Classifications

• • C—CHEMISTRY; METALLURGY
  • C21—METALLURGY OF IRON
  • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
  • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
  • C21D1/62—Quenching devices
  • C21D1/673—Quenching devices for die quenching
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper

Definitions

• the invention relates to the use of certain Alloys for cooling press plates in devices for the Heat treatment of steel parts, especially for the Hardening.
• the invention also relates to devices for Heat treatment, especially for hardening steel parts by means of a roller oven, the roller conveyor up to the Cooling zone leads in which the steel parts between the Cooling press plates with the desired cooling characteristics can be cooled, including steel parts with a small thickness and large longitudinal dimensions can be cooled quickly.
• the cooling press plates have been made of steel been based solely on the consideration that the workpieces before heat treatment temperatures in the range of 1000 ° C have and that only steel materials for this area
• the mechanical and the thermal are available Can cope with requirements.
• the steel plates themselves are designed so that they have a cooling system can be cooled so that the hot workpieces heat taken over can be dissipated quickly.
• the inventor of the present invention first of all recognized that steel is not the appropriate material to get from a large amount of heat relatively quickly on the hot workpieces decrease and then this amount of heat over the Dissipate cooling devices so the cooling press plate so as quickly as possible for the next operation low temperature is available again.
• copper and Wrought copper alloys have been found for here intended use in all its properties are usable.
• You have a sufficiently large thermal Storage capacity, so that at first touch the cooling press plate with the hot workpiece a relative large amount of energy per area that can be absorbed is then discharged via the cooling device.
• the Alloys according to the invention also have the advantage that they have a much higher thermal conductivity than have the steel materials used so far. You leave edit themselves with reasonable effort, so that the Manufacture of the cooling channels can be handled easily. Finally, they have such a hardness or strength that even higher pressures during the cooling press process and in Cooling circuit can be managed.
• a particularly preferred cooling press plate according to the invention is characterized in that it is compared to the previous cooling press plates a much greater thickness has, in particular a thickness in the range of 20 mm.
• the Steel plates previously used could only handle up to one 8 mm thick.
• With a cooling press plate with 20 mm thickness can due to the heat storage capacity and the thermal conductivity can be achieved at the Surface of the cooling press plate only a temperature of approx. 200 ° C occurs, although the cooling press plate with a Workpiece comes into contact, for example a Temperature of 1000 ° C.
• those copper alloys have been selected that are classified according to DIN in the range with the material no. 2.1200 to 2.1300, i.e. about 2.1285 and 2.1247, namely those that have a Brinell hardness of about 250 in N / mm 2 up to Have temperatures of 500 ° C and thermal conductivities of 150 to 250 W / m ⁇ K at 20 ° C.
• This is the optimal range for the copper alloys according to the invention.
• a table with the corresponding values for ferritic steel and electrolytic copper are examples that are classified according to DIN in the range with the material no. 2.1200 to 2.1300, i.e. about 2.1285 and 2.1247, namely those that have a Brinell hardness of about 250 in N / mm 2 up to Have temperatures of 500 ° C and thermal conductivities of 150 to 250 W / m ⁇ K at 20 ° C.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Crystallography & Structural Chemistry (AREA)
• Heat Treatments In General, Especially Conveying And Cooling (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (2)

Cited By (1)

Citations (4)

Family Cites Families (1)

• 1998
  • 1998-09-03 DE DE1998140094 patent/DE19840094C2/de not_active Expired - Lifetime
• 1999
  • 1999-08-03 EP EP99115307A patent/EP0984071A1/fr not_active Withdrawn

Patent Citations (4)

Non-Patent Citations (2)

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