EP1002594A2 - Method and device for forming a workpiece - Google Patents

Abstract

Process for deforming workpieces comprises using a local energy input to the workpiece (3) outside of the time prescribed for deforming a required workpiece in the deforming apparatus. An Independent claim is also included for an apparatus for carrying out the deforming process comprising a processing device (10) with local energy input arranged on a transporting device (5) for the workpiece (3).

Description

The invention relates to a method for forming Workpieces according to the preamble of claim 1 Art.

The invention further relates to a device to carry out the process according to the in the preamble of claims 12 and 13 defined art.

Such forming traverser and the associated forming devices are for example from EP 04 39 684 B1, EP 05 47 190 B1, DE 38 32 499 A1 and DE 39 05 069 A1 known.

As a rule, sheet metal sheets are used in these processes through the most diverse forming processes, such as e.g. Stamping, cutting or deep drawing, relatively large areas Workpieces made. To make such large workpieces are usually very large and thus used heavy forming tools, which to achieve a large number with a corresponding Number of strokes and the associated speed oscillate. The disadvantage here is that the high mass of these forming tools accelerates with every stroke and must be slowed down, which means a lot of energy is consumed. Another disadvantage is the big one Material and cost that is necessary to to manufacture the forming tools.

The very long development times pose an even bigger problem for the forming tools, which for example in the development of a motor vehicle a very large proportion of the total development time take in. Any changes to the forming tools disadvantageously lead to a high Expenditure.

Furthermore, the Workpieces from one forming stage to the next consumes a lot of time and it becomes unnecessarily high Costs.

It is therefore an object of the present invention Method and device for forming workpieces to create, which enable that by a reduced material and development effort an identical or better forming result can be like this with known forming processes and devices is possible. Furthermore, one should greatest possible degree of flexibility when converting can be achieved by switching to a other product as much as possible by reprogramming can be done.

According to the invention, this task is characterized by Features mentioned in claim 1 solved.

By machining the workpiece according to the invention with local energy input within the forming device outside of those intended for forming Time can otherwise bring a dead time with it Very beneficial step for editing of the workpieces are used. The flexibility of the entire forming process is increased in that the Machining contour can be programmed. Furthermore is advantageously a very low one Moving mass.

In the present context, local energy input means that the expansion of the energy-influenced Zone or the processing area without relative movement for machining the workpiece is small in comparison with the workpiece dimension.

Constructive solutions to the task result from the characterizing parts of claims 12 and 13.

By means of both ways of arranging the invention Machining facility on either Transport facility or directly inside the Forming device is an easy way to Given implementation of the method according to the invention. As a result, the Forming device can be dispensed with, which makes for the entire forming device saves considerable costs can result. In addition, the space requirement the forming device according to the invention reduced.

The general state of the art with regard to laser processing devices in machine tools to DE 34 10 913 A1, DE 41 28 194 C2 and EP 00 08 773 B1 referenced.

Advantageous refinements and training of Invention result from the dependent claims and from the principle shown below with reference to the drawing Embodiment.

Fig. 1

eine erste Ausführungsform einer Laserbearbeitung außerhalb der Umformung, wobei die Laser-Bearbeitungseinrichtung auf Zusatzachsen verfahrbar ist, die auf einer Transporteinrichtung für die Werkstücke angeordnet sind;

Fig. 2

eine zweite Ausführungsform einer Laserbearbeitung außerhalb der Umformung, mit einer Zwischenablage, wobei die Laser-Bearbeitungseinrichtung auf Zusatzachsen verfahrbar ist, die auf der Transporreinrichtung für die Werkstücke angeordnet sind;

Fig. 3

eine dritte Ausführungsform einer Laserbearbeitung außerhalb der Umformung, mit einer Zwischenablage, wobei die Laser-Bearbeitungseinrichtung auf Zusatzachsen verfahrbar ist, die auf der Transporteinrichtung für die Werkstücke angeordnet sind;

Fig. 4

eine vierte Ausführungsform einer Laserbearbeitung außerhalb der Umformung, wobei die Laser-Bearbeitungseinrichtung auf einer gemeinsamen Führung mit der Transporteinrichtung für die Werkstücke angeordnet ist, und wobei die Bearbeitung auf einer für den Transport erforderlichen Zwischenablage erfolgt;

