不需要对热熔丝6进行毫米-精度的定位。

Claims (3)

1．一种混合电路结构，它包括一施加于一板状电路基底(5)上的曲折电阻通路(1)和一热连接于电路基底(5)并电连接于曲折电阻通路(1)的热熔丝(6)，在因电路基底(5)发热造成的超载情况下，该热熔丝可由曲折电阻通路(1)触发，
其特征在于，曲折电阻通路(1)在电路基底(5)的一有限区域(4)中形成为一围绕热点(3)的多交错结构，这样热点(3)便将形成于电路基底(5)上一限定位置，并且热熔丝(6)在所述热点(3)处热连接于电路基底(5)。
2．如权利要求1所述的混合电路结构，
其特征在于，曲折电阻通路(1)具有调节点，但这些调节点不设置在所述有限区域(4)中。
3．如权利要求1或2的混合电路结构，
其特征在于，热熔丝(6)由一熔丝(6)构成，该熔丝具有至少一个以偏压方式焊接于混合电路的一接触区域的弹簧臂，并且所述接触区域设置在热点(3)中。
CN 99804338 1998-03-31 1999-03-16 具有热熔丝的混合电路结构 Pending CN1294749A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19814445.8 1998-03-31
DE1998114445 DE19814445C1 (de) 1998-03-31 1998-03-31 Hybridschaltungsanordnung mit Thermosicherung

Publications (1)

Publication Number Publication Date
CN1294749A true CN1294749A (zh) 2001-05-09

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CN 99804338 Pending CN1294749A (zh) 1998-03-31 1999-03-16 具有热熔丝的混合电路结构

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EP (1) EP1068626A1 (zh)
CN (1) CN1294749A (zh)
DE (1) DE19814445C1 (zh)
WO (1) WO1999050871A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101105284B (zh) * 2006-07-12 2010-12-22 Nec照明株式会社 放电灯

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1811819B1 (de) * 2006-01-19 2011-03-23 Siemens Aktiengesellschaft Leiterplatte

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3825897A1 (de) * 1988-07-28 1990-02-01 Siemens Ag Schmelzsicherung mit federarm
KR920007514Y1 (ko) * 1990-12-24 1992-10-15 동아전기부품 주식회사 모우터의 회전속도 조정용 저항기
EP0654170B1 (de) * 1992-08-07 1996-02-21 Siemens Aktiengesellschaft Thermosicherung und verfahren zu ihrer aktivierung
DE9319473U1 (de) * 1993-12-17 1994-06-23 Siemens Ag Hybridschaltungsanordnung
JPH0992110A (ja) * 1995-09-26 1997-04-04 Denso Corp 温度ヒューズ付抵抗器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101105284B (zh) * 2006-07-12 2010-12-22 Nec照明株式会社 放电灯

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EP1068626A1 (de) 2001-01-17
WO1999050871A1 (de) 1999-10-07
DE19814445C1 (de) 1999-06-24

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