EP0999057A2 - Procédé de formation d'une couche à film épais pour micro-dispositif d'injection - Google Patents

Procédé de formation d'une couche à film épais pour micro-dispositif d'injection Download PDF

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Publication number
EP0999057A2
EP0999057A2 EP99308721A EP99308721A EP0999057A2 EP 0999057 A2 EP0999057 A2 EP 0999057A2 EP 99308721 A EP99308721 A EP 99308721A EP 99308721 A EP99308721 A EP 99308721A EP 0999057 A2 EP0999057 A2 EP 0999057A2
Authority
EP
European Patent Office
Prior art keywords
film layer
thick film
substrate
approximately
organic liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99308721A
Other languages
German (de)
English (en)
Other versions
EP0999057A3 (fr
Inventor
Boris Nikolaevich Dunaev
Byung-Sun Ahn
Andrey Aleksandrovich Zukov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP0999057A2 publication Critical patent/EP0999057A2/fr
Publication of EP0999057A3 publication Critical patent/EP0999057A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14032—Structure of the pressure chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating

Definitions

  • the present invention relates to the field of micro-injecting devices and inkjet printheads, and, more particularly, to a method for forming a thick film layer in the manufacture of a micro-injecting device.
  • a micro-injecting device refers to a device which is designed to provide printing paper, a human body or motor vehicles with a predetermined amount of liquid, for example, ink, injection liquid or petroleum using the method in which a predetermined amount of electric or thermal energy is applied to the above-mentioned liquid, yielding a volumetric transformation of the liquid. This method allows the application of a small quantity of liquid to a specific object.
  • micro-injecting devices are being widely used in daily life.
  • One example of the use of micro-injecting devices in daily life is the inkjet printer.
  • the inkjet printer is a form of micro-injecting device which differs from conventional dot printers in the capability of performing print jobs in various colors by using cartridges. Additional advantages of inkjet printers over dot printers are lower noise and enhanced quality of printing. For these reasons, inkjet printers are gaining enormous in popularity.
  • An inkjet printer generally includes a printhead in which ink which is initially in the liquid state is transformed to a bubble state by turning on or off an electric signal applied from an external device. Then, the ink so bubbled expands and is ejected so as to perform a print job on a printing paper.
  • a thick film layer which ultimately defines the chamber region is formed on a substrate that constitutes a printhead. Chemicals, for example, ink or working liquid, is stored or retained stably in the chamber region defined by the thick film layer.
  • the thick film layer has a thickness of 10 ⁇ m or more so that the chamber region has sufficient depth and internal volume, and the thick film layer is made of organic substances to achieve chemical stability of the layer in the presence of ink or working liquid.
  • a layer made of an organic substance and which has a predetermined thickness is produced by spin-coating, and subsequently dried and heat-treated.
  • a basic thin film layer is formed on a protection layer formed on a substrate.
  • numerous further thin film layers are continuously formed on the basic thin film layer by repeatedly performing the above-described process for forming a thin film layer.
  • the process for forming a thin film layer having a thickness of 1 ⁇ m is performed ten times. This of course requires the process of drying and heat-treatment to be performed in each repeated process for forming a thin film layer.
  • the conventional thick film layer can be formed by depositing a plurality of thin film layers through a repeated process for forming a thin film layer.
  • the thin film layers that constitute a thick film layer each form a definite dividing line at the boundary surface with the next respective layer.
  • the resulting thick film layer includes discontinuities arising from the boundaries between its constituent thin film layers. The dividing lines are maintained through the assembly of the thick film layer into a certain structure of a printhead, which causes reduction of overall durability of the printhead.
  • a method for forming a thick film layer for use in a micro-injecting device comprising:
  • a particular feature of the method of the invention is that the combined thick film layer can be made substantially free from discontinuities.
  • a protective film is formed on the substrate prior to the first deposition step.
  • a second aspect of the present invention provides a thick film layer for a micro-injecting device obtainable by the method of the first aspect of the invention.
  • a third aspect of the present invention provides a print head for an ink jet printer including a thick film layer according to the second aspect of the invention
  • a print head for an ink jet printer comprising a substrate, a nozzle plate and a thick film layer disposed between the substrate and the nozzle plate and defining chambers for the printing ink, wherein the thick film layer has substantially no discontinuities in a direction from the substrate to the nozzle plate.
