DE69119381T2 - Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu - Google Patents

Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu

Info

Publication number
DE69119381T2
DE69119381T2 DE69119381T DE69119381T DE69119381T2 DE 69119381 T2 DE69119381 T2 DE 69119381T2 DE 69119381 T DE69119381 T DE 69119381T DE 69119381 T DE69119381 T DE 69119381T DE 69119381 T2 DE69119381 T2 DE 69119381T2
Authority
DE
Germany
Prior art keywords
attaching
connector
procedure
circuit element
connection frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69119381T
Other languages
English (en)
Other versions
DE69119381D1 (de
Inventor
Homer Henschen
Michael Mckee
Joseph Pawlikowski
Richard Schaeffer
James Scholz
David Shaffer
Alexander Sharpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/631,819 external-priority patent/US5090116A/en
Priority claimed from US07/631,814 external-priority patent/US5093987A/en
Application filed by Whitaker LLC filed Critical Whitaker LLC
Application granted granted Critical
Publication of DE69119381D1 publication Critical patent/DE69119381D1/de
Publication of DE69119381T2 publication Critical patent/DE69119381T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Dermatology (AREA)
  • General Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE69119381T 1990-12-21 1991-12-20 Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu Expired - Fee Related DE69119381T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/631,819 US5090116A (en) 1990-12-21 1990-12-21 Method of assembling a connector to a circuit element and soldering lead frame for use therein
US07/631,814 US5093987A (en) 1990-12-21 1990-12-21 Method of assembling a connector to a circuit element and soldering component for use therein

Publications (2)

Publication Number Publication Date
DE69119381D1 DE69119381D1 (de) 1996-06-13
DE69119381T2 true DE69119381T2 (de) 1996-11-14

Family

ID=27091486

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69119381T Expired - Fee Related DE69119381T2 (de) 1990-12-21 1991-12-20 Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu

Country Status (3)

Country Link
EP (1) EP0492492B1 (de)
JP (1) JP2807748B2 (de)
DE (1) DE69119381T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2282089B (en) * 1993-08-19 1996-08-28 Junichi Nakazawa Electronic lead elements and the production method thereof
JPH1050919A (ja) 1996-07-31 1998-02-20 Oki Electric Ind Co Ltd クリップリード端子束、クリップリード端子の接続方法、リード端子接続用基板およびリード端子付き基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0241597B1 (de) * 1982-12-01 1992-04-22 Metcal Inc. Verbinder mit Schmelzeinsatz und innerer Temperatursteuerung
US4717814A (en) * 1983-06-27 1988-01-05 Metcal, Inc. Slotted autoregulating heater
US4795870A (en) * 1985-06-18 1989-01-03 Metcal, Inc. Conductive member having integrated self-regulating heaters
US4814587A (en) * 1986-06-10 1989-03-21 Metcal, Inc. High power self-regulating heater
US4789767A (en) * 1987-06-08 1988-12-06 Metcal, Inc. Autoregulating multi contact induction heater
US5103071A (en) * 1988-11-29 1992-04-07 Amp Incorporated Surface mount technology breakaway self regulating temperature heater
US5059756A (en) * 1988-11-29 1991-10-22 Amp Incorporated Self regulating temperature heater with thermally conductive extensions
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board

Also Published As

Publication number Publication date
EP0492492A3 (en) 1993-02-03
EP0492492B1 (de) 1996-05-08
EP0492492A2 (de) 1992-07-01
JPH04301389A (ja) 1992-10-23
JP2807748B2 (ja) 1998-10-08
DE69119381D1 (de) 1996-06-13

Similar Documents

Publication Publication Date Title
DE69015251T2 (de) Verfahren und Vorrichtung zur Verbindung eines Drahtes an einer Anschlussklemme.
KR960016111A (ko) 시각 신호 발생용 회로 및 방법
DE68926757T2 (de) Verfahren zur Meldung eines asynchronen Ereignisses an einen Terminalbenutzer
DE69814268D1 (de) Verfahren zur Anbindung eines Prozessors an einen Koprozessor
DE69124421D1 (de) Verfahren und Vorrichtung für die Einstellung der Crimphöhe einer gequetschten elektrischen Verbindung
DE69128818T2 (de) Verbindungsverfahren zwischen einer integrierten Schaltung und einem Schaltungsträger und an dieses Verfahren angepasste, integrierte Schaltung
DE69418420D1 (de) Verfahren zum Anlöten eines elektrischen Kabels an eine Schaltungsplatte
FI98899B (fi) Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
FI944108A (fi) Menetelmä EMC-suojakotelon kiinnittämiseksi piirilevyyn ja EMC-suojakotelo
DE69615043D1 (de) Filterverbinder mit verbinderrahmen für pcb
GB9417760D0 (en) Method and apparatus for connecting an electrical component to a housing
DE69500748T2 (de) Elektronischer Schaltkreis und Verfahren für die Verwendung mit einem Koprozessor
KR970700941A (ko) 집적 회로를 볼들에 의해 다른 기판에 접속하는 기판 및 그 방법
DE69527165T2 (de) Verfahren zur Herstellung einer vorübergehenden Kontaktierung zu einem integrierten Halbleiterschaltkreis
DE69328387D1 (de) Leiterplatte mit stützender Randverbinder-Einrichtung, Verfahren für deren Zusammenbau sowie Verbinder zu deren Aufnahme
DE69423288T2 (de) Verfahren zur Ankopplung einer Prüfanordnung an einen elektrischen Baustein
DE69119381D1 (de) Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu
FI91204C (fi) Menetelmä sähkölaitteen piirilevyjen kytkemiseksi toisiinsa sekä menetelmällä aikaansaatu kytkentä
GB2320965B (en) Method for testing electronic devices attached to a leadframe
GB2185813B (en) Testing solder joints in electronic assemblies
DE69124860T2 (de) Verfahren und Vorrichtung zum Anschliessen eines Verbinders an ein Kabel
DE69102122D1 (de) Verfahren für die Anbringung von Anschlussstücken auf einem Modulrahmen.
EP0482825A3 (en) Method and apparatus for attaching successive pairs of wires to a data connector having fine-pitch contacts
DE69526493D1 (de) Klemmvorrichtung zur befestigung eines elements an einem blechteil eines fahrzeugs, sowie herstellungsverfahren dafür
DE69123908T2 (de) Elektronisches Schaltungselement und Verfahren zu dessen Herstellung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee