EP1003216A3 - Keramik-Mehrlagenstruktur - Google Patents

Keramik-Mehrlagenstruktur Download PDF

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Publication number
EP1003216A3
EP1003216A3 EP99308018A EP99308018A EP1003216A3 EP 1003216 A3 EP1003216 A3 EP 1003216A3 EP 99308018 A EP99308018 A EP 99308018A EP 99308018 A EP99308018 A EP 99308018A EP 1003216 A3 EP1003216 A3 EP 1003216A3
Authority
EP
European Patent Office
Prior art keywords
dielectric constant
constant materials
high dielectric
low
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99308018A
Other languages
English (en)
French (fr)
Other versions
EP1003216A2 (de
Inventor
Phillip S. Fisher
Charles Ii Jordan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Publication of EP1003216A2 publication Critical patent/EP1003216A2/de
Publication of EP1003216A3 publication Critical patent/EP1003216A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
EP99308018A 1998-11-17 1999-10-12 Keramik-Mehrlagenstruktur Withdrawn EP1003216A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19365598A 1998-11-17 1998-11-17
US193655 1998-11-17

Publications (2)

Publication Number Publication Date
EP1003216A2 EP1003216A2 (de) 2000-05-24
EP1003216A3 true EP1003216A3 (de) 2001-10-17

Family

ID=22714487

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99308018A Withdrawn EP1003216A3 (de) 1998-11-17 1999-10-12 Keramik-Mehrlagenstruktur

Country Status (4)

Country Link
EP (1) EP1003216A3 (de)
JP (1) JP2000200732A (de)
KR (1) KR20000034924A (de)
TW (1) TW428300B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673537B1 (ko) * 1999-12-10 2007-01-24 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 및 그 제작방법
CN1257575C (zh) 2001-02-28 2006-05-24 诺基亚公司 使用多层基底中的埋入式电容器的耦接装置
CN1319208C (zh) 2001-03-02 2007-05-30 松下电器产业株式会社 介电滤波器、天线收发转换装置和使用滤波器的通讯装置
US20040099999A1 (en) 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
US6893710B2 (en) 2003-04-18 2005-05-17 Yageo Corporation Multilayer ceramic composition
EP1471041A1 (de) * 2003-04-22 2004-10-27 Yageo Corporation Vielschicht-Keramikszusammensetzung
KR101047713B1 (ko) * 2003-12-29 2011-07-08 엘지이노텍 주식회사 Ｌｔｃｃ 커패시터
US6908809B1 (en) * 2004-04-02 2005-06-21 Harris Corporation Embedded capacitors using conductor filled vias
US7548432B2 (en) * 2005-03-24 2009-06-16 Agency For Science, Technology And Research Embedded capacitor structure
WO2009131346A2 (ko) * 2008-04-21 2009-10-29 (주)탑엔지니어링 Ｍｅｍｓ 프로브 카드 및 그의 제조 방법
US20110169517A1 (en) * 2008-09-05 2011-07-14 Kim Sang-Hee Mems probe card and method of manufacturing same
CN103950886B (zh) * 2014-04-30 2015-12-09 中国科学院地质与地球物理研究所 一种mems传感器封装结构及其封装方法
CN111362227A (zh) * 2018-12-25 2020-07-03 无锡华润矽科微电子有限公司 Mems传感器封装结构
CN110323061A (zh) * 2019-07-10 2019-10-11 南方科技大学 具有多种烧制模式的三维模组
CN115483033A (zh) * 2022-09-02 2022-12-16 深圳聚源新材科技有限公司 电容器、电路板及电路板埋容工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4650923A (en) * 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
WO1994007347A1 (en) * 1992-09-24 1994-03-31 Hughes Aircraft Company Field control and stability enhancement in multilayer, 3-dimensional structures
EP0725438A2 (de) * 1995-02-02 1996-08-07 Shinko Electric Industries Co. Ltd. Substrat mit eingebauter Kapazität
US5590017A (en) * 1995-04-03 1996-12-31 Aluminum Company Of America Alumina multilayer wiring substrate provided with high dielectric material layer
US5757611A (en) * 1996-04-12 1998-05-26 Norhtrop Grumman Corporation Electronic package having buried passive components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4650923A (en) * 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
WO1994007347A1 (en) * 1992-09-24 1994-03-31 Hughes Aircraft Company Field control and stability enhancement in multilayer, 3-dimensional structures
EP0725438A2 (de) * 1995-02-02 1996-08-07 Shinko Electric Industries Co. Ltd. Substrat mit eingebauter Kapazität
US5590017A (en) * 1995-04-03 1996-12-31 Aluminum Company Of America Alumina multilayer wiring substrate provided with high dielectric material layer
US5757611A (en) * 1996-04-12 1998-05-26 Norhtrop Grumman Corporation Electronic package having buried passive components

Also Published As

Publication number Publication date
EP1003216A2 (de) 2000-05-24
TW428300B (en) 2001-04-01
KR20000034924A (ko) 2000-06-26
JP2000200732A (ja) 2000-07-18

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