EP0993073A1 - Panel of active antennas with multilayer structure - Google Patents
Panel of active antennas with multilayer structure Download PDFInfo
- Publication number
- EP0993073A1 EP0993073A1 EP99402322A EP99402322A EP0993073A1 EP 0993073 A1 EP0993073 A1 EP 0993073A1 EP 99402322 A EP99402322 A EP 99402322A EP 99402322 A EP99402322 A EP 99402322A EP 0993073 A1 EP0993073 A1 EP 0993073A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- connection
- layers
- radiating elements
- distributor
- connection means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/22—Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
- H01Q3/40—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with phasing matrix
Definitions
- the invention relates to an active antenna panel with a multilayer structure.
- It aims in particular but not limited to antenna systems active for satellite intended to manage one or more beams by a single panel of radiating elements, via a beam distributor with structure multilayer.
- these distributors are built on a horizontal stacking model layers (parallel to the plane of the antenna, which creates significant constraints on the performance (generally narrow band) and the size of the interconnection with the radiating elements, then arranged perpendicularly to the dispatcher.
- the invention therefore aims to overcome the drawbacks mentioned above.
- the invention provides an active antenna panel having a main plane and comprising a network of n radiating elements and a distributor m bundles with a multilayer structure intended to supply the n elements radiant, the distributor comprising first so-called formation layers intended to support means for forming beams, and second so-called connection layers intended to support first means of electrical connection of the first layers to each other and of the second means of electrical connection to the radiating elements.
- This vertical multilayer topology in molded technology allows the reuse of the coplanar three-dimensional RF interconnection by one of the connection layers, the only known transition technique today high-performance, broadband three-dimensional. It allows you to target a wide panel of applications without variation of concepts or technologies.
- the monoblock is a plane parallelepiped, the connection layers extending substantially parallel to the plane of the antenna and comprising a front connection layer comprising the second means of connection and a rear connection layer comprising the first means of connection, the radiating elements being attached directly to said layer front connection.
- the three-dimensional RF interconnection routing then becomes simplistic and easier to optimize.
- the same surface is available as in multilayer horizontal for signal routing;
- Figure 1a is a schematic perspective representation of a active antenna panel according to the invention in which the radiating elements do not are not reported.
- Figure 1b is a schematic perspective representation of the panel active antenna of Figure 1a in which the radiating elements are attached.
- Figure 2a is an exploded and more detailed schematic representation of the active antenna panel of Figures 1a and 1b.
- Figure 2b is a schematic representation of the panel in Figure 2a after molding the different layers.
- Figures 3a, b and c are schematic representations of the different layers for forming an active antenna panel according to the invention.
- Figure 4a and b are schematic representations of different modes for making the connection layers of an active antenna panel according to the invention.
- FIG. 5 is an electrical diagram of the various functions implemented in the beam splitter of an antenna panel according to the invention.
- the active antenna panel 1 comprises a network of radiating elements 2 and a beam splitter 3.
- the array of radiating elements 2 comprises 64 radiating elements 2i distributed over an 8 ⁇ 8 matrix. These elements 2i radiators are made in a three-dimensional technology known from the skilled person. It will therefore not be described in more detail.
- the beam splitter 3 is intended to supply the elements radiating 2i from m beams, m being an integer greater than or equal to 1. In the embodiment shown in FIG. 2a, m is equal to 6.
- connection means are supported by so-called second layers connection 8.
- the formation layers 6 and the connection layers 8 are assembled by molding so that the beam splitter constitutes a monoblock 9, the formation layers 6 extending substantially perpendicular to the main plane P of the antenna.
- the monoblock 9 is a planar parallelepiped with two large faces 10 and 11 whose area corresponds to that of the matrix of radiating elements 2i.
- connection layers 8 have a front connection layer 8a comprising the second connection means 7b and a rear connection layer 8b comprising the first connection means 7a, the radiating elements 2i being attached directly to said layer of front connection 8a.