Fig. 5

eine fünfte Ausführungsform einer Laserbearbeitung außerhalb der Umformung, wobei die Laser-Bearbeitungseinrichtung auf einer Handhabungseinrichtung angeordnet ist, die ortsfest in der Umformvorrichtung sich befindet;

Fig. 6

eine sechste Ausführungsform einer Laserbearbeitung ebener Platinen außerhalb der Umformung, wobei die Laser-Bearbeitungseinrichtung fest in der Umformvorrichtung angeordnet ist; und

Fig. 7

eine Draufsicht auf die Laser-Bearbeitungseinrichtung aus Fig. 6 gemäß dem Pfeil VII.

It shows:

Fig. 1

a first embodiment of a laser processing outside the forming, the laser processing device being movable on additional axes which are arranged on a transport device for the workpieces;

Fig. 2

a second embodiment of laser processing outside the forming, with an intermediate storage, the laser processing device being movable on additional axes which are arranged on the transport device for the workpieces;

Fig. 3

a third embodiment of a laser processing outside the forming, with an intermediate storage, the laser processing device being movable on additional axes which are arranged on the transport device for the workpieces;

Fig. 4

a fourth embodiment of a laser processing outside the forming, the laser processing device being arranged on a common guide with the transport device for the workpieces, and the processing being carried out on a clipboard required for the transport;

Fig. 5

a fifth embodiment of a laser processing outside the forming, wherein the laser processing device is arranged on a handling device which is stationary in the forming device;

Fig. 6

a sixth embodiment of a laser processing of flat boards outside the forming, the laser processing device being arranged fixedly in the forming device; and

Fig. 7

a plan view of the laser processing device of FIG. 6 according to arrow VII.

1 shows part of a forming device 1, which is composed of several forming stages 2 and thus also as a multi-stage forming system or as Transfer press can be called.

A" gekennzeichnet. In der Umformvorrichtung 1 werden in an sich bekannter Weise mittels verschiedener Umformverfahren, wie Stanzen, Tiefziehen oder Biegen in den entsprechenden Umformstufen 2 die Werkstücke 3 bearbeitet. Von den Umformstufen 2 sind zusätzlich im oberen Bereich derselben sich befindliche Werkzeugoberteile 2a dargestellt.A workpiece 3 is located on a first depositing element 4 assigned to the first forming step 2 and is brought to a second depositing element 4 'assigned to the second forming step 2' by means of a transfer or transport device 5. The direction of transport of the workpieces 3 within the forming device 1 is shown in the figures

A ". In the forming device 1, the workpieces 3 are machined in a manner known per se by means of various forming methods, such as stamping, deep drawing or bending, in the corresponding forming stages 2. The upper tool parts 2a are also shown in the upper region thereof.

The transport device 5 for transporting the workpieces 3 can, for example, as a system of several handling robots or as a programmable two or also Three-axis system. The following will but not closer to the transport device 5, which also from the drive, not shown Forming device 1 can be driven.

2 is between the first Storage element 4 and the second storage element 4 ' a clipboard 6 known per se is provided. The Workpiece 3 is here the before second storage element 4 'placed on the clipboard 6. The clipboard 6 can be the workpiece 3 for processing in the second forming stage 2 ' reorient and can therefore also serve as an orientation facility be designated. Furthermore, the serves Clipboard 6, the distance between the forming stages 2 and 2 'to bridge the transit times for the workpiece 3 to decrease. The clipboard 6 is therefore also part of the transport device 5.

The transport device 5 has a guide element one running in the transport direction of the workpieces 3 Walking beam or a rail 7 and on the rail 7 moving suction bridges 8, which in known Way driven and thus on the rail 7th can be movable. At the suction bridges 8 are so-called suction spiders 9 attached, which serve the workpieces 3 by means of vacuum suction cups, by means of clamping elements or also by means of magnetic force to hold on and from the first forming stage 2 if necessary via the clipboard 6 to the second forming stage 2 'to implement.