  • an organic substance for example, a liquid comprising a polyimide
  • a substrate on which a protection film has been formed while spinning the substrate at high rotation rate, for example, 450 rpm to 550 rpm.
  • a thin film layer having a thickness of approximately 0.5 ⁇ m to 5 ⁇ m is formed on the protection film.
  • an organic substance is deposited again on the thin film layer so formed, while spinning the substrate on which the thin film layer is formed at a low rotation rate, for example, 20 rpm to 40 rpm.
  • a thick film layer having a thickness of approximately 18 ⁇ m to 22 ⁇ m is formed on the protection film.
  • the thin film layer and thick film layer on the substrate are simultaneously heat-treated, thus forming a single, combined, thick film layer without the discontinuities of the prior art.
  • the single thick film layer is formed by sequential coating processes without any interference from heat-treatments, thereby eliminating dividing lines. As a result, the overall durability of thick film layer can be significantly enhanced.
  • a liquid comprising an organic substance preferably, a solution comprising polyimide
  • a deposition means 100 is deposited in a first step, using a deposition means 100, on a silicon-substrate 1 on which a protection film 2 made of SiO 2 has been formed, while spinning, the substrate 1 as shown by arrow 110, by means of driving a spinning stage (not shown). Spinning may be in the direction of arrow 110 or in the opposite direction.
  • a first organic liquid layer 31' is formed on the protection film 2 of the substrate 1.
  • the viscosity coefficient of polyimide liquid is approximately 1.03 centipoise.
  • the substrate 1 spins in the first step at a high rotation rate, preferably in the range of approximately 450 rpm to 550 rpm, for a time period in the range of approximately 35 seconds to 45 seconds. If the substrate 1 spins at a high rotation rate as described above, the polyimide liquid deposited on the substrate 1 by the deposition means 100 spreads all over the substrate 1 by centrifugal force.
  • the first organic liquid layer 31' has a thickness preferably in the range of approximately 0.5 ⁇ m to 5 ⁇ m, and more preferably in the range of 1 ⁇ m to 2 ⁇ m.
  • a liquid comprising an organic substance is deposited on the first organic liquid layer 31' by the deposition means 100, while spinning the substrate 1 by driving the spinning stage.
  • a second organic liquid layer 32' is formed on the first organic liquid layer 31'.
  • the liquid comprising an organic substance is preferably deposited in an amount in the range of approximately 0.6cm 3 to 0.8cm 3 for a specific size of substrate, and has a viscosity coefficient of approximately 1.03 centipoise.
  • the substrate 1 spins at a low rotation rate, preferably in the range of approximately 20 rpm to 40 rpm, for a time period in the range of approximately 30 to 40 seconds.
  • a low rotation rate preferably in the range of approximately 20 rpm to 40 rpm, for a time period in the range of approximately 30 to 40 seconds.
  • the polyimide liquid deposited on the first organic liquid layer 31' by the deposition means 100 spreads all over the first organic liquid layer 31' by centrifugal force.
  • a regular wave is generated in the polyimide liquid by a viscosity of the liquid.
  • the second organic liquid layer 32' having uniform thickness is formed on the first organic liquid layer 31'.
  • the second organic liquid layer 32' has a thickness preferably in the range of 18 ⁇ m to 22 ⁇ m.
  • the amount of the second deposition of organic liquid and the rotation rate in the second spinning of the substrate can be correctly calculated by the following equation (1).
  • various experimental values can be assigned to the above equation (1), being based on the thickness of the second organic liquid layer 32' to be finally formed, and so the amount of second deposition of organic liquid and the speed of second spinning of the substrate can be obtained.
  • various experimental values which can be selected as values for the amount of the second deposition of the organic liquid and for the rotation rate of the second spinning of the substrate, can be assigned to the equation (1), being based on the thickness of the second organic liquid layer 32', preferably 18 ⁇ m to 22 ⁇ m. That is, values of the rotation rate and the volume of deposition can be determined based on the desired thickness of the second organic liquid layer.
  • the amount of second deposition of the organic liquid, 0.6cm 3 and 0.8cm 3 , and the rotation rate of the second spinning of the substrate, 20 rpm to 40 rpm can be obtained.
  • the first organic liquid layer 31' as a thin film layer and the second organic liquid layer 32' as a thick film layer are deposited in turn on the substrate 1 on which the protection film 2 is formed, thereby forming a single, combined, organic liquid layer 30' (see figure 1B).
  • the substrate 1 on which the single organic liquid layer 30's is formed is taken out from the spinning stage, and is taken into a heating tank or oven (not shown). Then, the first and second organic liquid layers 31' and 32' which constitute the single organic liquid layer 30' are dried and heat-treated.