- the various training means 5a, 5b, 5c are achievable using any technology accessible to the skilled person such as by example the multilayer microwave frequency PCB (Print Circuit Board) technology.
- PCB Print Circuit Board
- connection circuits 7a and 7b It is the same for the connection circuits 7a and 7b.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Steroid Compounds (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
Abstract
Description
L'invention concerne un panneau d'antenne active à structure multicouches.The invention relates to an active antenna panel with a multilayer structure.
Elle vise notamment mais de manière non limitative les systèmes d'antenne active pour satellite destinés à gérer un ou plusieurs faisceaux par un seul panneau d'éléments rayonnant, par l'intermédiaire d'un répartiteur de faisceaux à structure multicouches.It aims in particular but not limited to antenna systems active for satellite intended to manage one or more beams by a single panel of radiating elements, via a beam distributor with structure multilayer.
Ces systèmes d'antenne active pour satellite requièrent des complexités de plus en plus croissantes en terme notamment de nombre de faisceaux (m) gérés par le seul panneau rayonnant (n éléments rayonnants). La complexité et les missions du répartiteur de faisceau s'en trouvent alors accrues, puisqu'il faut dès lors assurer d'une part la division de puissance m x 1 vers m x n, et d'autre part la recombinaison m x n vers 1 x n :
- le routage devient alors plus dense et donc plus difficile, notamment pour assurer des chemins électriques identiques à tous les signaux; les pertes augmentant inévitablement ;
- la présence de plusieurs faisceaux oblige à gérer la loi (amplitude; phase) d'illumination de chaque pinceau au sein-même du répartiteur, entre les fonctions de division et de recombinaison, l'intégration de puces (atténuateur; déphaseur) dans le répartiteur s'avérant alors nécessaire.
- routing then becomes denser and therefore more difficult, in particular to ensure electrical paths identical to all the signals; losses inevitably increase;
- the presence of several beams makes it necessary to manage the law (amplitude; phase) of illumination of each brush within the distributor itself, between the division and recombination functions, the integration of chips (attenuator; phase shifter) in the distributor then proving necessary.
Enfin, l'inévitable montée en fréquence rend de plus en plus inapplicables les techniques et technologies traditionnellement employées pour mettre en oeuvre les répartiteurs d'antenne active.Finally, the inevitable increase in frequency makes it increasingly inapplicable the techniques and technologies traditionally used to implement active antenna splitters.
Actuellement, les technologies dites PCB (print circuit board) multicouches organique sont celles qui répondent le mieux au problème du répartiteur de faisceaux. Néanmoins, elles se montrent plus ou moins inadaptées dans certaines conditions telles que :
- dès que la fréquence d'utilisation dépasse 20 Ghz. Dans ce cas les techniques d'interconnexion multicouche RF utilisables dans cette technologie (trou métallisé notamment) sont limitées par l'état de l'art actuel ;
- pour l'intégration de puces à l'intérieur-même du répartiteur puisque le procédé de réalisation des multicouches PCB (laminage, pression, thermofusion) est généralement incompatible avec tout composant de relief que l'on souhaite insérer dans le multicouche. Cet inconvénient oblige à déporter les puces à l'extérieur du répartiteur.
- as soon as the frequency of use exceeds 20 Ghz. In this case, the multilayer RF interconnection techniques that can be used in this technology (metallized hole in particular) are limited by the current state of the art;
- for the integration of chips inside the distributor itself since the process for producing multilayer PCBs (laminating, pressure, thermofusion) is generally incompatible with any relief component which it is desired to insert into the multilayer. This drawback makes it necessary to deport the chips outside the distributor.
Enfin, ces répartiteurs sont construits sur un modèle d'empilement horizontal des couches (parallèlement au plan de l'antenne, qui crée d'importantes contraintes sur les performances (généralement bande étroite) et l'encombrement de l'interconnexion avec les éléments rayonnants, alors disposés perpendiculairement au répartiteur.Finally, these distributors are built on a horizontal stacking model layers (parallel to the plane of the antenna, which creates significant constraints on the performance (generally narrow band) and the size of the interconnection with the radiating elements, then arranged perpendicularly to the dispatcher.