There is a processing device on at least one of the suction bridges 8 10 for local energy input in the workpieces 3 attached, which is used to thus the workpieces 3 outside of that time edit in which this in one of the forming stages 2 or 2 'are processed. The machining facilities 10 can be used as laser, water, plasma, or Sandblasting processing devices 10 or as Processing devices 10 for introducing electromagnetic Energy, e.g. via induction or via line, be trained. All of the following described processing devices 10 are the For simplicity of description, as a laser beam or Laser processing devices 10 are formed.

For this purpose, the suction spiders are on the top 9 opposite side of the suction bridges 8 each beam-shaped guide elements 11 attached to which via two handling devices 12 two as Laser heads designed processing elements 13 arranged are. The handling devices 12 can doing so in a linear manner transverse to the direction of transport Move workpieces 3 on the guide elements 11 be, so that a kind of cross slide is created, the the lifting, rotating and swiveling around two or more axes Laser heads 12 carries. So the whole can be twofold curved surface of the workpieces 3 with the laser heads 13 can be painted over. The guide elements 11 can also in a manner not shown across the direction of transport opposite the suction bridges 8 can be moved. Possibilities of moving the Machining elements 13 by the handling device 12 are represented by arrows.

The two trained in the form of swivel arm robots Handling devices 12 can be independent move from each other in all three spatial directions and pivoted to the laser heads 13 in each to be able to align the desired position to the workpiece 3 and through a corresponding relative movement the workpiece 3 also three-dimensionally shaped workpieces 3 to be able to edit. This relative movement can also, as will be explained later, by a Movement of the workpiece 3 relative to the processing element 13 can be achieved.

Instead of the laser processing devices 10 could also water, plasma or sandblasting processing equipment be provided, for what then instead of the laser heads 13 corresponding processing tools or -Elements for processing the workpieces 3 with water, Plasma or sandblasting would be necessary. Moreover would also be processing elements 13 for insertion electromagnetic energy, e.g. via induction or Management, possible. The processing elements 13 serve generally to introduce energy locally into the workpieces 3.

Thus, in the laser processing device 10 described here, the laser heads 13 are provided for processing the workpiece 3, specifically in the form of cutting, welding, application, removal or heat processing. The corresponding type of laser head 13 can be used for each of the machining processes mentioned. This can be, for example, an Nd-YAK laser or a CO ₂ laser. The laser heads 13 are connected to a stationary beam source, which is not shown here. The beam source transmits the energy to the laser heads 13 via light guides or mirror systems, also not shown.

The laser heads move to machine the workpieces 3 13 below the suction spider 9 along the Workpiece 3, for example in this embodiment when cutting through the laser heads 13 the Section from one laser head 13 to the next laser head 13 is passed when the movement through a part, e.g. the suction bridges 8 or the suction spiders 9 is hindered. When programming the Movement movement of the laser heads 13 only needs to be on it be made sure that by machining the workpiece 3 no other part of the forming device 1 can be damaged.

This machining of the workpieces 3 by the laser heads 13 becomes during the transport step of the workpieces 3 by the transport device 5 from the first Storage element 4 to the second storage element 4 ' carried out. Also the removal from the second Storage element 4 'to a further forming stage 2 happens with a suction bridge 8, which is a laser processing device 10 and thus has a appropriate processing enables. An editing of the workpiece 3 is also possible if this still or already on one of the storage elements 4 or 4 ' or possibly 4 ''. Generally speaking is a machining of a specific workpiece 3 outside of that for forming this workpiece 3 scheduled time possible, or with others Words whenever it is the respective tool head 2a allows the processing element 13th machining the workpiece 3. Of course can another workpiece 3 in one other timform level 2 are processed reshaping, while on the workpiece 3 referred to above was taken by means of the processing element 13 processing is carried out. This is because Phase shift between the individual forming stages 2 or 2 'of the forming device 1, which in general is known and therefore not dealt with here should.

In this context, the movement of the clipboard 6 for the machining process with the laser machining device 10 exploited and thus higher processing speeds can be achieved. Processing with the processing device is general 10 by a relative movement between the Suction bridge 8 and one of the storage elements 4 or 4 ' or the clipboard 6 possible.