  • the drying is performed at a temperature in the range of approximately 80°C to 90°C for a time in the range of approximately 25 minutes to 35 minutes, and the heat-treatment is performed preferably in two stages at temperatures in the range of approximately 200°C to 220°C and 300°C to 330°C, and for times in the range of 25 to 35 minutes and 60 to 70 minutes, respectively.
  • the first and second organic liquid layers 31' and 32' are hardened and transformed respectively into a first organic film layer 31 as a thin film layer and a second organic film layer 32 as a thick film layer, to thereby form a single, combined, thick film layer 30.
  • the first and second organic liquid layers 31' and 32' are sequentially formed without performing additional heat-treatment, and each is hardened by a heat-treatment at the same time.
  • the single thick film layer 30 in which the first organic film layer 31 as a thin film layer and the second organic film layer 32 as a thick film layer are sequentially deposited can be obtained.
  • a dividing line between the first and second organic film layers 31 and 32 can be prevented.
  • the durability of an inkjet printhead is not lowered even when the single thick film layer 30 is assembled into the inkjet printhead.
  • drying and heat-treatment are performed only once so as to form the single thick film layer 30.
  • the time required for completion of the manufacturing process can be significantly reduced.
  • the time period of the process for forming a film can be reduced.
  • the problem of impurities introduced to the process can be rectified and a single thick film layer which has been completed can have uniform thickness.
  • the overall performance of an inkjet printhead can be significantly improved.
  • a pattern film (not shown) is formed on the second organic film layer 32 and the first and second organic film layers 31 and 32 are etched using the pattern film as a mask so that the protection film 2 can be exposed. Subsequently, the residual pattern film is removed by chemicals, to thereby complete the single thick film layer 30 which defines a chamber region 33.
  • the single thick film layer 30 is detached from the substrate 1 using chemicals, for example, hydrogen fluoride, as shown in FIG. 1D. Then, the single thick film layer 30 is formally assembled in the relevant position in an inkjet printhead.
  • the single thick film layer 30 of the present invention is assembled with a nozzle plate 8 which defines nozzles 10.
  • An ink feed channel 200 for defining an ink feed path is formed adjacent to the chamber region 33, and the ink fed from an external device flows along the ink feed channel 200 to thereby fill the chamber region 33.
  • a plurality of nozzles 10 for injecting an ink are formed at the nozzle plate 8. Such nozzles 10 perforate through the nozzle plate 8 and thus are exposed towards the external surface.
  • An inkjet printhead which employs a single thick film layer of the present invention operates as follows. As shown in FIG. 3, if an electric signal is applied from an external power supply to an electrode layer (not shown), a heater 11 that contacts the electrode layer is energized by the electric energy and rapidly heated to a high temperature, 500°C or higher. During such a process, the electric energy is converted to a thermal energy of approximately 500°C to 550°C. Then, the thermal energy is transmitted to the chamber region 33 that contacts the heater 11, and an ink 300 that fills the chamber region 33 is rapidly heated and caused to bubble by the transmitted thermal energy.
  • the bubbled ink 300 is rapidly transformed in volume and expanded.
  • the ink 300 is expelled from the chamber region 33 via the nozzle 10 of the nozzle plate 8 and is about to be discharged.
  • the ink 300 is then transformed into oval and circular shapes in turn due to its own weight and discharged onto external printing paper.
  • the single thick film layer 30 of the present invention consists of the first and second organic film layers 31 and 32 which are sequentially formed without additional heat-treatment, a dividing line is eliminated, thereby improving the durability of the inkjet printhead.
  • an inkjet printhead repeats the above-described process via an electric signal, to thereby perform a print job onto printing paper fed by an external device.
  • a first organic film layer as a thin film layer and a second organic film layer as a thick film layer are sequentially deposited without an additional heat-treatment so as to thereby form a single thick film layer.
  • a dividing line can be eliminated and impurities are prevented from being introduced during the process can be obtained.
  • the present invention is applicable not only to an inkjet printhead but also to any micro-injecting device which is used as a micro-pump of medical appliances or fuel-injecting device, etc.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Formation Of Insulating Films (AREA)
EP99308721A 1998-11-03 1999-11-03 Procédé de formation d'une couche à film épais pour micro-dispositif d'injection Withdrawn EP0999057A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU98119888 1998-11-03
RU98119888A RU2144472C1 (ru) 1998-11-03 1998-11-03 Способ образования толстопленочного слоя в микроинжекционном устройстве