En effet, cette interconnexion ne peut être réalisée qu'au niveau des tranches du circuit, ce qui constitue un inconvénient majeur pour un répartiteur "horizontal" : l'augmentation des pertes pour acheminer les signaux vers les tranches est rédhibitoire, et la densité de routage sur les tranches très peu spacieuses n'apporte aucun gain de simplicité par rapport à d'autres solutions.Indeed, this interconnection can only be achieved at the level of sections of the circuit, which is a major drawback for a dispatcher "horizontal": increased losses for routing signals to slices is unacceptable, and the density of routing on the slices very little spacious brings no gain in simplicity compared to other solutions.
L'invention vise donc à pallier les inconvénients précédemment mentionnés.The invention therefore aims to overcome the drawbacks mentioned above.
Elle a donc pour objet un panneau d'antenne active permettant sans difficultés l'intégration des puces au sein-même du répartiteur.It therefore relates to an active antenna panel allowing without difficulties integrating the chips within the distributor itself.
Elle a en outre pour objet un tel panneau dont l'encombrement en terme d'interconnexions et de circuits est réduit par rapport aux solutions de l'art antérieur.It further relates to such a panel whose size in terms interconnections and circuits is reduced compared to the solutions of the prior art.
A cet effet, l'invention propose un panneau d'antenne active présentant un plan principal et comportant un réseau de n éléments rayonnants et un répartiteur de m faisceaux à structure multicouches destiné à alimenter les n éléments rayonnants, le répartiteur comportant des premières couches dites de formation destinées à supporter des moyens de formation des faisceaux, et des deuxièmes couches dites de connexion destinées à supporter des premiers moyens de connexion électriques des premières couches entre elles et des seconds moyens de connexion électriques aux éléments rayonnants.To this end, the invention provides an active antenna panel having a main plane and comprising a network of n radiating elements and a distributor m bundles with a multilayer structure intended to supply the n elements radiant, the distributor comprising first so-called formation layers intended to support means for forming beams, and second so-called connection layers intended to support first means of electrical connection of the first layers to each other and of the second means of electrical connection to the radiating elements.
Selon l'invention :
- les couches de formation s'étendent sensiblement perpendiculairement au plan principal de l'antenne ;
- les couches de formation et les couches de connexion sont assemblées par moulage de telle sorte que le répartiteur de faisceaux constitue un monobloc. ;
- les éléments rayonnants sont connectés directement aux seconds moyens de connexion.
- the formation layers extend substantially perpendicular to the main plane of the antenna;
- the formation layers and the connection layers are assembled by molding in such a way that the beam distributor constitutes a single piece. ;
- the radiating elements are connected directly to the second connection means.
Cette topologie multicouche verticale en technologie moulée permet la réutilisation de l'interconnexion tridimensionnelle RF coplanaire par une des couches de connexion, seule technique aujourd'hui connue de transition tridimensionnelles performante et large bande. Elle permet ainsi de viser un large panel d'applications sans variation de concepts, ni de technologies.This vertical multilayer topology in molded technology allows the reuse of the coplanar three-dimensional RF interconnection by one of the connection layers, the only known transition technique today high-performance, broadband three-dimensional. It allows you to target a wide panel of applications without variation of concepts or technologies.
Selon un mode de réalisation le monobloc est un parallélépipède plan, les couches de connexion s'étendant sensiblement parallèlement au plan de l'antenne et comportant une couche de connexion avant comportant les second moyens de connexion et une couche de connexion arrière comportant les premiers moyens de connexion, les éléments rayonnant étant rapportés directement sur ladite couche de connexion avant.According to one embodiment, the monoblock is a plane parallelepiped, the connection layers extending substantially parallel to the plane of the antenna and comprising a front connection layer comprising the second means of connection and a rear connection layer comprising the first means of connection, the radiating elements being attached directly to said layer front connection.
