DE68908362T2 - Abbrechbares selbstregulierendes Heizelement für die Oberflächenmontagetechnik. - Google Patents

Abbrechbares selbstregulierendes Heizelement für die Oberflächenmontagetechnik.

Info

Publication number
DE68908362T2
DE68908362T2 DE89311649T DE68908362T DE68908362T2 DE 68908362 T2 DE68908362 T2 DE 68908362T2 DE 89311649 T DE89311649 T DE 89311649T DE 68908362 T DE68908362 T DE 68908362T DE 68908362 T2 DE68908362 T2 DE 68908362T2
Authority
DE
Germany
Prior art keywords
breakable
self
heating element
surface mounting
mounting technology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89311649T
Other languages
English (en)
Other versions
DE68908362D1 (de
Inventor
Homer Ernst Henschen
Michael John Mckee
Joseph Michael Pawlikowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE68908362D1 publication Critical patent/DE68908362D1/de
Application granted granted Critical
Publication of DE68908362T2 publication Critical patent/DE68908362T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Dermatology (AREA)
  • General Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE89311649T 1988-11-29 1989-11-10 Abbrechbares selbstregulierendes Heizelement für die Oberflächenmontagetechnik. Expired - Fee Related DE68908362T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/277,362 US5103071A (en) 1988-11-29 1988-11-29 Surface mount technology breakaway self regulating temperature heater

Publications (2)

Publication Number Publication Date
DE68908362D1 DE68908362D1 (de) 1993-09-16
DE68908362T2 true DE68908362T2 (de) 1994-02-24

Family

ID=23060529

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89311649T Expired - Fee Related DE68908362T2 (de) 1988-11-29 1989-11-10 Abbrechbares selbstregulierendes Heizelement für die Oberflächenmontagetechnik.

Country Status (6)

Country Link
US (1) US5103071A (de)
EP (1) EP0371644B1 (de)
JP (1) JPH02276181A (de)
KR (1) KR0150444B1 (de)
CA (1) CA1310138C (de)
DE (1) DE68908362T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421752A (en) * 1989-07-31 1995-06-06 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
DE69119381T2 (de) * 1990-12-21 1996-11-14 Whitaker Corp Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu
US5279028A (en) * 1993-04-30 1994-01-18 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5580271A (en) * 1994-09-08 1996-12-03 The Whitaker Corporation SCSI cable with termination circuit and method of making
EP0741396A1 (de) * 1995-05-04 1996-11-06 AT&T IPM Corp. Magnetische Leistungsvorrichtung mit drahtlose Leiterplattenanschluss und ihr Herstellungsverfahren
EP0741395A1 (de) 1995-05-04 1996-11-06 AT&T IPM Corp. Anschluss-montierbare planare magnetischen Vorrichtung und ihr Herstellungsverfahren
GB2330289A (en) * 1997-10-13 1999-04-14 Ericsson Omc Limited Heated printed circuit board
US6423939B1 (en) * 2000-10-02 2002-07-23 Agilent Technologies, Inc. Micro soldering method and apparatus
EP1291825B1 (de) * 2001-09-07 2006-03-01 Takashi Kuraishi System zur Identifikation eines Benutzers mit einer Karte, Hostvorrichtung dafür, Kartenlesergerät und Karte
ATE357123T1 (de) 2004-11-11 2007-04-15 Dbk David & Baader Gmbh Elektrischer platinenheizbaustein, elektronikplatine und verfahren zum beheizen
FR2912029B1 (fr) * 2007-01-31 2010-10-22 Hispano Suiza Sa Carte electronique incorporant une resistance chauffante.
US7530820B2 (en) * 2007-05-29 2009-05-12 Myoungsoo Jeon Temperature-activated self-extending surface mount attachment structures
WO2009076770A1 (en) * 2007-12-19 2009-06-25 Phoster Industries Modular led lighting device
WO2020068901A1 (en) 2018-09-25 2020-04-02 Caliente LLC Resistance welding copper terminals through mylar
KR102220763B1 (ko) * 2020-11-05 2021-03-02 신정개발특장차 주식회사 집진 필터모듈

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256945A (en) * 1979-08-31 1981-03-17 Iris Associates Alternating current electrically resistive heating element having intrinsic temperature control
US4701587A (en) * 1979-08-31 1987-10-20 Metcal, Inc. Shielded heating element having intrinsic temperature control
US4354629A (en) * 1980-06-09 1982-10-19 Raychem Corporation Solder delivery system
US4695713A (en) * 1982-09-30 1987-09-22 Metcal, Inc. Autoregulating, electrically shielded heater
DE3382551D1 (de) * 1982-12-01 1992-05-27 Metcal Inc Verbinder mit schmelzeinsatz und innerer temperatursteuerung.
US4717814A (en) * 1983-06-27 1988-01-05 Metcal, Inc. Slotted autoregulating heater
US4583807A (en) * 1983-12-13 1986-04-22 Amp Incorporated Surface mount connector
US4623401A (en) * 1984-03-06 1986-11-18 Metcal, Inc. Heat treatment with an autoregulating heater
US4745264A (en) * 1984-03-06 1988-05-17 Metcal, Inc. High efficiency autoregulating heater
US4659912A (en) * 1984-06-21 1987-04-21 Metcal, Inc. Thin, flexible, autoregulating strap heater
US4626767A (en) * 1984-12-21 1986-12-02 Metcal, Inc. Constant current r.f. generator
US4629278A (en) * 1985-04-15 1986-12-16 Amp Incorporated Surface mountable connector retention means and method
GB8509718D0 (en) * 1985-04-16 1985-05-22 Plessey Co Plc Adaptor for printed circuit board connector
US4693528A (en) * 1985-05-31 1987-09-15 Amp Incorporated Surface mount connector with floating terminals
US4795870A (en) * 1985-06-18 1989-01-03 Metcal, Inc. Conductive member having integrated self-regulating heaters
US4788404A (en) * 1985-06-20 1988-11-29 Metcal, Inc. Self-soldering flexible circuit connector
US4645287A (en) * 1985-09-09 1987-02-24 Amp Incorporated Surface mount connector
US4814587A (en) * 1986-06-10 1989-03-21 Metcal, Inc. High power self-regulating heater
US4789767A (en) * 1987-06-08 1988-12-06 Metcal, Inc. Autoregulating multi contact induction heater

Also Published As

Publication number Publication date
EP0371644A1 (de) 1990-06-06
CA1310138C (en) 1992-11-10
DE68908362D1 (de) 1993-09-16
KR900008729A (ko) 1990-06-03
EP0371644B1 (de) 1993-08-11
US5103071A (en) 1992-04-07
KR0150444B1 (ko) 1998-10-15
JPH02276181A (ja) 1990-11-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee