Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
  • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
  • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
  • H01F41/10—Connecting leads to windings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/29—Terminals; Tapping arrangements for signal inductances
  • H01F27/292—Surface mounted devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/29—Terminals; Tapping arrangements for signal inductances
  • H01F27/292—Surface mounted devices
  • H01F2027/295—Surface mounted devices with flexible terminals

Definitions

• the invention relates to a chip inductor with a wound coil core, which is arranged upright on pads that are part of a system carrier.
• Such a chip inductance is known from EP 0 212 812 AI.
• This design in which the board-side end face of the core and the connection parts lie in the system carrier plane, is characterized in that the influence of the metallic system carrier parts on the electromagnetic field produced by the coil is reduced.
• it is difficult to position the coil core and the electrical contact points on the leadframe connections with sufficient accuracy.
• the object of the present invention is therefore to further develop the chip inductance of the type mentioned in the introduction in such a way that better positioning accuracy of the coil core and electrical contacts on the connections is achieved without the electrical properties being impaired.
• connection surfaces have tabs with which the coil core is positioned and fixed and that of the electrical connections fertilization of winding and connections serve that the tabs and the coil core are within a space that exists between the end planes of the coil core, and that the remaining parts of the connections are arranged outside of this space.
• a coil core 1 with a winding 2 arranged thereon is shown.
• the coil body 1 stands with its board-side end face on connection faces 5, which are part of a system carrier 6 made of sheet metal.
• connection surfaces 5 Vertically standing tabs 7 are arranged on the connection surfaces 5, so that a space is formed which serves to position the coil core 1.
• the coil core 1 is fastened by means of adhesive connections between the end face of the coil body 1 on the circuit board side and the connection surfaces 5 on the one hand and between the tabs 7 and the core 1 on the other hand.
• the winding tension causes the connections 5 to bend due to their elasticity.
• the connections to reduce core dew accumulation must be prevented from moving as close as possible to core 1.
• the adjacent bobbins are connected to one another by the system carriers for automated production, with two winding support points per coil core on the system carriers.
• the winding wire portions between the guide plates and the winding support points are after winding to the terminals in the system support plane formed stemargn perpendicular to the sy ⁇ . Hold-down devices from both sides of the system carrier would be required, but the winding wire sections running over the connections and the winding support points would interfere. Furthermore, the known design requires a two-sided, mechanical cutting of the winding wire sections not required for the application.
• the automated production also takes place with the system carriers 6, on which, however, there is only one winding support point 8 per coil core 1.
• the winding wire sections 9 between the tabs 7 and the winding base 8 do not lie on the connections in the system carrier level which are formed parallel to the system carriers 6.
• hold-downs can be realized from one side of the system for the strong wire winding, so that the winding sections 9 and the winding base 8 are not in the working area of the hold-down devices. Furthermore, in the embodiment according to the invention, only one-sided cutting of the winding wire sections 9 that are not required is required.
• the embodiment according to the invention therefore leads to tighter tolerance of the electrical coil data through better reproducible winding patterns and to easier removal of the excess winding wire.
• Welded connections are required for use at elevated temperatures, such as in motor electronics, because they are more temperature-stable than soldered connections.
• a direct weld connection using the known ultrasound process is associated with cycle times of approx. 1 s and therefore leads to high production costs.
• the tabs 4 which improve the positioning of the coil core 1 and the adhesive strength, are partly designed with and partly without winding hooks. With winding hooks, they also serve as electrical connections positioned with small tolerances.
• For thick wire windings are those tabs 4, on which the electrical connection of the winding end and connection is made in two parts by slots 10, the partial tabs connected to the winding 2 preventing the spring wire from springing open since they are not melted, while those through the winding wire section 9 to the Winding base 8 connected partial tabs supply the material for the welding beads in indirect laser welding according to DE 44 32 740 AI.
• the embodiment according to the invention thereby enables indirect laser welding of thick wire windings with, for example, 0.3 mm wire diameter.
• the chip inductors are separated by the connections 5 being separated from the system carrier 6 on the dashed lines 12.
• the electrical connections that are required for soldering in printed circuit boards are produced by bending the connections 5 onto the casing 11.

Applications Claiming Priority (3)

Publications (2)

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ID=7824948

Family Applications (1)

Country Status (5)

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Family Cites Families (8)

• 1997
  • 1997-03-27 DE DE19713147A patent/DE19713147C2/de not_active Expired - Fee Related
• 1998
  • 1998-03-19 JP JP54105898A patent/JP2001516509A/ja active Pending
  • 1998-03-19 US US09/367,733 patent/US6249208B1/en not_active Expired - Fee Related
  • 1998-03-19 WO PCT/DE1998/000812 patent/WO1998044518A1/de active IP Right Grant
  • 1998-03-19 EP EP98924025A patent/EP0970492B1/de not_active Expired - Lifetime
  • 1998-03-19 DE DE59814075T patent/DE59814075D1/de not_active Expired - Fee Related

Non-Patent Citations (1)

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