Ainsi on déporte la zone d'interconnexion tridimensionnelle RF des tranches des solutions "horizontales" vers les couches de connexion avant et arrière du répartiteur, ces couches étant beaucoup plus spacieuses:Thus the RF three-dimensional interconnection zone is deported from the wafers "horizontal" solutions to the front and rear connection layers of the distributor, these layers being much more spacious:
Le routage d'interconnexion tridimensionnelle RF devient alors simpliste et plus facile à optimiser. En outre on dispose de la même surface qu'en multicouche horizontal pour effectuer l'acheminement des signaux;The three-dimensional RF interconnection routing then becomes simplistic and easier to optimize. In addition, the same surface is available as in multilayer horizontal for signal routing;
D'autres caractéristiques de l'invention sont explicitées dans la description qui suit d'un mode de réalisation donné uniquement à titre d'exemple, en référence aux figures annexées.Other characteristics of the invention are explained in the description which follows from an embodiment given solely by way of example, with reference to the appended figures.
La figure 1a est une représentation schématique en perspective d'un panneau d'antenne active selon l'invention dans lequel les éléments rayonnants ne sont pas rapportés.Figure 1a is a schematic perspective representation of a active antenna panel according to the invention in which the radiating elements do not are not reported.
La figure 1b est une représentation schématique en perspective du panneau d'antenne active de la figure 1a dans lequel les éléments rayonnants sont rapportés.Figure 1b is a schematic perspective representation of the panel active antenna of Figure 1a in which the radiating elements are attached.
La figure 2a est une représentation schématique éclatée et plus détaillée du panneau d'antenne active des figures 1a et 1b.Figure 2a is an exploded and more detailed schematic representation of the active antenna panel of Figures 1a and 1b.
La figure 2b est une représentation schématique du panneau de la figure 2a après moulage des différentes couches.Figure 2b is a schematic representation of the panel in Figure 2a after molding the different layers.
Les figure 3a, b et c sont des représentations schématiques des différentes couches de formation d'un panneau d'antenne active selon l'invention.Figures 3a, b and c are schematic representations of the different layers for forming an active antenna panel according to the invention.
La figure 4a et b sont des représentations schématiques de différents modes de réalisation des couches de connexion d'un panneau d'antenne active selon l'invention.Figure 4a and b are schematic representations of different modes for making the connection layers of an active antenna panel according to the invention.
La figure 5 est schéma électrique des différentes fonctions mises en oeuvre dans le répartiteur de faisceaux d'un panneau d'antenne selon l'invention. FIG. 5 is an electrical diagram of the various functions implemented in the beam splitter of an antenna panel according to the invention.
Le panneau 1 d'antenne active comporte un réseau d'éléments rayonnant 2
et un répartiteur de faisceaux 3.The
Dans l'exemple de réalisation représenté, le réseau d'éléments rayonnant 2
comporte 64 éléments rayonnant 2i répartis sur une matrice 8x8. Ces éléments
rayonnants 2i sont réalisés dans un technologie tridimensionnelle connue de
l'homme du métier. Elle ne sera donc pas décrite plus en détail.In the illustrated embodiment, the array of
Le répartiteur de faisceaux 3 est destiné à alimenter les éléments
rayonnants 2i à partir de m faisceaux, m étant un nombre entier supérieur ou égal
à 1. Dans l'exemple de réalisation représenté à la figure 2a, m est égal à 6.The
Pour alimenter les éléments rayonnants 2i, le répartiteur de faisceaux 3 met en oeuvre les fonctions suivantes :
- division de puissance des m sources de signal RF ( non représentées) ;
- traitement en phase et en amplitude de la puissance divisée de manière à générer, ou niveau des éléments rayonnants 2i, le dépointage souhaité ; et
- recombinaison après le traitement en phase et en amplitude de manière à alimenter les éléments rayonnants 2i pour obtenir ledit dépointage souhaité.
- power division of the m RF signal sources (not shown);
- treatment in phase and in amplitude of the divided power so as to generate, or level of the
radiating elements 2i, the desired depointing; and - recombination after the treatment in phase and in amplitude so as to supply the
radiating elements 2i to obtain said desired depointing.