3 shows a simplified embodiment of the laser processing device 10, in which case only a laser head 13, which has the same function like the laser heads 13 described above, directly attached to the suction bridge 8 or the suction spider 9 and movable in the longitudinal direction of the suction bridge 8 is. Because there is no separate handling device 12 is provided, the laser head 13 itself pivotable on the suction spider 9 or the suction bridge 8 attached and can therefore also be edited of the workpieces 3, i.e. along lines across to the direction of transport while the workpiece 3 on the Suction bridge 8 hangs and along lines with components in the transport direction while the workpiece 3 is deposited is.

4, the laser processing device 10 two separate and independently operable Carriage 14, which on the same rail 7th how the suction bridges 8 stored and in the same way and are movable. This allows during the transport step of one of the workpieces 3, which as stated above by means of the on the transport device 5 attached suction cups 8 performed is, another on the storage element 4 or 4 'or the clipboard 6 arranged workpiece 3 as above described with the Laserktofen 13 or the laser head 13 of the laser processing device 10. The laser head 13 is for this purpose with the respective carriage 14 connected via an adjusting element 15, which is able to move the laser head 13 transversely to the transport direction and move in the vertical direction. This movement is indicated by arrows. Here too is again the relative movement between the processing element 13 and the workpiece 3 crucial for processing the same.

The laser head 13 on the laser processing device 10 can in addition to its movability over the carriage 14 and the Verstellelernent 15 also in all Spatial directions are moved and pivoted like this 1 and 2 is the case. Of course is also the arrangement of two or more laser heads 13 possible on the slide 14. Editing the Workpiece 3 can also be done while the workpiece 3 is still fixed on the suction bridge 8 and is moved with it. General is also here as in all other cases, an edit outside of that for reshaping the corresponding Workpiece 3 provided or necessary time possible.

5 is the laser head 13 on a directly in the forming device 1 located and from the transport device 5 independent handling device 12, for example a swivel arm robot. The laser processing device 10 in this embodiment thus from the handling device 12 and the laser head 13 formed. The laser processing device 10 can during the transport step of the workpieces 3 through the transport device 5 from the first storage element 4 to the second storage element 6 the workpiece 3 edit by means of the laser head 13. Here can both the laser head 13 by means of the swivel arm robot 12 compared to the workpiece 3 in all three Spatial directions are moved as well as the laser head 13 stand still in the direction of transport and only the Transport movement of the workpiece 3 and the resultant Relative movement between the workpiece 3 and the processing element 13 for processing the same be exploited. A processing of any shape Workpieces 3 are thus possible, e.g. not shown Drilled holes in the workpiece 3 in this way can be that this before a subsequent Forming out of round, but exact after forming can be round.

In general, the forming device 1 works with one certain cycle to produce the workpieces 3 and evaluate or output from the last forming stage 2. The cycle of machining the workpieces 3 is a regular sequence of processing operations. This cycle relates to the entire forming device 1, being between the individual forming stages 2 or the processing devices 10 as already A certain phase shift occurs as mentioned above. All of the processing facilities described above 10 can also in this cycle of the forming device 1 work and therefore completely without problems into the forming device 1 and into that carried out with it Integrate forming processes.

In Fig. 6 is formed as a flat board Workpiece 3 moves past laser heads 13, which only on a two-dimensionally operating handling device 12 are arranged. The handling device In the present case, 12 consists of a Crossbar 16 with the laser heads 13 and in the present Case designed as a lifting cylinder 17, which is used for the height adjustment of the crossbar 16 worries. The laser processing device 10 thus includes the laser heads 13 and the handling device 12 with the crossbar 16 and the lifting elements 17. Here, the laser heads 13 through Adjustment devices, not shown, transverse to Transport direction of the workpieces 3 are moved, such as this is represented by arrows. This enables during the transport step through the transport device 5, which is also here for the movement the workpieces 3 ensures that laser processing is carried out. Such processing is particularly during inserting workpieces 3 or for other flat cuts make sense. The adjustment devices mentioned above for the laser heads 13, for example Be linear guides, making a quick Adjustment of the laser heads 13 would be ensured. Of course, instead of the lifting cylinder other lifting elements 17, e.g. an electric motor and an associated spindle, used to be a To enable height adjustment of the crossbar 16.