Publications (2)

Publication Number Publication Date
EP0999057A2 true EP0999057A2 (fr) 2000-05-10
EP0999057A3 EP0999057A3 (fr) 2000-11-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP99308721A Withdrawn EP0999057A3 (fr) 1998-11-03 1999-11-03 Procédé de formation d'une couche à film épais pour micro-dispositif d'injection

Country Status (5)

Country Link
EP (1) EP0999057A3 (fr)
JP (1) JP2000141670A (fr)
KR (1) KR20000034821A (fr)
CN (1) CN1253042A (fr)
RU (1) RU2144472C1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170083504A (ko) * 2016-01-08 2017-07-18 캐논 가부시끼가이샤 액체 토출 헤드 및 액체 토출 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283593A (ja) * 2008-05-21 2009-12-03 Seiko Epson Corp 半導体装置の製造方法
RU2692373C1 (ru) * 2018-08-03 2019-06-24 Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы") Способ получения диэлектрического слоя на основе полимерного покрытия в изделиях микроэлектроники

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490728A (en) 1981-08-14 1984-12-25 Hewlett-Packard Company Thermal ink jet printer
US4809428A (en) 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same
US5140345A (en) 1989-03-01 1992-08-18 Canon Kabushiki Kaisha Method of manufacturing a substrate for a liquid jet recording head and substrate manufactured by the method
US5274400A (en) 1992-04-28 1993-12-28 Hewlett-Packard Company Ink path geometry for high temperature operation of ink-jet printheads
US5420627A (en) 1992-04-02 1995-05-30 Hewlett-Packard Company Inkjet printhead

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053675B2 (ja) * 1978-09-20 1985-11-27 富士写真フイルム株式会社 スピンコ−テイング方法
US5682187A (en) * 1988-10-31 1997-10-28 Canon Kabushiki Kaisha Method for manufacturing an ink jet head having a treated surface, ink jet head made thereby, and ink jet apparatus having such head
US5450108A (en) * 1993-09-27 1995-09-12 Xerox Corporation Ink jet printhead which avoids effects of unwanted formations developed during fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490728A (en) 1981-08-14 1984-12-25 Hewlett-Packard Company Thermal ink jet printer
US4809428A (en) 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same
US5140345A (en) 1989-03-01 1992-08-18 Canon Kabushiki Kaisha Method of manufacturing a substrate for a liquid jet recording head and substrate manufactured by the method
US5420627A (en) 1992-04-02 1995-05-30 Hewlett-Packard Company Inkjet printhead
US5274400A (en) 1992-04-28 1993-12-28 Hewlett-Packard Company Ink path geometry for high temperature operation of ink-jet printheads

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170083504A (ko) * 2016-01-08 2017-07-18 캐논 가부시끼가이샤 액체 토출 헤드 및 액체 토출 장치

Also Published As

Publication number Publication date
CN1253042A (zh) 2000-05-17
EP0999057A3 (fr) 2000-11-29
RU2144472C1 (ru) 2000-01-20
JP2000141670A (ja) 2000-05-23
KR20000034821A (ko) 2000-06-26

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