Ces fonctions sont réalisées par l'intermédiaire de moyens de formation
comprenant des moyens de division de puissance 5a éventuellement à plusieurs
niveaux, des moyens de traitement en phase et en amplitude 5b et des moyens de
recombinaisons 5c, éventuellement à plusieurs niveaux. Ces moyens de formation
sont supportés par des premières couches dites de formation 6.These functions are carried out by means of training
comprising power division means 5a possibly with several
levels, means of treatment in phase and in
Le répartiteur 3 réalise en outre les fonctions de connexion électrique suivantes :
- connexion des moyens de division de
puissance 5a vers les sources de signaux RF ; - connexion des différents niveaux de division de puissance entre eux ;
- connexion des moyens de division de puissance 5a aux moyens de traitement 5b ;
- connexion des moyens de traitement 5b aux moyens de recombinaison 5c ;
- connexion des différents niveaux de recombinaison entre eux ; et
- connexion des moyens de recombinaison 5c aux éléments rayonnants 2i.
- connection of the power division means 5a to the sources of RF signals;
- connection of the different levels of power division between them;
- connection of the power division means 5a to the processing means 5b;
- connection of the processing means 5b to the recombination means 5c;
- connection of the different levels of recombination between them; and
- connection of the recombination means 5c to the
radiating elements 2i.
Ces fonctions de connexion sont réalisées par des moyens de connexion comportant :
- des premiers moyens de connexion 7a réalisant les connexions des moyens de division de puissance 5a vers les sources de signaux RF, les connexions des différents niveaux de division de puissance entre eux et les connexions des moyens de division de puissance 5a aux moyens de traitement 5b ; et
- des seconds moyens de connexions 7b réalisant les connexions des moyens de traitement 5b aux moyens de recombinaison 5c , les connexions des différents niveaux de recombinaison entre eux et les connexions des moyens de recombinaison 5c aux éléments rayonnants 2i.
- first connection means 7a making the connections of the power division means 5a to the RF signal sources, the connections of the different power division levels therebetween and the connections of the power division means 5a to the processing means 5b; and
- second connection means 7b making the connections of the processing means 5b to the recombination means 5c, the connections of the different recombination levels between them and the connections of the recombination means 5c to the
radiating elements 2i.
Ces moyens de connexion sont supportés par des deuxièmes couches dites de connexion 8.These connection means are supported by so-called second layers connection 8.
Selon l'invention, les couches de formation 6 et les couches de connexion 8 sont assemblées par moulage de telle sorte que le répartiteur de faisceaux constitue un monobloc 9, les couches de formation 6 s'étendant sensiblement perpendiculairement au plan principal P de l'antenne.According to the invention, the formation layers 6 and the connection layers 8 are assembled by molding so that the beam splitter constitutes a monoblock 9, the formation layers 6 extending substantially perpendicular to the main plane P of the antenna.
Dans le mode de réalisation représenté le monobloc 9 est un
parallélépipède plan présentant deux grandes faces 10 et 11 dont la superficie
correspond à celle de la matrice des éléments rayonnants 2i.In the embodiment shown, the monoblock 9 is a
planar parallelepiped with two
Dans cette configuration, les couches de connexion 8 comportent une
couche de connexion avant 8a comportant les second moyens de connexion 7b et
une couche de connexion arrière 8b comportant les premiers moyens de connexion
7a, les éléments rayonnant 2i étant rapportés directement sur ladite couche de
connexion avant 8a.In this configuration, the connection layers 8 have a
Bien entendu, les différents moyens de formation 5a, 5b, 5c sont réalisables à l'aide de toutes technologie accessibles à l'homme du métier telle que par exemple la technologie PCB (Print Circuit Board) multicouches hyperfréquence.Of course, the various training means 5a, 5b, 5c are achievable using any technology accessible to the skilled person such as by example the multilayer microwave frequency PCB (Print Circuit Board) technology.