FIG. 6 is a top view of that shown in FIG. 5 Given laser processing device 10. Here, too, is the mobility of the laser heads 13 recognizable in the transverse direction of the transport direction. With very simple, straight cuts on the Workpieces 3 could also have such a transverse movement can be dispensed with and the laser heads 13 could be completely rigidly attached to the handling device 12 his. Particularly in the case of series processing a waiver of the lifting elements 17 is also conceivable, since the position of the laser heads 13 then completely the workpieces 3 could be designed. Besides that, can the crossbar 16 with the linear guide even then not be designed to be liftable when the laser heads 13 each individually on movable, not shown Lifting elements are arranged. To achieve different Cutting geometries in the workpieces 3 is only a corresponding programming one not Control unit of the forming device 1 shown necessary.

Claims (25)

Method for forming workpieces in a forming device which has at least one forming step, the workpieces being transported from or to the at least one forming step,
characterized in that
outside of the time provided for forming a specific workpiece (3), processing with local energy input is carried out on this workpiece (3) in the forming device (1). Method according to claim 1,
characterized in that
the processing of the workpiece (3) is a beam processing. Method according to claim 2,
characterized in that
the beam processing of the workpiece (3) is a laser beam processing or a plasma beam processing or a water jet processing or a sandblasting processing. Method according to claim 2 or 3,
characterized in that
the blasting of the workpiece (3) is welding or cutting or removal or order processing. Method according to claim 1,
characterized in that
the machining of the workpiece (3) is an introduction of electromagnetic energy into the workpiece (3). Method according to one of claims 1 to 5,
characterized in that
the forming device (1) works with a certain cycle, the machining of the workpiece (3) being carried out with local energy input in time with the machine. Method according to one of claims 1 to 6,
characterized in that
the machining of the workpiece (3) is carried out while it is being transported. Method according to one of claims 1 to 6,
characterized in that
the machining of the workpiece (3) is carried out while the workpiece is in the region of the forming step (2). A method according to claim 8,
characterized in that
the workpiece (3) is located on a support element (4,4 ') during processing in the area of the forming step (2). Method according to claim 7,
characterized in that
the workpiece (3) is located on a clipboard (6) during processing in the area of the forming step (2). A method according to claim 10,
characterized in that
to process the workpiece (3) the clipboard (6) is moved. Device for carrying out the method according to one of claims 1 to 11 with at least one processing device arranged inside the forming device for local energy input,
characterized in that
the at least one processing device (10) with local energy input is arranged on a transport device (5) for the workpieces (3). Device for carrying out the method according to one of claims 1 to 11 with at least one processing device arranged inside the forming device for local energy input,
characterized in that
the at least one processing device (10) with local energy input is arranged fixedly in the forming device (1). Device according to claim 12 or 13,
characterized in that
the processing device (10) is provided with at least one processing element (13). Device according to claim 12 or 14,
characterized in that
the transport device (5) has at least one rail (7) and at least one suction bridge (8) which is movably arranged on the rail (7) and to which the at least one processing device (10) is attached. Device according to claim 15,
characterized in that
the at least one processing element (13) is attached to the suction bridge (8) via a guide element (11). Device according to claim 16,
characterized in that
the at least one processing element (13) is attached to the guide element (11) via a handling device (12). Device according to claim 12 or 14,
characterized in that
the transport device (5) has at least one separate carriage (14) on which the at least one processing device (10) is attached. Device according to claim 18,
characterized in that
the machining element (13) is attached to the slide (14) via an adjusting element (15), the machining element (13) being movable across the adjusting device (15) transversely to the transport direction of the workpiece (3). Device according to claim 19,
characterized in that
the at least one processing element (13) is attached to a separate handling device (12) in the forming device. Device according to claim 17 or 20,
characterized in that
the handling device (15) is programmable. Device according to claim 20,
characterized in that
the handling device (12) has a crossbar (16) and at least one lifting element (17) provided for height adjustment of the crossbar (16). Device according to claim 22,
characterized in that
the at least one machining element (13) attached to the crossbar (16) can be moved at least approximately perpendicular to the direction of transport of the workpieces (3). Device according to claim 23,
characterized in that
the at least one machining element (13) attached to the crossbar (16) can be moved at least approximately perpendicular to the direction of transport of the workpieces (3) by means of a linear guide. Device according to one of claims 12 to 24,
characterized in that
the at least one processing element is designed as a laser head (13).

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