Il en est de même pour les circuits de connexion 7a et 7b.It is the same for the
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9812457A FR2784237B1 (en) | 1998-10-05 | 1998-10-05 | ACTIVE ANTENNA PANEL WITH MULTI-LAYERED STRUCTURE |
FR9812457 | 1998-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0993073A1 true EP0993073A1 (en) | 2000-04-12 |
EP0993073B1 EP0993073B1 (en) | 2006-05-03 |
Family
ID=9531209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99402322A Expired - Lifetime EP0993073B1 (en) | 1998-10-05 | 1999-09-23 | Panel of active antennas with multilayer structure |
Country Status (7)
Country | Link |
---|---|
US (1) | US6188361B1 (en) |
EP (1) | EP0993073B1 (en) |
JP (1) | JP4185222B2 (en) |
AT (1) | ATE325442T1 (en) |
DE (1) | DE69931119T2 (en) |
ES (1) | ES2264248T3 (en) |
FR (1) | FR2784237B1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6509874B1 (en) * | 2001-07-13 | 2003-01-21 | Tyco Electronics Corporation | Reactive matching for waveguide-slot-microstrip transitions |
GB0204748D0 (en) * | 2002-02-28 | 2002-04-17 | Nokia Corp | Improved antenna |
US6943735B1 (en) * | 2004-02-20 | 2005-09-13 | Lockheed Martin Corporation | Antenna with layered ground plane |
GB0724684D0 (en) * | 2007-12-18 | 2009-01-07 | Bae Systems Plc | Anntenna Feed Module |
US8547278B2 (en) * | 2009-08-31 | 2013-10-01 | Electronics And Telecommunications Research Institute | Sensing device having multi beam antenna array |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0398555A2 (en) * | 1989-05-16 | 1990-11-22 | Hughes Aircraft Company | Lightweight, low profile phased array antenna with electromagnetically coupled integrated subarrays |
EP0620613A2 (en) * | 1993-04-15 | 1994-10-19 | Hughes Aircraft Company | Small manufacturable array lattice layers |
US5471220A (en) * | 1994-02-17 | 1995-11-28 | Itt Corporation | Integrated adaptive array antenna |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01157603A (en) * | 1987-12-15 | 1989-06-20 | Matsushita Electric Works Ltd | Plane antenna |
JPH0567912A (en) * | 1991-04-24 | 1993-03-19 | Matsushita Electric Works Ltd | Flat antenna |
-
1998
- 1998-10-05 FR FR9812457A patent/FR2784237B1/en not_active Expired - Fee Related
-
1999
- 1999-09-23 ES ES99402322T patent/ES2264248T3/en not_active Expired - Lifetime
- 1999-09-23 EP EP99402322A patent/EP0993073B1/en not_active Expired - Lifetime
- 1999-09-23 AT AT99402322T patent/ATE325442T1/en not_active IP Right Cessation
- 1999-09-23 DE DE69931119T patent/DE69931119T2/en not_active Expired - Lifetime
- 1999-10-04 JP JP28346899A patent/JP4185222B2/en not_active Expired - Fee Related
- 1999-10-04 US US09/411,229 patent/US6188361B1/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0398555A2 (en) * | 1989-05-16 | 1990-11-22 | Hughes Aircraft Company | Lightweight, low profile phased array antenna with electromagnetically coupled integrated subarrays |
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Also Published As
Publication number | Publication date |
---|---|
JP2000114867A (en) | 2000-04-21 |
US6188361B1 (en) | 2001-02-13 |
DE69931119D1 (en) | 2006-06-08 |
FR2784237A1 (en) | 2000-04-07 |
FR2784237B1 (en) | 2003-10-03 |
DE69931119T2 (en) | 2006-11-30 |
ATE325442T1 (en) | 2006-06-15 |
EP0993073B1 (en) | 2006-05-03 |
JP4185222B2 (en) | 2008-11-26 |
ES2264248T3 (en) | 2006-12-16 |
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